JP5571438B2 - LIGHTING DEVICE AND LIGHT SOURCE BOARD USED FOR LIGHTING DEVICE - Google Patents

LIGHTING DEVICE AND LIGHT SOURCE BOARD USED FOR LIGHTING DEVICE Download PDF

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JP5571438B2
JP5571438B2 JP2010092371A JP2010092371A JP5571438B2 JP 5571438 B2 JP5571438 B2 JP 5571438B2 JP 2010092371 A JP2010092371 A JP 2010092371A JP 2010092371 A JP2010092371 A JP 2010092371A JP 5571438 B2 JP5571438 B2 JP 5571438B2
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康孝 落合
翼 小西
照郎 小西
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Ｔｓｓ株式会社
株式会社エコサム
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本発明は、照明装置及び照明装置に用いられる光源基板に係り、特に円環状に複数のＬＥＤ（発光ダイオード）素子を配置した照明装置及び照明装置に用いられる光源基板に関する。 The present invention relates to an illuminating device and a light source substrate used in the illuminating device, and more particularly to an illuminating device in which a plurality of LED (light emitting diode) elements are arranged in an annular shape and a light source substrate used in the illuminating device .

ＬＥＤ（発光ダイオード）は、省電力、長寿命といった特性を有することから、白熱灯、蛍光灯等を利用した従来の照明器具に代わるものとして期待されている。
既に工業用検査の分野においては、従来から、光源として多数のＬＥＤ素子を用いた照明装置が好適に用いられている。例えば特許文献１には、反射光を利用し、製品表面の微少な傷や仕上がり具合等を検査するＬＥＤ照明装置が開示されている。 Since LEDs (light emitting diodes) have characteristics such as power saving and long life, they are expected to replace conventional lighting fixtures using incandescent lamps, fluorescent lamps, and the like.
Already, in the field of industrial inspection, conventionally, an illumination device using a large number of LED elements as a light source has been suitably used. For example, Patent Literature 1 discloses an LED lighting device that uses reflected light to inspect minute scratches, finishes, and the like on a product surface.

特許文献１に開示のＬＥＤ照明装置５０は、図１２（断面図）に示すように、円環状の照明ケース５１の下部に切頭円錐形の基板５２が設けられ、この基板５２の下面に一様に複数のＬＥＤ素子５３が配列されている。
このＬＥＤ照明装置５０によれば、被検査体Ｅに対し、周囲方向から一様にＬＥＤ光が照射される。即ち、被検査体の表面に光度斑が生じることなく被検査体を照射することができ、反射光を高精度に検査することができる。 As shown in FIG. 12 (cross-sectional view), the LED illumination device 50 disclosed in Patent Document 1 is provided with a truncated cone-shaped substrate 52 at the lower part of an annular illumination case 51, and a lower surface of the substrate 52 is arranged on the lower surface. Similarly, a plurality of LED elements 53 are arranged.
According to the LED illumination device 50, the LED light is uniformly irradiated from the peripheral direction to the inspection object E. That is, it is possible to irradiate the object to be inspected without causing specular spots on the surface of the object to be inspected, and it is possible to inspect the reflected light with high accuracy.

特許２９７５８９３号公報Japanese Patent No. 2975893

ところで近年、前記のような工業用途ではなく、室内照明等の光源としてＬＥＤを適用することが要求されている。
例えば、円環状の照明管の場合、円環状のガラス管内にＬＥＤ素子を配置することとなるが、その場合、特許文献１に開示された照明装置５０のように、円環状の基板に複数のＬＥＤ素子を配列することが考えられる。 Incidentally, in recent years, it has been required to apply LEDs as a light source for indoor lighting or the like instead of the industrial use as described above.
For example, in the case of an annular illumination tube, LED elements are arranged in an annular glass tube. In that case, as in the illumination device 50 disclosed in Patent Document 1, a plurality of annular elements are provided on an annular substrate. It is possible to arrange LED elements.

しかしながら、図１２に示すように連続する一基板面上に複数のＬＥＤ素子を配置した場合、指向性の強いＬＥＤ光の放射方向は基板面が臨む方向に依存するため、照射領域が狭くなり、室内照明には適さないという課題があった。
また、ＬＥＤ素子は、高出力を得るために大電力が投じられると、発熱し、その発熱によって発光効率、及び寿命が低下するという課題を有しており、特に閉じられた照明管内に多数のＬＥＤ素子を配置する場合には、より高温となりやすいという課題があった。 However, when a plurality of LED elements are arranged on one continuous substrate surface as shown in FIG. 12, the radiation direction of the highly directional LED light depends on the direction in which the substrate surface faces, so the irradiation area becomes narrow, There was a problem that it was not suitable for indoor lighting.
In addition, the LED element has a problem that heat is generated when a large amount of power is applied to obtain a high output, and the light emission efficiency and life are reduced due to the heat generation. When LED elements are arranged, there is a problem that the temperature tends to be higher.

本発明は、前記した点に着目してなされたものであり、円環状に複数のＬＥＤ素子を配置した照明装置において、効率的に放熱を行うと共に、明るさの斑の発生を抑制し、所定の明るさを確保することのできる照明装置を提供することを目的とする。また、円環状に複数のＬＥＤ素子を配置した照明装置において好適に用いられる光源基板を提供することを目的とする。 The present invention has been made paying attention to the above points, and in a lighting device in which a plurality of LED elements are arranged in an annular shape, while efficiently dissipating heat, suppressing occurrence of brightness spots, a predetermined It aims at providing the illuminating device which can ensure the brightness of. Moreover, it aims at providing the light source board | substrate used suitably in the illuminating device which has arrange | positioned several LED element in the annular | circular shape.

