CN104838205B - 平面照明设备 - Google Patents

平面照明设备 Download PDF

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CN104838205B
CN104838205B CN201380063873.0A CN201380063873A CN104838205B CN 104838205 B CN104838205 B CN 104838205B CN 201380063873 A CN201380063873 A CN 201380063873A CN 104838205 B CN104838205 B CN 104838205B
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ssl
lid component
light
light source
lighting apparatus
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CN104838205A (zh
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P·J·M·巴克姆斯
P·里杰斯坎普
S·E·卡迪杰克
J·P·M·安塞姆斯
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Signify Holding BV
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Koninklijke Philips NV
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/24—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/28—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/69—Details of refractors forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/006—Fastening of light sources or lamp holders of point-like light sources, e.g. incandescent or halogen lamps, with screw-threaded or bayonet base
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/90—Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21Y2115/00—Light-generating elements of semiconductor light sources
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
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Abstract

本发明涉及照明设备(11)，其包括具有至少两个固态光源(SSL)(18)的发光部分。发光部分包括：具有第一光源载体(13a)和第一光透射部分(14)的第一盖构件(12a)；具有第二光源载体(13b)和第二光透射部分(14)的第二盖构件(12b)。第一和第二盖构件被布置为使得第一光透射部分与第二SSL对准，以便允许从第二SSL发射的光通过第一盖构件的透射，并且第二光透射部分与第一SSL对准，以便允许从第一SSL发射的光通过第二盖构件的透射。根据这一设计，从一个盖构件上的SSL发射的光将透射通过另一盖构件。在另一方向上(即，在与每个SSL的发光方向相反的方向上)提供来自每个SSL的热量消散。

