EP1898144A2 - Agrégat lumineux doté de plusieurs composants DEL et son procédé de fabrication - Google Patents

Agrégat lumineux doté de plusieurs composants DEL et son procédé de fabrication Download PDF

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Publication number
EP1898144A2
EP1898144A2 EP07112708A EP07112708A EP1898144A2 EP 1898144 A2 EP1898144 A2 EP 1898144A2 EP 07112708 A EP07112708 A EP 07112708A EP 07112708 A EP07112708 A EP 07112708A EP 1898144 A2 EP1898144 A2 EP 1898144A2
Authority
EP
European Patent Office
Prior art keywords
housing
heat sink
led
unit according
illuminating unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07112708A
Other languages
German (de)
English (en)
Other versions
EP1898144A3 (fr
Inventor
Sigmund Braun
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102007002839A external-priority patent/DE102007002839A1/de
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP1898144A2 publication Critical patent/EP1898144A2/fr
Publication of EP1898144A3 publication Critical patent/EP1898144A3/fr
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/143—Light emitting diodes [LED] the main emission direction of the LED being parallel to the optical axis of the illuminating device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/151—Light emitting diodes [LED] arranged in one or more lines
    • F21S41/153—Light emitting diodes [LED] arranged in one or more lines arranged in a matrix
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a lighting unit with a plurality of LED components which are indirectly connected by means of a heat-transmitting intermediate element with a heat sink, via which the heat loss of the LED components can be dissipated.
  • Such lighting units can be used both for purposes of interior lighting and outdoor lighting. In particular, use of these lighting units is also possible in or on motor vehicles.
  • LED light emitting diode
  • optical semiconductor components in the form of light-emitting diodes in particular light-emitting diode chips (LED chips) can be used.
  • SMD surface mounted device
  • LEDs are increasingly being used because they have some significant advantages over conventional light bulbs. LEDs have a longer life, a smaller size and a better efficiency in the conversion of electrical energy into light. Furthermore, LEDs are characterized by insensitivity to shocks and vibrations, which represents a considerable advantage, especially in motor vehicles.
  • the LEDs must also be used against the backdrop of constantly increasing performance Loss occurring waste heat to be dissipated to prevent overheating and thus functional impairment or even destruction of the LEDs.
  • the waste heat is dissipated from the underside of the LED components via their electrical connections.
  • the high-brightness LEDs used for a particularly high light output have a third contact, via which the heat loss of the LED is dissipated.
  • This heat connection which is generally not floating, is soldered to a surface area of the circuit carrier which is configured over the layout of the circuit carrier so that it is not in electrical contact with the rest of the circuit. The waste heat is then removed via an electrical insulating layer in the circuit carrier to a metallic heat sink.
  • flexible printed circuit boards are usually equipped with LEDs in a two-dimensional plane, and then the flexible structure thus obtained is glued to a heat sink.
  • the heat sink can, as it is from the DE 199 22 176 A1 is known, for example, made of copper or aluminum, which have the desired application for the desired three-dimensional shape and be provided on the side facing away from the circuit board surfaces with cooling fins.
  • the printed circuit board is preferably attached to the heat sink with a thermal paste, a thermal adhesive, a heat-conducting foil or the like, with an exact alignment of the LED components is difficult and just like the sticking of the circuit board to the heatsink means a considerable assembly effort.
  • a lighting unit of the type mentioned above is from the DE 195 28 459 C2 known.
  • a printed circuit board is equipped with a plurality of encapsulated LEDs in a wired version, wherein on the equipped with the LEDs side of the circuit board a bored cooling plate is arranged such that the heads of the LEDs protrude into the holes and the cooling plate and are aligned therein.
  • Object of the present invention is to provide an improved lighting unit of the type mentioned above, which is constructed in a particularly effective modular construction method and allows installation of the LED modules, which makes their adjustment as possible no more adjustment required.
  • the idea underlying the present invention is that at least one housing is provided, which consists of a thermally conductive material and in which at least one LED component is arranged, wherein the housing is positively received in the heat sink.
