JP5564395B2 - LED lighting device - Google Patents

LED lighting device Download PDF

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JP5564395B2
JP5564395B2 JP2010237716A JP2010237716A JP5564395B2 JP 5564395 B2 JP5564395 B2 JP 5564395B2 JP 2010237716 A JP2010237716 A JP 2010237716A JP 2010237716 A JP2010237716 A JP 2010237716A JP 5564395 B2 JP5564395 B2 JP 5564395B2
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comb
heat
led
power supply
led lighting
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JP2012089450A (en
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聡成 国広
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FUKUNAGA CO.,LTD.
RYODEN CORPORATION
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RYODEN CORPORATION
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本発明は、複数のLED(発光ダイオード)を円環状に配置して軽量かつ放熱性に優れた構造により既存の環型蛍光灯の代替として使用できる照明装置に関するものである。   The present invention relates to an illuminating device that can be used as an alternative to an existing annular fluorescent lamp by arranging a plurality of LEDs (light emitting diodes) in an annular shape and having a lightweight and excellent heat dissipation structure.

LED(発光ダイオード)は、省電力、長寿命といった特性により従来の白熱電球型蛍光灯に変わる照明器具として急速に普及が進んでいる。   LEDs (light emitting diodes) are rapidly spreading as lighting fixtures that replace conventional incandescent light bulbs due to their power saving and long life.

LED素子は高出力を得るために大きな電力が投じられるとLED素子自体が発熱し、その発熱により輝度の劣化を招き寿命が低下する課題を有しており、特に放熱性について配慮する必要がある。   An LED element has a problem that when a large amount of power is applied to obtain a high output, the LED element itself generates heat, and this heat generation causes a deterioration in luminance, resulting in a decrease in life. In particular, it is necessary to consider heat dissipation. .

LEDを用いた従来の蛍光灯と同形状のLED照明器具については既に実用化されているが、蛍光灯と同等の照度を確保しようとした場合、高い放熱性を確保するために大型の放熱板(ヒートシンク)を実装する場合が多く、結果的に従来の蛍光灯に比べ照明器具重量が増加している傾向にある。   LED lighting fixtures of the same shape as conventional fluorescent lamps using LEDs have already been put into practical use, but when trying to ensure the same illuminance as fluorescent lamps, a large heat sink to ensure high heat dissipation In many cases, a (heat sink) is mounted, and as a result, the weight of the luminaire tends to increase compared to a conventional fluorescent lamp.

例えば、特許文献1に示されるような照明装置においては、LEDモジュールに対して非常に大きなヒートシンクを用いている。   For example, in the lighting device as disclosed in Patent Document 1, a very large heat sink is used for the LED module.

特表2008−518384号公報Special table 2008-518384 gazette

また、図7(A)に示すように、LED照明を環状型に形成した場合には、アルミニウム等の熱伝導率の高い金属系の材料を用いた平板基板10と、この平板基板10上に配置した多数のLED素子11で構成することになる。   In addition, as shown in FIG. 7A, when the LED illumination is formed in an annular shape, a flat substrate 10 using a metal material with high thermal conductivity such as aluminum, and the flat substrate 10 It will be composed of a large number of LED elements 11 arranged.

その結果、前記平板基板10の面積に対するLED素子11の熱容量が大きくなり、その発熱により輝度の劣化を招き、LED素子11の寿命が低下するという課題を有している。そこで、図7(B)に示すように、前記平板基板10の裏側に放熱板(ヒートシンク)12を貼り付けて放熱させる手法が採られる。   As a result, the heat capacity of the LED element 11 with respect to the area of the flat substrate 10 is increased, and the heat generation causes a deterioration in luminance, resulting in a problem that the life of the LED element 11 is reduced. Therefore, as shown in FIG. 7B, a method is adopted in which a heat radiating plate (heat sink) 12 is attached to the back side of the flat substrate 10 to dissipate heat.

しかしながら、このような放熱板(ヒートシンク)12を用いると、円環状の平板基板10の形状が特殊な形状であるため、基板の歩留まりが悪く、結果的に平板基板10のコストが高くなってしまうという問題があった。   However, when such a heat sink (heat sink) 12 is used, since the shape of the annular flat plate substrate 10 is a special shape, the yield of the substrate is poor, and as a result, the cost of the flat plate substrate 10 is increased. There was a problem.

