DE102007044628A1 - Headlamp i.e. H4 retrofit lamp, for use as e.g. gas-discharge lamp, in motor vehicle, has lamp base and light emission predefined by international standards with respect to distance and position in relation to reference plane of base - Google Patents

Abstract

The headlamp (5) has a lamp base (10) and light emission which is predefined by international standards with respect to distance and position in relation to a reference plane (11) of the base, where the light is emitted by a set of semiconductor light sources (21) e.g. multi-chip LEDs. Control electronics (75) or a part of the control electronics is arranged in the base for controlling the semiconductor light sources. A supporting structure (3) with the semiconductor light sources is surrounded by a protecting bulb (6), which is a transparent plastic or a glass, filled with a gas.

Description

Technical area

The The invention relates to a headlamp according to the preamble of Patent claim 1 and a use as a substitute for a trained as an incandescent lamp headlight.

State of the art

In the ECE standard no. 37 "Uniform provisions concerning the approval of filament lamps for use in approved lamp units on power-driven vehicles and of their trailers" various incandescent lamps used in the automotive industry are described with regard to the position of their filaments to a defined reference plane. Every headlamp with an incandescent filament to be used in a motor vehicle must comply with this standard.

From the DE 10 2005 026 949 A1 For example, a light-emitting diode lamp is known as a light source for a headlight. The design of this lamp is adapted to the designed for the use of the light-emitting diode lamp headlamp design.

task

It It is an object of the invention to provide a semiconductor light source Specify lamp as the headlamp in for installation Can be used by incandescent designed headlamps.

These Task is solved by a headlamp with the Features of claim 1.

advantageous Further developments of the invention are in the dependent claims specified.

Presentation of the invention

headlamps have to due to the visual appearance of today Headlight highest requirements regarding the Accuracy of the position of the light-emitting surfaces towards a usually located in the base Have reference level. This position is international Standardization specified. To achieve this, conventional Headlight bulbs facing the filaments said reference plane in the socket in the production measured and then fixed. Any lamp that substitutes for one Headlamp should be used, these requirements must also fulfill.

A Headlight lamp according to the invention is with semiconductor light sources equipped, which has a much higher light output compared to those used in conventional lamps Provide filaments. To the required accurate optical image too reach, the semiconductor light sources are arranged so that the Dimensions of the light-emitting surfaces of the semiconductor light sources correspond to the dimensions of the filament to be replaced, and at the by the o. g. international standardization Position.

A Headlight lamp according to the invention is intended in particular to conventional headlamps with one or two filaments too replace. The headlamps with two filaments usually have a filament for dipped beam and a filament for remote light up. The equipped with these lamps Headlamps are designed so that they needed the dipped beam Radiation characteristic among other things by a limitation of the filament emitted light on a so-called Reach half space. This is done with conventional light bulbs reached a small reflector, which in the one half space radiated light back into the other half space reflected. The high beam filament radiates in contrast both half rooms off. A headlamp using the invention is designed so that instead of the low beam filament at least one semiconductor light source is arranged, whose light-emitting Surface has the same geometric dimensions as the corresponding filament. The geometry of the filament is prescribed in international standardization. It is natural to note that the semiconductor light sources usually have no barrel-shaped light emitting surfaces, but that they are arranged planar. Thus, the dimensions to see the filament relative to its planar projection. Because semiconductor light sources without upstream optics from home can radiate only in a half-space, on a reflector as at the low beam filament are dispensed with. It is sufficient the at least one semiconductor light source to be arranged so that they radiates in the desired spatial direction.

Since the high-beam incandescent filament in headlight lamps with two incandescent filaments and the incandescent filament in headlight lamps with only one incandescent filament radiates in both spatial directions, the semiconductor light sources must be arranged on both sides. According to the invention, they are placed on both sides of a supporting structure, so that the two light-emitting surfaces coincide in the plan view, that is, they are arranged in the same profile. At least one semiconductor light source is arranged on each side of the supporting structure. The supporting structure is dimensioned at this point in its thickness so that the distance - as viewed in the side projection - corresponds approximately to the diameter of the high-beam incandescent filament of a conventional headlight bulb. The geometry of the filament is prescribed in international standardization. The headlamps with a filament can perform a variety of lighting tasks such as low beam, high beam, fog light, etc.

