EP2352165A4 - Halbleiterelement auf nitridbasis und herstellungsverfahren dafür - Google Patents

Halbleiterelement auf nitridbasis und herstellungsverfahren dafür

Info

Publication number
EP2352165A4
EP2352165A4 EP20100758190 EP10758190A EP2352165A4 EP 2352165 A4 EP2352165 A4 EP 2352165A4 EP 20100758190 EP20100758190 EP 20100758190 EP 10758190 A EP10758190 A EP 10758190A EP 2352165 A4 EP2352165 A4 EP 2352165A4
Authority
EP
European Patent Office
Prior art keywords
nitride
production method
semiconductor element
based semiconductor
method therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP20100758190
Other languages
English (en)
French (fr)
Other versions
EP2352165A1 (de
EP2352165B1 (de
Inventor
Mitsuaki Oya
Toshiya Yokogawa
Atsushi Yamada
Akihiro Isozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of EP2352165A1 publication Critical patent/EP2352165A1/de
Publication of EP2352165A4 publication Critical patent/EP2352165A4/de
Application granted granted Critical
Publication of EP2352165B1 publication Critical patent/EP2352165B1/de
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40Materials therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/30Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/04Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042Electrical excitation ; Circuits therefor
    • H01S5/0425Electrodes, e.g. characterised by the structure
    • H01S5/04252Electrodes, e.g. characterised by the structure characterised by the material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/04Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042Electrical excitation ; Circuits therefor
    • H01S5/0425Electrodes, e.g. characterised by the structure
    • H01S5/04256Electrodes, e.g. characterised by the structure characterised by the configuration
    • H01S5/04257Electrodes, e.g. characterised by the structure characterised by the configuration having positive and negative electrodes on the same side of the substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/32Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/3202Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth
    • H01S5/320225Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth polar orientation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/32Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/323Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/32308Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
    • H01S5/32341Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
EP10758190.2A 2009-04-03 2010-03-17 Halbleiterelement auf nitridbasis Not-in-force EP2352165B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009091506 2009-04-03
PCT/JP2009/007265 WO2010113237A1 (ja) 2009-04-03 2009-12-25 窒化物系半導体素子およびその製造方法
PCT/JP2010/001920 WO2010113405A1 (ja) 2009-04-03 2010-03-17 窒化物系半導体素子およびその製造方法

Publications (3)

Publication Number Publication Date
EP2352165A1 EP2352165A1 (de) 2011-08-03
EP2352165A4 true EP2352165A4 (de) 2012-11-14
EP2352165B1 EP2352165B1 (de) 2016-05-11

Family

ID=42827569

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10758190.2A Not-in-force EP2352165B1 (de) 2009-04-03 2010-03-17 Halbleiterelement auf nitridbasis

Country Status (5)

