EP1080392B1 - Flüssige, strahlungshärtbare zusammensetzung, insbesondere zur herstellung von biegsamen gehärteten gegenständen für die stereolithographie - Google Patents

Flüssige, strahlungshärtbare zusammensetzung, insbesondere zur herstellung von biegsamen gehärteten gegenständen für die stereolithographie Download PDF

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Publication number
EP1080392B1
EP1080392B1 EP99916836A EP99916836A EP1080392B1 EP 1080392 B1 EP1080392 B1 EP 1080392B1 EP 99916836 A EP99916836 A EP 99916836A EP 99916836 A EP99916836 A EP 99916836A EP 1080392 B1 EP1080392 B1 EP 1080392B1
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weight
aromatic
aliphatic
composition according
liquid
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French (fr)
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EP1080392A1 (de
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Anastasios Panayiotis Melisaris
Renyi Wang
Thomas Hsing Pang
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Huntsman Advanced Materials Switzerland GmbH
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Huntsman Advanced Materials Switzerland GmbH
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0037—Production of three-dimensional images
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C9/00—Stereo-photographic or similar processes
    • G03C9/08—Producing three-dimensional images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

Definitions

  • the present invention relates to a liquid, radiation-curable composition which is particularly suitable for the production of three-dimensional shaped articles by means of stereolithography, to a process for the production of a cured product and, in particular, for the stereolithographic production of a three-dimensional shaped article from this composition.
  • the desired shaped article is built up from a liquid, radiation-curable composition with the aid of a recurring, alternating sequence of two steps (a) and (b); in step (a), a layer of the liquid, radiation-curable composition, one boundary of which is the surface of the composition, is cured with the aid of appropriate radiation, generally radiation produced by a preferably computer-controlled laser source, within a surface region which corresponds to the desired cross-sectional area of the shaped article to be formed, at the height of this layer, and in step (b) the cured layer is covered with a new layer of the liquid, radiation-curable composition, and the sequence of steps (a) and (b) is repeated until a so-called green model of the desired shape is finished.
  • This green model is, in general, not yet fully cured and must therefore, normally, be subjected to post-curing.
  • the mechanical strength of the green model constitutes an important property of the green model and is determined essentially by the nature of the stereolithographic-resin composition employed.
  • Other important properties of a stereolithographic-resin composition include a high sensitivity for the radiation employed in the course of curing and a minimum curl factor, permitting high shape definition of the green model.
  • the precured material layers should be readily wettable by the liquid stereolithographic-resin composition, and of course not only the green model but also the ultimately cured shaped article should have optimum mechanical properties.
  • a still further important property of the cured article is increased flexibility and toughness, as measured by elongation at break and Izod impact resistance.
  • compositions for stereolithography which meet at least some of the abovementioned requirements are described, for example, in U.S. Pat. No. 5,476,748 .
  • the so-called hybrid systems compositions shown therein comprise free-radically and cationically photopolymerizable components.
  • Such hybrid compositions comprise at least:
  • a major disadvantage of flexibilized acrylate urethane compositions is the fact that: 1) polymerization is hindered by atmospheric oxygen because the polymerization thereof is of radical nature; 2) the cure shrinkage is unacceptably large; and 3) the acrylate urethane compounds are irritant to the skin, particularly when the viscosity is low (low viscosity is highly preferred for stereolithography applications).
  • Attempts to incorporate acrylate urethane flexibilizers into hybrid stereolithographic compositions have been unsuccessful as a means for improving flexibility and toughness. This approach tends to reduce photospeed to unacceptable levels.
  • This reduction in photospeed is due to the fact that the acid generated from the disassociation of the cationic photoinitiator, which is responsible for the polymerization of the epoxy ring or any other cationically cured compound, reacts with the nitrogen of the urethane group, thus prohibiting the cationic photopolymerization reaction from taking place.
  • An alternative technique that has been used for improving the flexibility of hybrid stereolithography compositions entails the use of low to medium range molecular weight diols triols or polyols, especially polyether polyols.
  • This approach has been employed for years, and is still being used. It relies on the reduction of the crosslink density of the three dimensional network as a means of reducing the brittleness of a cured object.
  • a recent worldwide patent application on photo-curable stereolithographic resin compositions to DSM Corp,, Japan Synthetic Rubber Co., and Japan Fine Coatings, Co., Ltd., WO 97/38354 (16 October, 1997 ) teaches the use of polyether polyols to increase the extensibility and toughness of the three-dimensional object.
  • polyether polyols have on average about 3 or more hydroxyl groups in one molecule.
  • examples of the suggested polyether polyols include original or ethyleneoxide chain-extended glycerol, pentaerythritol, trimethylolpropane, sorbitol, sucrose.
  • the preferable molecular weight of the polyether polyol is about 100 to 2000, and more preferably about 160-1000. This patent also teaches that "if polyether polyols having too large molecular weight are used, it results in lowering the mechanical strength of the three-dimensional object obtained by the photo-fabrication process".
  • EP-A-0 646 580 discloses a liquid, radiation-curable composition for producing three-dimensional shaped articles (see examples 20 and 21 on pages 28-29), which composition comprises:
  • EP-A-0 605 361 discloses a liquid, radiation-curable composition for producing three-dimensional shaped articles (see example 4 on page 11), which composition comprises:
  • a first aspect of the present invention relates to a liquid radiation-curable composition for the production of three-dimensional shaped articles, e.g. by stereolithography, as defined in the accompanying claims.
