EP1923627B1 - Commande intégrée d'agencements de DEL - Google Patents

Commande intégrée d'agencements de DEL Download PDF

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Publication number
EP1923627B1
EP1923627B1 EP07118265A EP07118265A EP1923627B1 EP 1923627 B1 EP1923627 B1 EP 1923627B1 EP 07118265 A EP07118265 A EP 07118265A EP 07118265 A EP07118265 A EP 07118265A EP 1923627 B1 EP1923627 B1 EP 1923627B1
Authority
EP
European Patent Office
Prior art keywords
led
led module
components
control unit
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP07118265A
Other languages
German (de)
English (en)
Other versions
EP1923627A1 (fr
Inventor
Josef Richter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP1923627A1 publication Critical patent/EP1923627A1/fr
Application granted granted Critical
Publication of EP1923627B1 publication Critical patent/EP1923627B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/151—Light emitting diodes [LED] arranged in one or more lines
    • F21S41/153—Light emitting diodes [LED] arranged in one or more lines arranged in a matrix
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED module, which is intended in particular for installation in a lighting unit. It comprises a plurality of LED components which are arranged on one or more carrier element (s). In addition, other elements, such as electrical connection means, via which the LED components can be connected to a power supply, and / or a thermally conductive connected to the LED components thermal contact element, via which the heat loss of the LED components preferably to the lighting unit or ., Can be dissipated to a heat sink of the lighting unit, be integrated into the LED module.
  • Such lighting units can be used both for purposes of interior lighting and outdoor lighting. In particular, a use of such lighting units is also possible in or on motor vehicles.
  • LED light emitting diode
  • optical semiconductor components in the form of light-emitting diodes in particular light-emitting diode chips (LED chips) can be used.
  • LED chips may be LED chips with phosphor coating or even RGB LEDs.
  • a plurality of LED components are arranged in an array, wherein the LEDs are preferably mounted as surface-mounted SMD (SMD) element by soldering or gluing on a support or a printed circuit board.
  • SMD surface-mounted SMD
  • LEDs are increasingly being used because they have some significant advantages over conventional light bulbs. LEDs have a longer life, a smaller size and a good efficiency in the conversion of electrical energy into light. Furthermore, LEDs are characterized by insensitivity to shocks and vibrations, which represents a considerable advantage, especially in motor vehicles.
  • a lighting unit in which a plurality of encapsulated LEDs are arranged in a wired version on one side of a support plate.
  • the operating current is supplied to the LEDs via a circuit in the form of printed conductors, which are applied to the other side of the carrier plate.
  • a cooling plate provided with bores is arranged such that the heads of the LEDs each protrude separately into the bores of the cooling plate.
  • flexible printed circuit boards are usually equipped with LEDs in a two-dimensional plane, and then the flexible structure thus obtained is glued to a heat sink.
  • the heat sink can, as it is from the DE 199 22 176 A1 is known, for example, made of copper or aluminum, which have the desired application for the desired three-dimensional shape and be provided on the side facing away from the circuit board surfaces with cooling fins.
  • the printed circuit board is preferably attached to the heat sink with a thermal paste, a thermal adhesive, a heat-conducting foil or the like, with an exact alignment of the LED components is difficult and just like the sticking of the circuit board to the heatsink means a considerable assembly effort.
  • LED lighting modules also called LED modules
  • LED modules are used in which a certain number of LEDs are combined in a specific arrangement to form a module to the required Amount of light for specific applications.
  • Such modules can be mounted relatively easily in a lighting unit.
  • the control of the LED modules or the individual LEDs by means of special driver circuits, which is arranged as an external control unit outside the respective modules and to be mounted separately.
  • a scanning head module with a photo-sensitive detector such as can be used in scanners or copiers or fax machines.
  • the photosensitive detector are integrated with a processor circuit in a module, so that a line for transmitting the detected photosignals between the processor circuit and the photosensitive detector is not needed.
  • Object of the present invention is to provide an improved LED module of the type mentioned, which allows an even easier and faster installation in a lighting unit.
  • control unit for controlling the LED components is combined with the LED module to form a uniform assembly.
  • a control unit is integrated into the LED module, which forms the carrier element at least for individual LED components fastened directly thereto.
  • the LED module according to the invention according to claim 1 over the prior art embodiments has the particular advantage that a separate assembly and subsequent connection of an external control unit for the LED module is no longer required, which the effort and thus the production costs of such LED modules equipped lighting unit significantly reduced.
  • For processing the LED module according to the invention only a few steps are required.
  • control unit comprises an electronic or integrated circuit which is designed as an IC (integrated circuit), in particular as an application-specific ASIC (ASIC), wherein the required functions for controlling the LEDs in the ASIC can be mapped with suitable processes.
  • IC integrated circuit
  • ASIC application-specific ASIC
  • control unit can also comprise a silicon IC or a silicon carbide IC, wherein silicon carbide is characterized by very good thermal properties and is often used as a base material for LEDs.
  • the control unit also includes the logic to operate the LED module, thereby creating a fully functional LED unit.