The Semiconductor light sources may also have optics, which changes the light emission characteristic so that they are the emission characteristics of the incandescent filament to be replaced equivalent.

Short description of the drawing (s)

The Invention will be described below by means of embodiments explained in more detail. Show it:

1 A side view of a first embodiment of a headlight lamp according to the invention.

2 A schematic plan view of a first embodiment of a headlight lamp according to the invention.

3 A side view of a second embodiment of a headlight lamp according to the invention.

4 A schematic plan view of a second embodiment of a headlight lamp according to the invention.

5 A side view of a third embodiment of a headlight lamp according to the invention.

6 A side view of a fourth embodiment of a headlight lamp according to the invention with a light function.

7 A side view of a fourth embodiment of a headlight lamp according to the invention with two light functions.

6 A side view of a fourth embodiment of a headlight lamp according to the invention with an additional cooling part structure 34 ,

9a A schematic section of the fourth embodiment in a variant with beads for stability and cooling surface increase.

9b A schematic section of the fourth embodiment in a variant with increased material thickness for stability and cooling surface increase.

10a A section through a second part of the structure 3 in a one-piece version.

10b A section through a second part of the structure 3 in a two-part variant.

10c A section through a second part of the structure 3 in a two-part variant with recesses.

Preferred embodiment the invention

First embodiment

Prefers is the headlight lamp according to the invention as so-called retrofit lamp of a conventional headlight bulb executed. It should be so the owners of motor vehicles with conventional lamp technology and in particular the owners of classic cars using the most modern Semiconductor lighting technology enable.

In 1 a first embodiment is shown as a H4 retrofit lamp in a side view. Some of the details described below are only in the schematic supervision in 2 to recognize. The lamp 5 is on a conventional lamp base 10 constructed, which is a reference ring 1 having, on a base sleeve 7 is appropriate. The reference ring 1 consists of a ring, which on 3 sides reference tabs 13 . 15 in turn, by means of slightly curved contact points a reference plane 11 describe. The base sleeve 7 consists of a cylindrical hollow body, which at its lower end by a base stone 71 is completed. In this base stone 71 made of an insulating material such. As plastic or ceramic, there are three tabs 73 embedded. In the above the base stone 71 lying cavity of the base sleeve 7 is an operating electronics 75 accommodated. At the top of the base sleeve 7 is a supporting structure 3 was introduced, on the surface of semiconductor light sources are arranged. The supporting structure 3 serves as a heat sink for the semiconductor light sources, and therefore consists of a good heat conducting material such. As aluminum, copper, an iron-containing alloy or a thermally conductive metal-ceramic composite, for. B. an LTCC ceramic. The semiconductor light sources are preferably designed as light-emitting diodes. It is also conceivable that the semiconductor light sources are designed as organic light-emitting diodes. The light-emitting diodes are preferably multichip LEDs 21 . 23 formed the multiple light-emitting diode chips 25 z. B. in a row. Such a structure is sometimes known as a light-emitting diode array. The operating electronics 75 is about on or in the supporting structure 3 arranged conductor tracks (not shown) with the multi-chip LEDs 21 . 23 connected. The power supply is the operating electronics 75 with the contact flags 73 connected (not shown).

To have comparable optical properties as a conventional H4 lamp, the geometry of the luminous surface of the multi-chip LEDs 21 . 23 formed analogous to the geometric surface projection of the corresponding filament. This means that the length of the light-emitting surface of the multichip light-emitting diodes 21 . 23 is equal to the length of the corresponding filament and the width of the light-emitting surface of the multi-chip LEDs 21 . 23 is equal to the diameter of the corresponding filament.

Since the low-beam filament of an H4 lamp radiates only into a half-space, the tra ing structure is only on one side 3 a multi-chip LED 23 appropriate. Instead of a multi-chip LED 23 but can also be several LEDs with one chip or multiple multi-chip LEDs 23 be used with fewer chips per LED. In order to meet the optical requirements, has the support structure at the point at which is in a conventional light bulb Abblendlichtglühwendel, a recess 31 on. In this recess 31 is the multi-chip LED 23 appropriate. The depth of the recess 31 is designed so that the distance from the optical axis to the light-emitting surface of the multi-chip LED 23 essentially corresponds to the radius of the corresponding filament. Alternatively, the depth of the recess 31 be sized so that the light-emitting surface of the multi-chip LED 23 lies on the optical axis. To the radiation characteristic of the multi-chip LED 23 to adapt to the radiation characteristics of the filament, the multi-chip LED 23 an optics (not shown here) have. The recess 31 has oblique edges to the light output of the multi-chip LED 23 to hinder as little as possible.