Description

平面照明设备
技术领域
本发明涉及包括固态光源(SSL)的平面照明设备，并且更具体地涉及平面灯。
背景技术
常规电LED灯包括其上布置有LED的印刷电路板。当以站立姿势(standingposition)布置LED灯时，印刷电路板以水平方式布置，或者，如果定义LED灯的纵轴，则印刷电路板被布置为与该纵轴成一定角度。在印刷电路板前方的出光方向上，布置塑料或者玻璃灯泡，以便于操纵从LED发射的光，并且保护灯内部的部件。在印刷电路板下方，布置了若干部件，主要目的为散布和转移LED生成的热量。这些部件可以是散热器、散热片、金属壳体以及盖体。这种LED灯因此包括大量部件以便于执行灯的所有任务，诸如生成和分布光、转移热量、保护电连接以及提供防火封闭(fire enclosure)。
在WO2011/107925A1中公开了一种备选LED灯，其中具有LED的印刷电路板被布置在反射器上。这种解决方案减少了灯中的部件数量。然而，在光学性能方面，这种灯可能不能完全代替常规LED灯。此外，这种布置可能对物理致动敏感，并且可能不能提供足够用于高流明灯的热学性质。
因此，需要一种灯，其以保护性方式进一步增加提供具有足够的光学、机械以及热学性质的灯的有效性。
发明内容
本发明的目的为克服这一问题，并且提供照明设备，该照明设备提供有效的光生成、分布以及热量管理。
根据本发明的第一方面，这一目的和其它目的通过具有至少两个固态光源(SSL)的发光部分来实现。发光部分包括：具有第一光源载体和第一光透射部分的第一盖构件；具有第二光源载体和第二光透射部分的第二盖构件；安装在第一光源载体上的第一SSL；以及安装在第二光源载体上的第二SSL。第一和第二盖构件被布置为第一光源载体面向第二光源载体，使得第一光透射部分与第二SSL对准，以便允许从第二SSL发射的光通过第一盖构件的透射，并且第二光透射部分与第一SSL对准，以便允许从第一SSL发射的光通过第二盖构件的透射。
根据这一设计，一个或者几个SSL可以被布置在两个盖构件中的每个盖构件中。从一个盖构件上的SSL发射的光将透射通过另一盖构件。来自每个SSL的热量消散可以被提供在另一方向上，即，与每个SSL的发光方向相反的方向上。示例性热量消散解决方案的细节在从属权利要求中概述。
第一盖构件和第二盖构件优选地具有基本上相同的几何设计。这实现高效率的制造并且因此实现有成本效益的照明设备。特别注意，通过在对称线的相对位置上提供SSL和光透射部分，当一个盖构件围绕对称线转动以便面向另一盖构件时，每个SSL将与光透射部分对准
第一和第二SSL承载表面可以是非平面的。因此，不同SSL的发光方向将是非平行的，从而实现了更好的光散布。
光透射部分可以包括分别通过第一和第二光源载体延伸的开口。为了增强光学性能，光透射部分可以进一步包括适于将从SSL发射的光引导出照明设备的光学结构。
根据一个实施例，第一光源载体包括第一热传导层，在第一热传导层上布置第一SSL，使得由第一SSL生成的热量被传输到第一层中，并且第二光源载体包括第二热传导层，在第二热传导层上布置第二SSL，使得由第二SSL生成的热量被传输到第二层中。第一层与第一盖构件热接触，并且第二层与第二盖构件热接触，使得从第一光源传输到第一层中和从第二光源传输到第二层中的大部分热量被分别传输到第一和第二盖构件中。
由于第一和第二盖构件形成照明设备的外表面，这种热传导层因此将提供离开光源并且到周围环境的高效率热量消散。
第一和第二热传导层优选地分别由第一和第二结构化电极层形成，其中每个SSL电连接和热连接到电极层中的一个电极层，并且其中驱动器电路电连接到每个电极层。这种组合的电极和热界面层优选地覆盖每个SSL承载表面的大部分(例如90％)，以便提供到第一和第二盖构件的足够好的热界面。
至少一个电极可以被布置为将第一电极层连接到驱动器电路，并且至少一个电极可以被布置为将第二电极层连接到所述驱动器电路。这种电极可以适于加偏压(bias)(例如，弹簧加载)抵靠夹在两个盖构件之间的具有驱动器电路的驱动器载体。
第一和第二盖构件均可以包括壳体，其中光源载体由布置在壳体中的分立载体形成，并且结构化电极层被提供在该分立载体上。备选地，第一和第二光源载体由壳体的内表面形成，并且电极层直接形成在该内表面上。
附图说明
将参照附图更详细地描述本发明，附图示出本发明当前优选的实施例。
图1示出了根据本发明的第一实施例的平面灯。
图2示出了根据本发明的第二实施例的平面灯。
图3示出了根据本发明的第三实施例的平面灯。
图4示出了根据本发明的第四实施例的平面灯。
图5示出了根据本发明的第五实施例的平面灯。
具体实施方式
在以下描述中，将参照平面灯的各种示例描述本发明。然而，本发明不应该被理解为限制于这种灯。
图1中的灯1包括两个盖构件2a、2b，每个盖构件具有安装在光源载体4a、4b上的诸如固态光源(SSL)之类的光源3a、3b。光源可以是LED、OLED、PLED等。光源载体4a、4b可以被形成为盖构件2a、2b的集成部分，例如通过将电连接印刷在盖构件的内表面上。备选地，光源载体4a、4b是安装在盖构件中的诸如PCB之类的分立载体。光源载体的导电层可以被配置为还具有散热作用，并且可以用于将热量从光源3a、3b传导到盖构件2a、2b，以进一步消散到周围环境。光源载体4a、4b被提供有开口5a、5b，开口5a、5b可能配备有诸如透镜之类的光学结构(未示出)。开口5a被布置在盖构件之一2a上，使得开口5a与另一盖构件2b上的对应光源3b对准。开口5a、5b和光源3a、3b以交替方式布置。两个盖构件适于与面向彼此的光源载体4a、4b装配在一起，以便形成灯。灯泡进一步包括电配件7(此处为常规螺纹配件)，用于将灯机械连接和电连接到插座。
