EP1177586A1 - Light-emitting diode arrangement - Google Patents

Light-emitting diode arrangement

Info

Publication number
EP1177586A1
EP1177586A1 EP00943581A EP00943581A EP1177586A1 EP 1177586 A1 EP1177586 A1 EP 1177586A1 EP 00943581 A EP00943581 A EP 00943581A EP 00943581 A EP00943581 A EP 00943581A EP 1177586 A1 EP1177586 A1 EP 1177586A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
heat sink
led arrangement
leds
arrangement according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00943581A
Other languages
German (de)
French (fr)
Inventor
Karlheinz Arndt
Günter Waitl
Georg Bogner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7908017&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP1177586(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of EP1177586A1 publication Critical patent/EP1177586A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F21/00—Mobile visual advertising
    • G09F21/04—Mobile visual advertising by land vehicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S10/00—Lighting devices or systems producing a varying lighting effect
    • F21S10/06—Lighting devices or systems producing a varying lighting effect flashing, e.g. with rotating reflector or light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Definitions

  • the invention relates to an LED arrangement according to the preamble of claim 1, which in particular can be installed in a luminaire housing, as can be used, for example, in exterior lights of motor vehicles.
  • LEDs light emission diodes
  • incandescent lamps since LEDs have a longer service life, better efficiency when converting electrical energy into radiation energy in the visible spectral range and associated with it a lower heat emission and overall less space requirement.
  • a certain additional effort must first be made, because due to the low luminance of an individual LED compared to an incandescent lamp, a plurality of LEDs shaped into an array must be constructed.
  • Such an array can be mounted, for example, in surface mounting technology (SMT) from a plurality of LEDs on a printed circuit board (PCB, pnnted circuit board).
  • SMT surface mounting technology
  • PCB printed circuit board
  • An LED design is used, such as that used in connection with the article "SIEMENS SMT-TOPLED for surface mounting" by F. Mollmer and G. Waitl in the magazine Siemens Components 29 (1991), No. 4, p. 147 Image 1 is described.
  • This form of the LED is extremely compact and, if necessary, allows the arrangement of a large number of such LEDs in a row or matrix arrangement.
  • the thermal resistance is still relatively low (for example approx. 180 K / W for an LED of the Power TOPLED ® type ).
  • Heat is emitted by all heat-generating components on the circuit board, including series resistors, transistors, MOS-FETs or control ICs that are located in the immediate vicinity of the LEDs.
  • the operating current must be reduced so that the component is not destroyed as a result of the generation of heat on the circuit board and the poor heat dissipation. As a result, the light output of the LEDs cannot be fully used.
  • LED arrangements for the third brake light are used in the area of motor vehicle lighting already mentioned. This is a one-line array, in which the thermal problems are not yet so heavy.
  • an LED arrangement is to be made available, with which various spatial shapes of three-dimensional luminous bodies can be easily realized.
  • an LED arrangement is provided with a circuit board and a plurality of LEDs which are particularly preferably surface-mounted on the circuit board, the circuit board having its side facing away from the LEDs being applied to a heat sink and having a highly heat-conducting layer on this side.
  • the invention is therefore based on the finding that, in particular in the case of a surface-mounted LED arrangement of high LED density, the heat dissipation to the rear must be supported.
  • the heat sink can e.g. consist of copper or aluminum or of a cooling plate and the circuit board is preferably attached to it with a heat-conducting paste, a heat-conducting adhesive, a heat-conducting film or the like. On the back it should enable the best possible heat radiation. For this purpose it can be painted black, for example, and / or have cooling fins and / or a rough surface.
  • the circuit board should be as thin as possible, since the plastic material from which it is constructed is generally poorly conducting the warmth.
  • the circuit board can be a flexible circuit board, for example.
  • the flexible circuit board is usually made of a flexible plastic.
  • it can consist of a polyester or polyimide film.
  • the use of so-called flexboards known per se in the prior art is particularly preferred. These flexboards are generally multi-layer printed circuit boards which are built up homogeneously from a plurality of poly carrier foils.
  • the copper pads around the solder surfaces of LEDs with surface (SMT) mounting technology should be as large as possible in order to broaden the warm path through the circuit board material before the heat flows to the back of the circuit board.
  • the main surface of the printed circuit board facing the heat sink is preferably laminated with copper or another metal, in order to enable heat conduction in the lamination of the lamination transversely to other adhesive points.
  • the copper layer can be structured, for example, in a meandering shape laterally to the circuit board in order to maintain the flexibility of the circuit board.
  • a heat sink with a certain three-dimensional shape is used, and a flexible printed circuit board, which is provided on a main surface with a plurality of LEDs, is laminated onto the surface of the heat sink deformed or curved in this way.
  • a flexible printed circuit board which is provided on a main surface with a plurality of LEDs, is laminated onto the surface of the heat sink deformed or curved in this way.
  • An LED module can e.g. as indicators, tail lights, brake lights or the like can be adapted to the outer contour of the vehicle to save space.
  • a particularly practical example of this type is a rotating beacon in which LED arrays are laminated on flexboards around a cylindrical heat sink.
  • the LED arrangement can preferably with its printed circuit board on a thermally highly conductive surface section of a device house or a car body or the like be upset.
  • the device housing or the car body or the like advantageously acts as a heat sink.
  • this leads to a lower technical manufacturing effort and to a weight saving.
  • These partial surface areas thus represent the heat sink in the sense of the present invention.
  • Fig. 1A shows a side view of a basic embodiment of the present invention, in which the circuit board of a surface-mounted LED arrangement is attached to a heat sink;
  • Fig.lB is a schematic representation of a possible structure of the thermally highly conductive layer and F ⁇ g.2A to C modified embodiments of the present invention with different shapes of heat sinks.
