EP1995514B1 - Unité d'éclairage - Google Patents

Unité d'éclairage Download PDF

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Publication number
EP1995514B1
EP1995514B1 EP20080102984 EP08102984A EP1995514B1 EP 1995514 B1 EP1995514 B1 EP 1995514B1 EP 20080102984 EP20080102984 EP 20080102984 EP 08102984 A EP08102984 A EP 08102984A EP 1995514 B1 EP1995514 B1 EP 1995514B1
Authority
EP
European Patent Office
Prior art keywords
heat
illumination unit
unit according
heat sink
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP20080102984
Other languages
German (de)
English (en)
Other versions
EP1995514A3 (fr
EP1995514A2 (fr
Inventor
Leopold Hellinger
Gerhard Neumann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP1995514A2 publication Critical patent/EP1995514A2/fr
Publication of EP1995514A3 publication Critical patent/EP1995514A3/fr
Application granted granted Critical
Publication of EP1995514B1 publication Critical patent/EP1995514B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/30—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by reflectors
    • F21S43/37—Attachment thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2103/00—Exterior vehicle lighting devices for signalling purposes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2103/00—Exterior vehicle lighting devices for signalling purposes
    • F21W2103/20—Direction indicator lights
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Definitions

  • the invention relates to a lighting unit with a planar support part, on each of which a plurality of light-emitting semiconductor components, in particular high-performance light-emitting diodes, are arranged on both sides, and a respective heat sink is provided on each side of the support part.
  • the object of the present invention is to create an improved heat dissipation in the simplest possible way in a lighting unit in which a plurality of light-emitting semiconductor components are arranged on both main surfaces of a planar support part.
  • the lighting unit requires a relatively small volume of construction and has a comparatively lower weight.
  • the direct heat dissipation to a heat sink, which is provided on the opposite side of the support member, has the advantage that a comparatively larger heat transfer surface can be used.
  • the high-power LEDs can be operated with a higher current, whereby a greater optical power can be targeted.
  • the support member may be a conventional circuit board such as a rigid FR4 circuit board or a planar ceramic substrate.
  • the support member may also be curved by a flexible circuit board, for example, polyimide formed.
  • the heat conduction means serving to transport the heat to the opposite side of the carrier part can be designed differently, for example in a rigid, plate-shaped carrier by conventional through-hole or by a metallic insert part, which is inserted flush with the surface in an opening of the carrier plate.
  • various surface treatment methods are available, such as for example, the application of a mirror-finish high-gloss layer. It may be advantageous if each reflector disposed on a main surface is associated with a respective reflector, which is formed on a, adjacent to this main surface heat sink.
  • each heat sink and each reflector formed on this heat sink in one piece and of the same material of a good heat-conducting material, e.g. a metal is made.
  • this integral component which serves both for cooling the semiconductor components and for directing the emitted light, can be produced inexpensively in large numbers, for example in injection molding technology.
  • the reflector may be formed, for example, as a spherical concave mirror or as a paraboloidal mirror, in whose focal plane an associated, light-emitting semiconductor component is arranged.
  • a low-cost design with efficient heat dissipation can be designed so that the support member is a printed circuit board on which the semiconductor devices, as seen in a view through the plane of the circuit board through, are each arranged equally spaced.
  • the offset between the components on the front and those on the back favors the heat transfer to the heat sink of the respective opposite side of the support member.
  • the heat transfer through the printed circuit board can be advantageously designed as a thermal through-connection, so-called “thermal vias”.
  • thermal vias consist of holes filled with solder and are largely handled in the production process of a printed circuit board like electrical feedthroughs. They abut with one end on the semiconductor device and are connected at the other end with a heat-conductive layer which is formed on the opposite major surface of the support member.
  • the thermally conductive layer may e.g. be a Cu layer.
  • each heat sink is designed as a shaped body which has support parts which, in an assembled state, have crashed on one of these heat-conducting layers.