また、放熱板12は、アルミニウム等の金属の固まりであるため、照明機器全体の重量が重くなってしまう。しかしながら、蛍光灯器具に取り付ける照明器具は、日本工業規格(JIS規格)に定められた重量以下である必要があり、落下事故防止の観点からより軽量であることが望ましい。   Moreover, since the heat sink 12 is a lump of metal, such as aluminum, the weight of the whole lighting equipment will become heavy. However, the lighting fixture to be attached to the fluorescent lamp fixture needs to be less than or equal to the weight defined in the Japanese Industrial Standard (JIS standard), and is desirably lighter from the viewpoint of preventing a fall accident.

特に、環状蛍光灯については住宅用照明(ペンダントライト・シーリングライト)及びエレベータ(昇降機)の照明などとして使用される場合が多く、地震や緊急停止などの際のエレベータの急制動による振動に耐えるため、特に軽量性に配慮する必要がある。しかしながら、図7(B)に示すような大型の放熱板12を用いると、照明機器全体の重量が重く、エレベータ(昇降機)の照明などとして使用した場合には、地震やエレベータ昇降による振動に耐えられなくなるという問題があった。   In particular, annular fluorescent lamps are often used as residential lighting (pendant lights / ceiling lights) and elevator (elevator) lighting, etc., to withstand vibration caused by sudden braking of the elevator during an earthquake or emergency stop. In particular, it is necessary to consider lightness. However, if a large heat sink 12 as shown in FIG. 7B is used, the entire lighting device is heavy, and when used as an elevator (elevator) lighting, etc., it can withstand vibrations caused by earthquakes and elevator elevators. There was a problem that it was impossible.

さらに、平板基板10と放熱板12との二つの部品から構成されるため、隙間が出来易く、放熱性の効率が悪くなってしまうという問題があった。通常、この隙間には、シリコーン系グリス、または、熱伝導シートなどを挟んで密着させるが、この熱伝導シートは金属に比べて熱伝導率が下がるため、平板基板10の熱を完全に放熱板12に伝えきれないという問題があった。   Furthermore, since it is comprised from two components, the flat substrate 10 and the heat sink 12, there existed a problem that a clearance gap was easy to make and the efficiency of heat dissipation worsened. Usually, silicone grease or a heat conductive sheet is sandwiched between the gaps, and the heat conductivity of the heat conductive sheet is lower than that of metal. There was a problem that I couldn't tell to 12.

本発明の目的は、円環状に複数のLED素子を配置した照明装置において、大型の放熱板を必要とせず、より軽量の照明装置を提供することを目的としている。   An object of the present invention is to provide a lighter illumination device that does not require a large heat sink in an illumination device in which a plurality of LED elements are arranged in an annular shape.

上記課題を解決するため、請求項1に係るLED照明装置は、長手方向に延びて形成された帯状部と、該帯状部と一体に短手方向に延びる櫛歯状に形成された櫛歯状部とを有する金属製のプリント基板であって、前記帯状部が円環状に屈曲加工されると共に、前記櫛歯状部のそれぞれが短手方向に三段階に屈曲加工されて、前記帯状部に対して所定の角度を有する斜面部と、前記帯状部に対して略垂直な位置関係となる水平部と、前記帯状部に対して略平行な位置関係となる後端部とを有するプリント基板と、前記プリント基板上に形成されたパターンであって、前記帯状部及び前記櫛歯状部に接触する放熱パッド部と、電源供給パターンとを有するパターンとを備え、前記電源供給パターンが、一の前記櫛歯状部における前記斜面部と、該一の前記櫛歯状部に隣接する前記櫛歯状部における前記水平部とに交互に形成されたパターンと、下面部に電極と放熱端子とを備えるLED素子であって、前記交互に形成された前記斜面部上の電源供給パターンと前記水平部上の電源供給パターンとに前記電極を接触され、前記放熱パッド部に前記放熱端子を接触されて取り付けられる複数のLED素子と、前記円環状に屈曲加工された前記帯状部の内面側に取り付けられ、前記帯状部と略同幅の円環状の放熱板と、前記LED素子と前記放熱板が取り付けられた円環状の前記プリント基板を収納する上ケース及び下ケースと、前記LED素子に電源を供給する電源手段と、を備えたことを特徴とする。   In order to solve the above-mentioned problem, an LED lighting device according to claim 1 includes a strip-like portion formed extending in the longitudinal direction, and a comb-teeth shape formed in a comb-teeth shape extending in the short direction integrally with the strip-like portion. A printed circuit board made of a metal, wherein the band-shaped portion is bent into an annular shape, and each of the comb-shaped portions is bent in three stages in a short direction, to form the band-shaped portion. A printed circuit board having a slope portion having a predetermined angle with respect to the horizontal portion, a horizontal portion that is substantially perpendicular to the belt-like portion, and a rear end portion that is substantially parallel to the belt-like portion; A pattern formed on the printed circuit board, wherein the power supply pattern comprises: a heat dissipation pad portion that contacts the belt-like portion and the comb-like portion; and a power supply pattern. The slope portion in the comb-like portion; An LED element comprising a pattern alternately formed on the horizontal portion of the comb-tooth-shaped portion adjacent to the comb-tooth-shaped portion, and an electrode and a heat radiating terminal on the lower surface portion, and formed alternately A plurality of LED elements that are attached to the power supply pattern on the slope portion and the power supply pattern on the horizontal portion and that are attached by contacting the heat dissipation terminal to the heat dissipation pad portion, and bent in an annular shape An upper case that is attached to the inner surface side of the processed belt-like portion, and stores an annular heat sink having substantially the same width as the belt-like portion, and the annular printed circuit board to which the LED element and the heat sink are attached. And a lower case and power supply means for supplying power to the LED element.