前記目的を達成するため、本発明に係る照明装置は、長尺帯状の基板が略円環状に湾曲形成された光源基板と、前記光源基板に配置された複数のＬＥＤ（発光ダイオード）素子と、前記光源基板に電気的接続され、前記ＬＥＤ素子に給電する給電手段とを備え、前記光源基板の下部には、周方向に沿って矩形波状に複数の凸部が配列され、前記凸部は、それぞれ径方向に向けて、湾曲または複数段階に屈曲されることにより、異なる方向に臨む複数の基板面が形成され、前記異なる方向に臨む複数の基板面に前記ＬＥＤ（発光ダイオード）素子が配置されている照明装置であって、前記各凸部は２段階に屈曲し、外側斜め下方に臨む基板面と垂直下方に臨む基板面とが形成され、各凸部において外側斜め下方に臨む基板面と垂直下方に臨む基板面のいずれかに一つのＬＥＤ（発光ダイオード）素子が設置されると共に、周方向に配列された複数の凸部において、ＬＥＤ（発光ダイオード）素子が外側斜め下方に臨む基板面と垂直下方に臨む基板面とに交互に配置されていること
に特徴を有する。
このように構成することにより、照明装置の垂直下方と、外側斜め下方とにＬＥＤの発光方向が円状に分散され、下方の空間に一様に照射することができ、光の斑の発生を抑制することができる。
特に、前記各凸部は２段階に屈曲し、外側斜め下方に臨む基板面と垂直下方に臨む基板面とが形成され、各凸部において外側斜め下方に臨む基板面と垂直下方に臨む基板面のいずれかに一つのＬＥＤ（発光ダイオード）素子が設置されると共に、周方向に配列された複数の凸部において、ＬＥＤ（発光ダイオード）素子が外側斜め下方に臨む基板面と垂直下方に臨む基板面とに交互に配置されていることに特徴を有する。
尚、平面視が矩形波状の蛇腹形状に屈曲形成されると共に、全体が略円環状に湾曲形成されたヒートシンクを備え、前記ヒートシンクは、その外周部が前記光源基板の内周部に接触した状態で、前記光源基板の内周側に収容されることが望ましい。
このように蛇腹形状のヒートシンクを備え、その外周部が光源基板の内周部に接触した状態となされるため、ＬＥＤ素子の発光により生じる熱は、光源基板を介してヒートシンクへと効率よく伝わり、放熱面積が大きいヒートシンクによって効果的に放熱することができる。 In order to achieve the above object, an illumination device according to the present invention includes a light source substrate in which a long belt-like substrate is formed in a substantially annular shape, a plurality of LED (light emitting diode) elements disposed on the light source substrate, A power supply means electrically connected to the light source substrate and supplying power to the LED element, and a plurality of convex portions are arranged in a rectangular wave shape along a circumferential direction at a lower portion of the light source substrate, A plurality of substrate surfaces facing different directions are formed by bending or bending in a plurality of stages toward the radial direction, and the LED (light emitting diode) elements are arranged on the plurality of substrate surfaces facing the different directions. Each of the convex portions is bent in two stages to form a substrate surface facing obliquely outward and a substrate surface facing vertically downward, and a substrate surface facing obliquely outward and downward in each convex portion; Base facing vertically downward One LED (light emitting diode) element is installed on any of the surfaces, and the LED (light emitting diode) element faces the substrate surface facing obliquely outward and vertically downward at a plurality of convex portions arranged in the circumferential direction. It is characterized by being alternately arranged on the substrate surface .
With this configuration, the light emission direction of the LEDs is distributed in a circular shape vertically below the lighting device and obliquely below the outside, and the space below can be illuminated uniformly, thereby generating light spots. Can be suppressed.
In particular, each of the convex portions is bent in two stages to form a substrate surface facing diagonally outward and a substrate surface facing vertically downward, and in each convex portion, a substrate surface facing vertically downward and a substrate surface facing diagonally outward and downward One LED (light emitting diode) element is installed in any of the above, and in a plurality of convex portions arranged in the circumferential direction, the substrate facing the LED (light emitting diode) element obliquely outward and vertically downward It is characterized by being alternately arranged on the surface.
Note that the heat sink includes a heat sink that is bent into a bellows shape having a rectangular wave shape in plan view and is curved in a generally annular shape, and the heat sink is in a state in which the outer peripheral portion is in contact with the inner peripheral portion of the light source substrate. Therefore, it is desirable that the light source substrate is accommodated on the inner peripheral side.
As described above, the bellows-shaped heat sink is provided, and the outer peripheral portion thereof is in contact with the inner peripheral portion of the light source substrate, so that the heat generated by the light emission of the LED element is efficiently transmitted to the heat sink through the light source substrate, Heat can be effectively radiated by a heat sink having a large heat radiation area.

前記目的を達成するため、本発明に係る照明装置は、長尺帯状の基板が略円環状に湾曲形成された光源基板と、前記光源基板に配置された複数のＬＥＤ（発光ダイオード）素子と、前記光源基板に電気的接続され、前記ＬＥＤ素子に給電する給電手段とを備え、前記光源基板の下部には、周方向に沿って矩形波状に複数の凸部が配列され、前記凸部は、それぞれ径方向に向けて、湾曲または複数段階に屈曲されることにより、異なる方向に臨む複数の基板面が形成され、前記異なる方向に臨む複数の基板面に前記ＬＥＤ（発光ダイオード）素子が配置されている照明装置であって、更に、平面視が矩形波状の蛇腹形状に屈曲形成されると共に、全体が略円環状に湾曲形成されたヒートシンクを備え、前記ヒートシンクは、その外周部が前記光源基板の内周部に接触した状態で、前記光源基板の内周側に収容されることに特徴を有する。
このように蛇腹形状のヒートシンクを備え、その外周部が光源基板の内周部に接触した状態となされるため、ＬＥＤ素子の発光により生じる熱は、光源基板を介してヒートシンクへと効率よく伝わり、放熱面積が大きいヒートシンクによって効果的に放熱することができる。 In order to achieve the above object, an illumination device according to the present invention includes a light source substrate in which a long belt-like substrate is formed in a substantially annular shape, a plurality of LED (light emitting diode) elements disposed on the light source substrate, A power supply means electrically connected to the light source substrate and supplying power to the LED element, and a plurality of convex portions are arranged in a rectangular wave shape along a circumferential direction at a lower portion of the light source substrate, A plurality of substrate surfaces facing different directions are formed by bending or bending in a plurality of stages toward the radial direction, and the LED (light emitting diode) elements are arranged on the plurality of substrate surfaces facing the different directions. And a heat sink that is bent into a bellows shape having a rectangular wave shape in plan view and that is curved in a substantially annular shape as a whole. In contact with the inner peripheral portion of the substrate, characterized in that accommodated in the inner circumferential side of the light source substrate.
As described above, the bellows-shaped heat sink is provided, and the outer peripheral portion thereof is in contact with the inner peripheral portion of the light source substrate, so that the heat generated by the light emission of the LED element is efficiently transmitted to the heat sink through the light source substrate, Heat can be effectively radiated by a heat sink having a large heat radiation area.

