EP1983614A4 - Module à haute fréquence - Google Patents

Module à haute fréquence

Info

Publication number
EP1983614A4
EP1983614A4 EP07707846A EP07707846A EP1983614A4 EP 1983614 A4 EP1983614 A4 EP 1983614A4 EP 07707846 A EP07707846 A EP 07707846A EP 07707846 A EP07707846 A EP 07707846A EP 1983614 A4 EP1983614 A4 EP 1983614A4
Authority
EP
European Patent Office
Prior art keywords
high frequency
frequency module
module
frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP07707846A
Other languages
German (de)
English (en)
Other versions
EP1983614B1 (fr
EP1983614A1 (fr
Inventor
Koichi Matsuo
Kazuyoshi Inami
Mamoru Yoshida
Takeshi Sueda
Shigeo Udagawa
Susumu Sato
Tsutomu Tamaki
Takuya Suzuki
Kousuke Yasooka
Minoru Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of EP1983614A1 publication Critical patent/EP1983614A1/fr
Publication of EP1983614A4 publication Critical patent/EP1983614A4/fr
Application granted granted Critical
Publication of EP1983614B1 publication Critical patent/EP1983614B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/213—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies
    • H01P1/2135—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies using strip line filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
    • H01P5/1007—Microstrip transitions to Slotline or finline
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0006—Particular feeding systems
    • H01Q21/0037—Particular feeding systems linear waveguide fed arrays
    • H01Q21/0068—Dielectric waveguide fed arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/064—Two dimensional planar arrays using horn or slot aerials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15182—Fan-in arrangement of the internal vias
    • H01L2924/15184—Fan-in arrangement of the internal vias in different layers of the multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Waveguide Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
EP07707846.7A 2006-02-06 2007-02-01 Module à haute fréquence Active EP1983614B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006028084 2006-02-06
PCT/JP2007/051660 WO2007091470A1 (fr) 2006-02-06 2007-02-01 Module à haute fréquence

Publications (3)

Publication Number Publication Date
EP1983614A1 EP1983614A1 (fr) 2008-10-22
EP1983614A4 true EP1983614A4 (fr) 2010-01-06
EP1983614B1 EP1983614B1 (fr) 2016-08-31

Family

ID=38345073

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07707846.7A Active EP1983614B1 (fr) 2006-02-06 2007-02-01 Module à haute fréquence

Country Status (5)