  • the composition is a mixture of
  • the present invention relates to a liquid, radiation-curable composition
  • a liquid, radiation-curable composition is defined in the accompanying claims and contains from 20 to 90 percent by weight of actinic radiation-curable and cationically polymerizable organic substances, from 0.05 to 12 percent by weight of a cationic initiator, from 0.5 to 60 percent by weight of a reactive cationic modifier in the form of a triglycidylether of poly(isopropoxylated) glycerol having the following formula: or at least one polyether polyol (PEPO), or mixtures thereof.
  • the PEPO has a molecular weight greater than or equal to 4,000.
  • composition further optionally contains up to 10 percent by weight of a radical photoinitiator, up to 40 percent by weight of a free radically curable component containing at least one mono- or poly(methacrylate), up to 30 percent by weight of a polyol different from said polyether polyol component, and up to 10 percent by weight of customary additives.
  • the actinic radiation-curable and cationically polymerizable organic substance preferably contains, 10 to 80% by weight of at least one solid or liquid cycloaliphatic polyepoxide having at least two epoxy groups with epoxy equivalent weight between 70 and 350 g/eq, or mixtures thereof.
  • the actinic radiation-curable and cationically polymerizable organic substance preferably contains 3 to 70% by weight of at least one solid or liquid polyglycidylether of aliphatic, alicyclic or aromatic alcohol or polybasic acid, epoxy cresol novolac, epoxyphenol novolac, spiro-orthoester compounds, oxetane compounds, having at least two cationically reactive groups per molecule, or mixtures thereof.
  • the actinic radiation-curable and cationically polymerizable organic substance contains 2 to 40% by weight of at least one solid or liquid vinylether having at least two vinylether groups, or at least one hydroxyl- or epoxy-functionalized vinylether compound.
  • the cationically curable component can be a mixture of at least one polyglycidyl compound or cycloaliphatic polyepoxide or aromatic ring-, epoxy cresol novolac or epoxy phenol novolac-containing polyglycidyl compound having, on average, at least two epoxy groups per molecule and at least one vinyl ether-based resin.
  • the curable composition optionally contains 3 to 40% by weight of a free radically curable component containing at least one mono- or poly(meth)acrylate.
  • the polyfunctional (meth)acrylate preferably has, on average, between 2 to 7 acrylate groups.
  • a polyether-polyol is an alternative to the cationic reactive modifier; it may be solid or liquid at room temperature and may have the following formula: [-O-A-O-R 1 -] m , where m is such that the molecular weight of the polyether polyol is greater than or equal to 4,000, A is para-, meta- or ortho- substituted aromatic diol residue selected from Bisphenol A, Bisphenol F, p, m, o-Biphenyl, p-, m-,o-Hydroquinone, substituted with aliphatic or aromatic substituents having (un)saturated C 1 -C 5 alkylgroups, ether- or ester-groups; para, meta and ortho substituted aromatic structures of the following structure: where R 2 is at least one -O-, -SO 2 -, -CO-, -COO-, -OCH 2 -, -CH 2 -, (CH 3 ) 2 C ⁇ , and an alipha
  • R 1 has the structure CH 2 CH(OH)(CR 3 R 4 ) n -, where n is greater than or equal to 1, R 3 and R 4 are independently of one another -H, -CH 3 , -CH 2 CH 3 , saturated or unsaturated linear or branched C 1 -C 20 alkylgroups, aliphatic or alicyclic or aromatic segment containing aromatic ether, aliphatic ether, ethoxy, propoxy, isopropoxy, oxytetramethylene, aliphatic or aromatic ester, siloxane and carbonate linkages.
  • A can be a linear or branched aliphatic or substituted alicyclic diol or unsubstituted alicyclic diol residue bearing saturated or unsaturated C 1 -C 20 alkylgroups, ether, ethoxy, propoxy, isopropoxy, oxytetramethylene, ester, sulfone, sulfoxide, siloxane and carbonate linkages.
  • A in the alternative, can be an aliphatic or substituted alicyclic diol or unsubstituted alicyclic diol, cyclohexane dimethanol, hydrogenated Bisphenol A and hydrogenated Bisphenol F.
  • A is an aromatic diol residue selected from Bisphenol A, Bisphenol F, hydroquinone, biphenol, aromatic diols bearing a flexible segment between the aromatic rings and R 1 is -CH 2 CH(OH)CH 2 -. More preferably, A is an aromatic diol residue selected from Bisphenol A, R 1 is -CH 2 CH(OH)CH 2 - and m is greater than 15.
  • composition preferably contains the reactive polyether polyol modifier from 0.5 to 45 percent by weight.
  • the reactive modifier solid or liquid polyether-polyol component can be blended, dispersed, diluted or dissolved in at least one liquid or solid diol or polyol containing aromatic rings or polyester linkages or polyether linkages or which is a derivative of aliphatic, alicyclic or aromatic polyhydric alcohols.
  • the curable composition can further contain from 0 to 30 percent by weight of a liquid or solid polyhydroxyl compound.
  • the polyhydroxyl compound can contain aliphatic, alicyclic or substituted alicyclic groups.
  • the polyhydroxyl compound can alternatively have aromatic carbon rings in its molecule.
  • the present invention further relates to a method of producing a cured product, in which the composition described above is treated with actinic radiation. More preferably, the present invention relates to a method for producing three-dimensional shaped articles by treating a radiation-curable composition described above with actinic radiation to form an at least partially cured layer on the surface of said composition within a surface region corresponding to a desired cross-sectional area of the three-dimensional article to be formed. The at least partially cured layer produced in step (a) is then covered with a new layer of the radiation-curable composition. Steps (a) and (b) are repeated until an article having the desired shape is formed. Optionally, the resulting article is subjected to post-curing.
  • compositions herein contain, in the broadest sense, a mixture of at least one cationically curable compound, at least one photoinitiator for the cationically cured compound(s), and a cationic reactive modifier or polyether-polyol modifier, as defined in the accompanying claims.
