EP2096685A1 - Module à DEL doté de corps de refroidissement comprenant un moyen de montage - Google Patents

Module à DEL doté de corps de refroidissement comprenant un moyen de montage Download PDF

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Publication number
EP2096685A1
EP2096685A1 EP08102125A EP08102125A EP2096685A1 EP 2096685 A1 EP2096685 A1 EP 2096685A1 EP 08102125 A EP08102125 A EP 08102125A EP 08102125 A EP08102125 A EP 08102125A EP 2096685 A1 EP2096685 A1 EP 2096685A1
Authority
EP
European Patent Office
Prior art keywords
led
led module
heat sink
module according
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08102125A
Other languages
German (de)
English (en)
Inventor
Sigmund Braun
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to EP08102125A priority Critical patent/EP2096685A1/fr
Publication of EP2096685A1 publication Critical patent/EP2096685A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/151—Light emitting diodes [LED] arranged in one or more lines
    • F21S41/153—Light emitting diodes [LED] arranged in one or more lines arranged in a matrix
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED module, which is intended for installation in a lighting unit, wherein the LED module comprises a plurality of LED components which are mounted on a circuit board such that they directly or indirectly with a to dissipate the heat loss of the LED -Building elements provided heatsink are connected.
  • Such lighting units can be used both for purposes of interior lighting and outdoor lighting. In particular, a use of such lighting units is also possible in or on motor vehicles.
  • LED light emitting diode
  • optical semiconductor components in the form of light-emitting diodes in particular light-emitting diode chips (LED chips) can be used.
  • LED chips light-emitting diode chips
  • a plurality of LED components are arranged in an array, wherein the LEDs are preferably mounted as surface-mounted SMD (SMD) element by soldering or gluing on a support or a printed circuit board.
  • SMD surface-mounted SMD
  • LEDs are increasingly being used because they have some significant advantages over conventional light bulbs. LEDs have a longer life, a smaller size and a better efficiency in the conversion of electrical energy into light. Furthermore, LEDs are characterized by insensitivity to shocks and vibrations from, which represents a considerable advantage, especially in motor vehicles.
  • the waste heat that occurs as a loss has to be dissipated against the backdrop of constantly increasing performance, even in LEDs, in order to prevent overheating and thus functional impairment or even destruction of the LEDs.
  • the waste heat is dissipated from the underside of the LED components via their electrical connections and / or via a serving as a heat connection third contact to a metallic heat sink.
  • flexible printed circuit boards are usually equipped with LEDs in a two-dimensional plane, and then the flexible structure thus obtained is glued to a heat sink.
  • the heat sink can, as it is from the DE 199 22 176 A1 is known, for example, made of copper or aluminum, which have the desired application for the desired three-dimensional shape and be provided on the side facing away from the circuit board surfaces with cooling fins.
  • the printed circuit board is preferably attached to the heat sink with a thermal paste, a thermal adhesive, a heat-conducting foil or the like, with an exact alignment of the LED components is difficult and just like the sticking of the circuit board to the heatsink means a considerable assembly effort.
  • LED lighting modules also called LED modules for short
  • LED modules in which a certain number of LEDs are combined in a specific arrangement into a module in order to achieve the required amount of light for specific applications.
  • Such modules can be mounted relatively easily in a lighting unit.
  • the LEDs are soldered or glued onto a structured circuit carrier, which may be formed by a rigid or flexible printed circuit board or by an IMS substrate.
  • a structured circuit carrier which may be formed by a rigid or flexible printed circuit board or by an IMS substrate.
  • a third contact via which the heat loss of the LED is dissipated.
  • This heat connection which is generally non-floating, is soldered or glued to a surface area of the circuit carrier that is designed so that it is not in electrical contact with the rest of the circuit. The heat is subsequently applied via an electrical insulating layer in the circuit carrier discharged to a metallic cooling carrier.
  • an LED module with a plurality of LEDs is arranged, which are arranged on a flexible printed circuit board, which is attached to a heat sink.
  • the flexible circuit board is provided with holes through which the individual LEDs are in direct contact with the heat sink.
  • Object of the present invention is to provide an improved LED module of the type mentioned, which allows for improved heat dissipation easier and more accurate installation of the individual light points of the LED module.
  • the LED module comprises at least one heat sink, which is connected to at least one LED component, and that the heat sink or at least one, preferably all heatsink, mounting means for a positive and / or non-positive mounting having on another element of the LED module or the LED module receiving luminous unit.
  • a prefabricated and easy-to-install LED assembly is created, which not only allows a particularly good heat dissipation, but in particular a quick and easy to perform mountability with improved positioning accuracy of the individual LEDs. So can the mounted on the heat sinks, in particular soldered LEDs are positioned in the assembly of the LED module together with the positive or non-positive attachment and alignment of the heat sink in a lighting unit.
  • the LED module according to the invention according to claim 1 thus has over the previously known embodiments in particular the advantage that an alignment of the individual LEDs when applying the printed circuit board on an arbitrarily shaped three-dimensional element due to the previously executed in a two-dimensional plane connection with the form-fitting and / or frictionally mountable heat sinks can be omitted, which significantly reduces the cost and therefore the manufacturing cost of equipped with such LED modules lighting unit.
