EP1177586A1 - Ensemble diodes electroluminescentes - Google Patents

Ensemble diodes electroluminescentes

Info

Publication number
EP1177586A1
EP1177586A1 EP00943581A EP00943581A EP1177586A1 EP 1177586 A1 EP1177586 A1 EP 1177586A1 EP 00943581 A EP00943581 A EP 00943581A EP 00943581 A EP00943581 A EP 00943581A EP 1177586 A1 EP1177586 A1 EP 1177586A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
heat sink
led arrangement
leds
arrangement according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00943581A
Other languages
German (de)
English (en)
Inventor
Karlheinz Arndt
Günter Waitl
Georg Bogner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7908017&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP1177586(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of EP1177586A1 publication Critical patent/EP1177586A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F21/00—Mobile visual advertising
    • G09F21/04—Mobile visual advertising by land vehicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S10/00—Lighting devices or systems producing a varying lighting effect
    • F21S10/06—Lighting devices or systems producing a varying lighting effect flashing, e.g. with rotating reflector or light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Definitions

  • the invention relates to an LED arrangement according to the preamble of claim 1, which in particular can be installed in a luminaire housing, as can be used, for example, in exterior lights of motor vehicles.
  • LEDs light emission diodes
  • incandescent lamps since LEDs have a longer service life, better efficiency when converting electrical energy into radiation energy in the visible spectral range and associated with it a lower heat emission and overall less space requirement.
  • a certain additional effort must first be made, because due to the low luminance of an individual LED compared to an incandescent lamp, a plurality of LEDs shaped into an array must be constructed.
  • Such an array can be mounted, for example, in surface mounting technology (SMT) from a plurality of LEDs on a printed circuit board (PCB, pnnted circuit board).
  • SMT surface mounting technology
  • PCB printed circuit board
  • An LED design is used, such as that used in connection with the article "SIEMENS SMT-TOPLED for surface mounting" by F. Mollmer and G. Waitl in the magazine Siemens Components 29 (1991), No. 4, p. 147 Image 1 is described.
  • This form of the LED is extremely compact and, if necessary, allows the arrangement of a large number of such LEDs in a row or matrix arrangement.
  • the thermal resistance is still relatively low (for example approx. 180 K / W for an LED of the Power TOPLED ® type ).
  • Heat is emitted by all heat-generating components on the circuit board, including series resistors, transistors, MOS-FETs or control ICs that are located in the immediate vicinity of the LEDs.
  • the operating current must be reduced so that the component is not destroyed as a result of the generation of heat on the circuit board and the poor heat dissipation. As a result, the light output of the LEDs cannot be fully used.
  • LED arrangements for the third brake light are used in the area of motor vehicle lighting already mentioned. This is a one-line array, in which the thermal problems are not yet so heavy.
  • an LED arrangement is to be made available, with which various spatial shapes of three-dimensional luminous bodies can be easily realized.
  • an LED arrangement is provided with a circuit board and a plurality of LEDs which are particularly preferably surface-mounted on the circuit board, the circuit board having its side facing away from the LEDs being applied to a heat sink and having a highly heat-conducting layer on this side.
  • the invention is therefore based on the finding that, in particular in the case of a surface-mounted LED arrangement of high LED density, the heat dissipation to the rear must be supported.
  • the heat sink can e.g. consist of copper or aluminum or of a cooling plate and the circuit board is preferably attached to it with a heat-conducting paste, a heat-conducting adhesive, a heat-conducting film or the like. On the back it should enable the best possible heat radiation. For this purpose it can be painted black, for example, and / or have cooling fins and / or a rough surface.
  • the circuit board should be as thin as possible, since the plastic material from which it is constructed is generally poorly conducting the warmth.
  • the circuit board can be a flexible circuit board, for example.
  • the flexible circuit board is usually made of a flexible plastic.
  • it can consist of a polyester or polyimide film.
  • the use of so-called flexboards known per se in the prior art is particularly preferred. These flexboards are generally multi-layer printed circuit boards which are built up homogeneously from a plurality of poly carrier foils.
  • the copper pads around the solder surfaces of LEDs with surface (SMT) mounting technology should be as large as possible in order to broaden the warm path through the circuit board material before the heat flows to the back of the circuit board.
  • the main surface of the printed circuit board facing the heat sink is preferably laminated with copper or another metal, in order to enable heat conduction in the lamination of the lamination transversely to other adhesive points.
  • the copper layer can be structured, for example, in a meandering shape laterally to the circuit board in order to maintain the flexibility of the circuit board.
  • a heat sink with a certain three-dimensional shape is used, and a flexible printed circuit board, which is provided on a main surface with a plurality of LEDs, is laminated onto the surface of the heat sink deformed or curved in this way.
  • a flexible printed circuit board which is provided on a main surface with a plurality of LEDs, is laminated onto the surface of the heat sink deformed or curved in this way.
  • An LED module can e.g. as indicators, tail lights, brake lights or the like can be adapted to the outer contour of the vehicle to save space.
  • a particularly practical example of this type is a rotating beacon in which LED arrays are laminated on flexboards around a cylindrical heat sink.
  • the LED arrangement can preferably with its printed circuit board on a thermally highly conductive surface section of a device house or a car body or the like be upset.
  • the device housing or the car body or the like advantageously acts as a heat sink.
  • this leads to a lower technical manufacturing effort and to a weight saving.
  • These partial surface areas thus represent the heat sink in the sense of the present invention.
  • Fig. 1A shows a side view of a basic embodiment of the present invention, in which the circuit board of a surface-mounted LED arrangement is attached to a heat sink;
  • Fig.lB is a schematic representation of a possible structure of the thermally highly conductive layer and F ⁇ g.2A to C modified embodiments of the present invention with different shapes of heat sinks.
  • the basic embodiment shown in FIG. 1 contains a printed circuit board 1 on which a plurality of preferably surface-mountable LEDs 2 are applied.
  • the circuit board 1 m in a known manner has a circuit which has connection areas for the mounting of the LEDs at defined points. These connection surfaces are provided with solder eyes, for example, in a surface mount device (SMD) automatic placement machine, and in a subsequent assembly step, the LEDs 2 are soldered to these connection surfaces with their electrical contacts 2a.
  • SMD surface mount device
  • the circuit board 1 can be a rigid circuit board, for example of the FR4 type, and is therefore essentially made of an epoxy resin material. However, it can also be a flexible printed circuit board such as a flexboard described above.
  • the circuit board 1 is laminated with a heat-conducting adhesive onto a heat sink 3, which consists of a cooling plate consists of or is made of another metal such as copper or aluminum and thus has a high thermal conductivity.
  • the main surface of the circuit board 1 facing the heat sink is laminated with a thermally highly conductive layer 4, for example with a copper layer or another metal layer, in order to allow heat conduction in the lamination in the lamination to other adhesive points.
  • the copper layer can, for example, be meandering (FIG. 1B) in order to maintain the flexibility of the printed circuit board.
  • the side of the heat sink 3 facing away from the printed circuit board 1 is preferably designed such that the heat dissipation to the surroundings is maximized.
  • this surface is blackened and / or provided with cooling ribs and / or with another suitable surface structure or roughening.
  • FIGS. 2A to C show how the invention can be used advantageously to produce certain three-dimensional luminous bodies.
  • a heat sink 3 with a desired shape is first provided, in which a surface is to be formed as a luminous surface by applying an LED arrangement made of surface-mounted LEDs 2.
  • Fig. 2A shows, for example in a side view, any curvature of a heat sink 3, which can be used particularly advantageously for vehicle exterior lighting such as a turn signal, a tail light or a brake light and the like, since it can be adapted to the outer contour of the vehicle in a space-saving manner.
  • the heat sink can, for example, directly from a surface portion of a car body (z. B. the headlight or taillight area the fender) or a device house or the like.
  • an axial cross section of an all-round light is shown, as can be used, for example, in emergency emergency vehicles.
  • the flexboard 1 provided with an array of LEDs 2 is laminated around a cylindrical, hollow heat sink 3 shaped like a tube.
  • the LEDs of the array which run parallel to the axis can additionally be combined to form strings which are operated successively in a clockwise direction (see arrow), so that a circulating light is generated.
  • One line or a certain number of adjacent lines can be operated at the same time.
  • the LEDs 2 can also be provided with lenses 4 for bundling the emitted light. This embodiment has the great advantage that practically all mechanical parts are omitted, which were previously necessary for conventional design all-round lights.
  • a gas such as air or a cooling liquid can also flow through the cylindrical heat sink 3 to further improve the heat dissipation.
  • FIG. 2C shows a three-dimensionally curved light hood in a perspective view.
  • the light hood has a regular shape with an upper surface and four inclined side surfaces, of which two side surfaces are arranged axially symmetrical to each other.
  • the heat sink itself is not visible in the representation of FIG. 2C, since it is completely covered by the flexboard 1.
  • the flexboard 1 has a number of sectors corresponding to the surfaces of the heat sink, each of which has a plurality of LEDs 2 arranged to form an array. If desired, the LEDs 2 can be provided with lenses for bundling the emitted light.
  • Such a light hood can be used for all kinds of lighting purposes.