图2中的平面灯11也具有两个(优选几何上完全相同的)盖构件12a、12b。每个构件12a、12b具有由中空脊14(或者如从内部看到的槽)包围的基本上平面的中心区域13。脊14(并且可能整个盖构件)由透明材料制成。光源载体由平面区域13的内表面13a形成，在其上提供结构化的电学和热学传导层15。该层可以是铜。层15与盖构件热接触。在一个实施例中，层15直接形成在内表面13a上。
在图2的实施例中，传导层15被结构化为若干(此处为5个)饼状焊盘16。焊盘由径向延伸的线17分离。沿着每条线17安装光源18，此处为固态光源(SSL)，其中光源的一个端子连接到第一焊盘16a，而第二端子连接到邻近焊盘16b。由此，SSL 18通过焊盘16串联连接，以便形成串联连接的成串SSL。
灯泡11的颈部部分中的两个焊盘具有朝向颈部延伸的舌形电极19。这些电极可以电连接到驱动器电路20。在一个实施例中，驱动器电路被布置在诸如PCB之类的驱动器载体21上，并且电极19被弹簧加载抵靠驱动器载体21。驱动器载体21可以适于使一侧连接到第一盖构件12a的电极，而相对侧连接到第二盖构件12b的电极。通过接触电极19，驱动器电路20连接到SSL串，并且可以操作SSL 18发光。
在层15的外围，形成有提供脊14的槽形内部14a接入的开口22。开口被定位使得，当两个盖构件装配在一起形成灯11时，每个开口22将与SSL 18相对。来自SSL 18的光因此将穿过开口22并且进入脊14的内部14a，在此处光将混合并且最终通过盖构件12a、12b的透明壁发射。
脊14中的透明材料可以漫射和/或准直光。如果适当，附加光学结构可以被提供在开口22中以便进一步将发射的光塑形。光学结构可以是透镜、光导或者光学散射器件。
SSL中生成的很大一部分热量将被转移到层15，并且进一步转移到盖构件12a、12b，在此处热量将被消散到周围环境中。由于焊盘16的相对大的尺寸，实现了从SSL、经由层15、到盖构件的令人满意的热界面。
在传导层15上提供一个或者几个突起元件23。当盖构件被装配在一起时，这些元件23将保证每个盖构件的传导层15不接触。为了避免光进入在两个层15之间形成的小间隙，每个SSL 18可以突起到传导层的平面之外，使得当盖构件被装配在一起时，SSL将延伸到在另一传导层平面那边的对应开口中。
图3中的灯30在设计上与图2中的灯11相似，并且完全相同或者相似的部分已被给出相同的附图标记。
光源载体的传导层32此处与图2中的层15不同地结构化。此处，层32包括由外围环34包围的大中心焊盘33。中心焊盘33具有匹配盖构件12的平面区域13的尺寸，并且脊14的内部延伸以在焊盘33和环34之间形成的槽14a。在围绕槽的若干位置处(此处为4个)，提供有“桥”或者支撑35，在其上安装诸如SSL之类的光源18。光源18此处安装为一个端子连接到中心焊盘33，并且第二端子连接到环34。由此，SSL 18将通过焊盘33和环34并联连接。开口36此处在支撑35之间一直延伸，从而提供到脊14内部的更大接入。
相似于图2中的灯11，两个舌形电极19(此处形成在环34的端部并且在焊盘33上)分别朝向灯泡的颈部部分延伸。电极19可以电连接到驱动器电路20。在图3中，驱动器电路被布置在诸如PCB之类的驱动器载体21上，并且电极19被弹簧加载抵靠驱动器载体21。通过接触电极19，驱动器电路20并联连接到SSL，并且可以操作SSL 18发光。
图4中的灯40相似于图3中的灯30，并且完全相同或者相似的部分已被给出相同的附图标记。
正如层32，光源载体的传导层41此处包括中心圆盘42和外围环43。然而，层41此处被结构化为五个饼状焊盘44，更像是图2中的层15。相似于图3中的实施例，SSL 18被安装在支撑35上。然而，在图4中，SSL 18串联连接在焊盘44之间，以便形成串联连接的成串SSL。驱动器电路20的连接也可以相似于图2中的驱动器电路20的连接。
图5示出了根据本发明的又一实施例的灯50。在此实施例中，每个盖构件的光源承载表面51不限于一个平面，而是在空间上弯曲。因此，安装在表面51上的SSL 18将具有非平行光轴A，从而导致改善的光分布。图5中的传导层52以与图2中的层15相似的方式结构化。与图3和图4中的那些结构化相似的结构化也将可能在弯曲表面上。
本领域技术人员了解，本发明决不限制于上文描述的优选实施例。相反地，在所附权利要求的范围内很多修改和变化是可能的，包括光源和光透射部分的数目和位置。
此外，结构化传导层的传导焊盘的精确形式和形状可以取决于光源的类型和它们的性质。如果使用具有非对称热设计的LED，则热量将主要经由LED的一侧转移到连接到该侧的焊盘。这一焊盘因此应该比连接到另一侧的焊盘更大。如果使用具有对称热设计的LED，则两侧都消散相等量的热量。连接到LED的焊盘则可以具有相等的尺寸，并且串联串中的最后和第一焊盘应该是中间焊盘的大约一半尺寸。
此外，向SSL提供功率的电学传导层(轨道)可以与从SSL消散热量的热学传导层分离。这可以利用两个不同的、隔离的铜层来实现，一个铜层用于散热，且一个铜层用于电接触。