Since the high beam filament of a H4 lamp radiates into both half-spaces, the supporting structure has 3 two opposite recesses 33 on (In 1 only one visible). The opposite recesses 33 are identical in coverage and profile. In each of the two recesses 33 is a multi-chip LED 21 attached, the light-emitting surfaces thus radiate in opposite directions. Thus, every multi-chip LED emits light 21 in a half-space. The depth of the recesses 33 is designed so that the remaining in the supporting structure web 35 has a thickness dimensioned such that the distance of the light-emitting surfaces of the multi-chip LEDs 21 essentially corresponds to the diameter of the filament.

The supporting structure 3 is by suitable methods, for. B. welding, soldering, clamping or bonding to the base sleeve. In order to save weight and material, the load-bearing structure can become 3 preferably taper towards the tip of the lamp.

To protect against environmental influences, the multi-chip LEDs 21 . 23 be provided with a protective layer. To give the users of the retrofit lamp the feeling of an incandescent lamp, the entire load-bearing structure can 3 also in a translucent protective flask 6 made of glass or plastic, which protects the entire structure from environmental influences. For better cooling of the LEDs is the piston 6 then preferably provided with a filling gas such as nitrogen. The filling gas is preferably under a pressure of more than 5 × 10 ⁴ Pa. If the filling gas is under a higher pressure than the atmospheric pressure, then the piston is 6 preferably designed unbreakable.

For optical adjustment during production, the base sleeve 7 opposite the reference ring 1 twisted, tilted and moved like a conventional H4 lamp. Thus, the proven manufacturing and adjustment method of conventional lamps can be adopted. Is the base sleeve 7 with the supporting structure 3 and the multi-chip LEDs arranged thereon 21 . 23 adjusted relative to the reference ring, the connection between the reference ring 1 and base sleeve 7 produced. Thus, the lamp is then optically adjusted.

Second embodiment

The second embodiment differs only in number the functions of the headlight lamp the first embodiment. It will therefore only the Differences from the first embodiment described.

A side view of the headlight lamp 5 the second embodiment is in 3 shown. Some details are as in the first embodiment only in the schematic plan view in FIG 4 to recognize.

The difference from the first embodiment is that the second embodiment is designed as a retrofit lamp of a conventional headlamp with only one filament. In the 3 and 4 this is shown using the example of a H7 lamp.

An H7 lamp is equipped with a free-radiating filament which radiates into both half-spaces. Therefore, the headlamp according to the invention with at least two multi-chip LEDs 21 equipped, each radiating in opposite directions. The multi-chip LEDs 21 are as in the first embodiment in two recesses 33 the carrying structure 3 attached. The recesses 33 can also have sloping edges here. The light-emitting surface of the multichip light-emitting diodes 21 again corresponds to the length and diameter of an H7 filament. The remaining bridge in the supporting structure 35 between the two recesses 33 has a thickness which is such that the distance of the light-emitting surfaces of the multi-chip light emitting diodes substantially corresponds to the diameter of an H7 filament. In the base sleeve 7 is in turn the operating electronics 75 accommodated. Since only one light function is provided here, there are only two contact lugs 73 in the pedestal 71 attached.

Third embodiment

The third embodiment differs in structure of the supporting structure 3 from the previous embodiments. In the following the differences to these are described.

In the third embodiment, which is in 5 is shown, the supporting structure is composed of 2 parts. The first part 36 the carrying structure 3 is with the base sleeve 7 connected. The first part 36 the carrying structure 3 is provided with conductor tracks, which are arranged on or in the part (not shown), and consists of a highly thermally conductive material such as copper, aluminum, steel or nickel-plated steel. But it can also consist of a good thermal conductivity one or more layers metal-ceramic composite. This has the advantage that required conductor structures can be incorporated into these already in the manufacture of the composite body. The second part 39 the carrying structure 3 is with the first part 36 the carrying structure 3 electrically and thermally connected. The electrical connection refers to the on or in the first part 36 the carrying structure 3 running tracks. Is the first part 36 the carrying structure 3 Of course, the part itself can also carry a potential. The conductor tracks of the first part and / or the first part itself are with the contact lugs 73 connected. The second part 39 the carrying structure 3 serves mainly as a circuit carrier and contains the multi-chip LEDs 21 , Additionally, on the second part 39 the carrying structure 3 also the operating electronics 76 or a part of the operating electronics, wherein the remaining operating electronics then in the base sleeve 7 Takes place. Depending on the light function to be fulfilled is the second part 39 single-sided or double-sided, each with at least one multi-chip LED 21 stocked. Alternatively, the second part can also be equipped with at least one single-chip LED.