  • the LED module comprises a plurality of heat sinks and the circuit board is provided with openings, wherein the LED components are mounted on the circuit board such that they are each connected through an opening with a heat sink.
  • the heat loss of the LEDs due to the direct contact with a heat sink can be dissipated particularly quickly and effectively, since the heat is passed only on metallic and highly thermally conductive materials.
  • the individual heat sinks can also be arranged movably relative to one another and connected to one another via the flexible printed circuit board, which can be advantageous, for example, in the case of cornering light or cornering light applications.
  • each LED component is connected to its own separate heat sink.
  • each LED component is connected to its own separate heat sink.
  • even more complex arrangements with a plurality of LEDs can be placed in a particularly accurate position on a three-dimensionally shaped support.
  • particularly close tolerances of the individual LEDs are achievable to each other.
  • this will ensures a particularly simple way of electrical insulation of the heat connections of the individual LEDs to each other.
  • the mounting means of the heat sink each comprise at least one recess which can be positively placed on a respective projection of an aggregate element. It is achieved by the direct positive positioning of the heat sink and an indirectly form-fitting positioning of the associated LEDs. If a plurality of heat sinks are provided, the printed circuit board is advantageously made flexible in order to ensure a certain relative mobility of the heat sinks to one another. It is also possible to turn the two elements cooperating with one another in a form-fitting manner, so that a projection is provided on the heat sink, which projection can be inserted in a form-locking manner into a recess provided on an aggregate element.
  • the projections may preferably be formed integrally on an element or embossed out of a contour.
  • a thermal adhesive between the projections and recesses are applied to achieve a cohesive grip.
  • the recess has a self-centering shape.
  • the recess may in particular have a hemispherical, conical, frusto-conical or similar tapering inner contour.
  • a particularly preferred embodiment provides that the heat sinks provided separately for each LED are each formed by a sleeve or sleeve closed on one side with a conical wall.
  • This embodiment of the positive mounting not only a structurally particularly simple embodiment, but above all, a particularly effective heat dissipation is achieved.
  • the heat dissipation takes place on the one hand on the inside of the sleeve directly to the form-fitting associated projection of the corresponding unit element as well as on the other hand by free convection on the outside of the soldered directly to the heat connection of the LED socket.
  • the dissipated via the free convection in the interior of a lighting unit heat can be used in the case of a headlight advantageously also for heating or defrosting the protective glass of the headlamp.
  • the heat sink bush formed in this way is made of copper.
  • the overall heat sink may preferably be formed in a manner known per se as a heat sink and have a plurality of cooling fins.
  • the mounting means of the heat sink in each case comprise at least one elastically resilient holding region, by means of which the heat sink can be fastened non-positively or latchingly on an element of the LED module or the lighting unit.
  • the heatsink can be used in addition to their function for dissipating the heat loss at the same time as retaining clips for mounting the LED module or individual portions thereof.
  • each holding region for positive engagement has at least one projection and / or a recess or opening through which the heat sink to another element form-fitting and / or frictionally engaged. This allows a particularly simple and quickly executable mounting of the LED module to other elements.
  • optical means in particular a plastic optics, are provided in the LED module. These can be connected in a particularly simple manner via the elastically resilient holding areas latching with the heat sinks.
  • a flexible LED chain can advantageously be formed with a plurality of LEDs attached to each other, each attached to a heat sink designed according to the invention, which are particularly simple and quick by clipping the individual Heatsink in a lighting unit, in particular in a headlight housing, can be mounted.
  • the present invention further relates to a lighting unit with a plurality of LED components and a plurality of heat sinks, via which the heat loss of the LEDs can be removed, wherein the lighting unit comprises at least one, but preferably a plurality of LED modules of the type described above, the at least one flexible circuit board and / or are interconnected by at least one flexible flat cable.
  • a lighting unit is due to the prefabricated and easily assembled LED modules in total very fast and easy to assemble, which allows a cost-effective production.
  • the lighting unit has at least one serving as an LED support total heat sink, can be dissipated via the heat loss of all LEDs, the total heat sink more as a fixed point for each LED serving projections, on each of which a heat sink of an LED component is seated.
  • the heat sink can also be mounted on projections of other elements of the lighting unit.
  • the lighting unit according to the invention is a headlamp, in particular a motor vehicle headlamp, which comprises a headlamp heat sink, on which at least one LED module is positively received or clipped.
  • the present invention can thus be used advantageously in particular in the automotive sector, but also in general lighting applications.
  • the present invention furthermore relates to a method for mounting an LED module according to the above-described first particularly preferred embodiment of the invention, in which module the mounting means of the heat sink each comprise at least one recess which is positively connected to a respective projection of an aggregate element or the LED. Module can be placed.
  • This mounting method according to the invention is characterized in that a negative pressure is applied to at least some projections of the unit element or the LED module via a line system opening into the projections.
  • openings are provided in the projections, to which the preferably formed by bores, channels, and / or hoses line system connects, which is connected to a pump for generating a negative pressure.