  • the basic embodiment shown in FIG. 1 contains a printed circuit board 1 on which a plurality of preferably surface-mountable LEDs 2 are applied.
  • the circuit board 1 m in a known manner has a circuit which has connection areas for the mounting of the LEDs at defined points. These connection surfaces are provided with solder eyes, for example, in a surface mount device (SMD) automatic placement machine, and in a subsequent assembly step, the LEDs 2 are soldered to these connection surfaces with their electrical contacts 2a.
  • SMD surface mount device
  • the circuit board 1 can be a rigid circuit board, for example of the FR4 type, and is therefore essentially made of an epoxy resin material. However, it can also be a flexible printed circuit board such as a flexboard described above.
  • the circuit board 1 is laminated with a heat-conducting adhesive onto a heat sink 3, which consists of a cooling plate consists of or is made of another metal such as copper or aluminum and thus has a high thermal conductivity.
  • the main surface of the circuit board 1 facing the heat sink is laminated with a thermally highly conductive layer 4, for example with a copper layer or another metal layer, in order to allow heat conduction in the lamination in the lamination to other adhesive points.
  • the copper layer can, for example, be meandering (FIG. 1B) in order to maintain the flexibility of the printed circuit board.
  • the side of the heat sink 3 facing away from the printed circuit board 1 is preferably designed such that the heat dissipation to the surroundings is maximized.
  • this surface is blackened and / or provided with cooling ribs and / or with another suitable surface structure or roughening.
  • FIGS. 2A to C show how the invention can be used advantageously to produce certain three-dimensional luminous bodies.
  • a heat sink 3 with a desired shape is first provided, in which a surface is to be formed as a luminous surface by applying an LED arrangement made of surface-mounted LEDs 2.
  • Fig. 2A shows, for example in a side view, any curvature of a heat sink 3, which can be used particularly advantageously for vehicle exterior lighting such as a turn signal, a tail light or a brake light and the like, since it can be adapted to the outer contour of the vehicle in a space-saving manner.
  • the heat sink can, for example, directly from a surface portion of a car body (z. B. the headlight or taillight area the fender) or a device house or the like.
  • an axial cross section of an all-round light is shown, as can be used, for example, in emergency emergency vehicles.
  • the flexboard 1 provided with an array of LEDs 2 is laminated around a cylindrical, hollow heat sink 3 shaped like a tube.
  • the LEDs of the array which run parallel to the axis can additionally be combined to form strings which are operated successively in a clockwise direction (see arrow), so that a circulating light is generated.
  • One line or a certain number of adjacent lines can be operated at the same time.
  • the LEDs 2 can also be provided with lenses 4 for bundling the emitted light. This embodiment has the great advantage that practically all mechanical parts are omitted, which were previously necessary for conventional design all-round lights.
  • a gas such as air or a cooling liquid can also flow through the cylindrical heat sink 3 to further improve the heat dissipation.
  • FIG. 2C shows a three-dimensionally curved light hood in a perspective view.
  • the light hood has a regular shape with an upper surface and four inclined side surfaces, of which two side surfaces are arranged axially symmetrical to each other.
  • the heat sink itself is not visible in the representation of FIG. 2C, since it is completely covered by the flexboard 1.
  • the flexboard 1 has a number of sectors corresponding to the surfaces of the heat sink, each of which has a plurality of LEDs 2 arranged to form an array. If desired, the LEDs 2 can be provided with lenses for bundling the emitted light.
  • Such a light hood can be used for all kinds of lighting purposes.

Abstract

The invention relates to a light-emitting diode array that is surface-mounted on a board (1), such as a flexible board. The light-emitting diode array is mounted on a heat sink (3), so that the heat can be dissipated in an optimal manner. Said heat sink can take any form desired so that it is possible to design motor vehicle lamps, such as indicator lamps or similar, that can be adapted to the outer contour of the vehicle. In the case of a rotating lamp, the board (1) can be mounted around a heat sink that is configured as a cylindrical hollow body and can be operated rotationally.

Description

Beschreibungdescription
LED-AnordnungLED arrangement
Die Erfindung betrifft eine LED-Anordnung nach dem Oberbegriff des Patentanspruches 1, welche insbesondere m ein Leuchtengehause eingebaut werden kann, wie es beispielsweise bei Außenleuchten von Kraftfahrzeugen verwendet werden kann.The invention relates to an LED arrangement according to the preamble of claim 1, which in particular can be installed in a luminaire housing, as can be used, for example, in exterior lights of motor vehicles.
Im Bereich der Außen- und Innenbeleuchtung von Kraftfahrzeugen, insbesondere für Rücklichter oder Bremsleuchten und dergleichen werden m zunehmendem Maße Lichtemissionsdioden (LEDs) anstelle der konventionellen Glühlampen eingesetzt, da LEDs eine längere Lebensdauer, einen besseren Wirkungsgrad bei der Umwandlung elektrischer Energie m Strahlungsenergie im sichtbaren Spektralbereich und damit verbunden eine geringere Wärmeabgabe und insgesamt geringeren Platzbedarf aufweisen. Im Aufbau muß jedoch zunächst ein gewisser Mehraufwand getrieben werden, denn aufgrund der geringen Leuchtdichte ei- ner einzelnen LED im Vergleich zu einer Glühlampe muß eine zu einem Array geformte Mehrzahl von LEDs aufgebaut werden.In the field of exterior and interior lighting of motor vehicles, in particular for taillights or brake lights and the like, light emission diodes (LEDs) are being used to an increasing extent instead of conventional incandescent lamps, since LEDs have a longer service life, better efficiency when converting electrical energy into radiation energy in the visible spectral range and associated with it a lower heat emission and overall less space requirement. In the construction, however, a certain additional effort must first be made, because due to the low luminance of an individual LED compared to an incandescent lamp, a plurality of LEDs shaped into an array must be constructed.