The embodiment in 5 refers again to a H7 headlamp with a light function. Of course, this embodiment can also be formed with 2 light functions. This is either another functional unit of the second part 39 the carrying structure 3 or part of it 39 the carrying structure 3 is to be designed to be large enough to accommodate both light functions.

Because the second part 39 the carrying structure 3 serves as a circuit carrier, but at the same time also the resulting heat of the LEDs to the first part 36 the carrying structure 3 should give off, preferably a circuit board technology is used here, which conducts heat well. This can be z. B. a board made of an LTCC ceramic or a ceramic-metal composite (eg., DCB ^® Fa. Curamik) be. This has the advantage that some parts such as resistors or capacitors of the operating electronics 76 can be embedded in the ceramic immediately, and the operating electronics 76 thus can be produced efficiently and space-saving. However, other technologies such as a metal core board with a thin polyimide or polyester film can be used as the conductor carrier. To heat the heat efficiently from the second part 39 the carrying structure 3 to the first part 36 the carrying structure 3 To be able to conduct, is between the parts a good thermal connection with a large contact surface 80 intended. This ensures the required good thermal connection of the LEDs to the heat sink serving as the first part 36 the carrying structure 3 ,

To increase the mechanical stability, the first part 36 the carrying structure 3 have mechanical stabilizations such as beads, reinforcements or struts. To improve the thermal and optical properties have the first part 36 and the second part 39 the carrying structure 3 preferably a heat radiating and antireflective coating.

Fourth embodiment

The fourth embodiment differs from the third embodiment mainly in that the supporting structure 3 consists of more than two parts. Otherwise, the previously made remarks apply here analogously.

A lamp of the fourth embodiment having a light function (such as a H7 lamp) is shown in FIG 6 represented. A lamp of the fourth embodiment having two light functions (such as a H4 lamp) is shown in FIG 7 shown. In this embodiment, the supporting structure 3 divided into several functional parts, some of which are made of a conductive material such as copper, aluminum, or steel another suitable material.

A first variant with a light function is in 6 shown. The supporting structure 3 consists of a first part 36 a second part 39 and a third part 37 , The first and third parts are both made of an electrically conductive material. The two parts 36 . 37 thus serve not only as a support structure and heat sink, but at the same time as a power supply for the second part 39 the carrying structure 3 and the light-emitting diodes located thereon. This has the decisive advantage that it is possible to dispense with the feed conductor tracks, and the electrical connection of the operating electronics and the light-emitting diodes can be made very simple and robust. Also in this embodiment is a good thermal connection of the second part 39 the carrying structure 3 to the first part 36 and the third part 37 the carrying structure 3 necessary. This is a connection with a large contact surface 80 intended.

To separate the first ( 36 ) and third ( 37 ) Part of the load-bearing structure 3 To mechanically stabilize, are between the two parts adhesive dots 82 intended. The adhesive dots consist of a suitable adhesive, which holds the parts together mechanically and keeps them electrically isolated.

7 shows analogously to the first variant, a second variant of the fourth embodiment. This forms a lamp with two light functions, but is otherwise constructed analogously to the first variant. In order to be able to display two light functions, the light-emitting diode-containing second part is 39 the carrying structure 3 in two functional units 391 and 392 divided up. The first functional unit 391 includes at least one light emitting diode or a multi-chip LED 23 which is equipped on one side. The second functional unit 392 is equipped on two sides and includes on each side at least one LED or a multi-chip LED 23 , Both functional units can each have an operating electronics 76 exhibit.