  • the compositions further optionally contain at least one free radically curable compound, a free radical photoinitiator/sensitizer and a hydroxyl-group containing compound.
  • the cationically curable liquid or solid compound may expeditiously be a polyglycidyl compound or cycloaliphatic polyepoxide or epoxy cresol novolac or epoxy phenol novolac compound and which on average possesses more than one epoxide group (oxirane ring) in the molecule.
  • Such resins may have an aliphatic, aromatic, cycloaliphatic, araliphatic or heterocyclic structure; they contain epoxide groups as side groups, or these groups form part of an alicyclic or heterocyclic ring system.
  • Epoxy resins of these types are known in general terms and are commercially available.
  • Polyglycidyl esters and poly( ⁇ -methylglycidyl) esters are one example of suitable epoxy resins.
  • Said polyglycidyl esters can be obtained by reacting a compound having at least two carboxyl groups in the molecule with epichlorohydrin or glycerol dichlorohydrin or ⁇ -methylepichlorohydrin. The reaction is expediently carried out in the presence of bases.
  • the compounds having at least two carboxyl groups in the molecule can in this case be, for example, aliphatic polycarboxylic acids, such as glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid or dimerized or trimerized linoleic acid.
  • cycloaliphatic polycarboxylic acids for example tetrahydrophthalic acid, 4-methyltetrahydrophthalic acid, hexahydrophthalic acid or 4-methylhexahydrophthalic acid.
  • aromatic polycarboxylic acids such as, for example, phthalic acid, isophthalic acid, trimellitic acid or pyromellitic acid, or else carboxyl-terminated adducts, for example of trimellitic acid and polyols, for example glycerol or 2,2-bis(4-hydroxycyclohexyl)propane, can be used.
  • Polyglycidyl ethers or poly( ⁇ -methylglycidyl) ethers can likewise be used.
  • Said polyglycidyl ethers can be obtained by reacting a compound having at least two free alcoholic hydroxyl groups and/or phenolic hydroxyl groups with a suitably substituted epichlorohydrin under alkaline conditions or in the presence of an acidic catalyst followed by alkali treatment.
  • Ethers of this type are derived, for example, from acyclic alcohols, such as ethylene glycol, diethylene glycol and higher poly(oxyethylene) glycols, propane-1,2-diol, or poly(oxypropylene) glycols, propane-1,3-diol, butane-1,4-diol, poly(oxytetramethylene) glycols, pentane-1,5-diol, hexane-1,6-diol, hexane-2,4,6-triol, glycerol, 1,1,1-trimethylolpropane, bistrimethylolpropane, pentaerythritol, sorbitol, and from polyepichlorohydrins.
  • acyclic alcohols such as ethylene glycol, diethylene glycol and higher poly(oxyethylene) glycols, propane-1,2-diol, or poly(oxypropylene) glycols, propane-1,3-diol
  • Suitable glycidyl ethers can also be obtained, however, from cycloaliphatic alcohols, such as 1,3- or 1,4-dihydroxycyclohexane, bis(4-hydroxycyclohexyl)methane, 2,2-bis(4-hydroxycyclohexyl)propane or 1,1-bis(hydroxymethyl)cyclohex-3-ene, or they possess aromatic rings, such as N,N-bis(2-hydroxyethyl)aniline or p,p'-bis(2-hydroxyethylamino)diphenylmethane.
  • cycloaliphatic alcohols such as 1,3- or 1,4-dihydroxycyclohexane, bis(4-hydroxycyclohexyl)methane, 2,2-bis(4-hydroxycyclohexyl)propane or 1,1-bis(hydroxymethyl)cyclohex-3-ene, or they possess aromatic rings, such as N,N-bis(2-hydroxyethyl)aniline or p,
  • Particularly important representatives of polyglycidyl ethers or poly( ⁇ -methylglycidyl) ethers are based on phenols; either on monocylic phenols, for example on resorcinol or hydroquinone, or on polycyclic phenols, for example on bis(4-hydroxyphenyl)methane (bisphenol F), 2,2-bis(4-hydroxyphenyl)propane (bisphenol A), or on condensation products, obtained under acidic conditions, of phenols or cresols with formaldehyde, such as phenol novolaks and cresol novolaks.
  • bisphenol F bis(4-hydroxyphenyl)methane
  • bisphenol A 2,2-bis(4-hydroxyphenyl)propane
  • condensation products obtained under acidic conditions, of phenols or cresols with formaldehyde, such as phenol novolaks and cresol novolaks.
  • These compounds are particularly preferred as epoxy resins for the present invention, especially diglycidyl ethers
  • Poly(N-glycidyl) compounds are likewise suitable for the purposes of the present invention and are obtainable, for example, by dehydrochlorination of the reaction products of epichlorohydrin with amines containing at least two amine hydrogen atoms.
  • amines may, for example, be n-butylamine, aniline, toluidine, m-xylylenediamine, bis(4-aminophenyl)methane or bis(4-methylaminophenyl)methane.
  • poly(N-glycidyl) compounds include N,N'-diglycidyl derivatives of cycloalkyleneureas, such as ethyleneurea or 1,3-propyleneurea, and N,N'-diglycidyl derivatives of hydantoins, such as of 5,5-dimethylhydantoin.
  • Poly(S-glycidyl) compounds are also suitable as the cationic curing resin herein, examples being di-S-glycidyl derivatives derived from dithiols, for example ethane-1,2-dithiol or bis(4-mercaptomethylphenyl) ether.