請求項1に係るLED照明装置によれば、金属製プリント基板の櫛歯状部を三段階に屈曲加工し、櫛歯状部と帯状部に接触する放熱パッド部を設け、この放熱パッド部にLED素子の放熱端子を接触させることにより、簡単な構造の円環状の放熱板を用いても十分な放熱効果が得られるので、LED照明装置の重量を増大することなく、照度の高いLED照明装置を提供する。   According to the LED lighting device according to claim 1, the comb-like portion of the metal printed board is bent in three stages, and the heat dissipating pad portion that contacts the comb-like portion and the belt-like portion is provided. By bringing the heat dissipation terminal of the LED element into contact, a sufficient heat dissipation effect can be obtained even if an annular heat sink having a simple structure is used, so that the LED illumination device has high illuminance without increasing the weight of the LED illumination device. I will provide a.

請求項2に係るLED照明装置では、請求項1に記載の発明の構成に加えて、前記プリント基板は、アルミニウム、鉄等の金属で形成されていることを特徴とする。   According to a second aspect of the present invention, in addition to the configuration of the first aspect of the invention, the printed circuit board is formed of a metal such as aluminum or iron.

請求項2に係るLED照明装置によれば、熱伝導率の高いアルミニウム、鉄等の金属をプリント基板に用いることにより、より一層放熱効果の高いLED照明装置を提供する。   According to the LED lighting device according to claim 2, by using a metal such as aluminum or iron having high thermal conductivity for the printed circuit board, an LED lighting device having a further higher heat dissipation effect is provided.

請求項3に係るLED照明装置では、請求項1または請求項2に記載の発明の構成に加えて、前記放熱パッド部は、前記櫛歯状部の前記斜面部に前記電源供給パターンが形成される場合には、当該櫛歯状部の前記水平部に形成され、前記櫛歯状部の前記水平部に前記電源供給パターンが形成される場合には、当該櫛歯状部の前記斜面部に形成されることを特徴とする   In the LED lighting device according to claim 3, in addition to the configuration of the invention according to claim 1 or 2, the power supply pattern is formed on the slope portion of the comb-shaped portion of the heat dissipating pad portion. If the power supply pattern is formed on the horizontal portion of the comb tooth portion, the slope portion of the comb tooth portion is formed on the horizontal portion of the comb tooth portion. Characterized by being formed

請求項3に係るLED照明装置によれば、放熱パッド部の面積を広くすることができ、より一層放熱効果の高いLED照明装置を提供する。   According to the LED lighting device of the third aspect, it is possible to increase the area of the heat dissipating pad portion, and to provide an LED lighting device having a higher heat dissipation effect.

請求項4に係るLED照明装置では、請求項1ないし請求項3のいずれか一に記載の発明の構成に加えて、前記放熱パッド部はその表面が鏡面加工され、または、前記放熱パッド部に、鏡面加工した別体の金属板あるいはレンズ等を貼り付けることを特徴とする。   In the LED lighting device according to claim 4, in addition to the configuration of the invention according to any one of claims 1 to 3, the surface of the heat dissipating pad part is mirror-finished or the heat dissipating pad part Further, a separate metal plate or lens that is mirror-finished is pasted.