To the second functional unit 392 supplying electricity is a fourth part 38 the carrying structure 3 provided, the middle between the first part 36 the carrying structure 3 and the third part 37 the carrying structure 3 is arranged. In order to mechanically stabilize the load-bearing structure, there are also between the first part 36 the third part 37 and the fourth part 38 the carrying structure 3 adhesive dots 82 arranged. These stabilize the structure, but electrically isolate the parts from each other.

In order to achieve a further mechanical stabilization, it can be provided that the first and third part 36 . 37 the carrying structure 3 is provided with beads, material thickening or the like. 9a shows a section through a beaded fourth embodiment. The first and third parts 36 . 37 the carrying structure 3 is always provided with a bead. This measure considerably increases the vibration stability in the vertical and horizontal directions of the lamp, and also increases the cooling surface and mass.

A similar result can be achieved by targeted material reinforcements, as in 9b is specified. With this measure, an increase in the vibration stability and the cooling mass, cross-section and surface is achieved. It can also be various other variants to increase the surface and stabilization such. As ribbing and different profiles can be used.

In both 9a and 9b is on the multichip light emitting diodes 21 an optic 22 shown. This serves to the emission characteristic of the planar formed luminous surfaces of the multi-chip LEDs 21 to match the emission characteristics of the conventional headlight bulb with filaments.

To further increase the cooling area, the first and third parts can be used 36 . 37 the carrying structure 3 also about the, limitation 'of the base sleeve 7 go as in a third variant of the fourth embodiment in 8th is shown. Here are the first and third parts 36 . 37 the carrying structure 3 each additional cooling structures 34 on. These structures may be betrayed, beaded, or otherwise formed to increase surface area and stiffening. The rest of the structure is analogous to the first or second variant.

10 shows various construction variants of the second part 39 the carrying structure 3 , In the first variant, shown in 10a , the second part exists 30 the carrying structure 3 in one piece and is equipped on both sides. Good to see here is the staggered arrangement of the multi-chip LEDs 21 on the top and bottom, which simulates the natural completion of the filament. As a material z. As a metal core board, a classic board made of GRP plastic or a ceramic structure in LTCC design can be used. It is important to have a good thermal conductivity of the material in order to ensure that the resulting heat of the multichip light-emitting diodes is in good agreement with the other substructures of the supporting structure 3 to be able to forward.

To simplify the assembly process, the second part 39 the carrying structure 3 also from two joined sides 393 and 394 , as in 10b shown exist. This has the advantage of being the first page 393 and the second page 394 only have to be equipped on one side, and assembled only after the assembly and testing by suitable methods.

To replace headlamps with very thin filaments by retrofit lamps with semiconductor light sources can be an arrangement as in 10c be used. This also consists of two sides that are joined together after loading. However, the light-emitting surfaces of the multi-chip LEDs do not show the outer surface of the two joined sides 393 and 394 but to the inner surface, where they are guided through corresponding openings of the other side and can shine due to the openings on the other side. This offers the advantage that the distance between the light-emitting surfaces of both sides is only about twice the thickness of the multichip light-emitting diodes 21 equivalent.

1

reference ring

3

supporting structure

5

headlight bulb

6

protective bulb

7

base sleeve

10

base

11

reference plane

13

reference tabs

15

reference tab

21

Multichip LED (arranged on both sides)

22

optics for multi-chip LED

23

Multichip LED (arranged only on one side)

25

LED chips

31

recess (One-sided)

33

recess (Both sides)

34

cooling structure

35

web

36

first part of the load-bearing structure 3

37

third part of the supporting structure 3

38

fourth part of the supporting structure 3

39

second part of the supporting structure 3

391

first functional unit of the second part 39 the carrying structure 3

392

second functional unit of the second part 39 the carrying structure 3

393

first page of the second part 39 the carrying structure 3

394

second side of the second part 39 the carrying structure 3

71

base insulator

73

tabs

75

operating electronics in the pedestal

76

operating electronics on supporting structure

80

thermal & electrical contact surface

82

gluepoint

QUOTES INCLUDE IN THE DESCRIPTION

This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Cited patent literature

• DE 102005026949 A1 [0003]

Cited non-patent literature

• - ECE standard no. 37 "Uniform provisions concerning the approval of filament lamps for use in approved lamp units on power-driven vehicles and of their trailers" [0002]

Claims (23)

