EP1081205A4 - Compositions resineuses - Google Patents

Compositions resineuses

Info

Publication number
EP1081205A4
EP1081205A4 EP99931563A EP99931563A EP1081205A4 EP 1081205 A4 EP1081205 A4 EP 1081205A4 EP 99931563 A EP99931563 A EP 99931563A EP 99931563 A EP99931563 A EP 99931563A EP 1081205 A4 EP1081205 A4 EP 1081205A4
Authority
EP
European Patent Office
Prior art keywords
resin compositions
compositions
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP99931563A
Other languages
German (de)
English (en)
Other versions
EP1081205B1 (fr
EP1081205A1 (fr
Inventor
Masahiro Ikawa
Hiroyuki Okuhira
Keisuke Chino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokohama Rubber Co Ltd
Original Assignee
Yokohama Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokohama Rubber Co Ltd filed Critical Yokohama Rubber Co Ltd
Publication of EP1081205A1 publication Critical patent/EP1081205A1/fr
Publication of EP1081205A4 publication Critical patent/EP1081205A4/fr
Application granted granted Critical
Publication of EP1081205B1 publication Critical patent/EP1081205B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/12—Polythioether-ethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/06—Polythioethers from cyclic thioethers
    • C08G75/08—Polythioethers from cyclic thioethers from thiiranes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J181/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Adhesives based on polysulfones; Adhesives based on derivatives of such polymers
    • C09J181/02—Polythioethers; Polythioether-ethers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
EP99931563A 1999-02-08 1999-07-27 Compositions resineuses Expired - Lifetime EP1081205B1 (fr)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP3012399 1999-02-08
JP3012399 1999-02-08
JP6831999 1999-03-15
JP6831999 1999-03-15
JP12165399 1999-04-28
JP12165399 1999-04-28
JP13279699 1999-05-13
JP13279699 1999-05-13
PCT/JP1999/004019 WO2000046317A1 (fr) 1999-02-08 1999-07-27 Compositions resineuses

Publications (3)

Publication Number Publication Date
EP1081205A1 EP1081205A1 (fr) 2001-03-07
EP1081205A4 true EP1081205A4 (fr) 2002-04-17
EP1081205B1 EP1081205B1 (fr) 2004-11-17

Family

ID=27459187

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99931563A Expired - Lifetime EP1081205B1 (fr) 1999-02-08 1999-07-27 Compositions resineuses

Country Status (6)

Country Link
US (1) US6528595B1 (fr)
EP (1) EP1081205B1 (fr)
JP (1) JP3913476B2 (fr)
KR (1) KR20010042508A (fr)
DE (1) DE69921991T2 (fr)
WO (1) WO2000046317A1 (fr)

Families Citing this family (42)