  • the control unit may comprise driver circuits, by which the LED components individually or in groups, in series or in parallel or in RGB arrangements can be controlled, which allows flexible use of the LED modules according to the invention also in areas where it arrives at multicolored light signals.
  • sensor means for monitoring the function of the LED components and / or compensating means to compensate for aging of the LED components are integrated into the control unit. These monitoring functions can be mapped in particular in an ASIC.
  • the LED components are glued or soldered to the control unit, in particular to the IC.
  • the area required for the subsequent LED assembly is omitted, which may include the contact area for the individual LED components and the areas required for the electrical connections, for example so-called bondpads.
  • these surfaces can be coated with a suitable metal coating.
  • the LED module can advantageously form a monolithic chip-on-chip unit.
  • control unit with the LED components applied according to the invention forms a fully functional semiconductor lamp unit which can be applied to a heat sink or to a carrier strip which is also designated as lead frame. Since the temperature resistance of integrated circuits corresponds to the permissible operating temperature of the LEDs, it is particularly easy to carry out a standardized further processing on a suitable heat sink or a lead frame with this combination according to the invention.
  • a carrier strip with two mutually parallel mounting bars and with a plurality of carrier elements each having at least one mounting surface for receiving an LED module is preferably proposed, wherein the carrier elements are each connected via connecting webs with the two mounting webs.
  • the two mounting webs are each provided with mounting means, in particular with mounting holes, for attachment to a housing or heat sink.
  • the carrier strip may for example consist of aluminum or copper or of a copper alloy.
  • the LED module comprises at least one thermal contact element, with which the LED components are thermally conductively connected and can be dissipated via the heat loss of the LED components in particular to a LED module receiving luminous unit.
  • the thermal contact element is formed by an open or closed housing made of a thermally conductive material, in which the control unit with the LED components, as well as optionally provided with other components of the LED module, in particular electrical connection means recorded .
  • a robust and particularly compact design of the LED module is achieved, which is not only easy to handle, but at the same time also allows a particularly effective transition of dissipated heat.
  • the housing can have an arbitrarily shaped outer contour, which can be adapted to the requirements imposed on the lighting unit.
  • the housing consists of a good heat-conducting material, in particular of copper or aluminum or of corresponding alloys.
  • a base made of a highly thermally conductive material is provided, on which the control unit is recorded with the attached LED components.
  • the waste heat can then be removed via the base, which is preferably adapted specifically to the size of the control unit and the number of LEDs of the module, depending on the type of module recording either directly or indirectly via the housing on to the lighting unit.
  • the base is in particular made in one piece with the housing and therefore also preferably consists of copper or aluminum.
  • optical means in particular plastic optics or optical conversion means, for example an optical filling medium for color conversion of the light emitted by the LEDs of the module, are accommodated or fitted in the housing.
  • optical means in particular plastic optics or optical conversion means, for example an optical filling medium for color conversion of the light emitted by the LEDs of the module.
  • optical conversion means for example an optical filling medium for color conversion of the light emitted by the LEDs of the module.
  • the outer sides of the housing at least partially have a toothing or knurling.
  • the housing of the LED module can be pressed particularly good thermal conductivity in a heat sink of the lighting unit.
  • the subject matter of the present invention is furthermore a lighting unit with a plurality of LED components and a heat sink, via which the heat loss of the LEDs can be dissipated, wherein the lighting unit comprises one or more LED modules of the type described above.
  • a lighting unit is due to the prefabricated LED modules with integrated control unit particularly fast and easy to assemble, allowing a cost-effective production.
  • the one or more LED modules each have a housing of the aforementioned type, which is received positively in the heat sink of the lighting unit.
  • the housings of the prefabricated LED modules are directly accommodated in the frictional insertion into the heat sink in such a way that the desired focusing of the light-emitting diodes is obtained virtually automatically in a particularly fast and simple manner.
  • a fast and particularly effective heat distribution heat spreader function
  • a particularly precise alignment of the LED module can be achieved in that the housing in an opening or in a recess of the heat sink of the lighting unit is used, preferably pressed.
  • the pressing of the module housing in a complementary recording of the heat sink allows a particularly fast, positive and positive recording and alignment of the LED module.
  • a plurality of housing of a plurality of LED modules can be pressed into a common heat sink, whereby particularly close tolerances of the individual LED modules can be maintained and a complex optical alignment of the LED modules to each other during assembly is no longer required.
  • optical applications and lighting units are for example from the DE 197 57 513 A1 Einpressdioden known in cooling plate design, which are received positively in a recess or depression of a cooling plate.
  • Such press-in diodes are used, for example in welding equipment as a rectifier, where it does not depend on an exact alignment during assembly.