Country Link
US (3) US8318594B2 (de)
EP (1) EP2352165B1 (de)
JP (1) JP4568379B1 (de)
CN (1) CN102007576B (de)
WO (2) WO2010113237A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9518340B2 (en) 2006-04-07 2016-12-13 Sixpoint Materials, Inc. Method of growing group III nitride crystals
WO2010113237A1 (ja) 2009-04-03 2010-10-07 パナソニック株式会社 窒化物系半導体素子およびその製造方法
JP4792136B2 (ja) * 2010-01-18 2011-10-12 パナソニック株式会社 窒化物系半導体素子およびその製造方法
WO2011125290A1 (ja) * 2010-04-02 2011-10-13 パナソニック株式会社 窒化物系半導体素子およびその製造方法
EP2565943A1 (de) 2010-04-28 2013-03-06 Panasonic Corporation Nitridhalbleiterelement und herstellungsverfahren dafür
WO2011135862A1 (ja) 2010-04-28 2011-11-03 パナソニック株式会社 窒化物系半導体素子およびその製造方法
JP5232338B2 (ja) * 2011-04-08 2013-07-10 パナソニック株式会社 窒化物系半導体素子およびその製造方法
JP5641505B2 (ja) * 2011-04-22 2014-12-17 パナソニックIpマネジメント株式会社 窒化物系半導体発光素子の製造方法
CN103081138A (zh) * 2011-05-18 2013-05-01 松下电器产业株式会社 氮化物类半导体发光元件及其制造方法
WO2013005391A1 (ja) * 2011-07-06 2013-01-10 パナソニック株式会社 窒化物半導体発光素子およびその製造方法
KR20130014849A (ko) * 2011-08-01 2013-02-12 삼성전자주식회사 쇼트키 배리어 다이오드 및 이의 제조방법
KR101916273B1 (ko) 2012-05-30 2018-11-07 삼성전자주식회사 반도체 발광소자 및 그 제조방법
CN104781057B (zh) 2012-08-28 2018-04-24 希波特公司 第iii族氮化物晶片和其制造方法
WO2014051692A1 (en) 2012-09-25 2014-04-03 Sixpoint Materials, Inc. Method of growing group iii nitride crystals
KR101812736B1 (ko) 2012-09-26 2017-12-27 식스포인트 머터리얼즈 인코퍼레이티드 Iii 족 질화물 웨이퍼 및 제작 방법과 시험 방법
WO2015076110A1 (ja) * 2013-11-19 2015-05-28 ソニー株式会社 半導体レーザ素子
US9633982B2 (en) * 2015-02-17 2017-04-25 Chun Yen Chang Method of manufacturing semiconductor device array
US9816871B2 (en) * 2015-09-25 2017-11-14 Intel IP Corporation Thermal sensor including pulse-width modulation output
JP6890979B2 (ja) * 2017-01-13 2021-06-18 一般財団法人ファインセラミックスセンター 窒化物系半導体の非極性面のエッチング方法および窒化物系半導体の非極性面における結晶欠陥の検出方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050145876A1 (en) * 2004-01-06 2005-07-07 Samsung Electronics Co., Ltd. Low resistance electrode and compound semiconductor light emitting device including the same
WO2007149487A2 (en) * 2006-06-21 2007-12-27 The Regents Of The University Of California Opto-electronic and electronic devices using n-face or m-plane gan substrate prepared with ammonothermal growth
WO2008069429A1 (en) * 2006-12-04 2008-06-12 Postech Academy-Industry Foundation Ohmic electrode and method thereof, semiconductor light emitting element having this