  • a pre-assembled LED module which consists of a separate housing with one or more LED components arranged therein, which are preferably designed as LED chips.
  • the inventive lighting unit according to claim 1 has the advantage over the prior art embodiments that in a relatively simple and robust construction due to the frictional recording of the module housing in the heat sink, a very quick and easy installation is possible, the one to the desired orientation of the LED components necessary adjustment to a minimum or even completely dispensable.
  • the housing of the LED modules are taken directly in the frictional insertion into the heat sink so that the desired focus of the LEDs is virtually automatically obtained in a particularly quick and easy way.
  • a fast and particularly effective heat distribution heat spreader function
  • the housing is inserted into an opening or a recess of the heat sink, preferably pressed.
  • a high-precision alignment of the LED module can be achieved.
  • the pressing of the module housing in a complementary recording of the heat sink allows a particularly fast, positive and positive recording and alignment of the LED module.
  • the housing includes an LED module which comprises a plurality of LED components, in particular a plurality of light-emitting diode chips.
  • the LED module can be preassembled with any number of LEDs before it is pressed in the manner described above in the heat sink of the lighting unit according to the invention.
  • arbitrarily shaped outer contours are possible both for the heat sink and for the housing, which can be adapted to the respective requirements of the lighting unit.
  • a plurality of housings of a plurality of LED modules can be pressed into a common overall heat sink, whereby particularly close tolerances of the individual LED modules can be maintained and a complex optical alignment of the LED modules to each other during assembly is no longer required.
  • the individual LED components are each arranged in a separate cooling element, wherein the individual cooling elements are each accommodated in the housing in such a way that they are in heat-conducting contact with the housing.
  • the waste heat of the individual LEDs is thereby passed via the individual cooling elements first to the housing of the LED module and from there to the heat sink housing the housing.
  • the individual cooling elements can also be positively received in the housing of the LED module be here to also allow a quick and highly effective heat transfer here.
  • At least individual cooling elements contain or form optical means, in particular reflectors and / or optical conversion means, for example an optical filling medium for color conversion of the light emitted by the LED.
  • optical means are received or fitted in the housing of the LED module.
  • a plastic optic can be inserted into the housing by means of clip mounting.
  • the housing is made of a material which has the same coefficient of thermal expansion as the material of which the heat sink is made.
  • the housing can be made of the same material as the heat sink, which can be used for cost reasons, in particular aluminum.
  • a permanently effective heat transfer can be further ensured by the fact that the outer sides of the housing at least partially have a toothing or knurling, which is pressed into the heat sink.
  • the subject matter of the present invention is furthermore a headlamp, in particular a motor vehicle headlamp, which comprises a headlamp heat sink in which at least one housing of the type described above is received in a force-fitting manner, preferably pressed in.
  • a headlamp in particular a motor vehicle headlamp, which comprises a headlamp heat sink in which at least one housing of the type described above is received in a force-fitting manner, preferably pressed in.
  • the present invention further relates to a method for producing and assembling a lighting unit comprising a plurality of LEDs and a heat sink.
  • a headlight for motor vehicles can then be manufactured or mounted.
  • at least one LED component is arranged in a housing made of a thermally conductive material, which is non-positively inserted into the heat sink. In this way, the production can be particularly fast and easy simultaneously high-precision optical alignment of the housing containing the LEDs are performed in the heat sink.
  • a plurality of openings and / or depressions be introduced simultaneously and / or in a single clamping of the heat sink in the heat sink for receiving a plurality of LED modules, which can be advantageously carried out with appropriate machining centers.