また、少なくとも前記光源基板と前記ヒートシンクとは、透光性を有するガラス、またはプラスチックからなる円環状の照明管に収容され、前記照明管の上部には、複数の放熱孔が設けられていることが望ましい。
このように照明管に複数の放熱孔を設けることにより、照明管内部の熱を外部に効率的に放熱することができ、ＬＥＤ素子への熱による悪影響を軽減することができる。 Further, at least the light source substrate and the heat sink are accommodated in an annular illumination tube made of light-transmitting glass or plastic, and a plurality of heat radiation holes are provided on the illumination tube. Is desirable.
By providing a plurality of heat radiation holes in the lighting tube in this way, heat inside the lighting tube can be efficiently radiated to the outside, and adverse effects due to heat on the LED elements can be reduced.

また、前記光源基板は、所定の金属層を有することにより屈曲及び湾曲可能な金属ベース基板からなり、前記金属ベース基板が湾曲されて略円環状に形成されていることが望ましい。
このような金属ベース基板を用いることにより、前記光源基板を略円環状に湾曲形成することができる。また、各凸部における第一、第二の基板面の臨む方向の調整を独立して容易に行うことができ、設置場所に応じてＬＥＤ光の放射角度を変えることができる。
また、前記目的を達成するため、本発明に係る光源基板は、長尺帯状の基板が略円環状に湾曲形成され、その下部には周方向に沿って矩形波状に複数の凸部が配列され、前記凸部は、それぞれ径方向に向けて、湾曲または複数段階に屈曲されることにより、異なる方向に臨む複数の基板面が形成され、前記異なる方向に臨む複数の基板面に前記ＬＥＤ（発光ダイオード）素子が配置された照明装置に用いられる光源基板であって、前記各凸部は２段階に屈曲し、外側斜め下方に臨む基板面と垂直下方に臨む基板面とが形成され、各凸部において外側斜め下方に臨む基板面と垂直下方に臨む基板面のいずれかに一つのＬＥＤ（発光ダイオード）素子が設置されると共に、周方向に配列された複数の凸部において、ＬＥＤ（発光ダイオード）素子が外側斜め下方に臨む基板面と垂直下方に臨む基板面とに交互に配置されていることに特徴を有する。
更に、前記光源基板は、所定の金属層を有することにより屈曲及び湾曲可能な金属ベース基板からなり、前記金属ベース基板が湾曲されて略円環状に形成されていることが望ましい。 Preferably, the light source substrate is formed of a metal base substrate that can be bent and bent by having a predetermined metal layer, and the metal base substrate is bent and formed in a substantially annular shape.
By using such a metal base substrate, the light source substrate can be formed in a substantially annular shape. Moreover, the direction which the 1st, 2nd board | substrate surface faces in each convex part can be adjusted easily independently, and the radiation angle of LED light can be changed according to an installation place.
In order to achieve the above object, the light source substrate according to the present invention has a long belt-like substrate formed in a substantially annular shape, and a plurality of convex portions are arranged in a rectangular wave shape along the circumferential direction at the lower portion thereof. The convex portions are curved or bent in a plurality of stages in the radial direction, whereby a plurality of substrate surfaces facing different directions are formed, and the LEDs (light emission) are formed on the plurality of substrate surfaces facing the different directions. The diode is a light source substrate used in an illuminating device, in which each convex portion is bent in two stages to form a substrate surface facing obliquely outward and a substrate surface facing vertically downward. One LED (light emitting diode) element is installed on either the substrate surface facing obliquely downward on the outer side or the substrate surface facing vertically downward at the portion, and at the plurality of convex portions arranged in the circumferential direction, the LED (light emitting diode) )element In particular having the features are arranged alternately in the outer slant surface of the substrate facing downward and the substrate surface facing vertically downward.
Furthermore, it is preferable that the light source substrate is formed of a metal base substrate that can be bent and bent by having a predetermined metal layer, and the metal base substrate is bent and formed in a substantially annular shape.

本発明によれば、円環状に複数のＬＥＤ素子を配置した照明装置において、効率的に放熱を行うと共に、明るさの斑の発生を抑制し、所定の明るさを確保することのできる照明装置を得ることができる。
また本発明によれば、円環状に複数のＬＥＤ素子を配置した照明装置において好適に用いられる光源基板を提供することを目的とする。 ADVANTAGE OF THE INVENTION According to this invention, in the illuminating device which has arrange | positioned several LED element in the annular | circular shape, while radiating efficiently, the generation | occurrence | production of the brightness spot can be suppressed and predetermined | prescribed brightness can be ensured. Can be obtained.
Moreover, according to this invention, it aims at providing the light source board | substrate used suitably in the illuminating device which has arrange | positioned several LED element in the annular | circular shape.