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Publication number Priority date Publication date Assignee Title
JP4171160B2 (ja) * 1999-04-28 2008-10-22 横浜ゴム株式会社 速硬化１液樹脂組成物
JP2002053668A (ja) * 2000-08-04 2002-02-19 Yokohama Rubber Co Ltd:The 低温硬化性樹脂組成物
JP2004142133A (ja) * 2002-10-22 2004-05-20 Japan Epoxy Resin Kk 電気積層板用積層体
JP2005019269A (ja) * 2003-06-27 2005-01-20 Three Bond Co Ltd 有機ｅｌ素子および有機ｅｌ素子貼合わせ用樹脂組成物
US20060167217A1 (en) * 2003-07-24 2006-07-27 Hiroyuki Okada Coating composition, coating film made of same, and optical article
DE102004023637A1 (de) 2004-05-10 2005-12-08 Tesa Ag UV-vernetzende Blockcopolymere
JP4642844B2 (ja) * 2004-06-17 2011-03-02 コーネル・リサーチ・ファンデーション・インコーポレイテッド 高屈折率を有する感光性樹脂組成物
JP4883264B2 (ja) * 2005-07-26 2012-02-22 株式会社スリーボンド 加熱硬化型一液性樹脂組成物
JP4826708B2 (ja) * 2005-02-17 2011-11-30 株式会社スリーボンド 加熱硬化型一液性樹脂組成物
WO2006088069A1 (fr) * 2005-02-17 2006-08-24 Three Bond Co., Ltd. Composition d’une resine monocomposant thermodurcissable
JP4826728B2 (ja) * 2005-09-28 2011-11-30 株式会社スリーボンド 熱硬化性樹脂組成物
WO2007061080A1 (fr) * 2005-11-25 2007-05-31 Three Bond Co., Ltd. Composition durcissable
TWI400263B (zh) * 2006-01-27 2013-07-01 Mitsubishi Gas Chemical Co Epoxy resin hardener and epoxy resin composition
US20170251635A1 (en) * 2008-01-21 2017-09-07 Kerr Corporation All-in-one packing, pad and shoe for hoof protection
TWI491601B (zh) * 2008-09-25 2015-07-11 Sekisui Chemical Co Ltd A sulfide compound, a mixture containing a cyclic sulfide, a process for producing a mixture containing a cyclic sulfide, a hardened composition and a connecting structure
US8901207B2 (en) * 2009-01-29 2014-12-02 Sekisui Chemical Co., Ltd. Adhesive for electronic components
DE102009007392A1 (de) * 2009-01-29 2010-08-05 Siemens Aktiengesellschaft Tränkharzsystem für Isolierstoffe in Schaltanlagen
DE102009008464A1 (de) 2009-02-10 2010-08-12 Siemens Aktiengesellschaft Gießharzsystem für Isolierstoffe in Schaltanlagen
FR2946350B1 (fr) * 2009-06-04 2012-05-11 Arkema France Utilisation de molecules porteuses de groupes associatifs comme durcisseurs de resines thermodurcissables
JP5767532B2 (ja) * 2010-08-31 2015-08-19 積水化学工業株式会社 硬化性組成物及び接続構造体
JP5764436B2 (ja) * 2010-08-31 2015-08-19 積水化学工業株式会社 硬化性組成物及び接続構造体
JP5675230B2 (ja) * 2010-09-03 2015-02-25 株式会社ダイセル 熱硬化性エポキシ樹脂組成物及びその用途
JP5815343B2 (ja) * 2010-09-14 2015-11-17 積水化学工業株式会社 エピスルフィド化合物材料の製造方法、硬化性組成物の製造方法及び接続構造体の製造方法
JP5580752B2 (ja) * 2011-02-03 2014-08-27 積水化学工業株式会社 導電性粒子を含む熱硬化性化合物の混合物、硬化性組成物及び接続構造体
JP5718466B2 (ja) * 2011-07-22 2015-05-13 旭化成ケミカルズ株式会社 組成物及び重合物
JP5767540B2 (ja) * 2011-09-14 2015-08-19 積水化学工業株式会社 エピスルフィド樹脂材料であるｂステージフィルム、多層基板及び積層フィルム
JP5941668B2 (ja) * 2011-12-15 2016-06-29 学校法人 関西大学 ９，９−ビス（縮合多環式アリール）フルオレン骨格を有するエピスルフィド化合物およびその硬化物
JP5860278B2 (ja) * 2011-12-15 2016-02-16 学校法人 関西大学 フルオレン骨格を有するエピスルフィド化合物およびその硬化物
JP2013209627A (ja) * 2012-03-01 2013-10-10 Mitsubishi Gas Chemical Co Inc 樹脂用組成物の重合停止方法
US10010064B2 (en) * 2013-10-04 2018-07-03 Kerr Corporation Methods and compositions for treating a hoof of an ungulate animal
JP6462345B2 (ja) * 2014-12-08 2019-01-30 旭化成株式会社 樹脂組成物の製造方法、樹脂組成物、硬化性樹脂組成物、硬化物、プリプレグ、及び繊維強化プラスチック
CN104910854A (zh) * 2015-05-19 2015-09-16 安徽省华凯轻工科技有限公司 一种玻璃专用密封胶及其制备方法
EP3307814B1 (fr) 2015-06-10 2019-07-03 Borealis AG Copolymere multimodal d'ethylene et d'au moins deux comonomeres d'alpha-olefine et articles finaux constitues de ceux-ci
JP6013563B2 (ja) * 2015-06-26 2016-10-25 学校法人 関西大学 フルオレン骨格を有するエピスルフィド化合物およびその硬化物
JP6654927B2 (ja) * 2016-02-26 2020-02-26 積水化学工業株式会社 硬化性樹脂組成物
JP2017193630A (ja) * 2016-04-20 2017-10-26 積水化学工業株式会社 硬化性樹脂組成物
JP2016216485A (ja) * 2016-07-08 2016-12-22 学校法人 関西大学 フルオレン骨格を有するエピスルフィド化合物およびその硬化物
KR20200140930A (ko) 2016-09-08 2020-12-16 요툰 에이/에스 코팅
JP7166245B2 (ja) * 2017-03-23 2022-11-07 ナミックス株式会社 樹脂組成物、電子部品用接着剤、半導体装置、および電子部品
KR20200135310A (ko) * 2018-03-26 2020-12-02 린텍 가부시키가이샤 수지 시트 및 그 제조 방법
JP6651161B1 (ja) * 2019-08-21 2020-02-19 ナミックス株式会社 エポキシ樹脂組成物
CN112752783B (zh) * 2019-08-21 2022-08-02 纳美仕有限公司 环氧树脂组合物

Citations (2)

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Publication number Priority date Publication date Assignee Title
GB968424A (en) * 1960-10-21 1964-09-02 Shell Int Research Epithio ethers, their preparation and polymers
EP0874016A2 (fr) * 1997-04-22 1998-10-28 Mitsubishi Gas Chemical Company, Inc. Résine pour matériau optique

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Publication number Priority date Publication date Assignee Title
GB968424A (en) * 1960-10-21 1964-09-02 Shell Int Research Epithio ethers, their preparation and polymers
EP0874016A2 (fr) * 1997-04-22 1998-10-28 Mitsubishi Gas Chemical Company, Inc. Résine pour matériau optique

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO0046317A1 *

Also Published As

Publication number Publication date
DE69921991T2 (de) 2005-11-03
WO2000046317A1 (fr) 2000-08-10
DE69921991D1 (de) 2004-12-23
KR20010042508A (ko) 2001-05-25
EP1081205B1 (fr) 2004-11-17
EP1081205A1 (fr) 2001-03-07
JP3913476B2 (ja) 2007-05-09
US6528595B1 (en) 2003-03-04

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