  • the lighting unit according to the invention is a headlamp, in particular a motor vehicle headlamp, comprising a headlamp heat sink in which at least one module housing of the type described above is positively received, preferably pressed in or screwed in.
  • the lighting unit can be configured as another motor vehicle lighting unit, such as a taillight and / or turn signal unit.
  • the present invention can thus be used advantageously in particular in the automotive sector, but also in general lighting applications.
  • LED module 1 is intended for installation in a lighting unit, not shown here. It comprises a cylindrical housing 2 made of aluminum, which in each case has a recess 3 at its two end faces and is thus designed to be open. Between the two recesses 3 is a disc-shaped base 4, which is integrally connected to the sleeve-shaped wall 5 of the housing 2.
  • a total of four LED components 6 are added, which are each designed here as a surface-mounted LED chips.
  • the individual LED chips 6 are mounted in a 2x2 array on the surface of a control unit 7 of the LED module 1, which in turn directly attached to the base 4 is.
  • the LED chips 6 are thermally conductively connected to the wall 5 of the module housing 2 via the control unit 7 and the base 4.
  • the module housing 2 in this case represents a thermal contact element, via which the heat loss of the LED components 6 can be dissipated to the LED module 1 receiving luminous unit or to a heat sink 8 of a lighting unit.
  • connection board 9 is received, which is connected to a running here as a flat cable connection cable 13, via the lines of the LED module 1 and thus in particular the LED chips 6 can be supplied with power.
  • connection board 9 Via two insulating pins 11 passed through the base 4, the connection board 9 is connected to the control unit 7 and the LED chips 6 attached thereto.
  • the front end surfaces of the contact pins 11 are connected by bonding wires 12 to the control unit 7.
  • the rear end portions of the contact pins 11 each contact a recessed in the connection board 9 connector socket.
  • other connection means 13 may be provided, such as connector or pins.
  • a plastic primary optics 14 can be glued over the LED chips 6 and / or inserted into the corresponding recess 3, in particular clipped, as in FIG FIG. 3 is shown.
  • the four LED chips 6 are arranged next to one another in a row on the control unit 7. Basically, any number of LED chips 6 can be provided in any arrangement in the LED module 1, depending on the purpose.
  • the back of the housing 2 can be completed by a suitable cover.
  • a pre-assembled LED module 1 is obtained, in which a control unit 7 for controlling the LED components 6 is already integrated.
  • the pre-assembled LED modules 1 are later particularly quickly and easily inserted into suitable recesses 15 of a heat sink 8 of a lighting unit.
  • the LED modules 1 preferably have on their housing 2 an outside knurling 16, via which they are positively and non-positively pressed into the recesses 15 of the heat sink 8.
  • a particularly simple, yet highly accurate optical alignment of the individual LED modules 1 to each other is achieved, so that a subsequent adjustment of individual LEDs for the desired focusing of the lighting unit during assembly is not required.
  • the LED modules 1 can be pressed directly into their predetermined by the recesses 15 positionally accurate alignment in the heat sink 8.
  • the in FIG. 4 shown heatsink 8 has three recesses 15 in order to record a total of three inventively prefabricated LED modules 1, each with an integrated control unit 7 non-positively.
  • the heat sink 8 which also consists of aluminum, provided with cooling fins 17, via which the waste heat can be dissipated to the environment. Since the heat sink 8 is made of aluminum here as well as the housing 2 of the LED modules 1, not only results in a particularly good heat transfer due to the identical thermal expansion coefficient, but it is also a permanently secure interference fit between the module housings 2 and the heat sink 8 guaranteed ,
  • the number and arrangement of the holes or recesses 15 as well as the shape of the heat sink 8 can be varied depending on the requirements of the associated lighting unit requirements.
  • any orientation of the bores or recesses 15 in three-dimensional space is possible with a three-dimensional heat sink 8.
  • the heat sink 8 may also be designed for a motor vehicle headlight.
  • the recesses 15 are preferably introduced in a corresponding processing center in only a single clamping.
  • a metallic carrier strip 20 a so-called lead frame is shown, to which a plurality of LED modules 1 can be attached.
  • the carrier strip 20 is preferably made of copper or a copper alloy.
  • the carrier strip 20 has a first mounting web 21 and a second mounting web 22, wherein the two mounting webs 21, 22 form parallel webs, in each of the mounting holes 23 are introduced.
  • the carrier strip 20 can be mounted in a housing and optionally connected to further cooling elements.
  • Support members 31, 32 and 33 which in the embodiment shown here form an approximate rectangular, planar surface, are held by thin support arms between the two webs 21, 22.
  • mounting surfaces 41, 42, 43 are sketched, where the respective LED modules 1 can be applied for example by gluing or by soldering.
  • the module housing 2 preferably contacts the surface of the respective associated carrier element.
  • the mounting webs 21, 22 are each connected only via thin connecting webs with the carriers 31, 32, 33. In the FIG. 5 are for the sake of clarity of the drawing, only two connecting webs 51, 52 provided with a reference numeral. By means of the openings formed by the thin design of the connecting webs 51, the carriers 31, 32 can be cooled with air guided past them.
  • connection webs in particular in an embodiment of a material with good heat conduction, that over the connecting webs 51, 52 heat to the mounting webs 21, 22 is led away for further dissipation.
  • the attachment of the LED modules on the surface of the carrier 31, 32, 33 can be done by means known from the processing of power semiconductors manufacturing processes.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Optical Couplings Of Light Guides (AREA)