  • the heat sink 2 which simultaneously forms the rear wall of a headlight for a motor vehicle, five recesses 3, in each of which the housing 4 of an LED module 1 is received and held positively and non-positively.
  • the heat sink 2 consists of a substantially flat plate on which are formed to improve the heat dissipation on both sides perpendicularly projecting cooling fins 5.
  • the heat sink 2 as well as the housing 4 of the LED modules 1 is made of aluminum, so that not only a particularly good heat transfer, but also a permanently secure interference fit between the module housings 4 and the overall heat sink 2 is ensured due to the identical thermal expansion coefficient.
  • the individual LED modules 1 comprise seven LED components 6, which are each designed here as surface-mounted LED chips.
  • the individual LED chips 6 are each connected via a separate cooling element 7 thermally conductive to the bottom 8 of the module housing 4.
  • the LED modules 1 are each terminated by a plastic optics 9 clipped into the housing 4.
  • preassembled LED modules are then pressed into the recesses 3 of the overall heat sink 2, that on the trough-shaped Metal housing 4 a particularly fast and effective distribution of heat loss to the heat sink 2 is ensured.
  • an optical alignment of the individual LED modules 1 to each other during assembly is no longer required in the inventive arrangement, since the LED modules 1 are pressed directly into their predetermined position by the recesses 3 positionally accurate alignment in the overall heat sink 2.
  • three LED modules 1 are frictionally received in a total heat sink 2, which also serves to cool a motor vehicle headlight.
  • the LED modules 1 in three different levels 10 of the heat sink 2 are aligned parallel to each other ( Figure 9).
  • the case 4 of the LED modules 1 which is circular in cross-section here, like the heat sink 2, is made of aluminum.
  • Each LED module 1 comprises in the embodiment shown nine LED chips 6, which are each arranged in a separate cone-shaped cooling element 7.
  • These cooling elements 7 are formed as a frusto-conical cooling base, wherein in the front side base of the truncated cone a likewise frusto-conical recess 11 is introduced, on the bottom 12 of the LED chip 6 is soldered.
  • the inner side region of the cooling base 7 surrounding the LED chip 6 forms a reflector 13, which is preferably mirrored (FIG. 6).
  • the individual cooling base 7 are then introduced with the soldered LED chips 6 in accordance with conically executed holes 14 in the bottom 8 of the module housing 4, wherein either the cooling base 7 wetted with a thermally conductive adhesive layer 15 or a thermally conductive adhesive before the onset of the cooling base 7 by dispensing is placed in the holes 14.
  • the cooling base 7 is made as a cooling element of a single LED chip 6 from a copper blank produced in particular by extrusion
  • the housing 4 of an LED module 1 is made of aluminum.
  • a geometrical requirements of the headlight corresponding three-dimensional housing base body is formed by die casting or machining.
  • nine conical holes 14 are machined into the bottom 8 of the module housing 4, wherein the number and arrangement The holes 14 may vary depending on the requirements placed on the headlight. In particular, any orientation of the bores 14 in three-dimensional space are possible with a three-dimensional basic body.
  • a plug-shaped plastic frame 16 is inserted with injected contacts 17 and exposed bonding surfaces 18 in the module housing 4 and preferably secured by gluing therein.
  • the individual LED components 6 are connected by bonding wires 19 in series with each other and with the two bonding surfaces 18 of the plastic frame 16.
  • an optical converting means 20 for converting the blue light emitted from the LED chip 6 into white light is applied to the recesses 11 of the cooling pedestals 7 on the bonded LED chips 6 (FIG. 7).
  • a plastic primary optics 9 is glued to the aluminum housing 4, which has an opening for the passage of the contact pins 17 of the plastic frame 16 in its lower region.
  • the three LED modules 1 thus produced are then pressed positively and non-positively into the recesses 3 provided in the overall heat sink 2, so that they are located directly in the desired optical alignment and subsequent adjustments are not required.
  • the three recesses 3 have been introduced in a corresponding processing center in only a single clamping.
  • special processing machines with a number of cutting tools corresponding to the desired number of LED modules 1 can be introduced into the heat sink 2 at the same time and thus in a high-precision positional tolerance.
  • a flexible circuit carrier 21 is applied to the heat sink 2 in a final assembly step and selectively soldered to the contacts 17 of the three LED modules 1 (FIG. 9).