Ein derartiges Array kann beispielsweise m der Oberflachen- nαontagetechnik (SMT, surface mount technology) aus einer Mehrzahl von LEDs auf einer Leiterplatte (PCB, pπnted cir- cuit board) montiert werden. Dabei wird eine LED-Bauform verwendet, wie sie beispielsweise m dem Artikel "SIEMENS SMT- TOPLED für die Oberflachenmontage" von F. Mollmer und G. Waitl m der Zeitschrift Siemens Components 29 (1991), Heft 4, S. 147 im Zusammenhang mit Bild 1 beschrieben ist. Diese Form der LED ist äußerst kompakt und erlaubt gegebenenfalls die Anordnung einer Vielzahl von derartigen LEDs m einer Reihen- oder Matrixanordnung.Such an array can be mounted, for example, in surface mounting technology (SMT) from a plurality of LEDs on a printed circuit board (PCB, pnnted circuit board). An LED design is used, such as that used in connection with the article "SIEMENS SMT-TOPLED for surface mounting" by F. Mollmer and G. Waitl in the magazine Siemens Components 29 (1991), No. 4, p. 147 Image 1 is described. This form of the LED is extremely compact and, if necessary, allows the arrangement of a large number of such LEDs in a row or matrix arrangement.
Innerhalb des Gehäuses einer derartigen LED, die beispielsweise auf der Basis von InGaAlP aufgebaut ist und gelb- oder bernsteinfarbenes Licht emittiert, wird jedoch nur etwa 5% der elektrischen Leistung m Form von Licht umgewandelt, wahrend etwa 95% m Form von Warme umgesetzt wird. Diese Warme wird von der Chipunterseite über die elektrischen Anschlüsse des Bauteils abgeführt. Je nach der Bauform wird bei den von der Anmeldeπn bekannten Bauelementen unter den Bezeichnungen TOPLED oder Power TOPLED die Warme entweder durch einen oder drei vorhandene Kathodenanschlusse zunächst aus dem Gehäuse auf die Lotpunkte auf der Leiterplatte gefuhrt. Von den Lotpunkten breitet sich die Warme zunächst hauptsachlich m den Kupferpads und dann m dem Epoxidharzmaterial m der Ebene der Leiterplatte aus. Anschließend wird die Warme durch War- mestrahlung und Warmekonvektion großflächig an die Umgebung abgegeben. Im Falle einer einzelnen LED auf FR4-Platmenmate- rial ist der Warmewiderstand noch relativ gering (beispielsweise ca. 180 K/W bei einer LED vom Typ Power TOPLED®) .However, only about 5% of the electrical power is converted into light within the housing of such an LED, which is built, for example, based on InGaAlP and emits yellow or amber-colored light, while around 95% is converted into heat. This warmth is dissipated from the underside of the chip via the electrical connections of the component. Depending on the design, in the components known from the application under the names TOPLED or Power TOPLED, the heat is first led from the housing to the solder points on the circuit board either through one or three existing cathode connections. The heat first spreads from the solder points mainly to the copper pads and then to the epoxy resin material in the plane of the circuit board. The heat is then emitted to the environment over a large area by heat radiation and warm convection. In the case of a single LED on FR4 platform material, the thermal resistance is still relatively low (for example approx. 180 K / W for an LED of the Power TOPLED ® type ).
Anders verhalt es sich jedoch, wenn viele LEDs dicht nebeneinander auf einer Platine angeordnet sind. Für jede einzelne LED steht jetzt eine geringere anteilige Flache auf dem PCB für die Wärmeübertragung an die Umgebung zur Verf gung. Dementsprechend hoher ist der Warmewiderstand von dem PCB auf die Umgebung. Bei einem Bauteilabstand von beispielsweise 6, 5mm steigt der Warmewiderstand auf bis zu 550K/W an, wenn die LEDs von dem Typ Power TOPLED und die Leiterplatte von However, the situation is different when many LEDs are arranged close to each other on a circuit board. For each individual LED there is now a smaller proportion of the area on the PCB for heat transfer to the environment. The thermal resistance from the PCB to the environment is correspondingly higher. With a component distance of, for example, 6.5 mm, the thermal resistance rises to up to 550 K / W if the LEDs of the Power TOPLED type and the printed circuit board of
Eine Wärmeabgabe geht von allen warmeerzeugenden Bauteilen auf der Platine aus, also auch von Vorwiderstanden, Transistoren, MOS-FETs oder Ansteuer-ICs, die sich m unmittelbarer Umgebung der LEDs befinden. Damit es infolge der Warmeerzeugung auf der Platine und der mangelhaften Warmeabfuhr nicht zu einer Zerstörung des Bauteils kommt, muß der Betriebsstrom reduziert werden. Folglich kann die Lichtleistung der LEDs nicht voll genutzt werden.Heat is emitted by all heat-generating components on the circuit board, including series resistors, transistors, MOS-FETs or control ICs that are located in the immediate vicinity of the LEDs. The operating current must be reduced so that the component is not destroyed as a result of the generation of heat on the circuit board and the poor heat dissipation. As a result, the light output of the LEDs cannot be fully used.
In dem bereits erwähnten Bereich der Beleuchtung von Kraft- fahrzeugen werden LED-Anordnungen für das dritte Bremslicht eingesetzt. Dieses ist ein einzeiliges Array, bei welchem die thermischen Probleme noch nicht so stark ms Gewicht fallen.LED arrangements for the third brake light are used in the area of motor vehicle lighting already mentioned. This is a one-line array, in which the thermal problems are not yet so heavy.