Abstract

L'invention concerne un groupe de diodes électroluminescentes montées en surface sur une platine (1), par exemple sur une carte souple, ledit groupe étant placé sur un dissipateur de chaleur (3) de sorte que la dissipation de chaleur soit optimale. Ce dissipateur de chaleur pouvant se présenter sous n'importe quelle forme souhaitée, il est possible de concevoir des lampes pour véhicules automobiles, par exemple des clignotants ou similaires, pouvant être adaptées au contour extérieur du véhicule. Dans le cas d'un gyrophare, on peut placer la platine (1) autour d'un dissipateur de chaleur se présentant sous la forme d'un corps creux cylindrique, et la faire fonctionner de manière rotative.
EP00943581A 1999-05-12 2000-05-12 Ensemble diodes electroluminescentes Withdrawn EP1177586A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19922176 1999-05-12
DE19922176A DE19922176C2 (de) 1999-05-12 1999-05-12 Oberflächenmontierte LED-Mehrfachanordnung und deren Verwendung in einer Beleuchtungseinrichtung
PCT/DE2000/001508 WO2000069000A1 (fr) 1999-05-12 2000-05-12 Ensemble diodes electroluminescentes

Publications (1)

Publication Number Publication Date
EP1177586A1 true EP1177586A1 (fr) 2002-02-06

Family

ID=7908017

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00943581A Withdrawn EP1177586A1 (fr) 1999-05-12 2000-05-12 Ensemble diodes electroluminescentes

Country Status (6)

Country Link
US (1) US6848819B1 (fr)
EP (1) EP1177586A1 (fr)
JP (2) JP2002544673A (fr)
KR (1) KR100629561B1 (fr)
DE (1) DE19922176C2 (fr)
WO (1) WO2000069000A1 (fr)

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WO2000069000A1 (fr) 2000-11-16
DE19922176A1 (de) 2000-11-23
KR100629561B1 (ko) 2006-09-27
KR20010114260A (ko) 2001-12-31
JP2002544673A (ja) 2002-12-24
JP2012080127A (ja) 2012-04-19
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