  • the heatsink are sucked when the negative pressure on the projections and tightened there, which further simplifies the assembly considerably further.
  • the suction force required for a cohesive hold of the heat sink can be applied by the suction of the heat sink to the unit element or to the LED module.
  • LED module 1 is intended for installation in a not shown in the figures lighting unit. It comprises a flexible printed circuit board 2 serving as a circuit carrier, on which a multiplicity of LED components 3 are arranged, each of which is embodied here as a surface-mounted LED chip. Each individual LED chip 3 is connected to a separate heat sink 4, which is designed here in the form of a bottom-side closed socket with a conical wall 5.
  • the printed circuit board 2 has an opening at each LED component 3, through which a central third contact provided for the dissipation of the lost heat of the LED 3 is firmly connected to the base 6 of the associated heat sink 4 by soldering.
  • the two electrical terminals 7 of the LED components 3 are connected to the heat sinks 4 opposite top of the circuit board 2 with the printed conductors applied thereto ( FIG. 1 ).
  • the individual heat sink bushes 4 have between their conical inner walls 5 a recess 8, which is open to the end facing away from the circuit board 2 end. About these recesses 8, the heat sink 4 are each form-fitting on a respective frustoconical projection 9 can be placed, which is integrally formed on a serving as an LED support heat sink 10 of the lighting unit ( FIG. 2 ).
  • the projections 9 fill as complementary counterparts the cavity or the recess 8 of the heat sink 4 completely, so that an optimal heat transfer is ensured only by metallic, good heat conducting materials.
  • the existing of copper heatsink bushes 4 serve as heatspreader, while the existing aluminum here total heat sink 10 with a plurality of molded cooling fins 11 serves as heatsink ( FIG. 3 ).
  • the outer sides of the copper sleeves 4 are heated by free convection directly into the interior of the lighting unit.
  • a dissipation of the heat loss takes place via the inside of the copper sleeve 4 to the entire heat sink 10, from where the heat is dissipated to the environment of the lighting unit.
  • the inside of the heat sink bushing 4 can also be connected via a thermal adhesive with the associated positive projection 9 of the overall heat sink 10.
  • the conical design of the projections 9 and the complementary recesses 8 of the associated heat sink 4 results in the assembly of the LED module 1 according to the invention automatically self-adjustment of the heat sink 4 and thus also the attached LED components 3.
  • the heat sink bushings 4 align themselves with the LED components 3 soldered to the fixed points formed by the projections 9, so that with ease of mounting improved positional accuracy can be achieved.
  • FIG. 4 arrangement shown several LED groups for different lighting functions on a common flexible printed circuit board 2 are arranged.
  • the entire circuit board 2 is first equipped in a two-dimensional plane with the surface mountable LED components 3 and then applied to a plurality of three-dimensionally shaped LED support plates or overall heat sink 10.
  • the exact position of the individual LEDs 3 is determined by the fixed points formed by the projections 9 of the overall heat sink 10, resulting in a particularly favorable tolerance chain.
  • FIG. 4 shown arrangement advantageously no connections between the individual LED modules 1 required.
  • the control electronics required for controlling the individual LED modules 1 and optionally further electronic circuits can likewise be arranged on the printed circuit board 2 and accommodated in the lighting unit equipped with the LED modules 1.
  • first openings 12 are punched into the printed circuit board 2b formed here by a flexible flat cable ( FIG. 6 ), through which the LED components 3b contact the bottoms 6b at a central extent 13 ( Fig. 7 ).
  • the individual heatsinks 4b are bonded to the circuit board 2b prior to connection to the LEDs 3b.
  • an elastically resilient, outwardly bendable holding region 14 with an opening 15 introduced therein is formed in each case.
  • the heat sink 4b can be mounted positively and / or non-positively on other elements of the LED module 1b or a lighting unit accommodating the LED module 1b via these two elastically outwardly bendable holding regions 14.
  • any number of LED chips 3b can be provided in any arrangement in the LED module 1b depending on the purpose.
  • an LED module 1c is provided in each case a heat sink 4c for each six series-connected LED components 3c.
  • the construction of the heat sink 4c substantially corresponds to the construction of the heat sink 4b from the Figure 5 to 7 .
  • two openings 15 are formed here, via which in the in the FIG. 9 and 10 illustrated embodiment, a plastic optics 16 for the respective LED module 1c is snap-mounted.
  • the plastic optics 16 has for this purpose laterally projecting projections 17 with an inlet slope 18, which engage in the mounted state in the openings 15 of the holding regions 14.
  • LED modules 1c can be interconnected by an FFC matrix of flexible ribbon cables 2c.
  • a thus obtained flexible network with chained LED modules 1c is relatively easy to mount in a lighting unit, for example in a car headlight.
  • the LED modules 1c can then be individually adjusted, whereas the individual LED components 3c within the LED modules 1c are already adjusted in advance.
  • the flexible networks of LED modules 1c can be particularly easily adapted to the different headlights of different vehicle types.
  • generously dimensioned heat paths even with the ribbon cables 2c, offer the possibility of dissipating the dissipated heat loss to corresponding total heat sinks or into more favorable zones.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
EP08102125A 2008-02-28 2008-02-28 Module à DEL doté de corps de refroidissement comprenant un moyen de montage Withdrawn EP2096685A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP08102125A EP2096685A1 (fr) 2008-02-28 2008-02-28 Module à DEL doté de corps de refroidissement comprenant un moyen de montage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP08102125A EP2096685A1 (fr) 2008-02-28 2008-02-28 Module à DEL doté de corps de refroidissement comprenant un moyen de montage