  • Examples of epoxide compounds in which the epoxide groups form part of an alicyclic or heterocyclic ring system include bis(2,3-epoxycyclopentyl) ether, 2,3-epoxycyclopentyl glycidyl ether, 1,2-bis(2,3-epoxycyclopentyloxy)ethane, bis(4-hydroxycyclohexyl)methane diglycidyl ether, 2,2-bis(4-hydroxycyclohexyl)propane diglycidyl ether, 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-6-methyl-cyclohexylmethyl 3,4-epoxy-6-methylcyclohexanecarboxylate, di(3,4-epoxycyclohexylmethyl) hexanedioate, di(3,4-epoxy-6-methylcyclohexylmethyl) hex
  • epoxy resins in which the 1,2-epoxide groups are attached to different heteroatoms or functional groups.
  • these compounds include the N,N,O-triglycidyl derivative of 4-aminophenol, the glycidyl ether/glycidyl ester of salicylic acid, N-glycidyl-N'-(2-glycidyloxypropyl)-5,5-dimethylhydantoin or 2-glycidyloxy-1,3-bis(5,5-dimethyl-1-glycidylhydantoin-3-yl)propane.
  • Examples of cationically polymerizable organic substances other than epoxy resin compounds include oxetane compounds, such as trimethylene oxide, 3,3-dimethyloxetane and 3,3-dichloromethyloxethane, 3-ethyl-3-phenoxymethyloxetane, and bis(3-ethyl-3-methyloxy)butane; oxolane compounds, such as tetrahydrofuran and 2,3-dimethyltetrahydrofuran; cyclic acetal compounds, such as trioxane, 1,3-dioxalane and 1,3,6-trioxan cycloctane; cyclic lactone compounds, such as beta-propiolactone and epsilon-caprolactone; thiirane compounds, such as ethylene sulfide, 1,2-propytene sulfide and thioepichlorohydrin; thiotane compounds, such as 1,3-propylene s
  • Vinyl ethers that can be used in stereolithography compositions include ethyl vinylether, n-propyl vinylether, isopropyl vinylether, n-butyl vinylether, isobutyl vinylether, octadecyl vinylether, cyclohexyl vinylether, butanediol divinylether, cyclohexanedimethanol divinylether, diethyleneglycol divinylether, triethyleneglycol divinylether, tert-butyl vinylether, tert-amyl vinylether, ethylhexyl vinylether, dodecyl vinylether, ethyleneglycol divinylether, ethyleneglycolbutyl vinylether, hexanediol divinylether, diethyleneglycol monovinylether, triethyleneglycol methylvinylether, tetraethyleneglycol divinylether, trimethylolpropane trivinylether, aminopropyl
  • Typical commercial chain extended vinyl ethers include the Pluriol-E200 divinyl ether (PEG200-DVE), poly-THF290 divinylether (PTHF290-DVE) and polyethyleneglycol-520 methyl vinylether (MPEG500-VE) all of BASF Corp.
  • Hydroxyl-functionalized vinylethers include butanediol monovinylethers, cyclohexanedimethanol monovinylether, ethyleneglycol monovinylether, hexanediol monovinylether, polyethyleneglycol monovinylethers.
  • vinyl ethers that are suitable for stereolithography and may be used in the hybrid flexible stereolithography compositions are all those included in the U.S. Patent 5,506,087 . More preferred are vinyl ethers commercially available from AlliedSignal under the tradenames Vectomer 4010, Vectomer 5015, Vectomer 4020.
  • cationically cured compounds include spiro ortho esters that are prepared by reacting epoxy compounds with lactone; ethylenically unsaturated compounds, such as vinylcyclohexane, n-vinyl-2-pyrrolidone and its various derivatives, isobutylene and polybutadiene, and derivatives of the above compounds.
  • the above cationically polymerizable compounds may be used alone or as a mixture of two or more thereof depending upon the desired performance.
  • Additional cationically curable commercial products that can be used herein include: Uvacure 1500, Uvacure 1501, Uvacure 1502, Uvacure 1530, Uvacure 1531, Uvacure 1532, Uvacure 1533, Uvacure 1534, Uvacure 1561, Uvacure 1562, all commercial products of UCB Radcure Corp., Smyrna, Georgia; UVR-6105, UVR-6100, UVR-6110, UVR-6128, UVR-6200, UVR-6216 (Union Carbide Corp.), the Araldite GY series that is Bisphenol A epoxy liquid resins, the Araldite CT and GT series that is Bisphenol A epoxy solid resins, the Araldite GY and PY series that is Bisphenol F epoxy liquids, the cycloaliphatic epoxides Araldite CY 179 and PY 284, the Araldite DY and RD reactive diluents series, the Araldite ECN series of epoxy cresol novolacs, the Araldite EPN series of
  • photoinitiators for epoxy resins for purposes of practicing the instant invention.
  • these photoinitiators are onium salts with anions of weak nucleophilicity.
  • examples thereof are halonium salts, iodosyl salts or sulfonium salts, sulfoxonium salts, or diazonium salts, as described for example in US-A-3,708,296 .
  • Other cationic photoinitiators are metallocene salts.
  • compositions comprising, as a cationic photoinitiator, a compound of the formula (B-I), (B-II) or (B-III) in which R 1B , R 2B , R 3B , R 4B , R 5B , R 6B , and R 7B independently of one another are C 6 -C 18 aryl which is unsubstituted or substituted by appropriate radicals, and
  • C 6 -C 18 aryl in this context are phenyl, naphthyl, anthryl and phenanthryl.
  • alkyl preferably C 1 -C 6 alkyl, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, isobutyl, tert-butyl or the various pentyl or hexyl isomers, alkoxy, preferably C 1 -C 6 alkoxy, such as methoxy, ethoxy, propoxy, butoxy, pentoxy or hexoxy, alkylthio, preferably C 1 -C 6 alkylthio, such as methylthio, ethylthio, propylthio, butylthio, pentylthio or hexylthio, halogen, such as fluorine, chlorine, bromine or iodine,
  • halogen atoms Q are chlorine and, in particular, fluorine.