Es ist daher Aufgabe der vorliegenden Erfindung, eine LED- Anordnung der eingangs genannten Art derart weiterzubilden, daß die Lichtleistung der LEDs möglichst optimal genutzt werden kann. Insbesondere ist es Aufgabe der vorliegenden Erfindung, eine oberflachenmontierte LED-Anordnung anzugeben, die sich durch eine verbesserte Warmeabfuhr von den LEDs aus- zeichnet. Daneben soll eine LED-Anordnung zur Verfugung gestellt werden, mit der auf einfache Weise verschiedene räumliche Formen von dreidimensionalen Leuchtkorpern realisierbar sind.It is therefore an object of the present invention to develop an LED arrangement of the type mentioned at the outset in such a way that that the light output of the LEDs can be used as optimally as possible. In particular, it is an object of the present invention to provide a surface-mounted LED arrangement which is distinguished by improved heat dissipation from the LEDs. In addition, an LED arrangement is to be made available, with which various spatial shapes of three-dimensional luminous bodies can be easily realized.
Diese Aufgabe wird durch eine LED-Anordnung mit den Merkmalen des Patentanspruchs 1 gelost. Die weitergehende Aufgabe wird durch eine LED-Anordnung mit den Merkmalen des Patentanspruchs 7 gelost. Vorteilhafte Weiterbildungen der Erfindung und bevorzugte Beleuchtungseinrichtungen mit erfmdungsgema- ßen LED-Anordnungen sind Gegenstand der Patentansprüche 2 bis 6 und 8 bis 16.This object is achieved by an LED arrangement with the features of claim 1. The further task is solved by an LED arrangement with the features of claim 7. Advantageous developments of the invention and preferred lighting devices with LED arrangements according to the invention are the subject of claims 2 to 6 and 8 to 16.
Gemäß der Erfindung ist eine LED-Anordnung mit einer Leiterplatte und einer Mehrzahl von auf der Leiterplatte besonders bevorzugt oberflachenmontierten LEDs vorgesehen, wobei die Leiterplatte mit ihrer den LEDs abgewandten Seite auf einen Kühlkörper aufgebracht ist und auf dieser Seite eine gut wärmeleitende Schicht aufweist. Der Erfindung liegt somit die Erkenntnis zugrunde, daß insbesondere bei einer oberflachen- montierten LED-Anordnung hoher LED-Dichte die Wärmeableitung nach hinten unterstutzt werden muß.According to the invention, an LED arrangement is provided with a circuit board and a plurality of LEDs which are particularly preferably surface-mounted on the circuit board, the circuit board having its side facing away from the LEDs being applied to a heat sink and having a highly heat-conducting layer on this side. The invention is therefore based on the finding that, in particular in the case of a surface-mounted LED arrangement of high LED density, the heat dissipation to the rear must be supported.
Der Kühlkörper kann z.B. aus Kupfer oder Aluminium oder aus einem Kuhlblech bestehen und die Leiterplatte wird vorzugs- weise mit einer Warmeleitpaste, einem Warmeleitkleber, einer Warmeleitfolie oder dergleichen auf ihm befestigt. Auf seiner Ruckseite soll er eine möglichst gute Warmeabstrahlung ermöglichen. Zu diesem Zweck kann er beispielsweise schwarz angestrichen sein und/oder Kuhlrippen und/oder eine rauhe Ober- flache aufweisen.The heat sink can e.g. consist of copper or aluminum or of a cooling plate and the circuit board is preferably attached to it with a heat-conducting paste, a heat-conducting adhesive, a heat-conducting film or the like. On the back it should enable the best possible heat radiation. For this purpose it can be painted black, for example, and / or have cooling fins and / or a rough surface.
Ferner sollte die Leiterplatte möglichst dünn sein, da das Kunststoffmaterial, aus dem sie aufgebaut ist, im allgemeinen die Warme schlecht leitet. Die Leiterplatte kann zum Beispiel eine flexible Leiterplatte sein. Die flexible Leiterplatte ist in der Regel aus einem flexiblen Kunststoff hergestellt. Sie kann beispielsweise aus einer Polyester- oder Polyimidfo- lie bestehen. Besonders bevorzugt ist die Verwendung sogenannter, an sich im Stand der Technik bekannter Flexboards . Diese Flexboards sind im allgemeinen mehrlagige Leiterplatten, die homogen aus einer Mehrzahl von Polyi idtragerfolien aufgebaut sind.Furthermore, the circuit board should be as thin as possible, since the plastic material from which it is constructed is generally poorly conducting the warmth. The circuit board can be a flexible circuit board, for example. The flexible circuit board is usually made of a flexible plastic. For example, it can consist of a polyester or polyimide film. The use of so-called flexboards known per se in the prior art is particularly preferred. These flexboards are generally multi-layer printed circuit boards which are built up homogeneously from a plurality of poly carrier foils.
Weiterhin sollten die Kupferpads um die Lotflachen von mit Oberflachen (SMT) -Montagetechnik aufgebrachten LEDs so groß wie möglich sein, um den Warmepfad durch das Leiterplattenma- teπal zu verbreitern, bevor die Warme zur Ruckseite der Lei- terplatte fließt. Vorzugsweise ist die dem Kühlkörper zugewandte Hauptflache der Leiterplatte mit Kupfer oder einem anderen Metall kaschiert, um bei Lunkern m der Laminierung noch Warmeleitung quer zu anderen Klebestellen zu ermöglichen. Die Kupferschicht kann lateral zur Leiterplatte bei- spielsweise maanderformig strukturiert sein, um die Flexibilität der Leiterplatte zu erhalten.Furthermore, the copper pads around the solder surfaces of LEDs with surface (SMT) mounting technology should be as large as possible in order to broaden the warm path through the circuit board material before the heat flows to the back of the circuit board. The main surface of the printed circuit board facing the heat sink is preferably laminated with copper or another metal, in order to enable heat conduction in the lamination of the lamination transversely to other adhesive points. The copper layer can be structured, for example, in a meandering shape laterally to the circuit board in order to maintain the flexibility of the circuit board.