Country Link
US (1) US8040286B2 (fr)
EP (1) EP1983614B1 (fr)
JP (1) JP4394147B2 (fr)
CN (1) CN101395759B (fr)
WO (1) WO2007091470A1 (fr)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006093219A1 (fr) * 2005-03-03 2006-09-08 Toshiba Tec Kabushiki Kaisha Imprimante et dispositif de communication a puce a circuit integre
EP2124253B1 (fr) * 2007-03-14 2019-05-22 Mitsubishi Electric Corporation Boitier a haute frequence
JP4999985B2 (ja) * 2008-03-25 2012-08-15 三菱電機株式会社 積層管路組立体及び管路部品のねじ締結方法
JP5179570B2 (ja) * 2008-03-31 2013-04-10 京セラ株式会社 高周波モジュールおよびその製造方法ならびに該高周波モジュールを備えた送信器、受信器、送受信器およびレーダ装置
DE112009000784B4 (de) * 2008-03-31 2014-12-04 Kyocera Corporation Hochfrequenzmodul und Verfahren zu seiner Herstellung und Sender, Empfänger, Sender-Empfänger und Radarvorrichtung, die das Hochfrequenzmodul umfassen
JP4592786B2 (ja) * 2008-06-18 2010-12-08 三菱電機株式会社 アンテナ装置及びレーダ
JP4996640B2 (ja) * 2009-03-10 2012-08-08 株式会社東芝 アンテナ装置、レーダ装置
JP5309209B2 (ja) * 2009-03-31 2013-10-09 京セラ株式会社 導波構造体、ならびに、導波構造体を含む高周波モジュールおよびレーダ装置
DE112010001453B4 (de) * 2009-03-31 2017-06-22 Kyocera Corp. Leiterplatte, Wellenleiterstruktur, Hochfrequenzmodul und Radarvorrichtung
EP2267832A1 (fr) * 2009-06-11 2010-12-29 Imec Système intégré comprenant un guide d'ondes sur un appareil de couplage de microruban
CN102064380A (zh) * 2010-10-26 2011-05-18 李峰 波导平板阵列天线
US9570420B2 (en) 2011-09-29 2017-02-14 Broadcom Corporation Wireless communicating among vertically arranged integrated circuits (ICs) in a semiconductor package
US8508029B2 (en) * 2011-09-29 2013-08-13 Broadcom Corporation Semiconductor package including an integrated waveguide
US8866687B2 (en) 2011-11-16 2014-10-21 Andrew Llc Modular feed network
US9160049B2 (en) 2011-11-16 2015-10-13 Commscope Technologies Llc Antenna adapter
US8558746B2 (en) 2011-11-16 2013-10-15 Andrew Llc Flat panel array antenna
DE102012203293B4 (de) * 2012-03-02 2021-12-02 Robert Bosch Gmbh Halbleitermodul mit integriertem Wellenleiter für Radarsignale
JP6102106B2 (ja) * 2012-07-20 2017-03-29 株式会社デンソー レーダ装置
EP2940795B1 (fr) * 2012-12-20 2019-10-09 Murata Manufacturing Co., Ltd. Antenne multibande
CN105590902B (zh) * 2013-02-08 2019-02-19 日月光半导体制造股份有限公司 天线封装模块及其制造方法
US9130254B1 (en) 2013-03-27 2015-09-08 Google Inc. Printed waveguide transmission line having layers bonded by conducting and non-conducting adhesives
US9123979B1 (en) 2013-03-28 2015-09-01 Google Inc. Printed waveguide transmission line having layers with through-holes having alternating greater/lesser widths in adjacent layers
US9142872B1 (en) 2013-04-01 2015-09-22 Google Inc. Realization of three-dimensional components for signal interconnections of electromagnetic waves