Claims (10)

  1. Module LED (1) présentant plusieurs composants LED (6) disposés sur au moins un élément de support, une unité de commande (7) destinée à commander les composants LED (6) étant intégrée dans le module LED (1),
    caractérisé en ce que
    l'unité de commande (7) est un circuit intégré (IC) et en particulier un ASIC,
    en ce qu'au moins certains des composants LED (6) sont fixés directement sur l'unité de commande (7) de sorte que l'unité de commande (7) forme l'élément de support pour ces composants LED (6) et
    en ce que l'unité de commande (7) forme avec les composants LED (6) une unité d'éclairage à semiconducteur qui est placée sur un corps de refroidissement (8) ou sur un ruban de support (conducteur de support) (20).
  2. Module LED selon la revendication 1, caractérisé en ce que l'unité de commande (7) comprend un IC au silicium ou un IC au carbure de silicium.
  3. Module LED selon l'une des revendications précédentes, caractérisé en ce que des moyens de détection qui surveillent le fonctionnement des composants LED (6) et/ou des moyens de compensation qui compensent le vieillissement des composants LED (6) sont intégrés dans l'unité de commande (7).
  4. Module LED selon l'une des revendications précédentes, caractérisé en ce que les composants LED (6) sont collés ou brasés sur l'unité de commande (7).
  5. Module LED selon l'une des revendications précédentes, caractérisé en ce que le ruban de support comprend deux nervures de montage (21, 22) disposées parallèlement l'une à l'autre et dotées chacune de moyens de montage (23) et en particulier d'ouvertures de montage, ainsi que plusieurs éléments de support (31, 32, 33) dotés chacun au moins d'une surface de montage (41, 42, 43) qui loge un module LED (1), les éléments de support (31, 32, 33) étant reliés aux nervures de montage (21, 22) par des traverses de liaison (51, 52).
  6. Module LED selon l'une des revendications précédentes, caractérisé en ce qu'il comprend au moins un élément thermique de contact (2, 5) par lequel les pertes de chaleur des composants LED (6) qui lui sont reliés de manière thermiquement conductrice puissent être évacuées et en particulier transférées à un ensemble de lampe qui loge le module LED.
  7. Module LED selon la revendication 6, caractérisé en ce que l'élément thermique de contact est formé par un boîtier (2) ouvert ou fermé en matériau thermiquement conducteur dans lequel l'unité de commande (7) est reprise en même temps que les composants LED (6) ainsi qu'éventuellement d'autres composants prévus dans le module LED (1), en particulier des moyens (13) de raccordement électrique.
  8. Ensemble de lampe présentant plusieurs composants LED (6) et un corps de refroidissement (8) par lequel les pertes de chaleur des composants LED (6) peuvent être évacuées, caractérisé en ce qu'il comporte au moins un module LED (1) selon l'une des revendications précédentes.
  9. Ensemble de lampe selon la revendication 8, doté d'un module LED selon la revendication 7 et caractérisé en ce que le ou les modules LED (1) présentent un boîtier (2, 5) qui est repris en correspondance mécanique, de préférence en compression, dans le corps de refroidissement (8), en particulier dans une ouverture ou découpe (15) du corps de refroidissement (8).
  10. Ensemble de lampe selon les revendications 8 ou 9, caractérisé en ce qu'il est configuré comme phare et en particulier comme phare de véhicule automobile qui présente un corps (8) de refroidissement de phare dans lequel au moins un module LED (1) est repris et de préférence enfoncé par l'intermédiaire d'un boîtier de module (2, 5).
EP07118265A 2006-11-16 2007-10-11 Commande intégrée d'agencements de DEL Not-in-force EP1923627B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006054180 2006-11-16
DE102007024390A DE102007024390A1 (de) 2006-11-16 2007-05-25 LED-Modul mit integrierter Ansteuerung

