EP1672028A4 - Composition de resine - Google Patents

Composition de resine

Info

Publication number
EP1672028A4
EP1672028A4 EP04773675A EP04773675A EP1672028A4 EP 1672028 A4 EP1672028 A4 EP 1672028A4 EP 04773675 A EP04773675 A EP 04773675A EP 04773675 A EP04773675 A EP 04773675A EP 1672028 A4 EP1672028 A4 EP 1672028A4
Authority
EP
European Patent Office
Prior art keywords
resin composition
resin
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP04773675A
Other languages
German (de)
English (en)
Other versions
EP1672028A1 (fr
EP1672028B1 (fr
Inventor
Hironori Kobayashi
Katsuyuki Tsuchida
Masashi Kumagai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mining Holdings Inc
Original Assignee
Nippon Mining and Metals Co Ltd
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining and Metals Co Ltd, Nippon Mining Co Ltd filed Critical Nippon Mining and Metals Co Ltd
Publication of EP1672028A1 publication Critical patent/EP1672028A1/fr
Publication of EP1672028A4 publication Critical patent/EP1672028A4/fr
Application granted granted Critical
Publication of EP1672028B1 publication Critical patent/EP1672028B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/2805—Compounds having only one group containing active hydrogen
    • C08G18/288—Compounds containing at least one heteroatom other than oxygen or nitrogen
    • C08G18/289—Compounds containing at least one heteroatom other than oxygen or nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
    • C08G18/6216—Polymers of alpha-beta ethylenically unsaturated carboxylic acids or of derivatives thereof
    • C08G18/622—Polymers of esters of alpha-beta ethylenically unsaturated carboxylic acids
    • C08G18/6225—Polymers of esters of acrylic or methacrylic acid
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
    • C08G18/78—Nitrogen
    • C08G18/7806—Nitrogen containing -N-C=0 groups
    • C08G18/7818—Nitrogen containing -N-C=0 groups containing ureum or ureum derivative groups
    • C08G18/7831—Nitrogen containing -N-C=0 groups containing ureum or ureum derivative groups containing biuret groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C08K5/5477—Silicon-containing compounds containing nitrogen containing nitrogen in a heterocyclic ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
EP04773675.6A 2003-10-10 2004-09-30 Composition de resine Active EP1672028B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003352546 2003-10-10
PCT/JP2004/014814 WO2005035662A1 (fr) 2003-10-10 2004-09-30 Composition de resine

Publications (3)

Publication Number Publication Date
EP1672028A1 EP1672028A1 (fr) 2006-06-21
EP1672028A4 true EP1672028A4 (fr) 2010-05-05
EP1672028B1 EP1672028B1 (fr) 2013-08-21

Family

ID=34431115

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04773675.6A Active EP1672028B1 (fr) 2003-10-10 2004-09-30 Composition de resine

Country Status (7)

Country Link
US (1) US20070123681A1 (fr)
EP (1) EP1672028B1 (fr)
JP (1) JP4734605B2 (fr)
KR (1) KR100767941B1 (fr)
CN (1) CN100478399C (fr)
TW (1) TWI289145B (fr)
WO (1) WO2005035662A1 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007106952A (ja) * 2005-10-17 2007-04-26 Asahi Glass Coat & Resin Co Ltd 塗料用組成物、塗料、塗料用キットおよび塗装物品
EP1973125A1 (fr) * 2006-01-13 2008-09-24 Aisin Seiki Kabushiki Kaisha Element central d'un corps de structure magnetique
CN101511900B (zh) * 2006-09-14 2011-11-23 松下电工株式会社 印刷电路板用环氧树脂组合物、树脂组合物清漆、预成型料、覆金属层压体、印刷电路板以及多层印刷电路板
JP2008185502A (ja) * 2007-01-31 2008-08-14 Sekisui House Ltd 塗装鋼板の複合劣化試験方法
IN2012DN03296A (fr) * 2009-11-04 2015-10-23 Huntsman Int Llc
JP5764883B2 (ja) * 2010-08-13 2015-08-19 日立化成株式会社 ウレタン樹脂組成物及び光半導体装置
JP5943932B2 (ja) * 2010-11-19 2016-07-05 ビーエーエスエフ コーティングス ゲゼルシャフト ミット ベシュレンクテル ハフツングＢＡＳＦ Ｃｏａｔｉｎｇｓ ＧｍｂＨ 高固形分及び良好な流展性を有するコーティング剤並びにそれより製造された多層塗膜並びにその使用
CN104321359B (zh) * 2012-05-23 2016-12-14 Sika技术股份公司 含硅烷基团的聚合物
JP6320014B2 (ja) * 2012-12-13 2018-05-09 キヤノン株式会社 電子写真用部材、プロセスカートリッジ及び電子写真装置
CN103320001A (zh) * 2013-06-24 2013-09-25 丹阳市佳美化工有限公司 双组份pu涂料
CN103333574B (zh) * 2013-06-25 2016-03-09 丹阳市佳美化工有限公司 防屏蔽导电涂料
CN107541177A (zh) * 2017-09-07 2018-01-05 深圳市康利邦科技有限公司 硅烷功石墨烯的制备方法、抗静电有机硅压敏胶及其制备方法
WO2020245037A1 (fr) * 2019-06-03 2020-12-10 Covestro Intellectual Property Gmbh & Co. Kg Composition pour la fabrication d'une mousse de polyuréthane
WO2023112873A1 (fr) * 2021-12-13 2023-06-22 積水化学工業株式会社 Composition adhésive, adhésif pour composants électroniques, et adhésif pour dispositifs électroniques portables