請求項4に係るLED照明装置によれば、前記放熱パッド部が前記LED素子からの照射光を反射させる拡散板としての機能を有することになり、より一層照度の高いLED照明装置を提供する。   According to the LED lighting device of the fourth aspect, the heat dissipating pad portion has a function as a diffusion plate that reflects the irradiation light from the LED element, and provides an LED lighting device with higher illuminance.

本発明によれば、金属製プリント基板の櫛歯状部を三段階に屈曲加工し、櫛歯状部と帯状部に接触する放熱パッド部を設け、この放熱パッド部にLED素子の放熱端子を接触させることにより、簡単な構造の円環状の放熱板を用いても十分な放熱効果が得られるので、軽量で照度の高いLED照明装置を提供することができる。   According to the present invention, the comb-like portion of the metal printed circuit board is bent in three stages, and the heat dissipating pad portion that contacts the comb-like portion and the belt-like portion is provided, and the heat dissipating terminal of the LED element is provided on the heat dissipating pad portion. By making contact, a sufficient heat dissipation effect can be obtained even if an annular heat sink having a simple structure is used, so that an LED illumination device that is lightweight and has high illuminance can be provided.

本発明の実施形態におけるLED照明装置の全体概略構造を示す分解図である。It is an exploded view which shows the whole schematic structure of the LED lighting apparatus in embodiment of this invention. 図1に示したLED照明装置に用いられる金属製プリント基板とLED素子を示す平面図である。It is a top view which shows the metal printed circuit boards and LED element which are used for the LED lighting apparatus shown in FIG. 図1に示したLED照明装置に用いられる金属製プリント基板にパターンとLED素子4を取り付けた状態を示す一部破断斜視図である。It is a partially broken perspective view which shows the state which attached the pattern and the LED element 4 to the metal printed circuit board used for the LED lighting apparatus shown in FIG. 図に示したLED照明装置に用いられるLED素子4を示す図であり、(A)はLED素子4を示す上面図、(B)はLED素子4を示す下面図である。It is a figure which shows the LED element 4 used for the LED illuminating device shown in the figure, (A) is a top view which shows the LED element 4, (B) is a bottom view which shows the LED element 4. 図1に示したLED照明装置に用いられる円環状放熱板を示す斜視図である。It is a perspective view which shows the annular | circular shaped heat sink used for the LED lighting apparatus shown in FIG. 図5に示した円環状放熱板を金属製プリント基板に取り付けた状態を示す側面図である。It is a side view which shows the state which attached the annular heat sink shown in FIG. 5 to metal printed boards. 従来のLED照明装置に用いられるLED素子を取り付けたプリント基板と放熱板を示す図であり、(A)は、従来のLED素子を取り付けたプリント基板を示す斜視図、(B)は、従来の放熱板を示す斜視図である。It is a figure which shows the printed circuit board and the heat sink which attached the LED element used for the conventional LED lighting apparatus, (A) is a perspective view which shows the printed circuit board which attached the conventional LED element, (B) is the conventional It is a perspective view which shows a heat sink.

以下、本発明の実施の形態を図面を参照しつつ説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

本発明の第1の実施形態を図1〜図8により説明する。本実施形態は、エレベータ等に用いられるLED照明装置に本発明を適用した実施形態である。   A first embodiment of the present invention will be described with reference to FIGS. The present embodiment is an embodiment in which the present invention is applied to an LED illumination device used for an elevator or the like.

図1は、本実施形態のLED照明装置1を示す図である。図1に示すように、本実施形態のLED装置1は、樹脂製の上カバー2と、樹脂製の下カバー3と、複数のLED素子4と、これらのLED素子4を実装した金属製プリント基板5と、金属製の円環状放熱板6と、電源基板7とを備えている。   FIG. 1 is a diagram showing an LED lighting device 1 according to this embodiment. As shown in FIG. 1, the LED device 1 of this embodiment includes a resin upper cover 2, a resin lower cover 3, a plurality of LED elements 4, and a metal print on which these LED elements 4 are mounted. A substrate 5, a metal annular heat sink 6, and a power supply substrate 7 are provided.

上カバー2及び下カバー3は透過性と耐熱性に優れた透明または乳白色のプラスチック製で形成されている。下カバー3には、図1に示すように、熱を外気に放熱する放熱孔3aが形成されており、金属製プリント基板5に伝わった熱が外気に放熱される。さらに、下カバー3を、熱伝導率の良いプラスチック樹脂で形成することにより、金属製プリント基板5の熱を、筐体である下カバー3にも逃がしている。   The upper cover 2 and the lower cover 3 are made of a transparent or milky white plastic excellent in permeability and heat resistance. As shown in FIG. 1, the lower cover 3 is formed with a heat radiating hole 3a for radiating heat to the outside air, and the heat transmitted to the metal printed board 5 is radiated to the outside air. Furthermore, by forming the lower cover 3 from a plastic resin having a good thermal conductivity, the heat of the metal printed board 5 is also released to the lower cover 3 that is a housing.