Bei einer erfmdungsgemaßen LED-Anordnung ist ein Kühlkörper mit einer bestimmten dreidimensionalen Form verwendet und ei- ne flexible Leiterplatte, die auf einer Hauptflache mit einer Mehrzahl von LEDs versehen ist, wird auf die solchermaßen verformte oder gekrümmte Oberflache des Kühlkörpers auflaminiert. Dadurch können aufgrund bestimmter Vorgaben raumlich geformte LED-Module hergestellt werden. Ein LED-Modul kann z.B. als Blinker, Rücklicht, Bremsleuchte oder dergleichen platzsparend an die Außenkontur des Fahrzeugs angepaßt werden. Ein besonders praktisches Ausfuhrungsbeispiel dieser Art ist eine Rundumleuchte, bei der LED-Arrays auf Flexboards um einen zylindrischen Kühlkörper laminiert werden.In the case of an LED arrangement according to the invention, a heat sink with a certain three-dimensional shape is used, and a flexible printed circuit board, which is provided on a main surface with a plurality of LEDs, is laminated onto the surface of the heat sink deformed or curved in this way. As a result, spatially shaped LED modules can be produced based on certain specifications. An LED module can e.g. as indicators, tail lights, brake lights or the like can be adapted to the outer contour of the vehicle to save space. A particularly practical example of this type is a rotating beacon in which LED arrays are laminated on flexboards around a cylindrical heat sink.
Die LED-Anordnung kann vorzugsweise mit ihrer Leiterplatte auf einen thermisch gut leitenden Oberflächen-Teilbereich eines Gerategehauses oder einer Autokarosserie oder dergleichen aufgebracht sein. Hierbei wirkt vorteilhafterweise das Gera- tegehause bzw. die Autokarosserie oder dergleichen als Kühlkörper. Dies fuhrt unter anderem zu einem geringeren technischen Herstellungsaufwand und zu einem Gewichtsersparnis. Diese Oberflächen-Teilbereich stellen damit den Kühlkörper im Sinne der vorliegenden Erfindung dar.The LED arrangement can preferably with its printed circuit board on a thermally highly conductive surface section of a device house or a car body or the like be upset. In this case, the device housing or the car body or the like advantageously acts as a heat sink. Among other things, this leads to a lower technical manufacturing effort and to a weight saving. These partial surface areas thus represent the heat sink in the sense of the present invention.
Weitere vorteilhafte Weiterbildungen und bevorzugte Ausfuhrungsformen werden im Folgenden anhand von Ausfuhrungsbei- spielen m Verbindung mit den Figuren 1A bis 2C naher erläutert. Es zeigen:Further advantageous developments and preferred embodiments are explained in more detail below with reference to exemplary embodiments in conjunction with FIGS. 1A to 2C. Show it:
Fig.lA eine Seitenansicht einer grundlegenden Ausfuhrungsform der vorliegenden Erfindung, bei der die Leiterplatte einer oberflachenmontierten LED-Anordnung an einen Kühlkörper befestigt wird;Fig. 1A shows a side view of a basic embodiment of the present invention, in which the circuit board of a surface-mounted LED arrangement is attached to a heat sink;
Fig.lB eine schematische Darstellung einer möglichen Struktur der thermisch gut leitenden Schicht und Fιg.2A bis C modifizierte Ausfuhrungsformen der vorliegenden Erfindung mit unterschiedlichen Formen von Kühlkörpern.Fig.lB is a schematic representation of a possible structure of the thermally highly conductive layer and Fιg.2A to C modified embodiments of the present invention with different shapes of heat sinks.
Die m Fig.l dargestellte grundlegende Ausfuhrungsform enthalt eine Leiterplatte 1, auf der eine Mehrzahl bevorzugt oberflachenmontierbarer LEDs 2 durch aufgebracht sind. Dabei weist die Leiterplatte 1 m bekannter Weise eine Schaltung auf, die an definierten Stellen Anschlußflachen für die Montage der LEDs aufweist. Diese Anschlußflachen werden beispielsweise m einem Surface Mount Device (SMD) -Bestuckungs- automaten mit Lotaugen versehen und m einem anschließenden Montageschritt werden die LEDs 2 mit ihren elektrischen Kontakten 2a an diese Anschlußflachen angelotet.The basic embodiment shown in FIG. 1 contains a printed circuit board 1 on which a plurality of preferably surface-mountable LEDs 2 are applied. The circuit board 1 m in a known manner has a circuit which has connection areas for the mounting of the LEDs at defined points. These connection surfaces are provided with solder eyes, for example, in a surface mount device (SMD) automatic placement machine, and in a subsequent assembly step, the LEDs 2 are soldered to these connection surfaces with their electrical contacts 2a.