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4537934A (en) * 1980-07-01 1985-08-27 Th. Goldschmidt Ag Thermosetting adhesive
EP0526847A1 (fr) * 1991-08-01 1993-02-10 Japan Energy Corporation Composées siliciques contenant des groupements imidazole, procédé pour les préparer et agents de finissage pour une surface de métal les contenant
US20030088108A1 (en) * 2000-04-07 2003-05-08 Masashi Kumagai Monocarboxylate salts of imidazole reaction products, process for preparing the salts, and surface treatments, additives for resins, and resin compositions, containing the same

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4622369A (en) * 1985-04-30 1986-11-11 Ppg Industries, Inc. Urethane resins containing hydrolyzable moieties from organosilane compounds
US4732858A (en) * 1986-09-17 1988-03-22 Brewer Science, Inc. Adhesion promoting product and process for treating an integrated circuit substrate
JP2710939B2 (ja) * 1988-01-28 1998-02-10 株式会社神戸製鋼所 消耗電極式両極性アーク溶接方法
JPH0352976A (ja) * 1989-07-19 1991-03-07 Dainippon Ink & Chem Inc 塗料用樹脂組成物
US5391664A (en) * 1992-09-03 1995-02-21 Nippon Shokubai Co., Ltd. Process for producing polymer
JP3600625B2 (ja) * 1993-09-02 2004-12-15 三井化学株式会社 二成分系ポリウレタン発泡型シーリング材組成物、シーリング方法及び灯具
ES2191876T3 (es) * 1994-01-21 2003-09-16 Minnesota Mining & Mfg Material de moldeo ortopedico.
DE19646879A1 (de) * 1995-11-23 1997-05-28 Henkel Kgaa Einkomponenten-Polyurethan-Reaktionsklebstoff
JPH09278861A (ja) * 1996-04-12 1997-10-28 Dainippon Ink & Chem Inc 発泡性難燃組成物及び発泡成形体の製造方法
JP3555802B2 (ja) * 1996-04-30 2004-08-18 株式会社日鉱マテリアルズ 新規有機ケイ素化合物およびその製造方法並びにそれを用いる表面処理剤および樹脂添加剤
JP3812986B2 (ja) * 1997-04-01 2006-08-23 旭シュエーベル株式会社 イミダゾール基含有表面処理剤およびガラスクロス
JP3555825B2 (ja) * 1997-09-22 2004-08-18 株式会社日鉱マテリアルズ 新規有機ケイ素化合物およびその製造方法並びにそれを用いる表面処理剤および樹脂添加剤
JPH11310768A (ja) * 1998-02-27 1999-11-09 Sekisui Chem Co Ltd 接着剤組成物
JP3555845B2 (ja) * 1999-04-15 2004-08-18 株式会社日鉱マテリアルズ 新規有機ケイ素化合物およびその製造方法並びにそれを用いる表面処理剤および樹脂添加剤
JP3523804B2 (ja) * 1999-04-15 2004-04-26 株式会社日鉱マテリアルズ 新規有機ケイ素化合物およびその製造方法並びにそれを用いる表面処理剤および樹脂添加剤
JP2002322232A (ja) * 2001-04-24 2002-11-08 Nippon Polyurethane Ind Co Ltd 硬質ポリウレタンフォーム用組成物、及びこれを用いた硬質ポリウレタンフォームの製造方法
JP2002348392A (ja) * 2001-05-28 2002-12-04 Matsushita Electric Works Ltd プリプレグ及び積層板
JP2002356534A (ja) * 2001-05-29 2002-12-13 Nippon Polyurethane Ind Co Ltd 硬質ポリウレタンフォーム用ポリイソシアネート組成物、及びそれを用いた硬質ポリウレタンフォームの製造方法
JP2003071378A (ja) * 2001-09-05 2003-03-11 Toray Ind Inc マグネシウム合金成形物の塗装方法
DE10158491A1 (de) * 2001-11-28 2003-06-12 Bayer Ag Metall-Polyurethan-Laminate
JP2003277717A (ja) * 2002-03-25 2003-10-02 Dainippon Ink & Chem Inc 反応性ホットメルト接着剤
JP4276923B2 (ja) * 2003-02-27 2009-06-10 富士フイルム株式会社 光硬化性着色樹脂組成物及びそれを用いたカラーフィルター
JP4619636B2 (ja) * 2003-08-29 2011-01-26 ヘンケルジャパン株式会社 湿気硬化型ホットメルト接着剤組成物
US20050238899A1 (en) * 2004-04-27 2005-10-27 Isao Nagata High solids clearcoat compositions containing silane functional compounds

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4537934A (en) * 1980-07-01 1985-08-27 Th. Goldschmidt Ag Thermosetting adhesive
EP0526847A1 (fr) * 1991-08-01 1993-02-10 Japan Energy Corporation Composées siliciques contenant des groupements imidazole, procédé pour les préparer et agents de finissage pour une surface de métal les contenant
US20030088108A1 (en) * 2000-04-07 2003-05-08 Masashi Kumagai Monocarboxylate salts of imidazole reaction products, process for preparing the salts, and surface treatments, additives for resins, and resin compositions, containing the same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2005035662A1 *

Also Published As

Publication number Publication date
JPWO2005035662A1 (ja) 2006-12-21
TW200519132A (en) 2005-06-16
CN1863872A (zh) 2006-11-15
EP1672028A1 (fr) 2006-06-21
JP4734605B2 (ja) 2011-07-27
CN100478399C (zh) 2009-04-15
EP1672028B1 (fr) 2013-08-21
KR100767941B1 (ko) 2007-10-17
US20070123681A1 (en) 2007-05-31
KR20060085922A (ko) 2006-07-28
TWI289145B (en) 2007-11-01
WO2005035662A1 (fr) 2005-04-21

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