金属製プリント基板5には、アルミニウム・鉄などの熱伝導率が良く、かつ、適度な柔軟性を有する厚さの金属板を用いている。金属製プリント基板5は、図2に示すように、長手方向に延びて形成された帯状部5aと、この帯状部5aと一体で短手方向に延びて形成された櫛歯状部5bとを備えている。   The metal printed board 5 is made of a metal plate having a thickness such as aluminum or iron, which has a good thermal conductivity and an appropriate flexibility. As shown in FIG. 2, the metal printed board 5 includes a band-shaped portion 5a formed extending in the longitudinal direction, and a comb-tooth-shaped portion 5b formed integrally with the band-shaped portion 5a and extending in the short direction. I have.

櫛歯状部5bは、図3に示すように、三段階に屈曲加工され、帯状部5aに対して所定の角度を有する斜面部5cと、帯状部5aに対して略垂直な位置関係となる水平部5dと、帯状部5aに対して略平行な位置関係となる後端部5eとに分けられる。   As shown in FIG. 3, the comb-like portion 5b is bent in three stages, and has a slope portion 5c having a predetermined angle with respect to the belt-like portion 5a and a positional relationship substantially perpendicular to the belt-like portion 5a. It is divided into a horizontal portion 5d and a rear end portion 5e having a positional relationship substantially parallel to the belt-like portion 5a.

金属製プリント基板5の櫛歯状部5bの前記屈曲加工は、図2に示すように、LED素子4を斜面部5cと水平部5dとに交互に実装した後に行われる。このようにLED素子4を斜面部5cと水平部5dとに交互に実装し、その後前記のように金属製プリント基板5の櫛歯状部5bを屈曲加工することにより、LED素子4の発光方向は、図3に示すように、帯状部5aに対して所定の角度を有する方向と、帯状部5aに対して略垂直な方向とに分散される。その結果、LED照射装置1は、被照射空間を一様に照射することができ、光の斑の発生を抑制することができる。   The bending process of the comb-like portion 5b of the metal printed board 5 is performed after the LED elements 4 are alternately mounted on the slope portion 5c and the horizontal portion 5d as shown in FIG. In this way, the LED elements 4 are alternately mounted on the slope portions 5c and the horizontal portions 5d, and then the comb-tooth portions 5b of the metal printed board 5 are bent as described above, whereby the light emitting direction of the LED elements 4 is obtained. As shown in FIG. 3, are dispersed in a direction having a predetermined angle with respect to the band-shaped part 5 a and a direction substantially perpendicular to the band-shaped part 5 a. As a result, the LED irradiation device 1 can uniformly irradiate the irradiated space, and can suppress the occurrence of light spots.

金属製プリント基板5は、図3のように前記屈曲加工した後は、図1に示すように、帯状部5aを円環状に屈曲加工することにより、上カバー2と下カバー3内に収納可能となっている。   The metal printed board 5 can be accommodated in the upper cover 2 and the lower cover 3 by bending the belt-like portion 5a into an annular shape as shown in FIG. 1 after the bending process as shown in FIG. It has become.

図3に示すように、金属製プリント基板5の表面にはパターン8が形成されており、このパターン8は、放熱パッド部8a〜8iと電源供給パターン8jを有している。LED素子4は、後述するように放熱端子を有しており、このパターン8上にLED素子4の放熱端子を半田付けすることによりLED素子4がパターン8に接合されている。   As shown in FIG. 3, a pattern 8 is formed on the surface of the metal printed board 5, and this pattern 8 has heat radiation pad portions 8 a to 8 i and a power supply pattern 8 j. The LED element 4 has a heat radiating terminal as described later, and the LED element 4 is joined to the pattern 8 by soldering the heat radiating terminal of the LED element 4 on the pattern 8.