  • Preferred anions LQ mB are BF 4 - , PF 6 - , AsF 6 - , SbF 6 - and SbF 5 (OH) - .
  • compositions are those comprising as a cationic photoinitiator a compound of the formula (B-III), in which R 5B , R 6B and R 7B are aryl, aryl being in particular phenyl or biphenyl or mixtures of these two groups.
  • compositions comprising as a photoinitiator a compound of the formula (B-IV) in which
  • Examples of ⁇ -arenes as R 8B and anions of ⁇ -arenes as R 9B can be found in EP-A-0 094 915 .
  • Examples of preferred ⁇ -arenes as R 8B are toluene, xylene, ethylbenzene, cumene, methoxybenzene, methylnaphthalene, pyrene, perylene, stilbene, diphenylene oxide and diphenylene sulfide. Cumene, methylnaphthalene or stilbene are particularly preferred.
  • Examples of non-nucleophilic anions X - are FSO 3 - , anions of organic sulfonic acids, of carboxylic acids or of anions LQ mB - .
  • Preferred anions are derived from partially fluoro- or perfluoro-aliphatic or partially fluoro- or perfluoro-aromatic carboxylic acids such as CF 3 SO 3 - , C 2 F 5 SO 3 - , n-C 3 F 7 SO 3 - , n-C 4 F 9 SO 3 - , n-C 6 F 13 SO 3 - , n-C 8 F 17 SO 3 - , or in particular from partially fluoro- or perfluoro-aliphatic or partially fluoro- or perfluoro-aromatic organic sulfonic acids, for example from C 6 F 5 SO 3 - , or preferably are anions LQ mB - , such as BF 4 - , PF 6 - , AsF 6 - , SbF 6 - , and SbF 5 (OH) - .
  • the metallocene salts can also be employed in combination with oxidizing agents. Such combinations are described in EP-A-0 126 712 .
  • sensitizers are polycyclic aromatic hydrocarbons or aromatic keto compounds. Specific examples of preferred sensitizers are mentioned in EP-A-0 153 904 .
  • More preferred commercial cationic photoinitiators are UVI-6974, UVI-6970, UVI-6960, UVI-6990 (manufactured by Union Carbide Corp.), CD-1010, CD-1011, CD-1012 (manufactured by Sartomer Corp.), Adekaoptomer SP-150, SP-151, SP-170, SP-171 (manufactured by Asahi Denka Kogyo Co., Ltd.), Irgacure 261 (Ciba Specialty Chemicals Corp.), Cl-2481, Cl-2624, Cl-2639, Cl-2064 (Nippon Soda Co, Ltd.), DTS-102, DTS-103, NAT-103, NDS-103, TPS-103, MDS-103, MPI-103, BBI-103 (Midori Chemical Co, Ltd.).
  • UVI-6974 Most preferred are UVI-6974, CD-1010, UVI-6970, Adekaoptomer SP-170, SP-171, CD-1012, and MPI-103.
  • the above-mentioned cationic photo-initiators can be used either individually or in combination of two or more.
  • free-radical photoinitiators which form free radicals given the appropriate irradiation.
  • free-radical photoinitiators are benzoins, such as benzoin, benzoin ethers, such as benzoin methyl ether, benzoin ethyl ether and benzoin isopropyl ether, benzoin phenyl ether and benzoin acetate, acetophenones, such as acetophenone, 2,2-dimethoxy-acetophenone and 1,1-dichloroacetophenone, benzil, benzil ketals, such as benzil dimethylketal and benzil diethyl ketal, anthraquinones, such as 2-methylanthraquinone, 2-ethylanthra-quinone, 2-tert-butylanthraquinone, 1-chloroanthraquinone and 2-amylanthraquinone, and also triphenylphos, such as be
  • a class of photoinitiators that are commonly employed when using argon ion lasers comprises the benzil ketals, for example benzil dimethyl ketal.
  • the photoinitiator used is an ⁇ -hydroxy phenyl ketone, benzil dimethyl ketal or 2,4,6-trimethylbenzoyldiphenylphosphine oxide.
  • a further class of suitable photoinitiators constitutes the ionic dye-counterion compounds, which are capable of absorbing actinic radiation and of generating free radicals which are able to initiate the polymerization of the acrylates.
  • the novel compositions containing ionic dye-counterion compounds can in this way be cured more variably with visible light in an adjustable wavelength range of 400-700 nm.
  • Ionic dye-counterion compounds and their mode of action are known, for example US Patent Nos. 4,751,102 , 4,772,530 and 4,772,541 .
  • ionic dye-counterion compounds examples include the anionic dye-iodonium ion complexes, the anionic dye-pyryllium ion complexes and, in particular, the cationic dye-borate anion compounds of the following formula: in which D C + is a cationic dye and R 1C , R 2C , R 3C and R 4C independently of one another are each an alkyl, aryl, alkaryl, allyl, aralkyl, alkenyl, alkynyl, an alicyclic or saturated or unsaturated heterocyclic group.
  • R 1C to R 4C can be taken for example, from EP-A-0 223 587 .
  • the novel compositions preferably include a 1-hydroxy phenyl ketone, especially 1-hydroxycyclohexyl phenyl ketone.
  • the free radical and cationic photoinitiators are added in effective quantities, i.e. in quantities from 0.1 to 12, particularly from 0.5 to 9 percent by weight, based on the overall quantity of the composition. If the novel compositions are used for stereolithographic processes, in which laser beams are normally employed, it is essential for the absorption capacity of the composition to be matched, by way of the type and concentration of the photoinitiators, in such a way that the depth of curing at normal laser rate is from approximately 0.1 to 2.5 mm.