  • a particularly compact structure can be achieved if the semiconductor components are mounted in surface mounting on the main surfaces of the support member.
  • a good thermal decoupling between LED's on the front and back can be achieved by each mounted on one of the main surfaces semiconductor device is spaced by an annular gap of the main surface facing the heat sink. If the LEDs on the front and rear are not operated simultaneously, the operating temperature will be lower.
  • a lighting device may be advantageous in the case of each the heat sink a plurality of reflectors are formed so that overlaps adjacent radiation characteristic.
  • the reflector and the cooling fins are formed of the same material and the cooling fins extend in the radiation direction.
  • a different number of LEDs on the front or - back of the support member may be advantageous.
  • the FIG. 1 and the FIG. 2 shows an embodiment of the illumination device according to the invention in a spatial representation as a front or rear view.
  • the lighting device is indicated overall by the reference numeral 12. It consists in the present example essentially of a printed circuit board 3, which is equipped on both sides with high-power light-emitting diodes 6 and is held together by means of fastening screws 20 in the manner of a sandwich between two heat sink 4.5.
  • Each cooling body has cooling ribs 8. These cooling ribs 8 each point in the direction of radiation of the reflectors 18, which are formed on each cooling body 4 and 5, respectively.
  • the heat sink 4 and 5 forms with the respective reflector 18 a structural unit, which in each case fulfills the dual function of heat dissipation and the light beam steering.
  • the heat sink 4 and 5 are made in this example as injection molded articles made of a metal and arranged on a frame 13.
  • each heat sink 4.5 each have a support member 10 and 11, respectively.
  • Each of these support members 10 and 11 was used to heat the each opposite high-performance light-emitting diode, which is explained in more detail below:
  • each support part 10 of the heat sink 4 comes into contact with a heat-conducting surface 14, in the present case a Cu layer, which is formed on the main surface 1 of the printed circuit board 3.
  • a heat-conducting surface 14 in the present case a Cu layer, which is formed on the main surface 1 of the printed circuit board 3.
  • two of these heat-conducting layers 14 are located on the main surface 1.
  • the heat-conducting layers 14 are in turn connected to the four on the second main surface 2 (see FIG FIG. 4 ) of the printed circuit board 3 arranged four high-power LEDs 6 by "thermal vias" good heat conduction connected. In this way, the heat produced during operation of the four LEDs heat to the heat sink 4, which faces the first main surface 1, transmitted and derived from there to the outside space.
  • each support part 11 of the rear heatsink 5 comes with a heat conduction surface 15, the best FIG. 4 to recognize, to the plant.
  • the heat-conducting layer 15 is again a Cu layer which is formed in a manner known per se on the second main surface 2 of the printed circuit board 3.
  • On the back 2, three of these heat-conducting layers 15 are formed.
  • Each of these layers 15 is each connected to a pair of the six high-power LEDs 6 (see FIG FIG. 3 ) on the front side 1 of the circuit board 3 thermally connected.
  • the thermal connection is again by so-called "thermal vias".
  • these six high-power LEDs 6 arranged on the front side 1 of the printed circuit board 3 are cooled by the rear heat sink 5.
  • each high-power LED of one side is cooled by a heat sink arranged on the other side, which is at the same time a reflector for LEDs arranged on the main surface facing it.
  • FIG. 5 shown in a sectional drawing.
  • the drawing shows in section two high-performance LEDs 6 on the second main surface 2 of the circuit board 3.
  • the resulting electrical power loss is through the circuit board 3 through (see detail X of FIG. 6 ) is transferred to an underlying support part 10 of the cooling molded body 4, the surface of which emits the heat to the ambient air.
  • FIG. 6 is the detail X the FIG. 5 shown enlarged.
  • the LED 6 is soldered in surface mounting on the second main surface 2 of the circuit board 3.
  • the printed circuit board 3 has a plurality of holes 17 formed as bores. These holes 17 are filled with solder and form a thermal feedthrough 16. With its rear side, the LED 6 abuts against these metallically filled plated-through holes 16, whereby the heat generated during operation in the LED 6 is first conducted backwards onto the heat-conducting Cu layer 14 becomes.
  • a support member 10 of a heat sink 4 is supported, which dissipates the heat generated in the LED 6.
  • a metallic insert part in an opening of the printed circuit board 3 is also conceivable.
  • annular gap 19 is also formed between the LEDs on the first main surface 1 and the heat sink 4 ( FIG. 1 ).