LED素子4は、上面図である図5(A)に示すように、LED発光部4aを備え、下面図である図5(B)に示すように、+側電極(アノード)4bと−側電極(カソード)4cと放熱端子4dを備えている。+側電極(アノード)4bと−側電極(カソード)4cは、半田付けによりパターン8に接合され、放熱端子4dは、半田付けによりパターン8の放熱パッド部8a〜8iに接合されるようになっている。   As shown in FIG. 5A, which is a top view, the LED element 4 includes an LED light emitting unit 4a, and as shown in FIG. 5B, which is a bottom view, the + side electrode (anode) 4b and the − side An electrode (cathode) 4c and a heat radiating terminal 4d are provided. The + side electrode (anode) 4b and the − side electrode (cathode) 4c are joined to the pattern 8 by soldering, and the heat radiating terminal 4d is joined to the heat radiating pad portions 8a to 8i of the pattern 8 by soldering. ing.

円環状放熱板6は、熱伝導率及び自己放熱性の良い合金から成る長尺帯状の板を、図5に示すように湾曲させて円環状に形成する。この円環状放熱板6はLED素子4の出力をさらに増量させて照度を得ようとする場合に、放熱性をさらに高める補足部品として実装する。   The annular heat radiating plate 6 is formed in an annular shape by bending a long strip plate made of an alloy having good thermal conductivity and self-heat dissipation as shown in FIG. The annular heat radiating plate 6 is mounted as a supplementary part that further enhances heat dissipation when the output of the LED element 4 is further increased to obtain illuminance.

円環状放熱板6は、金属製プリント基板5を図1のように円環状に加工した後、図6に示すように、金属製プリント基板5の帯状部5aの裏面部に面で密着させて取り付けられる。このように、金属製プリント基板5の帯状部5aの裏面部に一様に密着させて取り付けることで、放熱性を高めている。   After the metal printed board 5 is processed into an annular shape as shown in FIG. 1, the annular heat sink 6 is brought into close contact with the back surface of the band-like part 5 a of the metal printed board 5 as shown in FIG. 6. It is attached. Thus, heat dissipation is improved by attaching it in close contact with the back surface of the belt-like portion 5a of the metal printed board 5.

この円環状放熱板6は、従来のLED照明器具に使用されている大型の放熱板(ヒートシンク)に比べて非常に簡単な構造であるため、LED照明器具の重量に大きく影響を与えず、軽量な放熱板として実装できる。   Since this annular heat sink 6 has a very simple structure compared to a large heat sink (heat sink) used in conventional LED lighting fixtures, it does not significantly affect the weight of the LED lighting fixtures and is lightweight. Can be mounted as a heat sink.

図1に示す電源基板7は、商用交流電源(AC電源)をLED素子4に供給する直流電源(DC電源)に変換する機能を持っている。電源基板7には、電源を供給する端子が長手方向の両側に形成されており、これらの端子が金属製プリント基板5上のパターン8の端部と接合されて、LED素子4への電源供給が可能となっている。   The power supply board 7 shown in FIG. 1 has a function of converting commercial AC power (AC power) into DC power (DC power) that supplies the LED element 4. Terminals for supplying power are formed on both sides in the longitudinal direction of the power supply board 7, and these terminals are joined to the ends of the pattern 8 on the metal printed board 5 to supply power to the LED elements 4. Is possible.

以上のような本実施形態のLED照明装置1によれば、金属製プリント基板5におけるLED素子4の実装部が、図2に示すように短手方向に延びて櫛歯状に形成されているため、表面積を広く取る事が可能となり、高い放熱効果を得ることができる。   According to the LED lighting device 1 of the present embodiment as described above, the mounting portion of the LED element 4 on the metal printed board 5 extends in the short direction as shown in FIG. Therefore, a large surface area can be obtained, and a high heat dissipation effect can be obtained.

また、本実施形態の金属製プリント基板5は、図3に示すように屈曲加工するため、放熱の方向が分散され、大気中へ効率良く自己放熱でき、さらに高い放熱効果を得ることができる。   Further, since the metal printed board 5 of the present embodiment is bent as shown in FIG. 3, the direction of heat dissipation is dispersed, the heat can be efficiently dissipated into the atmosphere, and a higher heat dissipation effect can be obtained.

さらに、本実施形態のLED照明装置1は、従来に比べて極めて簡単な構造の軽量な円環状放熱板6を備えているので、照明装置全体の重量の軽量化を図りつつ、より一層高い放熱効果を得ることができる。   Furthermore, since the LED lighting device 1 of the present embodiment includes the light-weight annular heat sink 6 having a very simple structure as compared with the conventional one, the weight of the entire lighting device is reduced, and further higher heat dissipation is achieved. An effect can be obtained.