図１は、本発明に係る照明装置を上方から見た斜視図である。FIG. 1 is a perspective view of a lighting device according to the present invention as viewed from above. 図２は、本発明に係る照明装置を下方から見た斜視図である。FIG. 2 is a perspective view of the lighting device according to the present invention as viewed from below. 図３は、本発明に係る照明装置を分解した状態で、照明装置を構成する各部材を下方から見た斜視図である。FIG. 3 is a perspective view of members constituting the lighting device as viewed from below in a state where the lighting device according to the present invention is disassembled. 図４は、本発明に係る照明装置が備える光源基板とヒートシンクとを重ねた状態で上方から見た斜視図である。FIG. 4 is a perspective view seen from above in a state in which a light source substrate and a heat sink provided in the illumination device according to the present invention are stacked. 図５は、本発明に係る照明装置が備える光源基板とヒートシンクとを重ねた状態で下方から見た斜視図である。FIG. 5 is a perspective view seen from below in a state in which a light source substrate and a heat sink provided in the lighting device according to the present invention are overlapped. 図６は、図４のＡ−Ａ矢視断面図である。6 is a cross-sectional view taken along line AA in FIG. 図７は、本発明に係る照明装置が備える光源基板を屈曲及び湾曲形成する前の加工前基板を示し、図７（ａ）は正面図、図７（ｂ）は側面図である。7A and 7B show a substrate before processing before bending and bending the light source substrate included in the illumination device according to the present invention, FIG. 7A is a front view, and FIG. 7B is a side view. 図８は、本発明に係る照明装置が備える光源基板の層構造を説明するための断面図である。FIG. 8 is a cross-sectional view for explaining the layer structure of the light source substrate provided in the lighting apparatus according to the present invention. 図９は、本発明に係る照明装置が備える光源基板の形成方法を説明するための図であり、図９（ａ）は正面図、図９（ｂ）は側面図である。9A and 9B are diagrams for explaining a method of forming a light source substrate included in the lighting apparatus according to the present invention, in which FIG. 9A is a front view and FIG. 9B is a side view. 図１０は、本発明に係る照明装置が備える光源基板の形成方法を説明するための光源基板の下面図である。FIG. 10 is a bottom view of the light source substrate for explaining a method of forming the light source substrate included in the illumination device according to the present invention. 図１１は、本発明に係る照明装置が備える光源基板の形成方法を説明するための光源基板の側面図である。FIG. 11 is a side view of a light source substrate for explaining a method of forming a light source substrate included in the illumination device according to the present invention. 図１２は、従来の工業用途における円環状のＬＥＤ照明装置の断面図である。FIG. 12 is a cross-sectional view of an annular LED illumination device in a conventional industrial application.

以下、本発明の実施の形態を図面に基づき説明する。図１は、本発明に係る照明装置を上方から見た斜視図、図２は、下方から見た斜視図である。
図１に示す照明装置１は、照明管として円環状のガラス管２を備え、このガラス管２内に光源として複数のＬＥＤ（発光ダイオード）素子を備える。ガラス管２は、透光性に優れる上カバー３と下カバー４とからなり、それらが係合した状態で、上カバー３側から複数本の螺子５により相互に螺合されている。
尚、ガラス管２（上カバー３、下カバー４）の内面には、例えば光拡散のための粉末状の微粒子がベーキングにより付着加工され、ガラス管２は外観上、乳白色を呈している。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a lighting device according to the present invention as viewed from above, and FIG. 2 is a perspective view as viewed from below.
The illuminating device 1 shown in FIG. 1 includes an annular glass tube 2 as an illumination tube, and a plurality of LED (light emitting diode) elements as light sources in the glass tube 2. The glass tube 2 includes an upper cover 3 and a lower cover 4 that are excellent in translucency. The glass tube 2 is screwed together by a plurality of screws 5 from the upper cover 3 side in the engaged state.
For example, powdery fine particles for light diffusion are attached to the inner surface of the glass tube 2 (upper cover 3 and lower cover 4) by baking, and the glass tube 2 is milky white in appearance.

また、図１に示すように上カバー３の上面には、複数の放熱孔３ａが形成され、これら放熱孔３ａからガラス管２内部の熱を外部に放熱する構造となされている。
また、円環状のガラス管２の内周面には、一般的な円環状の蛍光管と同様に、電源供給のための電極ピン６を有するコネクタ７が設けられている。 Further, as shown in FIG. 1, a plurality of heat radiation holes 3a are formed on the upper surface of the upper cover 3, and the heat inside the glass tube 2 is radiated to the outside through these heat radiation holes 3a.
A connector 7 having electrode pins 6 for supplying power is provided on the inner peripheral surface of the annular glass tube 2 in the same manner as a general annular fluorescent tube.

次にガラス管２内部の構成について説明する。図３は、照明装置１を分解した状態で、照明装置１を構成する各部材を下方から見た斜視図である。
図３に示すように、ガラス管２（上カバー３、下カバー４）の中には、複数のＬＥＤ素子８が取り付けられた光源基板１０と、放熱のためのヒートシンク２０とが重ねられた状態で収容される。
更に、複数のＬＥＤ素子８に安定した給電を行うための電源回路基板３０（給電手段）が前記光源基板１０に電気的に接続されて収容される。 Next, the structure inside the glass tube 2 will be described. FIG. 3 is a perspective view of the members constituting the illuminating device 1 as seen from below with the illuminating device 1 being disassembled.
As shown in FIG. 3, in the glass tube 2 (upper cover 3 and lower cover 4), a light source substrate 10 to which a plurality of LED elements 8 are attached and a heat sink 20 for heat dissipation are overlaid. Is housed in.
Further, a power supply circuit board 30 (feeding means) for stably feeding power to the plurality of LED elements 8 is electrically connected to the light source board 10 and accommodated.

光源基板１０は、１枚の長尺帯状の基板本体１０ａが略円環状に湾曲形成され、その両端１０ｂ、１０ｃは自由端となされている。
また、基板本体１０ａの下部には、矩形波状に複数の凸部１０ｄが周方向に配列されている。それら凸部１０ｄは、径方向に向けて二段階に屈曲され、径方向断面が略Ｌ字形となされている。
尚、基板本体１０ａ、及び各凸部１０ｄには、所定の回路パターン（図示せず）がプリント配線により形成されている。 The light source substrate 10 is formed by bending a long strip-shaped substrate body 10a into a substantially annular shape, and both ends 10b and 10c are free ends.
In addition, a plurality of convex portions 10d are arranged in the circumferential direction in a rectangular wave shape at the lower portion of the substrate body 10a. These convex portions 10d are bent in two stages toward the radial direction, and the radial cross section is substantially L-shaped.
A predetermined circuit pattern (not shown) is formed by printed wiring on the substrate body 10a and each convex portion 10d.