Publications (1)

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EP2096685A1 true EP2096685A1 (fr) 2009-09-02

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EP08102125A Withdrawn EP2096685A1 (fr) 2008-02-28 2008-02-28 Module à DEL doté de corps de refroidissement comprenant un moyen de montage

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EP (1) EP2096685A1 (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2461151A (en) * 2008-05-29 2009-12-30 Integration Technology Ltd Led device and cooling arrangement
WO2011147644A3 (fr) * 2010-05-25 2012-04-26 Osram Ag Dispositif d'éclairage à semi-conducteur, procédé de fabrication d'un substrat support et procédé d'application d'un substrat support sur un corps de refroidissement
US20130170145A1 (en) * 2012-01-02 2013-07-04 Tem Products Inc. Thermal connector
DE102012112070A1 (de) * 2012-12-11 2014-06-12 Hella Kgaa Hueck & Co. Gehäuseeinheit für ein Kraftfahrzeug mit mindestens einem Modul
US9267659B2 (en) 2012-05-14 2016-02-23 Sl Corporation Vehicle lamp
WO2017008643A1 (fr) * 2015-07-15 2017-01-19 福建永德吉灯业股份有限公司 Lampe à del ayant une structure de radiateur et de calotte de lampe intégrée
WO2020011452A1 (fr) 2018-07-11 2020-01-16 Robert Bosch Gmbh Dispositif de support servant au raccordement électrique d'au moins un élément lumineux
WO2022048954A1 (fr) * 2020-09-01 2022-03-10 HELLA GmbH & Co. KGaA Ensemble pour une lampe de véhicule à moteur

