DE10234102A1 - Light emitting diode arrangement has many diodes which are directly interconnected by both housings and electrodes - Google Patents
Light emitting diode arrangement has many diodes which are directly interconnected by both housings and electrodes Download PDFInfo
- Publication number
- DE10234102A1 DE10234102A1 DE10234102A DE10234102A DE10234102A1 DE 10234102 A1 DE10234102 A1 DE 10234102A1 DE 10234102 A DE10234102 A DE 10234102A DE 10234102 A DE10234102 A DE 10234102A DE 10234102 A1 DE10234102 A1 DE 10234102A1
- Authority
- DE
- Germany
- Prior art keywords
- light
- emitting diode
- diode arrangement
- emitting diodes
- arrangement according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
- F21S43/14—Light emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
- F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
- F21Y2105/16—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array square or rectangular, e.g. for light panels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
Description
Die vorliegende Erfindung betrifft eine Leuchtdiodenanordnung aus mehreren Leuchtdioden.The present invention relates to a light-emitting diode arrangement from several light-emitting diodes.
Eine derartige Anordnung ist beispielsweise aus
der Druckschrift
Ein Nachteil der in der eingangs
genannten Druckschrift
Der Erfindung liegt daher die Aufgabe zugrunde, eine Leuchtdiodenanordnung vorzuschlagen, bei welcher die Packungsdichte im Vergleich zu den bekannten Leuchtdiodenanordnungen größer ist, um so eine höhere Lichtstärke zu erreichen.The invention is therefore the object based on proposing a light-emitting diode arrangement in which the packing density in comparison to the known light-emitting diode arrangements is bigger so much the higher luminous intensity to reach.
Diese Aufgabe wird erfindungsgemäß dadurch gelöst, dass die Leuchtdioden der Leuchtendiodenanordnung unmittelbar miteinander verbunden sind.This object is achieved according to the invention solved, that the light emitting diodes of the light emitting diode arrangement are connected directly to one another are connected.
Im Vergleich zu den bisher bekannten Lösungen für Leuchtdiodenanordnungen ist bei einer Leuchtdiodenanordnung gemäß der Erfindung kein Schaltungsträger vorgesehen, auf welchem die Leuchtdioden angebracht sind, um gegeneinander räumlich festgelegt zu sein. Bei einer Leuchtdiodenanordnung gemäß der Erfindung werden die Leuchtdioden vielmehr unmittelbar, d. h. mit möglichst geringem Abstand oder abstandslos, aneinander befestigt, um so räumlich gegeneinander festgelegt zu sein. Ein Schaltungsträger kann hierdurch entfallen. Eine erfindungsgemäße Leuchtdiodenanordnung kann vielmehr als einheitliches Bauelement wie z. B. Widerstände, Kondensatoren oder dergleichen betrachtet werden, wodurch die erfindungsgemäße Leuchtdiodenanordnung in beliebigen Schaltungen als Bauelement eingesetzt werden kann. Die Verbindung der Leuchtdioden kann gemäß der Erfindung über die Gehäuse der Leuchtdioden erfolgen, welche miteinander verklebt sind. Ebenso ist es alternativ oder zusätzlich möglich, dass die Elektroden verschiedener benachbarter Leuchtdioden miteinander verlötet sind.Compared to the previously known solutions for LED arrangements no circuit carrier is provided in a light-emitting diode arrangement according to the invention, on which the light emitting diodes are attached in order to spatially fixed against each other to be. In a light-emitting diode arrangement according to the invention, the Rather, LEDs directly, i. H. with the smallest possible distance or spaced, attached to each other, so spatially fixed against each other to be. A circuit carrier can be omitted. A light-emitting diode arrangement according to the invention can rather as a unitary component such. B. resistors, capacitors or the like can be considered, whereby the light-emitting diode arrangement according to the invention can be used as a component in any circuit. The connection of the light emitting diodes can be according to the invention via the casing of the LEDs, which are glued together. As well is it alternative or additional possible, that the electrodes of different neighboring light-emitting diodes are soldered together.
Die Leuchtdioden nach einer erfindungsgemäßen Leuchtdiodenanordnung können gruppiert sein. Vorteilhaft sind dann die Leuchtdioden einer Gruppe in Reihe geschaltet. Die Leuchtdioden einer Gruppe können zueinander benachbart insbesondere in Vektorform angeordnet sein. Es ist jedoch ebenso möglich, dass die Leuchtdioden in bestimmten Mustern angeordnet sind, wodurch beispielsweise Leuchtzeichen erzeugt werden können.The light emitting diodes according to a light emitting diode arrangement according to the invention can be grouped. The LEDs of a group are then advantageous connected in series. The light emitting diodes of a group can be connected to each other be arranged adjacent in particular in vector form. However, it is equally possible that the LEDs are arranged in certain patterns, whereby for example, illuminated signs can be generated.