US9806431B1 (en) * 2013-04-02 2017-10-31 Waymo Llc Slotted waveguide array antenna using printed waveguide transmission lines
DE102014200660A1 (de) * 2014-01-16 2015-07-16 Conti Temic Microelectronic Gmbh Sende- und Empfangseinheit für Radarsignale und Verfahren zur Herstellung derselben
JP6042028B2 (ja) * 2014-03-11 2016-12-14 三菱電機株式会社 高周波パッケージ
EP3091611B1 (fr) 2014-05-12 2019-07-24 Huawei Technologies Co., Ltd. Antenne et dispositif sans fil
WO2016016968A1 (fr) 2014-07-30 2016-02-04 富士通株式会社 Dispositif électronique et procédé de fabrication de dispositif électronique
CN206610893U (zh) * 2015-11-05 2017-11-03 日本电产艾莱希斯株式会社 缝隙天线
WO2017083812A1 (fr) * 2015-11-12 2017-05-18 Duke University Cavités imprimées pour l'imagerie hyperfréquence computationnelle, et procédés d'utilisation
JP2019047141A (ja) 2016-03-29 2019-03-22 日本電産エレシス株式会社 マイクロ波ｉｃ導波路装置モジュール、レーダ装置およびレーダシステム
US10613216B2 (en) * 2016-05-31 2020-04-07 Honeywell International Inc. Integrated digital active phased array antenna and wingtip collision avoidance system
US10490905B2 (en) * 2016-07-11 2019-11-26 Waymo Llc Radar antenna array with parasitic elements excited by surface waves
JP6368342B2 (ja) * 2016-09-09 2018-08-01 株式会社フジクラ アンテナ装置及びその製造方法
WO2018122926A1 (fr) 2016-12-26 2018-07-05 三菱電機株式会社 Dispositif radar et procédé d'agencement d'antennes
CN107181043B (zh) * 2017-05-22 2020-03-27 上海安费诺永亿通讯电子有限公司 一种无线移动终端
US10199336B2 (en) 2017-05-24 2019-02-05 Advanced Semiconductor Engineering, Inc. Antenna package device
DE112018003566T5 (de) 2017-07-11 2020-03-26 Mitsubishi Electric Corporation Radarvorrichtung
DE102018203106A1 (de) * 2018-03-01 2019-09-05 Conti Temic Microelectronic Gmbh Radarsystem zur Umfelderfassung eines Kraftfahrzeugs mit einer Kunststoffantenne
KR102089285B1 (ko) 2018-07-17 2020-03-16 삼성전자주식회사 안테나 모듈
US11011816B2 (en) * 2018-10-29 2021-05-18 Aptiv Technologies Limited Radar assembly with a slot transition through a printed circuit board
US10700440B1 (en) 2019-01-25 2020-06-30 Corning Incorporated Antenna stack
US10749256B1 (en) * 2019-01-30 2020-08-18 Raytheon Company Waveguide adapter for slot antennas
JP6840308B2 (ja) 2019-01-31 2021-03-10 三菱電機株式会社 レーダ装置および信号処理方法
US11128023B2 (en) * 2019-02-22 2021-09-21 Texas Instruments Incorporated Substrate design for efficient coupling between a package and a dielectric waveguide
KR102290019B1 (ko) 2019-05-29 2021-08-17 주식회사 아모텍 레이더 안테나
JP7493922B2 (ja) * 2019-08-26 2024-06-03 キヤノン株式会社 発振器、撮像装置
US11378683B2 (en) * 2020-02-12 2022-07-05 Veoneer Us, Inc. Vehicle radar sensor assemblies