Publications (2)

Publication Number Publication Date
EP1923627A1 EP1923627A1 (fr) 2008-05-21
EP1923627B1 true EP1923627B1 (fr) 2009-08-19

Family

ID=39027610

Family Applications (2)

Application Number Title Priority Date Filing Date
EP07118261A Expired - Fee Related EP1923626B1 (fr) 2006-11-16 2007-10-11 Module DEL avec commande intégrée
EP07118265A Not-in-force EP1923627B1 (fr) 2006-11-16 2007-10-11 Commande intégrée d'agencements de DEL

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP07118261A Expired - Fee Related EP1923626B1 (fr) 2006-11-16 2007-10-11 Module DEL avec commande intégrée

Country Status (4)

Country Link
EP (2) EP1923626B1 (fr)
AT (1) ATE440250T1 (fr)
DE (3) DE102007024390A1 (fr)
ES (2) ES2329522T3 (fr)

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US10180248B2 (en) 2015-09-02 2019-01-15 ProPhotonix Limited LED lamp with sensing capabilities

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DE102008059468A1 (de) * 2008-11-28 2010-06-24 Osram Opto Semiconductors Gmbh Optoelektronische Lampe
DE102009024907A1 (de) * 2009-06-15 2010-12-16 Osram Gesellschaft mit beschränkter Haftung Kühlkörper für Halbleiterleuchtelemente
DE102009054620A1 (de) 2009-12-14 2011-06-16 Robert Bosch Gmbh Lichtmodul zum Einbau in ein Leuchtaggregat
DE102009060790A1 (de) 2009-12-22 2011-06-30 Automotive Lighting Reutlingen GmbH, 72762 Lichtmodul für eine Beleuchtungseinrichtung eines Kraftfahrzeugs sowie Beleuchtungseinrichtung eines Kraftfahrzeugs mit einem solchen Lichtmodul
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DE102007024390A1 (de) 2008-05-21
DE502007001339D1 (de) 2009-10-01
EP1923627A1 (fr) 2008-05-21
EP1923626A1 (fr) 2008-05-21
DE502007001338D1 (de) 2009-10-01
ATE440250T1 (de) 2009-09-15
ES2330386T3 (es) 2009-12-09
EP1923626B1 (fr) 2009-08-19
ES2329522T3 (es) 2009-11-26

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