Vorteilhaft können die Leuchtdioden einer erfindungsgemäßen Leuchtdiodenanordnung in einer Matrix angeordnet sein, wobei dann die Leuchtdioden einer Gruppe einer Zeile der Matrix zugeordnet sein können. Die einzelnen Zeilen, d. h. Gruppen der Matrix sind vorteilhaft parallel geschaltet, wozu die Elektroden der jeweils ersten und letzten Leuchtdiode Zeilen miteinander verlötet sein können.The LEDs can advantageously be one LED arrangement according to the invention be arranged in a matrix, in which case the light-emitting diodes Group can be assigned to a row of the matrix. The individual lines, d. H. Groups of the matrix are advantageously connected in parallel, for what the electrodes of the first and last light-emitting diode rows soldered together could be.
Die Verbindungen zwischen den Leuchtdioden der Leuchtdiodenanordnung sind vorteilhaft flexibel, so dass die Leuchtdiodenanordnung formbar ist und auf einer dreidimensional geformten Oberfläche angebracht werden kann.The connections between the LEDs the LED arrangement are advantageously flexible, so that the Light-emitting diode arrangement is formable and on a three-dimensional molded surface attached can be.
Zum Abführen der in den Leuchtdioden der Leuchtdiodenanordnung entstehenden Wärme kann die Leuchtdiodenanordnung einen Kühlkörper aufweisen. Die Leuchtdioden können dabei unter Zwischenschaltung eines Isolators auf dem Kühlkörper angebracht sein.For removing the in the LEDs The heat generated by the light-emitting diode arrangement can be the light-emitting diode arrangement have a heat sink. The LEDs can attached to the heat sink with the interposition of an insulator his.
Die Herstellung einer erfindungsgemäßen Leuchtdiodenanordnung kann folgendermaßen erfolgen. Zunächst werden die Leuchtdioden vorteilhaft mit abwärts gerichtetem Gehäuse auf einem Träger angeordnet. Dazu werden die Leuchtdioden im Normalfall als Schüttgut angeliefert, weshalb zunächst die Leuchtdioden vereinzelt und die Polarität der Leuchtdioden festgestellt werden muss. Die vereinzelten Leuchtdioden werden automatisch in dem gewünschten Muster, beispielsweise einer Matrix, auf dem planaren oder räumlich ausgeführten Träger angeordnet.The manufacture of a light-emitting diode arrangement according to the invention can be as follows respectively. First the LEDs are advantageously on with the housing facing downwards arranged a carrier. For this purpose, the LEDs are normally delivered as bulk goods, which is why the Light emitting diodes isolated and the polarity of the light emitting diodes determined must become. The isolated light emitting diodes are automatically switched on the desired one Patterns, for example a matrix, are arranged on the planar or spatially designed carrier.
In einem zweiten Schritt wird auf der nach oben weisenden Unterseite der Leuchtdioden ein vorzugsweise hochschmelzendes Lot aufgetragen, um die Elektroden benachbarter Leuchtdioden seriell miteinander zu verbinden. Ebenso können Klebstoffe aufgetragen werden, um die Gehäuse der Leuchtdioden miteinander zu verkleben. Das Auftragen des Klebstoffes bzw. des Lotes kann dabei mittels Sieb- oder Schablonendruck oder Dispensen mit nachfolgendem Aushärten bzw. Aufschmelzen erfolgen.The second step is on the upward-facing underside of the light emitting diodes is a preferred high melting solder applied to the electrodes adjacent To connect LEDs with each other in series. Adhesives can also be applied to the housing to glue the LEDs together. Applying the glue or the solder can be by means of screen or stencil printing or Dispense with subsequent curing or melting.
In einem dritten Schritt können die beim Verlöten der Elektroden entstandenen Lotdepots durch Schleifen eingeebnet werden. Damit ist eine weiterverarbeitungsfähige Leuchtdiodenanordnung hergestellt. Diese Leuchtdiodenanordnung wird nun vom Träger gelöst und kann beispielsweise unter Zwischenschaltung eines isolierenden Werkstoffes auf einem Schaltungsträger oder einem Kühlkörper befestigt werden, wobei der Schaltungsträger oder aber der Kühlkörper eine beliebige dreidimensionale Form haben kann.In a third step, the Ver soldering the electrodes resulting solder deposits can be leveled by grinding. A light-emitting diode arrangement capable of further processing is thus produced. This light-emitting diode arrangement is now detached from the carrier and can be fastened, for example, with the interposition of an insulating material on a circuit carrier or a heat sink, wherein the circuit carrier or the heat sink can have any three-dimensional shape.