  • the novel mixtures may also contain various photoinitiators of different sensitivity to radiation of emission lines with different wavelengths to obtain a better utilization of a UVNIS light source which emits emission lines of different wavelengths.
  • various photoinitiators it is advantageous for the various photoinitiators to be selected such, and employed in a concentration such, that equal optical absorption is produced with the emission lines used.
  • the optional free radically curable component preferably comprises at least one solid or liquid poly(meth)acrylates, for example, be di-, tri-, tetra- or pentafunctional monomeric or oligomeric aliphatic, cycloaliphatic or aromatic acrylates or methacrylates.
  • the compounds preferably have a molecular weight of from 200 to 500.
  • Suitable aliphatic poly(meth)acrylates are the triacrylates and trimethacrylates of hexane-2,4,6-triol, glycerol or 1,1,1 -trimethylolpropane, ethoxylated or propoxylated glycerol or 1,1,1-trimethylolpropane, and the hydroxyl-containing tri(meth)acrylates which are obtained by reacting triepoxide compounds, for example the triglycidyl ethers of said triols, with (meth)acrylic acid.
  • pentaerythritol tetraacrylate bistrimethylolpropane tetraacrylate, pentaerythritol monohydroxytriacrylate or -methacrylate, or dipentaerythritol monohydroxypentaacrylate or -methacrylate.
  • urethane (meth)acrylates are known to the person skilled in the art and can be prepared in a known manner by, for example, reacting a hydroxyl-terminated polyurethane with acrylic acid or methacrylic acid, or by reacting an isocyanate-terminated prepolymer with hydroxyalkyl (meth)acrylates to give the urethane (meth)acrylate.
  • Suitable aromatic tri(meth)acrylates are the reaction products of triglycidyl ethers of trihydric phenols and phenol or cresol novolaks containing three hydroxyl groups, with (meth)acrylic acid.
  • the (meth)acrylates used herein are known compounds and some are commercially available, for example from the SARTOMER Company under product designations such as SR ® 295, SR ® 350, SR ® 351, SR ® 367, SR ® 399, SR ® 444, SR ® 454 or SR ® 9041.
  • compositions are those in which the free radically curable component contains a tri(meth)acrylate or a penta(meth)acrylate.
  • di(meth)acrylates are the di(meth)acrylates of cycloaliphatic or aromatic diols such as 1,4-dihydroxymethylcyctohexane, 2,2-bis(4-hydroxycyclohexyl)propane, bis(4-hydroxycyclohexyl)methane, hydroquinone, 4,4'-dihydroxybiphenyl, bisphenol A, bisphenol F, bisphenol S, ethoxylated or propoxylated bisphenol A, ethoxylated or propoxylated bisphenol F or ethoxylated or propoxylated bisphenol S.
  • Di(meth)acrylates of this kind are known and some are commercially available.
  • di(meth)acrylates which can be employed are compounds of the formulae (F-I), (F-II), (F-III) or (F-IV) in which
  • di(meth)acrylates are compounds of the formulae (F-V), (F-VI), (F-VII) and (F-VIII)
  • Examples of commercially available products of these polyfunctional monomers are KAYARAD R-526, HDDA, NPGDA, TPGDA, MANDA, R-551, R-712, R-604, R-684, PET-30, GPO-303, TMPTA, THE-330, DPHA-2H, DPHA-2C, DPHA-21, D-310, D-330, DPCA-20, DPCA-30, DPCA-60, DPCA-120, DN-0075, DN-2475, T-1420, T-2020, T-2040, TPA-320, TPA-330, RP-1040, R-011, R-300, R-205 (Nippon Kayaku Co., Ltd.), Aronix M-210, M-220, M-233, M-240, M-215, M- 305, M-309, M-310, M-315, M-325, M-400, M-6200, M-6400 (Toagosei Chemical Indtustry Co, Ltd.), Light acrylate BP-4EA
  • the radiation-curable and cationically polymerizable organic component (a) may optionally contain at least one component (a1) that is a polyfunctional aliphatic, alicyclic or aromatic glycidylether(s) having at least three epoxy groups per molecule.
  • Component (a1) improves the side wall finish of the cured article and the wet recoatability of the liquid composition. More preferred compositions contain a component (a1) that is a polyfunctional aliphatic, alicyclic or aromatic glycidylether(s) having at least three epoxy groups per molecule with an epoxy equivalent weight (EEW) between 100 and 2000. Most preferred are those having an EEW weight between 100 and 800.
  • the triglycidylether of trimethylolpropane, Heloxy 48 of Shell Corp., with EEW of about 140-160 is one of the most preferred polyglycidylether compounds.
  • the polyfunctional glycidylether(s) having at least three epoxy groups in their molecule may comprise between 2 and 90% by weight the overall cationic component of the composition. More preferred between 5 and 60% by weight. Most preferred between 7 and 40% by weight.
  • the radiation-curable and cationically polymerizable organic component (a) comprise at least one component (a2) that is an alicyclic polyepoxide having at least two epoxy groups per molecule. More preferred compositions contain component (a2) with monomer purity over 80%.
  • component (a2) with monomer purity over 80%.
  • 3,4-epoxycyclohexylmethyl 3',4'-epoxycyclohexanecarboxylate (ECEC) with varying degrees of purification can be purchased through various commercial sources.
  • ECEC 3,4-epoxycyclohexylmethyl 3',4'-epoxycyclohexanecarboxylate
  • Araldite CY179 of Ciba Specialty Chemicals Corporation which is a ECEC containing a certain percentage of dimers or oligomers of about 10% or less.