また、凸部１０ｄは、前記のように二段階に屈曲することにより、垂直下方に臨む基板面１０ｅと、外側斜め下方に臨む基板面１０ｆとが形成されている。各凸部１０ｄには、基板面１０ｅと基板面１０ｆのいずれかに１つのＬＥＤ素子８が設置されるが、周方向に配列された複数の凸部１０ｄにおいて、その設置面が交互に異なるようになされている。
このようなＬＥＤ素子８の設置パターンによれば、照明装置１の垂直下方と、外側斜め下方とにＬＥＤの発光方向が円状に分散され、下方の空間に一様に照射することができ、光の斑の発生を抑制することができる。 Further, the convex portion 10d is bent in two stages as described above, thereby forming a substrate surface 10e that faces vertically downward and a substrate surface 10f that faces obliquely downward outside. Each of the convex portions 10d is provided with one LED element 8 on either the substrate surface 10e or the substrate surface 10f, but the plurality of convex portions 10d arranged in the circumferential direction have different installation surfaces. Has been made.
According to such an installation pattern of the LED elements 8, the light emission directions of the LEDs are distributed in a circular shape in the vertically lower side and the outer diagonally lower side of the lighting device 1, and the lower space can be uniformly irradiated. Generation of light spots can be suppressed.

また、ヒートシンク２０は、１枚の長尺の金属板、例えばアルミニウム板が平面視で矩形波状の蛇腹形状に屈曲形成されると共に、光源基板１０と同様に全体が略円環状に湾曲形成されている。このヒートシンク２０が設けられることにより、ＬＥＤ素子８の発光により生じる熱を効果的に放熱することができる。
具体的に説明すると、図４は、光源基板１０とヒートシンク２０とを重ねた状態で上方から見た斜視図、図５は、下方から見た斜視図、図６は、図４のＡ−Ａ矢視断面図である。図４、図５に示すように、略円環状の光源基板１０の内周に沿って、同じく略円環状のヒートシンク２０が丁度収まるように重ねられている。 Further, the heat sink 20 is formed by bending a long metal plate, for example, an aluminum plate into a rectangular corrugated shape in a plan view, and is curved in a substantially annular shape as in the light source substrate 10. Yes. By providing the heat sink 20, heat generated by light emission of the LED element 8 can be effectively radiated.
More specifically, FIG. 4 is a perspective view seen from above with the light source substrate 10 and the heat sink 20 overlapped, FIG. 5 is a perspective view seen from below, and FIG. 6 is AA in FIG. It is arrow sectional drawing. As shown in FIGS. 4 and 5, the substantially annular heat sink 20 is overlapped along the inner periphery of the substantially annular light source substrate 10 so as to be just fit.

即ち、ヒートシンク２０の外周形状は、図６に示すように、光源基板１０の内周形状に合わせて形成され、その外周部２０ａ、２０ｂ、及び下端部２０ｃが、光源基板１０の内周部にそれぞれ接触するようになされている。
したがって、ＬＥＤ素子８の発光により生じる熱は、凸部１０ｄ及び基板本体１０ａを介してヒートシンク２０へと効率よく伝わり、放熱面積が大きいヒートシンク２０によって効果的に放熱される。
尚、図１に示すように上カバー３の内面には、電源回路基板３０を装着するための回路保持部３ｂと、螺子５が螺入される螺子穴３ｃとが形成されると共に、ヒートシンク２０を支持するための複数のリブ３ｄが径方向に沿って複数形成されている。 That is, the outer peripheral shape of the heat sink 20 is formed in accordance with the inner peripheral shape of the light source substrate 10 as shown in FIG. 6, and the outer peripheral portions 20 a and 20 b and the lower end portion 20 c are formed on the inner peripheral portion of the light source substrate 10. Each is in contact.
Therefore, the heat generated by the light emission of the LED element 8 is efficiently transmitted to the heat sink 20 via the convex portion 10d and the substrate body 10a, and is effectively radiated by the heat sink 20 having a large heat radiation area.
As shown in FIG. 1, on the inner surface of the upper cover 3, a circuit holding portion 3b for mounting the power supply circuit board 30 and a screw hole 3c into which the screw 5 is screwed are formed, and a heat sink 20 is provided. A plurality of ribs 3d are formed along the radial direction.

続いて、前記円環状の光源基板１０の形成方法について説明する。
光源基板１０を形成する場合、図７（ａ）に示すように長尺帯状の基板本体１０ａの下部に櫛歯状（矩形波状）に複数の凸部１０ｄが配列された加工前基板２５を用意する。
この加工前基板２５は、図７（ｂ）に示すようにフラット基板であって、その上面には所定の回路パターン（図示せず）がプリント形成されている。
このフラットな状態の加工前基板２５において、ＬＥＤ素子８、チップ抵抗９等が所定の回路パターン上に取り付けられる。
尚、ＬＥＤ素子８は、一列の配列された複数の凸部１０ｄにおいて、その取り付けの位置が交互に異なるようになされる（即ち、基板面１０ｅが形成される位置と、基板面１０ｆが形成される位置とに交互に配置される）。 Next, a method for forming the annular light source substrate 10 will be described.
When the light source substrate 10 is formed, as shown in FIG. 7A, a pre-processing substrate 25 is prepared in which a plurality of convex portions 10d are arranged in a comb-like shape (rectangular wave shape) below the elongated strip-shaped substrate body 10a. To do.
The pre-processing substrate 25 is a flat substrate as shown in FIG. 7B, and a predetermined circuit pattern (not shown) is printed on the upper surface thereof.
On the flat unprocessed substrate 25, the LED element 8, the chip resistor 9 and the like are mounted on a predetermined circuit pattern.
The LED elements 8 are arranged so that the mounting positions of the plurality of convex portions 10d arranged in a row are alternately different (that is, the position where the substrate surface 10e is formed and the substrate surface 10f are formed). Alternate with each other).