また、本実施形態においては、金属製プリント基板5上のパターン8に、面積の広い放熱パッド部8a〜8iを設けているので、LED素子4からの発熱を金属製プリント基板5の全体に効率よく熱伝導させることができる。その結果、より一層高い放熱効果を得ることができる。   Moreover, in this embodiment, since the heat radiation pad parts 8a to 8i having a large area are provided in the pattern 8 on the metal printed board 5, the heat generated from the LED elements 4 is efficiently applied to the entire metal printed board 5. It can conduct heat well. As a result, an even higher heat dissipation effect can be obtained.

またこれらの放熱パッド部8a〜8iは、その表面を直接鏡面加工する、または、鏡面加工した金属板や光学レンズ・プリズムなどを貼り付けるスペースにすることで、光を反射させる拡散板の機能をもたせている。   These heat radiating pad portions 8a to 8i have a function of a diffusing plate that reflects light by directly mirror-finishing the surface, or by making a space for attaching a mirror-finished metal plate, optical lens, prism, or the like. I'm giving it.

以上のように、本実施形態によれば、LED素子4を取り付ける金属製プリント基板5を、弾力性のある薄い金属板で形成すると共に、長手方向に延びて形成された帯状部5aと、帯状部5aに連続し、短手方向に延びて櫛歯状に形成された櫛歯状部5bとから形成したので、帯状部5aを円環状に屈曲加工することにより、円環状の金属製プリント基板5を得ることができ、従来のように特殊な形のプリント基板を作成する必要がないので、金属製プリント基板5の歩留まりを向上させることができる。   As described above, according to the present embodiment, the metal printed board 5 to which the LED element 4 is attached is formed of an elastic thin metal plate, and is formed to extend in the longitudinal direction. An annular metal printed circuit board is formed by bending the belt-like portion 5a into an annular shape because it is formed from a comb-like portion 5b that is continuous with the portion 5a and extends in the lateral direction and is formed in a comb-like shape. 5 and the yield of the metal printed circuit board 5 can be improved because it is not necessary to produce a specially shaped printed circuit board as in the prior art.

また、プリント基板5を金属製とし、面積の広い櫛歯状部5bに面積の広い放熱パッド部8a〜8iを取り付け、放熱パッド部8a〜8iにLED素子4の放熱端子4dを直接取り付けると共に、櫛歯状部5bを短手方向に屈曲加工するので、従来に比べて極めて高い放熱効果を得ることができる。   In addition, the printed circuit board 5 is made of metal, the heat dissipating pad portions 8a to 8i having a large area are attached to the comb-shaped portion 5b having a large area, and the heat dissipating terminals 4d of the LED elements 4 are directly attached to the heat dissipating pad portions 8a to 8i Since the comb-tooth shaped portion 5b is bent in the short direction, an extremely high heat dissipation effect can be obtained as compared with the prior art.

さらに、プリント基板5と、LED素子4と、放熱パッド部8a〜8iとにより、極めて高い放熱効果を得ることができるので、放熱板は、従来に比べて極めて簡単な構造の軽量な円環状放熱板6を用いることができ、結果的に従来のような大型の熱対策部品の追加を必要としないので、照明装置全体の重量の軽量化を図りつつ、極めて高い放熱効果が得られる。   Furthermore, since the printed circuit board 5, the LED element 4, and the heat radiating pad portions 8a to 8i can obtain an extremely high heat radiating effect, the heat radiating plate has a lighter annular heat radiation structure that is extremely simple compared to the conventional case. Since the plate 6 can be used and, as a result, it is not necessary to add a large heat countermeasure component as in the prior art, an extremely high heat dissipation effect can be obtained while reducing the weight of the entire lighting device.

本発明は、エレベータ(昇降機)の照明装置などに利用可能である。   The present invention can be used for an illumination device of an elevator (elevator).

1 LED照明装置
2 上カバー
3 下カバー
4 LED素子
4a LED発光部
4b 放熱端子
5 金属製プリント基板
5a 帯状部
5b 櫛歯状部
6 円環状放熱板
7 電源基板
8 パターン
8a、8b、8c、8d、8e、8f、8g、8h、8i 放熱パッド部
DESCRIPTION OF SYMBOLS 1 LED illuminating device 2 Upper cover 3 Lower cover 4 LED element 4a LED light emission part 4b Radiation terminal 5 Metal printed board 5a Strip | belt-shaped part 5b Comb-tooth shaped part 6 Ring-shaped heat sink 7 Power supply board 8 Pattern 8a, 8b, 8c, 8d , 8e, 8f, 8g, 8h, 8i Heat dissipation pad