  • UVR6105 of Union Carbide Corp. which is an ECEC containing a smaller percentage of oligomers than Araldite CY 179.
  • Preferred compositions contain component (a2) between 5 to 80 % by weight. More preferred compositions contain component (a2) between 20 and 75% by weight. Most preferred compositions contain component (a2) between 25 to 70% by weight.
  • the radiation-curable and cationically polymerizable organic component (a) may optionally comprise at least one component (a3) that is a solid or liquid epoxycresol novolac or epoxycresol novolac having at least two epoxy groups per molecule.
  • the epoxy equivalent weight of component (a3) is between 100 to 400 grams/equivalent Preferred amount for component (a3) is between 3 and 80% by weight. More preferred amount is between 6 to 75% by weight. The most preferred amount is between 10 to 40% by weight.
  • Preferred vinylethers are those having aliphatic, aromatic or alicyclic moities in their molecules. Preferred are also hydroxyl-functionalized vinylethers. Preferred amount of the vinylether component is between 1 to 40% by weight. More preferred amount is between 3 to 30% by weight. Most preferred amount is between 4 to 20% by weight.
  • radiation curable and radically-polymerizable organic component (component (e) of accompanying claim 1) be contained in amounts from 0.5 to 40% by weight. More preferred compositions contain component (e) between 7 to 30% by weight. Most preferred are compositions containing component (e) between 8 to 20% by weight. Most preferred compositions contain 4 to 10% by weight of at least one liquid or solid poly(meth)acrylate having a (meth)acrylate functionality of more than 2, and from 4 to 10% by weight of one or more di(meth)acrylates.
  • the radiation-curable composition may optionally comprise between 0 and 30% by weight at least one solid or liquid polyol component (component (f) of accompanying claim 1). More preferred compositions contain component (f) comprising aliphatic or alicyclic polyhydric alcohols bearing polyester, caprolactone, polyether, polyalkylene, polysiloxane derivatives, or mixtures thereof.
  • compositions containing a polyol component (f) comprising substances having aromatic carbon rings in their molecules, in particular phenolic compounds having at least 2 hydroxyl groups, phenolic compounds having at least 2 hydroxyl groups, which are reacted with ethylene oxide, propylene oxide or with ethylene and propylene oxide, aliphatic hydroxy compounds having not more than 80 carbon atoms, compounds having at least one hydroxyl group and at least one epoxide group, or mixtures thereof. More preferred amount of polyol component (f) is between 3 and 30% by weight, and most preferred amount is between 5 and 25% by weight.
  • compositions contain a cationic photoinitiator or a mixture of cationic photoinitiators (component (b) of accompanying claim 1) between 0.1 to 12% by weight. More preferred compositions contain component (b) between 0.2 to 9% by weight. Most preferred compositions contain component (b) between 0.25 to 8% by weight. It is preferred for a free-radical photoinitiator or a mixture of free-radical photoinitiators (component (d) of accompanying claim 1) to be contained between 0.1 to 10% by weight. More preferred compositions contain component (d) between 0.3 to 5% by weight. Most preferred compositions contain component (d) between 0.4 to 4% by weight.
  • Preferred, more preferred and most preferred compositions may contain between 0 to 10% by weight of additives or reactive diluents.
  • the novel compositions herein further include a cationic reactive modifier.
  • the cationic reactive modifier component imparts flexibility and impact resistance to the cured article without compromising photospeed of the liquid composition or water resistance of the cured article.
  • the cationic reactive modifier is a triglycidyl ether of polypropoxylated glycerol having the following structure: which is commercially available under the tradename Heloxy ® 84 from Shell Company, Houston, TX.
  • the reactive polyether-polyol modifier (PEPO) component can be solid or liquid at room temperature and preferably is characterized by following formula: [-O-A-O-R 1 -] m , where m is such that the molecular weight of PEPO is greater than or equal to 4000.
  • A is a para, meta or ortho substituted aromatic diol residue
  • said aromatic diols preferably are Bisphenol A, Bisphenol F, p, m, o-Biphenyl, p-, m-, o-Hydroquinone, substituted with aliphatic or aromatic substituents, para, meta and ortho substituted aromatic structures of the following structure: where the linkage R 2 is a direct bond, or at least one -O-, -SO 2 -, -CO-, -COO-, -OCH 2 -, -OCX 1 X 2 -,-CX 1 X 2 - wherein X 1 and X 2 independently of one another can be hydrogen and C 1 -C 3 alkyl.
  • Substituents on the aromatic ring(s) of the above chemical structure independently from one another can be hydrogen, C 1 -C 5 alkyl, alkoxy, nitro, carboxylic, ester, and hydroxyl groups.
  • A can be an unsubstituted or substituted (un)saturated aliphatic or alicyclic or aromatic diol residue linked with saturated and/or unsaturated chain extension segment having 1 to 100 repeating C 1 -C 4 alkylgroups or alkoxy groups, ether group, oxytetramethylene, ester, sulfone, sulfoxide, siloxane and carbonate.
  • Substituents for said diol residue are C 1 -C 6 alkyl and C 1 -C 6 alkoxy.
  • Preferred examples of alicyclic diols include hydrogenated Bisphenol A and hydrogenated Bisphenol F.
  • R 1 can be represented by the formula: -CH 2 CH(OH)(CR 3 R 4 ) n -, where n is greater than or equal to 1, R 3 and R 4 are independently of one another are hydrogen, C 1 -C 8 alkyl, C 5 -C 12 cycloaliphatic, C 5 -C 12 aromatic ring containing aromatic ether, aliphatic ether, C 2 -C 4 alkoxy, oxytetramethylene, aliphatic or aromatic ester, siloxane and carbonate linkages.