また、この加工前基板２５は、屈曲及び湾曲可能な金属ベース基板からなり、例えば、図８に示すような層構造となされている。即ち、ベース層として、金属層１１を有する。この金属層１１は、屈曲及び湾曲を可能とするために、例えば、鉄（Ｆｅ）を主成分とする鋼板１１ａを有し、その上部、及び下部に溶融アルミニウム１１ｂがコーティングされてなる。尚、この溶融アルミニウム１１ｂのコーティング処理は、基板の放熱性（熱伝導性）を向上させるために施される。
また、この金属層１１は、所定の厚さ寸法を有することにより、屈曲及び湾曲した形状を維持できるようになされている。
また、金属層１１の上部、及び下部には、粒径１〜１５μｍの粉末アルミニウムを分散してなる可撓性を有する放熱金属層１２（放熱層）と、同じく可撓性を有する放熱樹脂層１３（放熱層）とが形成されている。
また、上部の放熱樹脂層１３の上部には、接着層１４を介して配線用銅層１５（回路パターン）が形成され、下部の放熱樹脂層１３の下部には、ポリエステル組成物からなる保護層１６が形成されている。 The pre-processing substrate 25 is made of a metal base substrate that can be bent and curved, and has a layer structure as shown in FIG. 8, for example. That is, the metal layer 11 is provided as a base layer. In order to bend and bend, the metal layer 11 has, for example, a steel plate 11a mainly composed of iron (Fe), and the upper and lower portions thereof are coated with molten aluminum 11b. The coating process of the molten aluminum 11b is performed in order to improve the heat dissipation (thermal conductivity) of the substrate.
Further, the metal layer 11 has a predetermined thickness dimension so that a bent and curved shape can be maintained.
Moreover, on the upper part and the lower part of the metal layer 11, a flexible heat radiating metal layer 12 (heat radiating layer) obtained by dispersing powdered aluminum having a particle diameter of 1 to 15 μm, and a flexible heat radiating resin layer. 13 (heat radiation layer) is formed.
Further, a wiring copper layer 15 (circuit pattern) is formed on the upper portion of the heat dissipation resin layer 13 via an adhesive layer 14, and a protective layer made of a polyester composition is formed on the lower portion of the lower heat dissipation resin layer 13. 16 is formed.

このような層構造とすることにより、加工前基板２５を屈曲及び湾曲加工することが可能となる。
即ち、先ず、治具（図示せず）を用いて、図９（ａ）、（ｂ）に示すように凸部１０ｄを二段階に屈曲加工し、その断面が略Ｌ字形とする。これにより凸部１０ｄにおいて基板面１０ｅと基板面１０ｆとが形成される。
次いで、他の治具（図示せず）を用いて、加工前基板２５を略円環状に湾曲加工することにより、図１０（下面図）、図１１（側面図）に示すような光源基板１０を得ることができる。 With such a layer structure, the unprocessed substrate 25 can be bent and curved.
That is, first, using a jig (not shown), the convex portion 10d is bent in two stages as shown in FIGS. 9A and 9B, and the cross section thereof is formed into an approximately L shape. Thereby, the substrate surface 10e and the substrate surface 10f are formed in the convex portion 10d.
Next, the light source substrate 10 as shown in FIG. 10 (bottom view) and FIG. 11 (side view) is obtained by bending the unprocessed substrate 25 into a substantially annular shape using another jig (not shown). Can be obtained.

以上のように本発明に係る実施の形態によれば、光源基板１０において円環状に複数設けられた、垂直下方に臨む基板面１０ｅと外側斜め下方に臨む基板面１０ｆとにＬＥＤ素子８が配置される。
このようなＬＥＤ素子を設置することにより、照明装置の垂直下方と、外側斜め下方とにＬＥＤの発光方向が円状に分散され、下方の空間に一様に照射することができ、光の斑の発生を抑制することができる。 As described above, according to the embodiment of the present invention, the LED elements 8 are arranged on the substrate surface 10e facing the vertically lower side and the substrate surface 10f facing the lower outer side, which are provided in a plurality of annular shapes in the light source substrate 10. Is done.
By installing such an LED element, the light emitting direction of the LED is distributed in a circular shape vertically below the lighting device and obliquely below the outside, so that the space below can be illuminated uniformly, and light spots Can be suppressed.

また、蛇腹形状のヒートシンク２０の外周部が光源基板１０の内周部に接触した状態となされるため、ＬＥＤ素子８の発光により生じる熱は、光源基板１０を介してヒートシンク２０へと効率よく伝わり、放熱面積が大きいヒートシンク２０によって効果的に放熱することができる。また、ガラス管２内部の熱は、ガラス管２上部の放熱孔３ａから効率的に放熱することができ、ＬＥＤ素子８への熱による悪影響をより軽減することができる。
また、光源基板１０は、屈曲可能な層構造により形成されるため、凸部１０ｄにおける基板面１０ｅ、１０ｆの臨む方向の調整を独立して容易に行うことができ、設置場所に応じてＬＥＤ光の放射角度を変えることができる。 Further, since the outer peripheral portion of the bellows-shaped heat sink 20 is in contact with the inner peripheral portion of the light source substrate 10, the heat generated by the light emission of the LED element 8 is efficiently transmitted to the heat sink 20 via the light source substrate 10. The heat sink 20 having a large heat radiation area can effectively radiate heat. Further, the heat inside the glass tube 2 can be efficiently radiated from the heat radiating holes 3 a above the glass tube 2, and adverse effects due to heat on the LED elements 8 can be further reduced.
Further, since the light source substrate 10 is formed with a bendable layer structure, the direction in which the substrate surfaces 10e and 10f face the convex portion 10d can be easily adjusted independently, and the LED light can be selected according to the installation location. The radiation angle can be changed.