Die Leiterplatte 1 kann dabei eine starre Leiterplatte, beispielsweise vom Typ FR4 sein und ist demnach im wesentlichen aus einem Epoxidharzmaterial aufgebaut. Sie kann aber auch eine flexible Leiterplatte wie ein oben beschriebenes Flex- board sein. Die Leiterplatte 1 wird mit einem Warmeleitkleber auf einen Kühlkörper 3 auflaminiert, der aus einem Kuhlblech besteht oder aus einem anderen Metall wie Kupfer oder Aluminium gefertigt ist und damit eine hohe Wärmeleitfähigkeit aufweist.The circuit board 1 can be a rigid circuit board, for example of the FR4 type, and is therefore essentially made of an epoxy resin material. However, it can also be a flexible printed circuit board such as a flexboard described above. The circuit board 1 is laminated with a heat-conducting adhesive onto a heat sink 3, which consists of a cooling plate consists of or is made of another metal such as copper or aluminum and thus has a high thermal conductivity.
Die dem Kühlkörper zugewandte Hauptfläche der Leiterplatte 1 ist mit einer thermisch gut leitenden Schicht 4, beispielsweise mit einer Kupferschicht oder einer anderen Metallschicht kaschiert, um bei Lunkern in der Laminierung noch Wärmeleitung quer zu anderen Klebestellen zu ermöglichen. Die Kupferschicht kann beispielsweise maanderformig (Figur 1B) sein, um die Flexibilität der Leiterplatte zu erhalten.The main surface of the circuit board 1 facing the heat sink is laminated with a thermally highly conductive layer 4, for example with a copper layer or another metal layer, in order to allow heat conduction in the lamination in the lamination to other adhesive points. The copper layer can, for example, be meandering (FIG. 1B) in order to maintain the flexibility of the printed circuit board.
Die der Leiterplatte 1 abgewandte Seite des Kühlkörpers 3 ist vorzugsweise derart gestaltet, daß die Wärmeabgabe an die Um- gebung maximiert wird. Zu diesem Zweck ist diese Oberflache geschwärzt und/oder mit Kuhlrippen versehen und/oder mit einer anderen geeigneten Oberflachenstruktur oder -aufrauhung ausgeführt.The side of the heat sink 3 facing away from the printed circuit board 1 is preferably designed such that the heat dissipation to the surroundings is maximized. For this purpose, this surface is blackened and / or provided with cooling ribs and / or with another suitable surface structure or roughening.
In Fig.2A bis C ist gezeigt, wie die Erfindung vorteilhaft genutzt werden kann, um bestimmte dreidimensionale Leuchtkor- per herzustellen. In allen gezeigten Fallen wird zunächst ein Kühlkörper 3 mit einer gewünschten Form bereitgestellt, bei dem eine Oberflache durch Aufbringen einer LED-Anordnung aus oberflachenmontierten LEDs 2 als Leuchtflache ausgebildet werden soll. Sodann wird eine flexible Leiterplatte 1 wie ein Flexboard, welches mit einem Array von LEDs 2 versehen ist, auf den Kühlkörper 3 auflaminiert .2A to C show how the invention can be used advantageously to produce certain three-dimensional luminous bodies. In all the cases shown, a heat sink 3 with a desired shape is first provided, in which a surface is to be formed as a luminous surface by applying an LED arrangement made of surface-mounted LEDs 2. A flexible printed circuit board 1, such as a flexboard, which is provided with an array of LEDs 2, is then laminated onto the heat sink 3.
Fιg.2A zeigt beispielsweise in einer Seitenansicht eine beliebige Krümmung eines Kühlkörpers 3, die besonders vorteilhaft für eine Fahrzeugaußenbeleuchtung wie einen Blinker, ein Rucklicht oder eine Bremsleuchte und dergleichen verwendet werden kann, da sie platzsparend an die Außenkontur des Fahr- zeugs angepaßt werden kann. Der Kühlkörper kann beispielsweise unmittelbar von einem Oberflächen-Teilbereich einer Autokarosserie (z. B. der Scheinwerfer- oder Ruckleuchtenbereich der Kotflügel) oder eines Gerategehauses oder dergleichen gebildet sein.Fig. 2A shows, for example in a side view, any curvature of a heat sink 3, which can be used particularly advantageously for vehicle exterior lighting such as a turn signal, a tail light or a brake light and the like, since it can be adapted to the outer contour of the vehicle in a space-saving manner. The heat sink can, for example, directly from a surface portion of a car body (z. B. the headlight or taillight area the fender) or a device house or the like.
In dem Ausfuhrungsbeispiel der Fιg.2B ist ein achsialer Quer- schnitt einer Rundumleuchte dargestellt, wie sie beispielsweise bei Notfall-Emsatzfahrzeugen verwendet werden kann. Bei der Rundumleuchte der Fιg.2B ist das mit einem Array aus LEDs 2 versehene Flexboard 1 um einen wie ein Rohr geformten zylindrischen, hohlen Kühlkörper 3 laminiert. In diesem Aus- fuhrungsbeispiel können zusatzlich die achsenparallel verlaufenden LEDs des Arrays zu Strängen zusammengefaßt sein, die nacheinander im Uhrzeigersinn (siehe Pfeil) betrieben werden, so daß ein umlaufendes Licht erzeugt wird. Zu einem Zeitpunkt können dabei ein Strang oder eine bestimmte Anzahl benachbar- ter Strange gleichzeitig betrieben werden. Die LEDs 2 können zudem zur Bündelung des abgestrahlten Lichts mit Linsen 4 versehen sein. Diese Ausfuhrungsform hat den großen Vorteil, daß praktisch alle mechanischen Teile wegfallen, die bisher für Rundumleuchten konventioneller Bauart notwendig sind. Ge- wunschtenfalls kann der zylindrische Kühlkörper 3 auch noch zur weiteren Verbesserung der Warmeabfuhr von einem Gas wie Luft oder einer Kuhlflussigkeit durchströmt werden.In the exemplary embodiment of FIG. 2B, an axial cross section of an all-round light is shown, as can be used, for example, in emergency emergency vehicles. In the rotating light of FIG. 2B, the flexboard 1 provided with an array of LEDs 2 is laminated around a cylindrical, hollow heat sink 3 shaped like a tube. In this exemplary embodiment, the LEDs of the array which run parallel to the axis can additionally be combined to form strings which are operated successively in a clockwise direction (see arrow), so that a circulating light is generated. One line or a certain number of adjacent lines can be operated at the same time. The LEDs 2 can also be provided with lenses 4 for bundling the emitted light. This embodiment has the great advantage that practically all mechanical parts are omitted, which were previously necessary for conventional design all-round lights. If desired, a gas such as air or a cooling liquid can also flow through the cylindrical heat sink 3 to further improve the heat dissipation.