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Vehicle Body Suspensions (AREA)
  • Fluid-Damping Devices (AREA)

Claims (12)

  1. Unité d'éclairage comprenant une pièce support (3) de forme plane sur laquelle est disposée des deux côtés, sur une surface principale (1, 2), une pluralité de composants semi-conducteurs (6) émettant de la lumière, en particulier des diodes électroluminescentes à haute puissance, et de chaque coté de ladite pièce support (3) est prévu un radiateur (4, 5), caractérisée en ce que
    - par l'intermédiaire d'un moyen thermoconducteur (16) guidé à travers une rupture (17) de la pièce support (3), chacun des composants semi-conducteurs (6) est relié avec une bonne conduction thermique à un radiateur (4, 5) prévu sur le côté opposé de la pièce support (3), et
    - sur chaque radiateur (4, 5) est réalisé au moins un réflecteur (18) qui possède une surface réfléchissante (7), laquelle focalise l'émission de lumière d'un composant semi-conducteur (6) disposé sur le côté faisant face audit radiateur de la pièce support (3).
  2. Unité d'éclairage selon la revendication 1, caractérisée en ce qu'à chacun des composants semi-conducteurs (6) disposés sur une surface principale (1, 2) est associé un réflecteur (18), lequel est réalisé sur un radiateur (4, 5) faisant face à ladite surface principale.
  3. Unité d'éclairage selon la revendication 1 ou 2, caractérisée en ce que chaque réflecteur (18) réalisé sur l'un des radiateurs (4, 5) est fabriqué en une seule pièce avec ledit radiateur et de manière homogène à partir d'un même matériau métallique.
  4. Unité d'éclairage selon la revendication 3, caractérisée en ce que chaque réflecteur (18) est réalisé en tant que partie d'un miroir concave sphérique dans le plan focal duquel est disposé un composant semi-conducteur (6) associé.
  5. Unité d'éclairage selon la revendication 4, caractérisée en ce que plusieurs réflecteurs (18) sont réalisés sur chacun des radiateurs (4, 5), de sorte qu'il y a chevauchement d'une caractéristique de rayonnement voisine.
  6. Unité d'éclairage selon l'une des revendications 2 à 5, caractérisée en ce que la pièce support (3) est une carte de circuit imprimé sur laquelle les composants semi-conducteurs (6), vus à travers le plan de ladite carte, sont disposés à distance égale.
  7. Unité d'éclairage selon la revendication 6, caractérisée en ce que ledit moyen thermoconducteur est conçu sous forme de contact traversant thermique (16), relié à une extrémité à un composant semi-conducteur (6) et à l'extrémité opposée à une couche thermoconductrice (14, 15) réalisée sur la surface principale en regard dudit composant semi-conducteur (6) de la pièce support (3).
  8. Unité d'éclairage selon la revendication 7, caractérisée en ce qu'à l'état assemblé, sur chaque couche thermoconductrice (14, 15), au moins une pièce d'appui (10, 11) d'un radiateur (4, 5) faisant face à une couche (14, 15) est en appui.
  9. Unité d'éclairage selon la revendication 8, caractérisée en ce que les composants semi-conducteurs (6) sont montés sur les surfaces principales (1, 2) de la pièce support (3) selon la technique de montage en surface.
  10. Unité d'éclairage selon la revendication 9, caractérisée en ce que chacun des composants semi-conducteurs (6) montés sur une surface principale (1, 2) est séparé du radiateur (4, 5) faisant face à ladite surface principale (1, 2) par un espace (19).
  11. Unité d'éclairage selon la revendication 10, caractérisée en ce que chaque radiateur (4, 5) a des ailettes de refroidissement (8).
  12. Unité d'éclairage selon la revendication 10, caractérisée en ce que le nombre de composants semi-conducteurs (6) sur la première surface principale (1) est différent du nombre de composants semi-conducteurs (6) sur la deuxième surface principale (2).
EP20080102984 2007-05-23 2008-03-27 Unité d'éclairage Active EP1995514B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200710023918 DE102007023918A1 (de) 2007-05-23 2007-05-23 Beleuchtungseinheit