尚、前記実施の形態においては、照明管としてガラス管２を例に説明したが、本発明の照明装置にあっては、それに限定されず、照明管としてプラスチック管を用いてもよい。
また、前記ガラス管２は、光拡散のために粉末状の微粒子がベーキングにより付着加工されているものとしたが、それに限定されず、本発明に係る照明管にあっては、その材質に拘わらず、表面に梨地加工が施されたものを用いてもよい。 In the above embodiment, the glass tube 2 is described as an example of the illumination tube. However, the illumination device of the present invention is not limited to this, and a plastic tube may be used as the illumination tube.
Further, the glass tube 2 is such that powdery fine particles are adhered and processed by baking for light diffusion. However, the present invention is not limited to this, and the lighting tube according to the present invention is not limited to the material. Instead, a material with a satin finish on the surface may be used.

また、前記実施の形態においては、光源基板１０の下部に設けられた凸部１０ｄは、径方向に向けて二段階に屈曲されているものとしたが、二段階の屈曲に限定されるものではない。例えば、凸部１０ｄを三段階以上屈曲させ、異なる方向に臨む基板面を複数設け、それら異なる基板面にＬＥＤ素子８を配置してもよい。
或いは、凸部１０ｄを屈曲させるのではなく、径方向に円弧状に湾曲させることにより、異なる方向に臨む基板面を複数設け、それら異なる基板面にＬＥＤ素子８を配置してもよい。 Moreover, in the said embodiment, although the convex part 10d provided in the lower part of the light source board | substrate 10 shall be bent in two steps toward radial direction, it is not limited to two steps of bending. Absent. For example, the convex portion 10d may be bent at three or more stages, a plurality of substrate surfaces facing different directions may be provided, and the LED elements 8 may be arranged on these different substrate surfaces.
Alternatively, instead of bending the convex portion 10d, a plurality of substrate surfaces facing different directions may be provided by curving in an arc shape in the radial direction, and the LED elements 8 may be arranged on these different substrate surfaces.

また、前記実施の形態においては、金属層１１は、屈曲及び湾曲可能とするために、鉄（Ｆｅ）を主成分とする鋼板１１ａが用いられたものとしたが、それに限定されず、その他の金属材料（例えば、銅、アルミニウム等）が用いられたものであってもよい。   Moreover, in the said embodiment, in order to bend and bend the metal layer 11, although the steel plate 11a which has iron (Fe) as a main component was used, it is not limited to it, Other A metal material (for example, copper, aluminum, etc.) may be used.

１ 照明装置
２ ガラス管（照明管）
３ 上カバー
３ａ 放熱孔
４ 下カバー
５ 螺子
６ 電極ピン
７ コネクタ
８ ＬＥＤ素子
９ チップ抵抗
１０ 光源基板
１０ａ 基板本体
１０ｂ 端部
１０ｃ 端部
１０ｄ 凸部
１０ｅ 基板面
１０ｆ 基板面
１１ 金属層
１２ 放熱金属層（放熱層）
１３ 放熱樹脂層（放熱層）
１４ 接着層
１５ 配線用銅層（回路パターン）
２０ ヒートシンク
２５ 加工前基板（金属ベース基板）
３０ 電源回路基板（給電手段） 1 Lighting device 2 Glass tube (lighting tube)
3 Upper cover 3a Heat dissipation hole 4 Lower cover 5 Screw 6 Electrode pin 7 Connector 8 LED element 9 Chip resistor 10 Light source substrate 10a Substrate body 10b End portion 10c End portion 10d Projection portion 10e Substrate surface 10f Substrate surface 11 Metal layer 12 Heat dissipation metal layer (Heat dissipation layer)
13 Heat dissipation resin layer (heat dissipation layer)
14 Adhesive layer 15 Copper layer for wiring (circuit pattern)
20 Heat sink 25 Substrate before processing (metal base substrate)
30 Power circuit board (power supply means)

Claims (7)