Vorteile der erfindungsgemäßen Leuchtdiodenanordnungen liegen beispielsweise darin, dass es nicht notwendig ist, die Leuchtdioden auf einem bei herkömmlichen Leuchtdiodenanordnungen erforderlichen Schaltungsträger anzuordnen, wodurch die Materialkosten für den Schaltungsträger entfallen. Ebenso werden dadurch, dass z. B. eine aufwendige SMD-Bestückung der Leuchtdioden auf einem Schaltungsträger entfällt, Kosten reduziert. Durch die kompakte Anordnung der Leuchtdioden in der Leuchtdiodenanordnung, werden hohe Lichtstärken erreicht. Ebenso ist wegen der kompakten Anordnung der Leuchtdioden eine verbesserte Farbmischung möglich. Durch die Biegsamkeit der Leuchtdiodenanordnungen gemäß der Erfindung ist der Aufbau dreidimensional geformter Leuchtdiodenanordnungen möglich. Durch den Wegfall des Schaltungsträgers ist es ebenfalls möglich, Leuchtdiodenanordnungen geringerer Bauhöhe zu erhalten. Durch die Möglichkeit in einer erfindungsgemäßen Leuchtdiodenanordnung unmittelbar unter den Leuchtdioden einen Kühlkörper vorzusehen, können die thermischen Eigenschaften einer erfindungsgemäßen Leuchtdiodenanordnung über das bisher Bekannte verbessert werden. Die Anbringung des Kühlkörpers kann beispielsweise durch ein Hinterspritzen mit einem wärmeleitenden Werkstoff erfolgen.Advantages of the light emitting diode arrangements according to the invention are, for example, that the LEDs are not necessary on a conventional one Arrange the necessary circuit carriers for LED arrangements reducing the cost of materials for the circuit carrier omitted. Likewise, that z. B. a complex SMD assembly of the There is no need for LEDs on a circuit board, costs are reduced. By the compact arrangement of the light-emitting diodes in the light-emitting diode arrangement, become high light intensities reached. Likewise, because of the compact arrangement of the LEDs improved color mixing possible. Due to the flexibility of the light emitting diode arrangements according to the invention the construction of three-dimensionally shaped LED arrangements is possible. By is the elimination of the circuit carrier it is also possible to reduce the number of light emitting diodes height to obtain. By the possibility in a light-emitting diode arrangement according to the invention Providing a heat sink directly under the LEDs can thermal properties of a light emitting diode arrangement according to the invention via the previously known are improved. The heat sink can be attached for example by back injection with a thermally conductive Material.
Ausführungsbeispiele für erfindungsgemäße Leuchtdiodenanordnungen werden anhand der Zeichnung näher beschrieben. Darin zeigtEmbodiments for light emitting diode arrangements according to the invention will be closer to the drawing described. In it shows
Die in
Ein Vektor von Leuchtdioden
Bei der in
Bei der in
Die Leuchtdiodenanordnungen
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10234102A DE10234102A1 (en) | 2002-07-26 | 2002-07-26 | Light emitting diode arrangement has many diodes which are directly interconnected by both housings and electrodes |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10234102A DE10234102A1 (en) | 2002-07-26 | 2002-07-26 | Light emitting diode arrangement has many diodes which are directly interconnected by both housings and electrodes |
Publications (1)
Publication Number | Publication Date |
---|---|
DE10234102A1 true DE10234102A1 (en) | 2004-02-12 |
Family
ID=30128426
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10234102A Withdrawn DE10234102A1 (en) | 2002-07-26 | 2002-07-26 | Light emitting diode arrangement has many diodes which are directly interconnected by both housings and electrodes |
Country Status (1)
Country | Link |
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DE (1) | DE10234102A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101329017B (en) * | 2007-06-19 | 2012-07-25 | 汽车照明罗伊特林根有限公司 | Lighting arrangement with semiconductor light sources on flexible printed circuits |
DE102014105818A1 (en) | 2014-04-25 | 2015-10-29 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Headlamp assembly of a motor vehicle in LED matrix design and a method for adjusting such a headlamp assembly |
WO2021224130A1 (en) * | 2020-05-04 | 2021-11-11 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for producing an optoelectronic component |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2509047C3 (en) * | 1975-03-01 | 1980-07-10 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Plastic housing for a light emitting diode |