In Fιg.2C ist m einer perspektivischen Ansicht eine dreidi- mensional gewölbte Lichthaube dargestellt. Die Lichthaube weist eine regelmäßige Form mit einer oberen Flache und vier schraggestellten Seitenflachen auf, von denen jeweils zwei Seitenflächen achsensymmetrisch zueinander angeordnet sind. In der Darstellung der Fιg.2C ist der Kühlkörper selbst nicht sichtbar, da er vollständig von dem Flexboard 1 abgedeckt ist. Das Flexboard 1 weist eine der Flachen des Kühlkörpers entsprechende Anzahl von Sektoren auf, m denen jeweils eine Vielzahl von zu einem Array angeordneten LEDs 2 montiert sind. Die LEDs 2 können gewunschtenfalls mit Linsen zur Bun- delung des abgestrahlten Lichts versehen sein. Eine derartige Lichthaube kann für Beleuchtungszwecke aller Art eingesetzt werden. FIG. 2C shows a three-dimensionally curved light hood in a perspective view. The light hood has a regular shape with an upper surface and four inclined side surfaces, of which two side surfaces are arranged axially symmetrical to each other. The heat sink itself is not visible in the representation of FIG. 2C, since it is completely covered by the flexboard 1. The flexboard 1 has a number of sectors corresponding to the surfaces of the heat sink, each of which has a plurality of LEDs 2 arranged to form an array. If desired, the LEDs 2 can be provided with lenses for bundling the emitted light. Such a light hood can be used for all kinds of lighting purposes.

Claims

Patentansprüche claims
1. LED-Anordnung mit einer Leiterplatte (1) und - einer Mehrzahl von LEDs (2), die auf einer Hauptflache der Leiterplatte (1) angeordnet sind, d a d u r c h g e k e n n z e i c h n e t, daß die Leiterplatte (1) mit ihrer von den LEDs (2) abgewandten Seite mit einem Kühlkörper (3) verbunden ist und - die Leiterplatte (1) auf ihrer dem Kühlkörper (3) zugewandten Hauptflache mit einer thermisch gut leitenden Schicht (4) , insbesondere einer Schicht aus Kupfer oder einem anderen Metall mit guter Wärmeleitfähigkeit versehen1. LED arrangement with a circuit board (1) and - a plurality of LEDs (2) which are arranged on a main surface of the circuit board (1), characterized in that the circuit board (1) with its facing away from the LEDs (2) Side is connected to a heat sink (3) and - the circuit board (1) on its main surface facing the heat sink (3) is provided with a thermally highly conductive layer (4), in particular a layer of copper or another metal with good thermal conductivity
2. LED-Anordnung nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t, daß die Leiterplatte (1) eine flexible Leiterplatte, insbesondere ein Flexboard ist.2. LED arrangement according to claim 1, d a d u r c h g e k e n n z e i c h n e t that the circuit board (1) is a flexible circuit board, in particular a flexboard.
3. LED-Anordnung nach Anspruch 1 oder 2, d a d u r c h g e k e n n z e i c h n e t, daß die thermisch gut leitende Schicht (4) eine maanderartige oder dergleichen laterale Struktur aufweist.3. LED arrangement according to claim 1 or 2, so that the thermally well-conductive layer (4) has a meandering or the like lateral structure.
4. LED-Anordnung nach einem der Ansprüche 1 bis 3, d a d u r c h g e k e n n z e i c h n e t, daß der Kühlkörper (3) aus Metall, insbesondere aus Kupfer oder Aluminium oder einem Blech besteht.4. LED arrangement according to one of claims 1 to 3, d a d u r c h g e k e n n z e i c h n e t that the heat sink (3) consists of metal, in particular copper or aluminum or a sheet metal.
5. LED-Anordnung nach einem der Ansprüche 1 bis 4, d a d u r c h g e k e n n z e i c h n e t, daß die der Leiterplatte (1) abgewandte Oberflache des Kühlkörpers (3) geschwärzt ist und/oder Kuhlrippen und/oder eine Oberflachenaufrauhung aufweist.5. LED arrangement according to one of claims 1 to 4, so that the surface of the heat sink (3) facing away from the circuit board (1) is blackened and / or cooling fins and / or a surface roughening.
6. LED-Anordnung nach einem der Ansprüche 1 bis 5, d a d u r c h g e k e n n z e i c h n e t, daß die LEDs (2) mit Linsen (4) versehen sind.6. LED arrangement according to one of claims 1 to 5, characterized in that the LEDs (2) are provided with lenses (4).