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19922176A1 (de) 1999-05-12 2000-11-23 Osram Opto Semiconductors Gmbh Oberflächenmontierte LED-Mehrfachanordnung
US20010030866A1 (en) * 2000-03-31 2001-10-18 Relume Corporation LED integrated heat sink
US20050212439A1 (en) 2004-03-25 2005-09-29 Integrated Illumination Systems, Inc. Integrating flex circuitry and rigid flexible circuitry, with high power/high brightness LEDs
US20060131602A1 (en) * 2004-12-21 2006-06-22 Ouderkirk Andrew J Illumination assembly and method of making same
WO2006122392A1 (fr) * 2005-05-20 2006-11-23 Tir Systems Ltd. Module d’éclairage à corniches et système
US20070007540A1 (en) * 2003-05-26 2007-01-11 Matsushita Electric Works, Ltd. Light-emitting device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19922176A1 (de) 1999-05-12 2000-11-23 Osram Opto Semiconductors Gmbh Oberflächenmontierte LED-Mehrfachanordnung
US20010030866A1 (en) * 2000-03-31 2001-10-18 Relume Corporation LED integrated heat sink
US20070007540A1 (en) * 2003-05-26 2007-01-11 Matsushita Electric Works, Ltd. Light-emitting device
US20050212439A1 (en) 2004-03-25 2005-09-29 Integrated Illumination Systems, Inc. Integrating flex circuitry and rigid flexible circuitry, with high power/high brightness LEDs
US20060131602A1 (en) * 2004-12-21 2006-06-22 Ouderkirk Andrew J Illumination assembly and method of making same
WO2006122392A1 (fr) * 2005-05-20 2006-11-23 Tir Systems Ltd. Module d’éclairage à corniches et système

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2461151A (en) * 2008-05-29 2009-12-30 Integration Technology Ltd Led device and cooling arrangement
GB2461151B (en) * 2008-05-29 2012-04-04 Integration Technology Ltd LED device and arrangement
WO2011147644A3 (fr) * 2010-05-25 2012-04-26 Osram Ag Dispositif d'éclairage à semi-conducteur, procédé de fabrication d'un substrat support et procédé d'application d'un substrat support sur un corps de refroidissement
US20130170145A1 (en) * 2012-01-02 2013-07-04 Tem Products Inc. Thermal connector
US8929077B2 (en) * 2012-01-02 2015-01-06 Tem Products Inc. Thermal connector
US9267659B2 (en) 2012-05-14 2016-02-23 Sl Corporation Vehicle lamp
DE102012112070A1 (de) * 2012-12-11 2014-06-12 Hella Kgaa Hueck & Co. Gehäuseeinheit für ein Kraftfahrzeug mit mindestens einem Modul
DE102012112070B4 (de) 2012-12-11 2022-12-01 HELLA GmbH & Co. KGaA Gehäuseeinheit für ein Kraftfahrzeug mit mindestens einem Modul
WO2017008643A1 (fr) * 2015-07-15 2017-01-19 福建永德吉灯业股份有限公司 Lampe à del ayant une structure de radiateur et de calotte de lampe intégrée
WO2020011452A1 (fr) 2018-07-11 2020-01-16 Robert Bosch Gmbh Dispositif de support servant au raccordement électrique d'au moins un élément lumineux
DE102018211528A1 (de) 2018-07-11 2020-01-16 Robert Bosch Gmbh Trägervorrichtung zum elektrischen Anschließen von mindestens einem Leuchtelement
WO2022048954A1 (fr) * 2020-09-01 2022-03-10 HELLA GmbH & Co. KGaA Ensemble pour une lampe de véhicule à moteur

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