Claims (4)

長手方向に延びて形成された帯状部と、該帯状部と一体に短手方向に延びる櫛歯状に形成された櫛歯状部とを有する金属製のプリント基板であって、前記帯状部が円環状に屈曲加工されると共に、前記櫛歯状部のそれぞれが短手方向に三段階に屈曲加工されて、前記帯状部に対して所定の角度を有する斜面部と、前記帯状部に対して略垂直な位置関係となる水平部と、前記帯状部に対して略平行な位置関係となる後端部とを有するプリント基板と、
前記プリント基板上に形成されたパターンであって、前記帯状部及び前記櫛歯状部に接触する放熱パッド部と、電源供給パターンとを有するパターンとを備え、前記電源供給パターンが、一の前記櫛歯状部における前記斜面部と、該一の前記櫛歯状部に隣接する前記櫛歯状部における前記水平部とに交互に形成されたパターンと、
下面部に電極と放熱端子とを備えるLED素子であって、前記交互に形成された前記斜面部上の電源供給パターンと前記水平部上の電源供給パターンとに前記電極を接触され、前記放熱パッド部に前記放熱端子を接触されて取り付けられる複数のLED素子と、
前記円環状に屈曲加工された前記帯状部の内面側に取り付けられ、前記帯状部と略同幅の円環状の放熱板と、
前記LED素子と前記放熱板が取り付けられた円環状の前記プリント基板を収納する上ケース及び下ケースと、
前記LED素子に電源を供給する電源手段と、
を備えるLED照明装置。
A metal printed board having a strip-like portion formed extending in the longitudinal direction and a comb-like portion formed in a comb-teeth shape extending in the lateral direction integrally with the strip-like portion, wherein the strip-like portion is Each of the comb-shaped portions is bent in three stages in a short direction, and the inclined portion having a predetermined angle with respect to the strip-shaped portion, and the strip-shaped portion A printed circuit board having a horizontal portion that is in a substantially vertical positional relationship and a rear end portion that is in a substantially parallel positional relationship to the belt-shaped portion;
A pattern formed on the printed circuit board, comprising a heat dissipation pad portion that contacts the belt-like portion and the comb-like portion, and a power supply pattern, wherein the power supply pattern is A pattern formed alternately on the inclined surface portion in the comb-tooth-shaped portion and the horizontal portion in the comb-tooth-shaped portion adjacent to the one comb-tooth-shaped portion;
An LED element comprising an electrode and a heat radiating terminal on a lower surface portion, wherein the electrode is brought into contact with the alternately formed power supply pattern on the inclined surface portion and the power supply pattern on the horizontal portion, and the heat radiating pad A plurality of LED elements that are attached to the heat dissipation terminal in contact with the part;
Attached to the inner surface side of the belt-shaped portion bent into the annular shape, an annular heat sink having substantially the same width as the belt-shaped portion;
An upper case and a lower case for housing the annular printed circuit board to which the LED element and the heat sink are attached;
Power supply means for supplying power to the LED element;
LED lighting device comprising:
前記プリント基板は、アルミニウム、鉄等の金属で形成されていることを特徴とする請求項1記載のLED照明装置。   The LED lighting device according to claim 1, wherein the printed circuit board is made of a metal such as aluminum or iron. 前記放熱パッド部は、前記櫛歯状部の前記斜面部に前記電源供給パターンが形成される場合には、当該櫛歯状部の前記水平部に形成され、前記櫛歯状部の前記水平部に前記電源供給パターンが形成される場合には、当該櫛歯状部の前記斜面部に形成されることを特徴する請求項1または2記載のLED照明装置。   When the power supply pattern is formed on the slope portion of the comb-like portion, the heat dissipating pad portion is formed on the horizontal portion of the comb-like portion, and the horizontal portion of the comb-like portion. 3. The LED lighting device according to claim 1, wherein when the power supply pattern is formed, the LED lighting device is formed on the slope portion of the comb-like portion. 前記放熱パッド部はその表面が鏡面加工され、または、前記放熱パッド部に、鏡面加工した別体の金属板あるいはレンズ等を貼り付けることを特徴とする請求項1ないし請求項3のいずれか一記載のLED照明装置。   The surface of the heat radiating pad portion is mirror-finished, or a separate metal plate or lens or the like that is mirror-finished is attached to the heat radiating pad portion. LED lighting apparatus of description.
JP2010237716A 2010-10-22 2010-10-22 LED lighting device Expired - Fee Related JP5564395B2 (en)

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