7. LED-Anordnung mit einer Leiterplatte (1) und - einer Mehrzahl von LEDs (2) , die auf einer Hauptfläche der Leiterplatte (1) angeordnet sind, d a d u r c h g e k e n n z e i c h n e t, daß die Leiterplatte (1) eine flexible Leiterplatte, insbesondere ein Flexboard ist, die mit ihrer von den LEDs (2) ab- gewandten Seite auf eine gekrümmte oder ein- oder mehrfach abgewinkelte Oberfläche eines Kühlkörpers (3) oder eines thermisch gut leitenden Teilbereichs eines Gerätegehäuses oder einer Autokarosserie oder dergleichen aufgebracht ist, derart, daß die Mehrzahl von LEDs (2) in einer von der gekrümmten oder ein- oder mehrfach abgewinkelten Oberfläche des Kühlkörpers (3) oder dergleichen vorgegebenen räumlichen Form angeordnet sind.7. LED arrangement with a circuit board (1) and - a plurality of LEDs (2) which are arranged on a main surface of the circuit board (1), characterized in that the circuit board (1) is a flexible circuit board, in particular a flexboard, which is applied with its side facing away from the LEDs (2) to a curved or single or multiple angled surface of a heat sink (3) or a thermally highly conductive partial area of a device housing or a car body or the like, such that the majority of LEDs (2) are arranged in a spatial shape predetermined by the curved or single or multiple angled surface of the heat sink (3) or the like.
8. LED-Anordnung nach Anspruch 7, d a d u r c h g e k e n n z e i c h n e t, daß die Leiterplatte (1) auf ihrer dem Kühlkörper (3) zugewandten Hauptfläche mit einer thermisch gut leitenden Schicht (4), insbesondere einer Schicht aus Kupfer oder einem anderen Metall mit guter Wärmeleitfähigkeit versehen ist.8. LED arrangement according to claim 7, characterized in that the circuit board (1) on its heat sink (3) facing the main surface with a thermally highly conductive layer (4), in particular a layer of copper or other metal with good thermal conductivity is provided .
9. LED-Anordnung nach Anspruch 7 oder 8, d a d u r c h g e k e n n z e i c h n e t, daß die thermisch gut leitende Schicht (4) eine mäanderartige oder dergleichen laterale Struktur aufweist.9. LED arrangement according to claim 7 or 8, so that the thermally highly conductive layer (4) has a meandering or similar lateral structure.
10. LED-Anordnung nach einem der Ansprüche 7 bis 9, d a d u r c h g e k e n n z e i c h n e t, daß der Kühlkörper (3) aus Metall, insbesondere aus Kupfer oder Aluminium oder einem Blech besteht.10. LED arrangement according to one of claims 7 to 9, d a d u r c h g e k e n n z e i c h n e t that the heat sink (3) consists of metal, in particular copper or aluminum or a sheet.
11. LED-Anordnung nach einem der Ansprüche 7 bis 10, d a d u r c h g e k e n n z e i c h n e t, daß - die der Leiterplatte (1) abgewandte Oberfläche des Kühlkörpers (3) geschwärzt ist und/oder Kühlrippen und/oder eine Oberflächenaufrauhung aufweist.11. LED arrangement according to one of claims 7 to 10, characterized in that - The surface of the heat sink (3) facing away from the printed circuit board (1) is blackened and / or cooling fins and / or has a surface roughening.
12. LED-Anordnung nach einem der Ansprüche 7 bis 11, d a d u r c h g e k e n n z e i c h n e t, daß die LEDs (2) mit Linsen (4) versehen sind.12. LED arrangement according to one of claims 7 to 11, d a d u r c h g e k e n n z e i c h n e t that the LEDs (2) are provided with lenses (4).
13. Beleuchtungseinrichtung mit einer LED-Anordnung nach ei- nem der vorhergehenden Ansprüche.13. Lighting device with an LED arrangement according to one of the preceding claims.
14. Beleuchtungseinrichtung mit einer LED-Anordnung nach Anspruch 13, d a d u r c h g e k e n n z e i c h n e t, daß - sie eine Außenbeleuchtung eines Kraftfahrzeugs wie ein14. Lighting device with an LED arrangement according to claim 13, d a d u r c h g e k e n n z e i c h n e t that - they like an exterior lighting of a motor vehicle
Blinker, ein Rücklicht, eine Bremsleuchte oder dergleichen ist, und der Kühlkörper (3) eine an die Außenkontor des Kraftfahrzeugs angepaßte Krümmung aufweist oder ein Oberflächen- Teilbereich einer Autokarosserie ist.Indicator, a taillight, a brake light or the like, and the heat sink (3) has a curvature adapted to the exterior of the motor vehicle or is a partial surface area of a car body.
15. Beleuchtungseinrichtung nach Anspruch 13, d a d u r c h g e k e n n z e i c h n e t, daß sie eine Rundumleuchte ist, und - der Kühlkörper (3) ein zylindrischer Hohlkörper ist, an dessen Außenwand die Leiterplatte (1) angebracht ist.15. Lighting device according to claim 13, d a d u r c h g e k e n n z e i c h n e t that it is an all-round lamp, and - the heat sink (3) is a cylindrical hollow body, on the outer wall of the circuit board (1) is attached.
16. Beleuchtungseinrichtung nach Anspruch 15, d a d u r c h g e k e n n z e i c h n e t, daß - achsenparallel verlaufende LEDs des Arrays elektrisch zu Strängen zusammengefaßt sind, die nacheinander umlaufend betrieben werden können. 16. Illumination device according to claim 15, d a d u r c h g e k e n e z e i c h n e t that - axially parallel LEDs of the array are electrically combined to form strands that can be operated in sequence one after the other.
EP00943581A 1999-05-12 2000-05-12 Light-emitting diode arrangement Withdrawn EP1177586A1 (en)

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WO2000069000A1 (en) 2000-11-16
KR20010114260A (en) 2001-12-31
JP2012080127A (en) 2012-04-19
US6848819B1 (en) 2005-02-01
DE19922176A1 (en) 2000-11-23
DE19922176C2 (en) 2001-11-15
JP2002544673A (en) 2002-12-24
KR100629561B1 (en) 2006-09-27

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