Publications (3)

Publication Number Publication Date
EP1995514A2 EP1995514A2 (fr) 2008-11-26
EP1995514A3 EP1995514A3 (fr) 2009-03-04
EP1995514B1 true EP1995514B1 (fr) 2011-05-04

Family

ID=39712342

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20080102984 Active EP1995514B1 (fr) 2007-05-23 2008-03-27 Unité d'éclairage

Country Status (4)

Country Link
US (1) US7794115B2 (fr)
EP (1) EP1995514B1 (fr)
AT (1) ATE508328T1 (fr)
DE (2) DE102007023918A1 (fr)

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AT518266A4 (de) * 2016-02-24 2017-09-15 Zkw Group Gmbh Halterungsvorrichtung für ein elektronisches Bauteil
CN107795949A (zh) * 2016-08-19 2018-03-13 古德里奇照明系统有限责任公司 飞行器前灯

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JP5288161B2 (ja) * 2008-02-14 2013-09-11 東芝ライテック株式会社 発光モジュール及び照明装置
GB0809650D0 (en) * 2008-05-29 2008-07-02 Integration Technology Ltd LED Device and arrangement
US8585241B2 (en) * 2008-06-11 2013-11-19 Chang Wah Electromaterials Inc. Power-saving lighting apparatus
US20090323295A1 (en) * 2008-06-30 2009-12-31 Houle Sabina J Injection molded metal stiffener and integrated carrier for packaging applications
JP2010153803A (ja) * 2008-11-28 2010-07-08 Toshiba Lighting & Technology Corp 電子部品実装モジュール及び電気機器
CN101813248A (zh) * 2009-02-19 2010-08-25 富准精密工业(深圳)有限公司 发光二极管灯具
JP4960981B2 (ja) * 2009-03-03 2012-06-27 シャープ株式会社 Ｌｅｄ基板、ｌｅｄ光源装置
US9887338B2 (en) * 2009-07-28 2018-02-06 Intellectual Discovery Co., Ltd. Light emitting diode device
DE102010043313B4 (de) * 2010-11-03 2022-08-25 HELLA GmbH & Co. KGaA Beleuchtungsvorrichtung für Fahrzeuge
US8777455B2 (en) 2011-06-23 2014-07-15 Cree, Inc. Retroreflective, multi-element design for a solid state directional lamp
US8757840B2 (en) 2011-06-23 2014-06-24 Cree, Inc. Solid state retroreflective directional lamp
US8616724B2 (en) 2011-06-23 2013-12-31 Cree, Inc. Solid state directional lamp including retroreflective, multi-element directional lamp optic
USD696436S1 (en) 2011-06-23 2013-12-24 Cree, Inc. Solid state directional lamp
US8777463B2 (en) * 2011-06-23 2014-07-15 Cree, Inc. Hybrid solid state emitter printed circuit board for use in a solid state directional lamp
US9291317B2 (en) 2011-07-29 2016-03-22 Cooper Technologies Company Channel-type connection structure for a lighting system
JP2013062177A (ja) * 2011-09-14 2013-04-04 Panasonic Corp 照明器具
JP6320941B2 (ja) 2012-03-08 2018-05-09 フィリップス ライティング ホールディング ビー ヴィ 発光装置及び発光装置の製造方法
US20130265769A1 (en) * 2012-04-09 2013-10-10 MaxLite, Inc. Even pressure distribution led illumination device
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US20080291631A1 (en) 2008-11-27
EP1995514A3 (fr) 2009-03-04
US7794115B2 (en) 2010-09-14
DE502008003395D1 (de) 2011-06-16
EP1995514A2 (fr) 2008-11-26
ATE508328T1 (de) 2011-05-15

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