Headlight bulb ( 5 ) with a socket ( 10 ) and one by international standardization in terms of distance and location to a reference level ( 11 ) of the base predetermined light output, characterized in that the light output by one or more semiconductor light sources ( 21 . 23 ) he follows. Headlamp according to claim 1, characterized in that an operating electronics ( 75 ) or a part of the operating electronics for operating the one or more semiconductor light sources ( 21 . 23 ) in the socket ( 10 ) of the headlamp is arranged. Headlamp according to claim 2, characterized in that the one or more semiconductor light sources ( 21 . 23 ) on a supporting structure ( 3 ) are arranged with a first and a parallel to this second flat side. Headlamp according to claim 3, characterized in that in each case at least one semiconductor light source ( 21 ) on the first planar side and at least one semiconductor light source ( 21 ) lie congruently on top of each other on the second flat side. Headlamp according to claim 4, characterized in that the supporting structure ( 3 ) in the region of the congruently superimposed semiconductor light sources between the first and the second two-dimensional side a web ( 35 ) having a thickness dimensioned such that the semiconductor light sources ( 21 ) have with their light-emitting surfaces to each other at a distance corresponding to a specified in the standard diameter of the filament described therein. Headlamp according to claim 5, characterized in that in addition one or more semiconductor light sources ( 23 ) are arranged only on one of the flat sides of the supporting structure. Headlamp according to claim 6, characterized in that the supporting structure ( 3 ) in the region of the additional one or more semiconductor light sources ( 23 ) has a thickness dimensioned such that the position of the light-emitting surface of the additional one or more semiconductor light sources ( 23 ) is determined by a specified in the standard diameter of the filament described therein. Headlamp according to claim 3, characterized in that on both flat sides of the supporting structure ( 3 ) one or more semiconductor light sources ( 21 ) are arranged, wherein in each case at least one semiconductor light source ( 21 ) on the first planar side and at least one semiconductor light source ( 21 ) are positioned alternately on the second flat side or at least partially overlapping. Headlamp according to one of the preceding claims 2-8, characterized in that the supporting structure ( 3 ) is simultaneously formed as a heat sink and consists of a good heat conducting material. Headlamp according to claim 9, characterized in that the supporting structure ( 3 ) consists of at least a first and a second part, the first part ( 36 ) of the supporting structure ( 3 ) is simultaneously formed as a heat sink and the second part ( 39 ) of the supporting structure ( 3 ) is formed as a support for the semiconductor light sources and consists of a good heat conductive material. Headlamp according to claim 10, characterized in that the supporting structure ( 3 ) consists of more than two parts, with some of the parts ( 36 . 37 . 38 ) consist of an electrically conductive material and are simultaneously formed as power supply lines. Headlamp according to claim 10 or 11, characterized in that the second part ( 39 ) of the supporting structure ( 3 ) the operating electronics ( 76 ) partially or completely. Headlamp according to one of claims 2-12, characterized in that the supporting structure ( 3 ) tapers towards the tip of the lamp and / or a cooling structure projecting sideways ( 34 ) having. Headlamp according to one of claims 2-13, characterized in that the supporting structure ( 3 ) has a heat radiating and / or antireflective coating. Headlight lamp according to one of the preceding claims, characterized in that the semiconductor light sources have an optical system which has a light emission characteristic of the semiconductor light sources ( 21 . 23 ) changed so that it corresponds to a required in the standardization radiation characteristic. Headlight bulb after one of the previous ones Claims, characterized in that the semiconductor light sources Light emitting diodes are. Headlight bulb after one of the previous ones Claims, characterized in that the semiconductor light sources Multichip LEDs are. Headlight bulb after one of the previous ones Claims, characterized in that the semiconductor light sources Organic light-emitting diodes are. Headlight bulb after one of the previous ones Claims, characterized in that the semiconductor light sources coated with a protective layer. Headlamp according to one of claims 2-19, characterized in that the supporting structure ( 3 ) with the semiconductor light sources ( 21 . 23 ) from a protective flask ( 6 ) is surrounded. Headlamp according to claim 20, characterized that the material of the protective piston is a translucent Plastic or a glass is. Headlight lamp according to Claim 21, characterized that the protective piston is filled with a gas. Using a headlight bulb ( 5 ) according to one of the preceding claims as a substitute for a trained as a light bulb headlamp in a provided for receiving the bulb headlights.