JPH0366214U - - Google Patents

Info

Publication number
JPH0366214U
JPH0366214U JP8569089U JP8569089U JPH0366214U JP H0366214 U JPH0366214 U JP H0366214U JP 8569089 U JP8569089 U JP 8569089U JP 8569089 U JP8569089 U JP 8569089U JP H0366214 U JPH0366214 U JP H0366214U
Authority
JP
Japan
Prior art keywords
waveguide
phase
probe
power feeding
array antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8569089U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8569089U priority Critical patent/JPH0366214U/ja
Publication of JPH0366214U publication Critical patent/JPH0366214U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Waveguide Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
JP8569089U 1989-07-24 1989-07-24 Pending JPH0366214U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8569089U JPH0366214U (fr) 1989-07-24 1989-07-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8569089U JPH0366214U (fr) 1989-07-24 1989-07-24

Publications (1)

Publication Number Publication Date
JPH0366214U true JPH0366214U (fr) 1991-06-27

Family

ID=31634952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8569089U Pending JPH0366214U (fr) 1989-07-24 1989-07-24

Country Status (1)

Country Link
JP (1) JPH0366214U (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002225470A (ja) * 2001-01-31 2002-08-14 Toppan Forms Co Ltd ギフト用ｉｃ封書および該ｉｃ封書の製造方法
JP2003099735A (ja) * 2001-09-21 2003-04-04 Dainippon Printing Co Ltd 非接触ｉｃモジュール送付媒体
JP2005279975A (ja) * 2004-03-29 2005-10-13 National Printing Bureau スキミング防止冊子及び挿入部材
WO2007091470A1 (fr) * 2006-02-06 2007-08-16 Mitsubishi Electric Corporation Module à haute fréquence

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002225470A (ja) * 2001-01-31 2002-08-14 Toppan Forms Co Ltd ギフト用ｉｃ封書および該ｉｃ封書の製造方法
JP4570117B2 (ja) * 2001-01-31 2010-10-27 トッパン・フォームズ株式会社 Ｉｃモジュール部材入り封書の製造方法
JP2003099735A (ja) * 2001-09-21 2003-04-04 Dainippon Printing Co Ltd 非接触ｉｃモジュール送付媒体
JP2005279975A (ja) * 2004-03-29 2005-10-13 National Printing Bureau スキミング防止冊子及び挿入部材
WO2007091470A1 (fr) * 2006-02-06 2007-08-16 Mitsubishi Electric Corporation Module à haute fréquence

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