長尺帯状の基板が略円環状に湾曲形成された光源基板と、
前記光源基板に配置された複数のＬＥＤ（発光ダイオード）素子と、
前記光源基板に電気的接続され、前記ＬＥＤ素子に給電する給電手段とを備え、
前記光源基板の下部には、周方向に沿って矩形波状に複数の凸部が配列され、
前記凸部は、それぞれ径方向に向けて、湾曲または複数段階に屈曲されることにより、異なる方向に臨む複数の基板面が形成され、
前記異なる方向に臨む複数の基板面に前記ＬＥＤ（発光ダイオード）素子が配置されている照明装置であって、
前記各凸部は２段階に屈曲し、外側斜め下方に臨む基板面と垂直下方に臨む基板面とが形成され、
各凸部において外側斜め下方に臨む基板面と垂直下方に臨む基板面のいずれかに一つのＬＥＤ（発光ダイオード）素子が設置されると共に、
周方向に配列された複数の凸部において、ＬＥＤ（発光ダイオード）素子が外側斜め下方に臨む基板面と垂直下方に臨む基板面とに交互に配置されていることを特徴とする照明装置。 A light source substrate in which a long belt-like substrate is curved in a substantially annular shape;
A plurality of LED (light emitting diode) elements disposed on the light source substrate;
A power supply means that is electrically connected to the light source substrate and supplies power to the LED element;
At the bottom of the light source substrate, a plurality of convex portions are arranged in a rectangular wave shape along the circumferential direction,
The convex portions are curved or bent in a plurality of stages toward the radial direction, thereby forming a plurality of substrate surfaces facing different directions,
A lighting device in which the LED (light emitting diode) elements are arranged on a plurality of substrate surfaces facing the different directions ,
Each of the convex portions is bent in two stages to form a substrate surface facing obliquely outward and a substrate surface facing vertically downward,
In each convex part, one LED (light emitting diode) element is installed on either the substrate surface facing diagonally downward outside or the substrate surface facing vertically downward,
In the plurality of convex portions arranged in the circumferential direction, LED (light emitting diode) elements are alternately arranged on a substrate surface facing obliquely outward and a substrate surface facing vertically downward. 長尺帯状の基板が略円環状に湾曲形成された光源基板と、A light source substrate in which a long belt-like substrate is curved in a substantially annular shape;
前記光源基板に配置された複数のＬＥＤ（発光ダイオード）素子と、A plurality of LED (light emitting diode) elements disposed on the light source substrate;
前記光源基板に電気的接続され、前記ＬＥＤ素子に給電する給電手段とを備え、A power supply means that is electrically connected to the light source substrate and supplies power to the LED element;
前記光源基板の下部には、周方向に沿って矩形波状に複数の凸部が配列され、At the bottom of the light source substrate, a plurality of convex portions are arranged in a rectangular wave shape along the circumferential direction,
前記凸部は、それぞれ径方向に向けて、湾曲または複数段階に屈曲されることにより、異なる方向に臨む複数の基板面が形成され、The convex portions are curved or bent in a plurality of stages toward the radial direction, thereby forming a plurality of substrate surfaces facing different directions,
前記異なる方向に臨む複数の基板面に前記ＬＥＤ（発光ダイオード）素子が配置されている照明装置であって、A lighting device in which the LED (light emitting diode) elements are arranged on a plurality of substrate surfaces facing the different directions,
更に、平面視が矩形波状の蛇腹形状に屈曲形成されると共に、全体が略円環状に湾曲形成されたヒートシンクを備え、Furthermore, a plan view includes a heat sink that is bent into a bellows shape having a rectangular wave shape and that is curved in a generally annular shape as a whole.
前記ヒートシンクは、その外周部が前記光源基板の内周部に接触した状態で、前記光源基板の内周側に収容されることを特徴とする照明装置。The lighting device, wherein the heat sink is housed on the inner peripheral side of the light source substrate in a state where the outer peripheral portion is in contact with the inner peripheral portion of the light source substrate. 平面視が矩形波状の蛇腹形状に屈曲形成されると共に、全体が略円環状に湾曲形成されたヒートシンクを備え、
前記ヒートシンクは、その外周部が前記光源基板の内周部に接触した状態で、前記光源基板の内周側に収容されることを特徴とする請求項１に記載された照明装置。 A plan view includes a heat sink that is bent and formed into a rectangular wave-shaped bellows shape, and is curved in a substantially annular shape as a whole.
2. The lighting device according to claim 1, wherein the heat sink is accommodated on an inner peripheral side of the light source substrate in a state where an outer peripheral portion thereof is in contact with an inner peripheral portion of the light source substrate. 少なくとも前記光源基板と前記ヒートシンクとは、透光性を有するガラス、またはプラスチックからなる円環状の照明管に収容され、前記照明管の上部には、複数の放熱孔が設けられていることを特徴とする請求項２または請求項３に記載された照明装置。 At least the light source substrate and the heat sink are accommodated in an annular illumination tube made of light-transmitting glass or plastic, and a plurality of heat radiation holes are provided on the illumination tube. The lighting device according to claim 2 or 3 . 前記光源基板は、所定の金属層を有することにより屈曲及び湾曲可能な金属ベース基板からなり、前記金属ベース基板が湾曲されて略円環状に形成されていることを特徴とする請求項１乃至請求項４のいずれかに記載された照明装置。   The said light source board | substrate consists of a metal base board | substrate which can be bent and curved by having a predetermined | prescribed metal layer, The said metal base board | substrate is curved and is formed in the substantially annular | circular shape. Item 5. The lighting device according to any one of Items 4 to 6. 長尺帯状の基板が略円環状に湾曲形成され、その下部には周方向に沿って矩形波状に複数の凸部が配列され、
前記凸部は、それぞれ径方向に向けて、湾曲または複数段階に屈曲されることにより、異なる方向に臨む複数の基板面が形成され、
前記異なる方向に臨む複数の基板面に前記ＬＥＤ（発光ダイオード）素子が配置された照明装置に用いられる光源基板であって、
前記各凸部は２段階に屈曲し、外側斜め下方に臨む基板面と垂直下方に臨む基板面とが形成され、
各凸部において外側斜め下方に臨む基板面と垂直下方に臨む基板面のいずれかに一つのＬＥＤ（発光ダイオード）素子が設置されると共に、
周方向に配列された複数の凸部において、ＬＥＤ（発光ダイオード）素子が外側斜め下方に臨む基板面と垂直下方に臨む基板面とに交互に配置されていることを特徴とする光源基板。 A long belt-like substrate is formed in a curved shape in a substantially annular shape, and a plurality of convex portions are arranged in a rectangular wave shape along the circumferential direction at the lower part thereof,
The convex portions are curved or bent in a plurality of stages toward the radial direction, thereby forming a plurality of substrate surfaces facing different directions,
A light source substrate used in a lighting device in which the LED (light emitting diode) elements are arranged on a plurality of substrate surfaces facing in different directions ,
Each of the convex portions is bent in two stages to form a substrate surface facing obliquely outward and a substrate surface facing vertically downward,
In each convex part, one LED (light emitting diode) element is installed on either the substrate surface facing diagonally downward outside or the substrate surface facing vertically downward,
A light source substrate , wherein LED (light emitting diode) elements are alternately arranged on a substrate surface facing obliquely outward and a substrate surface facing vertically downward in a plurality of convex portions arranged in a circumferential direction . 前記光源基板は、所定の金属層を有することにより屈曲及び湾曲可能な金属ベース基板からなり、前記金属ベース基板が湾曲されて略円環状に形成されていることを特徴とする請求項６に記載された光源基板。 Wherein the light source substrate, according to claim 6, characterized in that it is formed in a substantially circular ring made of a metal base substrate bendable and curved, the metal base substrate is bent by having the predetermined metal layer Light source substrate.
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