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3494478B2 (ja) * 1994-08-22 2004-02-09 日亜化学工業株式会社 窒化ガリウム系化合物半導体素子
JP3735960B2 (ja) * 1996-09-06 2006-01-18 松下電器産業株式会社 半導体発光素子
JP4013288B2 (ja) 1997-06-25 2007-11-28 住友化学株式会社 3−5族化合物半導体用電極の製造方法と3−5族化合物半導体素子
JP3525061B2 (ja) 1998-09-25 2004-05-10 株式会社東芝 半導体発光素子の製造方法
JP2000294837A (ja) 1999-04-05 2000-10-20 Stanley Electric Co Ltd 窒化ガリウム系化合物半導体発光素子
JP2001308462A (ja) 2000-04-21 2001-11-02 Matsushita Electric Ind Co Ltd 窒化物半導体素子の製造方法
JP4024994B2 (ja) 2000-06-30 2007-12-19 株式会社東芝 半導体発光素子
WO2003007390A1 (fr) 2001-07-12 2003-01-23 Nichia Corporation Dispositif semi-conducteur
JP2003332697A (ja) 2002-05-09 2003-11-21 Sony Corp 窒化物半導体素子及びその製造方法
KR100612832B1 (ko) * 2003-05-07 2006-08-18 삼성전자주식회사 고성능의 질화갈륨계 광소자 구현을 위한 니켈계 고용체를 이용한 오믹 접촉 형성을 위한 금속박막 및 그 제조방법
JP4411871B2 (ja) 2003-06-17 2010-02-10 日亜化学工業株式会社 窒化物半導体発光素子
EP1548852B1 (de) 2003-12-22 2013-07-10 Samsung Electronics Co., Ltd. Oberflächenemittierendes Licht aussendendes Halbleiterbauelement aus einer Nitridverbindung und Verfahren zu seiner Herstellung
KR100586949B1 (ko) 2004-01-19 2006-06-07 삼성전기주식회사 플립칩용 질화물 반도체 발광소자
JP2006024750A (ja) 2004-07-08 2006-01-26 Matsushita Electric Ind Co Ltd 発光素子
KR100773538B1 (ko) * 2004-10-07 2007-11-07 삼성전자주식회사 반사 전극 및 이를 구비하는 화합물 반도체 발광소자
JP2007109915A (ja) * 2005-10-14 2007-04-26 Stanley Electric Co Ltd 発光ダイオード
JP5214128B2 (ja) 2005-11-22 2013-06-19 シャープ株式会社 発光素子及び発光素子を備えたバックライトユニット
JP2007207869A (ja) 2006-01-31 2007-08-16 Rohm Co Ltd 窒化物半導体発光素子
DE112007001235B4 (de) 2006-05-23 2018-05-09 Meijo University Licht emittierende Halbleitervorrichtung
KR100845037B1 (ko) * 2006-08-02 2008-07-09 포항공과대학교 산학협력단 오믹 전극 및 그 형성 방법, 이를 구비하는 반도체 발광소자
KR100891833B1 (ko) * 2006-10-18 2009-04-07 삼성전기주식회사 다층 전극 및 이를 구비한 화합물 반도체 발광소자
JP2008140841A (ja) * 2006-11-30 2008-06-19 Matsushita Electric Ind Co Ltd 発光素子
JP2008153285A (ja) * 2006-12-14 2008-07-03 Rohm Co Ltd 窒化物半導体装置および窒化物半導体製造方法
JP2008166393A (ja) 2006-12-27 2008-07-17 Showa Denko Kk Iii族窒化物半導体発光素子の製造方法
KR100835116B1 (ko) 2007-04-16 2008-06-05 삼성전기주식회사 질화물 반도체 발광 소자
JP4974867B2 (ja) 2007-12-12 2012-07-11 昭和電工株式会社 発光ダイオード及びその製造方法
JP5169397B2 (ja) 2008-04-07 2013-03-27 パナソニック株式会社 半導体発光素子およびそれを用いた半導体発光装置
TWI412159B (zh) 2008-06-16 2013-10-11 Toyoda Gosei Kk 半導體發光元件、其電極以及製造方法、及燈
JP2010062425A (ja) 2008-09-05 2010-03-18 Showa Denko Kk 半導体発光素子及び半導体発光素子の製造方法、ランプ
WO2010027016A1 (ja) 2008-09-05 2010-03-11 シャープ株式会社 窒化物半導体発光素子および半導体発光素子
JP2010062460A (ja) 2008-09-05 2010-03-18 Sharp Corp 窒化物半導体発光素子
WO2010113237A1 (ja) 2009-04-03 2010-10-07 パナソニック株式会社 窒化物系半導体素子およびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050145876A1 (en) * 2004-01-06 2005-07-07 Samsung Electronics Co., Ltd. Low resistance electrode and compound semiconductor light emitting device including the same
WO2007149487A2 (en) * 2006-06-21 2007-12-27 The Regents Of The University Of California Opto-electronic and electronic devices using n-face or m-plane gan substrate prepared with ammonothermal growth
WO2008069429A1 (en) * 2006-12-04 2008-06-12 Postech Academy-Industry Foundation Ohmic electrode and method thereof, semiconductor light emitting element having this

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
MOCHIDA N ET AL: "Crystal orientation dependence of p-type contact resistance of GaN", JOURNAL OF CRYSTAL GROWTH, ELSEVIER, AMSTERDAM, NL, vol. 189-190, 15 June 1998 (1998-06-15), pages 716 - 719, XP004148608, ISSN: 0022-0248, DOI: 10.1016/S0022-0248(98)00269-3 *
See also references of WO2010113405A1 *
YUHZOH TSUDA ET AL: "Blue Laser Diodes Fabricated on m-Plane GaN Substrates", APPLIED PHYSICS EXPRESS, THE JAPAN SOCIETY OF APPLIED PHYSICS, vol. 1, 11 January 2008 (2008-01-11), pages 1104.1 - 1104.3, XP008153917, ISSN: 1882-0778, DOI: 10.1143/APEX.1.011104 *

Also Published As

Publication number Publication date
CN102007576A (zh) 2011-04-06
WO2010113405A1 (ja) 2010-10-07
EP2352165A1 (de) 2011-08-03
US8318594B2 (en) 2012-11-27
WO2010113237A1 (ja) 2010-10-07
US20110037088A1 (en) 2011-02-17
JP4568379B1 (ja) 2010-10-27
JPWO2010113405A1 (ja) 2012-10-04
US20130015427A1 (en) 2013-01-17
US20110253976A1 (en) 2011-10-20
US8299490B2 (en) 2012-10-30
EP2352165B1 (de) 2016-05-11
CN102007576B (zh) 2012-11-07

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