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6127985A (en) * 1997-07-31 2000-10-03 Ems Technologies, Inc. Dual polarized slotted array antenna
WO2001004993A1 (fr) * 1999-07-09 2001-01-18 Telefonaktiebolaget Lm Ericsson Dispositif destine a etre utilise dans un reseau d'antennes en vue d'emettre et recevoir a au moins une frequence selon au moins deux axes de polarisation
JP2002016408A (ja) * 2000-06-29 2002-01-18 Kyocera Corp 配線基板およびその導波管との接続構造
EP1274149A2 (fr) * 2001-07-05 2003-01-08 Matsushita Electric Industrial Co., Ltd. Méthode de fabrication d'un circuit à haute fréquence et circuit à haute fréquence
WO2003098742A1 (fr) * 2002-05-21 2003-11-27 Marconi Communications Gmbh Antenne secteur a guide d'ondes creux
US6870438B1 (en) * 1999-11-10 2005-03-22 Kyocera Corporation Multi-layered wiring board for slot coupling a transmission line to a waveguide

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0789603B2 (ja) 1986-03-12 1995-09-27 株式会社日立製作所 導波管形スロツトアレイアンテナ
JPH0366214U (fr) * 1989-07-24 1991-06-27
JPH0366214A (ja) 1989-08-05 1991-03-20 Mitsubishi Electric Corp 高周波電力増幅回路
CA2080244A1 (fr) 1990-04-30 1991-10-31 Geoffrey T. Poulton Antenne a elements plats
CA2066887C (fr) 1991-05-06 1996-04-09 Harry Wong Repartiteur de puissance rf a cavite a plat
JPH053405A (ja) 1991-06-25 1993-01-08 Asahi Chem Ind Co Ltd 導波管結合構造
JPH056921A (ja) 1991-06-28 1993-01-14 Toshiba Corp 半導体装置
JPH056921U (ja) * 1991-07-01 1993-01-29 旭化成工業株式会社 高剛性アンテナ
JPH07106843A (ja) 1993-09-29 1995-04-21 Japan Atom Energy Res Inst 高周波出力アンテナ
JPH07106847A (ja) 1993-10-07 1995-04-21 Nippon Steel Corp 漏れ波導波管スロットアレーアンテナ
JPH10313214A (ja) 1997-05-13 1998-11-24 Nippon Steel Corp アンテナおよびその製造方法
WO1999017142A1 (fr) 1997-10-01 1999-04-08 Hitachi Chemical Company, Ltd. Processeur optique d'informations
JPH11344537A (ja) 1998-06-03 1999-12-14 Matsushita Electric Ind Co Ltd 半導体デバイス
JP3812203B2 (ja) 1999-02-17 2006-08-23 三菱電機株式会社 導波管スロットアレイアンテナ
JP2000261239A (ja) 1999-03-05 2000-09-22 Fujitsu Ltd 導波管スロットアンテナ
WO2001018901A1 (fr) * 1999-09-02 2001-03-15 Commonwealth Scientific And Industrial Research Organisation Structure d'alimentation pour guides d'ondes electromagnetiques
SE517155C2 (sv) 1999-09-08 2002-04-23 Ericsson Telefon Ab L M Fördelningsnät, samt antennanordning innefattande sådant fördelningsnät
JP2001144512A (ja) 1999-11-10 2001-05-25 Kyocera Corp 配線基板およびその導波管との接続構造
JP3428575B2 (ja) * 2000-09-07 2003-07-22 三菱電機株式会社 高周波モジュールおよび高周波無線装置
JP4021150B2 (ja) * 2001-01-29 2007-12-12 沖電気工業株式会社 スロットアレーアンテナ
NZ528252A (en) * 2001-03-21 2005-03-24 Microface Co Waveguide slot antenna and manufacturing method thereof
JP2003318642A (ja) 2002-04-25 2003-11-07 Japan Radio Co Ltd 導波管スロットアレーアンテナ
JP2004088504A (ja) 2002-08-27 2004-03-18 Kyocera Corp 高周波素子収納用パッケージ
JP3846585B2 (ja) 2002-11-18 2006-11-15 三菱電機株式会社 導波管ベンド、導波管プレートおよび高周波装置
JP2005217865A (ja) 2004-01-30 2005-08-11 Toko Inc 誘電体導波管スロットアンテナ
US8170643B2 (en) * 2005-11-22 2012-05-01 Bsd Medical Corporation System and method for irradiating a target with electromagnetic radiation to produce a heated region

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6127985A (en) * 1997-07-31 2000-10-03 Ems Technologies, Inc. Dual polarized slotted array antenna
WO2001004993A1 (fr) * 1999-07-09 2001-01-18 Telefonaktiebolaget Lm Ericsson Dispositif destine a etre utilise dans un reseau d'antennes en vue d'emettre et recevoir a au moins une frequence selon au moins deux axes de polarisation
US6870438B1 (en) * 1999-11-10 2005-03-22 Kyocera Corporation Multi-layered wiring board for slot coupling a transmission line to a waveguide
JP2002016408A (ja) * 2000-06-29 2002-01-18 Kyocera Corp 配線基板およびその導波管との接続構造
EP1274149A2 (fr) * 2001-07-05 2003-01-08 Matsushita Electric Industrial Co., Ltd. Méthode de fabrication d'un circuit à haute fréquence et circuit à haute fréquence
WO2003098742A1 (fr) * 2002-05-21 2003-11-27 Marconi Communications Gmbh Antenne secteur a guide d'ondes creux

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2007091470A1 *

Also Published As

Publication number Publication date
CN101395759A (zh) 2009-03-25
EP1983614B1 (fr) 2016-08-31
US8040286B2 (en) 2011-10-18
JPWO2007091470A1 (ja) 2009-07-02
CN101395759B (zh) 2011-06-22
JP4394147B2 (ja) 2010-01-06
US20090079648A1 (en) 2009-03-26
EP1983614A1 (fr) 2008-10-22
WO2007091470A1 (fr) 2007-08-16

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