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Geometry (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
EP07112708A 2006-09-08 2007-07-18 Agrégat lumineux doté de plusieurs composants DEL et son procédé de fabrication Withdrawn EP1898144A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006042319 2006-09-08
DE102007002839A DE102007002839A1 (de) 2006-09-08 2007-01-19 Leuchtaggregat mit mehreren LED-Bauelementen und Verfahren zu seiner Herstellung

Publications (2)

Publication Number Publication Date
EP1898144A2 true EP1898144A2 (fr) 2008-03-12
EP1898144A3 EP1898144A3 (fr) 2010-08-25

Family

ID=38950773

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07112708A Withdrawn EP1898144A3 (fr) 2006-09-08 2007-07-18 Agrégat lumineux doté de plusieurs composants DEL et son procédé de fabrication

Country Status (1)

Country Link
EP (1) EP1898144A3 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011107896A1 (fr) 2010-03-01 2011-09-09 Koninklijke Philips Electronics N.V. Appareil d'éclairage
CN107883340A (zh) * 2017-07-31 2018-04-06 上海小糸车灯有限公司 一种汽车的led后雾灯

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002097884A1 (fr) * 2001-05-26 2002-12-05 Gelcore, Llc Module de del de grande puissance pour un eclairage
US20060002125A1 (en) * 2004-07-01 2006-01-05 Samsung Electro-Mechanics Co., Ltd. Light emitting diode module for automobile headlights and automobile headlight having the same
WO2006066531A1 (fr) * 2004-12-22 2006-06-29 Patent-Treuhand- Gesellschaft Für Elektrische Glühlampen Mbh Dispositif d'eclairage ayant au moins une diode electroluminescente et phare de vehicule
EP1691130A1 (fr) * 2005-02-10 2006-08-16 Osram-Sylvania Inc. Source lumineuse à diodes électroluminiscentes
US20060274544A1 (en) * 2005-06-06 2006-12-07 Koito Manufacturing Co., Ltd. Vehicle lamp and vehicle lamp system
DE202006015881U1 (de) * 2006-06-29 2006-12-21 AUGUX CO., LTD., Gueishan Zusammenbaukonstruktion für eine LED-Lampe mit einer Wärmeableitanordnung

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002097884A1 (fr) * 2001-05-26 2002-12-05 Gelcore, Llc Module de del de grande puissance pour un eclairage
US20060002125A1 (en) * 2004-07-01 2006-01-05 Samsung Electro-Mechanics Co., Ltd. Light emitting diode module for automobile headlights and automobile headlight having the same
WO2006066531A1 (fr) * 2004-12-22 2006-06-29 Patent-Treuhand- Gesellschaft Für Elektrische Glühlampen Mbh Dispositif d'eclairage ayant au moins une diode electroluminescente et phare de vehicule
EP1691130A1 (fr) * 2005-02-10 2006-08-16 Osram-Sylvania Inc. Source lumineuse à diodes électroluminiscentes
US20060274544A1 (en) * 2005-06-06 2006-12-07 Koito Manufacturing Co., Ltd. Vehicle lamp and vehicle lamp system
DE202006015881U1 (de) * 2006-06-29 2006-12-21 AUGUX CO., LTD., Gueishan Zusammenbaukonstruktion für eine LED-Lampe mit einer Wärmeableitanordnung

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011107896A1 (fr) 2010-03-01 2011-09-09 Koninklijke Philips Electronics N.V. Appareil d'éclairage
CN107883340A (zh) * 2017-07-31 2018-04-06 上海小糸车灯有限公司 一种汽车的led后雾灯

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Publication number Publication date
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