Claims (14)

1.一种照明设备，包括：
发光部分，具有至少两个固态光源SSL，
所述发光部分包括：
第一盖构件，具有第一光源载体和第一光透射部分，
第二盖构件，具有第二光源载体和第二光透射部分，
第一SSL，安装在所述第一光源载体上，以及
第二SSL，安装在所述第二光源载体上，
所述第一盖构件和所述第二盖构件被布置成所述第一光源载体面向所述第二光源载体，使得所述第一光透射部分与所述第二SSL对准，以便允许从所述第二SSL发射的光透射通过所述第一盖构件，并且所述第二光透射部分与所述第一SSL对准，以便允许从所述第一SSL发射的光透射通过所述第二盖构件，
其中所述第一光透射部分和所述第二光透射部分中的每个光透射部分包括分别延伸通过所述第一光源载体和所述第二光源载体的开口。
2.根据权利要求1所述的照明设备，其中每个盖构件由透明的、半透明的或者着色的材料形成，并且其中每个光透射部分包括所述盖构件的一部分。
3.根据权利要求1或者2所述的照明设备，其中所述第一盖构件和所述第二盖构件具有基本上相同的几何设计。
4.根据权利要求1或者2所述的照明设备，其中每个第一盖构件和第二盖构件包括至少两个光透射部分，所述发光部分包括与每个光透射部分对准的一个SSL。
5.根据权利要求1或者2所述的照明设备，其中所述第一光源载体和所述第二光源载体是非平面的。
6.根据权利要求1或者2所述的照明设备，其中所述第一光透射部分和所述第二光透射部分中的每个光透射部分包括适于将从所述固态光源发射的光引导出所述照明设备的光学结构。
7.根据权利要求6所述的照明设备，其中所述光学结构是透镜、光导或者光学散射器件。
8.根据权利要求6所述的照明设备，其中所述光学结构被设计为提供非对称光分布。
9.根据权利要求1-2和7-8中的任一项所述的照明设备，
所述第一光源载体包括第一热传导层，在所述第一热传导层上布置所述第一SSL，使得由所述第一SSL生成的热量被传输到所述第一热传导层中；并且
所述第二光源载体包括第二热传导层，在所述第二热传导层上布置所述第二SSL，使得由所述第二SSL生成的热量被传输到所述第二热传导层中；
所述第一热传导层与所述第一盖构件热接触以便形成在所述第一热传导层和所述第一盖构件之间的第一热界面，并且所述第二热传导层与所述第二盖构件热接触以便形成在所述第二热传导层和所述第二盖构件之间的第二热界面，并且
所述第一热界面和所述第二热界面被布置为分别传输从所述第一光源传输到所述第一热传导层中和从所述第二光源传输到所述第二热传导层中的大部分热量。
10.根据权利要求1-2和7-8中的任一项所述的照明设备，进一步包括用于驱动所述SSL的驱动器电路。
11.根据权利要求9所述的照明设备，进一步包括用于驱动所述SSL的驱动器电路，其中所述第一热传导层和所述第二热传导层分别由第一结构化电极层和第二结构化电极层形成，其中每个SSL电连接并且热连接到所述结构化电极层中的一个结构化电极层，并且其中所述驱动器电路电连接到每个电极层。
12.根据权利要求11所述的照明设备，进一步包括被布置为将所述第一结构化电极层连接到所述驱动器电路的至少一个电极和被布置为将所述第二结构化电极层连接到所述驱动器电路的至少一个电极。
13.根据权利要求11或者12所述的照明设备，所述第一盖构件和所述第二盖构件均包括碗形壳体，其中所述光源载体由被布置在所述壳体中的分立载体形成，并且所述结构化电极层被提供在所述分立载体上。
14.根据权利要求11或者12所述的照明设备，所述第一盖构件和所述第二盖构件均包括壳体，其中所述光源载体由所述壳体的内表面形成，并且电极层直接形成在所述内表面上。
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