EP2766922A1 - Leistungshalbleiterchip mit metallischen formkörpern zum kontaktieren mit dickdrähten oder bändchen sowie verfahren zu dessen herstellung - Google Patents

Leistungshalbleiterchip mit metallischen formkörpern zum kontaktieren mit dickdrähten oder bändchen sowie verfahren zu dessen herstellung

Info

Publication number
EP2766922A1
EP2766922A1 EP12769904.9A EP12769904A EP2766922A1 EP 2766922 A1 EP2766922 A1 EP 2766922A1 EP 12769904 A EP12769904 A EP 12769904A EP 2766922 A1 EP2766922 A1 EP 2766922A1
Authority
EP
European Patent Office
Prior art keywords
power semiconductor
semiconductor chip
shaped body
potential
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP12769904.9A
Other languages
German (de)
English (en)
French (fr)
Inventor
Martin Becker
Ronald Eisele
Frank Osterwald
Jacek Rudzki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Danfoss Silicon Power GmbH
Original Assignee
Danfoss Silicon Power GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Danfoss Silicon Power GmbH filed Critical Danfoss Silicon Power GmbH
Publication of EP2766922A1 publication Critical patent/EP2766922A1/de
Pending legal-status Critical Current

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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H01L23/4924—Bases or plates or solder therefor characterised by the materials
    • A—HUMAN NECESSITIES
    • A41—WEARING APPAREL
    • A41F—GARMENT FASTENINGS; SUSPENDERS
    • A41F1/00—Fastening devices specially adapted for garments
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    • H01L2924/181—Encapsulation
EP12769904.9A 2011-10-15 2012-09-10 Leistungshalbleiterchip mit metallischen formkörpern zum kontaktieren mit dickdrähten oder bändchen sowie verfahren zu dessen herstellung Pending EP2766922A1 (de)

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DE102011115887A DE102011115887A1 (de) 2011-10-15 2011-10-15 Leistungshalbleiterchip mit oberseitigen Potentialflächen
PCT/EP2012/003787 WO2013053420A1 (de) 2011-10-15 2012-09-10 Leistungshalbleiterchip mit metallischen formkörpern zum kontaktieren mit dickdrähten oder bändchen sowie verfahren zu dessen herstellung

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WO2013053420A1 (de) 2013-04-18
US9318421B2 (en) 2016-04-19
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