EP0364806A2 (en) * | 1988-10-21 | 1990-04-25 | TEMIC TELEFUNKEN microelectronic GmbH | Surface light-emitting device |
US5160200A (en) * | 1991-03-06 | 1992-11-03 | R & D Molded Products, Inc. | Wedge-base LED bulb housing |
DE29603557U1 (en) * | 1995-05-16 | 1996-04-18 | LumiLeds Lighting, U.S., LLC, San Jose, Calif. | Formable array frame for an array of light-emitting diodes |
US5924785A (en) * | 1997-05-21 | 1999-07-20 | Zhang; Lu Xin | Light source arrangement |
DE19818403A1 (en) * | 1998-04-24 | 1999-10-28 | Horn Hannes Schulze | Lighting system with low voltage lights and lamps |
DE19922176A1 (en) * | 1999-05-12 | 2000-11-23 | Osram Opto Semiconductors Gmbh | Surface-mounted LED multiple arrangement |
DE20021934U1 (en) * | 2000-12-27 | 2001-04-05 | Zweibrüder Stahlwarenkontor GmbH, 42697 Solingen | Lamp, in particular living room, table or flashlight |
DE10025563A1 (en) * | 2000-05-24 | 2001-12-06 | Osram Opto Semiconductors Gmbh | Module for arranging electrical light emitting elements has metal grid with conducting tracks enclosed by mechanical stabilizing material and bound into material in flat manner. |
US6371637B1 (en) * | 1999-02-26 | 2002-04-16 | Radiantz, Inc. | Compact, flexible, LED array |
DE10051159A1 (en) * | 2000-10-16 | 2002-05-02 | Osram Opto Semiconductors Gmbh | LED module, e.g. White light source |
DE10110835A1 (en) * | 2001-03-06 | 2002-09-19 | Osram Opto Semiconductors Gmbh | Illuminating deviec with numerous LED modules fitted on cooler surface |
-
2002
- 2002-07-26 DE DE10234102A patent/DE10234102A1/en not_active Withdrawn
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2509047C3 (en) * | 1975-03-01 | 1980-07-10 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Plastic housing for a light emitting diode |
EP0364806A2 (en) * | 1988-10-21 | 1990-04-25 | TEMIC TELEFUNKEN microelectronic GmbH | Surface light-emitting device |
US5160200A (en) * | 1991-03-06 | 1992-11-03 | R & D Molded Products, Inc. | Wedge-base LED bulb housing |
DE29603557U1 (en) * | 1995-05-16 | 1996-04-18 | LumiLeds Lighting, U.S., LLC, San Jose, Calif. | Formable array frame for an array of light-emitting diodes |
US5924785A (en) * | 1997-05-21 | 1999-07-20 | Zhang; Lu Xin | Light source arrangement |
DE19818403A1 (en) * | 1998-04-24 | 1999-10-28 | Horn Hannes Schulze | Lighting system with low voltage lights and lamps |
US6371637B1 (en) * | 1999-02-26 | 2002-04-16 | Radiantz, Inc. | Compact, flexible, LED array |
DE19922176A1 (en) * | 1999-05-12 | 2000-11-23 | Osram Opto Semiconductors Gmbh | Surface-mounted LED multiple arrangement |
DE10025563A1 (en) * | 2000-05-24 | 2001-12-06 | Osram Opto Semiconductors Gmbh | Module for arranging electrical light emitting elements has metal grid with conducting tracks enclosed by mechanical stabilizing material and bound into material in flat manner. |
DE10051159A1 (en) * | 2000-10-16 | 2002-05-02 | Osram Opto Semiconductors Gmbh | LED module, e.g. White light source |
DE20021934U1 (en) * | 2000-12-27 | 2001-04-05 | Zweibrüder Stahlwarenkontor GmbH, 42697 Solingen | Lamp, in particular living room, table or flashlight |
DE10110835A1 (en) * | 2001-03-06 | 2002-09-19 | Osram Opto Semiconductors Gmbh | Illuminating deviec with numerous LED modules fitted on cooler surface |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101329017B (en) * | 2007-06-19 | 2012-07-25 | 汽车照明罗伊特林根有限公司 | Lighting arrangement with semiconductor light sources on flexible printed circuits |
DE102014105818A1 (en) | 2014-04-25 | 2015-10-29 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Headlamp assembly of a motor vehicle in LED matrix design and a method for adjusting such a headlamp assembly |
WO2021224130A1 (en) * | 2020-05-04 | 2021-11-11 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for producing an optoelectronic component |
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OP8 | Request for examination as to paragraph 44 patent law | ||
8127 | New person/name/address of the applicant |
Owner name: ZAVT ZENTRUM FUER AUFBAU- UND VERBINDUNGS-TECHNIK G Owner name: HELLA KGAA HUECK & CO., 59557 LIPPSTADT, DE |
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R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |
Effective date: 20120201 |