  • the polyether polyol modifier has the formula [-O-A-O-R 1 -] m , wherein the molecular weight of the polyether polyol is greater than or equal to 4000, A is an aromatic diol residue and R 1 is -CH 2 CH(OH)CH 2 -.
  • PEPO is a polyarylether polyol modifier having the formula: where c is 15 to greater than 60.
  • the end-groups of the above-drawn polymer structure depend on the feeding ratio of the raw materials during the manufacturing process, reaction conditions, and purity of the raw materials. The end-groups can be tailored based on specific chemistry and applications. PEPO may be in a liquid or solid form at room temperature. Most preferred PEPOs include PKHM-85X, PKHC, PKHH, PKHJ, PKHM-30, PKHM-301, PKFE all of Phenoxy Specialties, Corp., NC. These specific candidates have a molecular weight between 10,000 and 20,000.
  • PEPO may be dissolved or diluted with commercial diols or triols or polyols to form from low to high viscous intermediates suitable as flexibilizers and tougheners.
  • Paphen PKHM-85X is a mixture of a solid paphen phenoxy with a liquid commercial polyol.
  • the cationic reactive modifier is highly compatible with the liquid curable composition, which results in, not only an improvement in elongation and impact resistance, but improved recoatability and elimination of undesirable phase separation phenomena
  • the cationic reactive modifier and polyether-polyol modifiers are preferably present in the overall composition at between 0.5% to 60% by weight, more preferably 1% to 50% by weight, most preferably 2% to 30 by weight.
  • the solid or liquid reactive cationically modifier and polyether-polyol modifiers may be used singly or as a mixture.
  • novel compositions optionally comprise at least one compound selected from the group consisting of: dihydroxybenzenes, trihydroxybenzenes and the compounds of the formula (D-I): in which R 1D and R 2D are a hydrogen atom or a methyl group; compounds of the formula (D-II): in which R 1D and R 2D are each a hydrogen atom or a methyl group;
  • the optional polyol component can consist of (D2) phenolic compounds having at least 2 hydroxyl groups which are reacted with ethylene oxide, propylene oxide or with ethylene oxide and propylene oxide, and especially of the compounds of the formula (D-IIa): in which R 1D and R 2D are both a hydrogen atom or both a methyl group; R 3D and R 4D are all, independently of one another, each a hydrogen atom or a methyl group, and xD and yD are each an integer from 1 to 15.
  • the optional polyol component can also comprise hydroxyl group containing polyester compounds obtained by esterifying at least one aliphatic polyhydric alcohol with at least one monobasic acid, polybasic acid, or phenol and the hydroxyl group-containing polyesters obtained through an esterification reaction between at least one lactone compound and at least one monobasic acid, polybasic acid or phenol.
  • 1,3-butanediol, 1,4-butanediol, 1,6-hexanediol, diethylene glycol, triethylene glycol, neopentyl glycol, polyethylene glycol, polypropylene glycol, trimethylolpropane, glycerin, pentaerythritol and dipentaerythritol can be used, for example.
  • monobasic acid formic acid, acetic acid, butylcarboxylic acid, and benzoic acid can be used, for example.
  • polybasic acid adipic acid, terephthalic acid, phthalic anhydride and trimellitic acid can be used, for example.
  • phenol phenol, p-nonylphenol, bisphenol A and bisphenol F can be used, for example.
  • lactone ⁇ -propiolactone and ⁇ -caprolactone can be used, for example.
  • Other suitable compounds include caprolactone based oligo- and polyesters such as the trimethylolpropane triester with caprolactone, Tone 0301 and Tone 0310, or the Tone 02xx series of Union carbide Corp.
  • polyester polyols As said polyester polyols, the Desmophen series of Bayer Corp., K-Flex series of King Industries, Corp., the Rucoflex series of Ruco Polymer Corp., the Fomrez series of Witco Corp., and the Capa series of Solvay Corp. can also be used.
  • the hydroxyl group-containing polyester can be used either singly or in combination of two or more in accordance with the properties desired.
  • the optional polyol component can also comprise hydroxyfunctional polyetheralcohols, such as alkoxylated trimethylolpropane, alkoxylated bisphenol A, alkoxylated bisphenol F, polytetramethyleneether glycol known as polybutylene glycol (molecular weight between 250 and 9000), in particular the propoxylated, isopropoxylated and ethoxylated compounds, polyethyleneglycol-200 or -600 and the like.
  • Polyether alcohols also include the Desmophen U&L and the Mutranol series of Bayer Corp., the Voranol series of Dow Corp. and the Arcol series of Arco Corp. (LHT28, LHT42, E786).
  • the preferable molecular weight of the polyol should be 100 to 2000, and more preferably 160-1000.
  • the polyol concentration may vary between 0 and 30% by weight.
  • the hybrid cationically and radically cured composition does not include the optional polyol component.
  • hydroxyl group-containing compounds are a must component for epoxy hybrid compositions used in stereolithography. It was believed that epoxy formulations do not cure and postcure to high extent unless the composition contains a certain percentage of a diol, triol or polyol. The presense of diols or polyols was believed to be a major factor for obtaining UV cured articles with exceptionally good mechanical and thermomechanical properties.
  • the hydroxyl groups react with the epoxy groups during the epoxy ring opening, and contribute to the formation of a three dimensional network.
  • the resin composition for stereolithography applications according to the present invention may contain other materials in suitable amounts, as far as the effect of the present invention is not adversely affected.
  • materials include radical-polymerizable organic substances other than the aforementioned cationically polymerizable organic substances; heat-sensitive polymerization initiators; various additives for resins such as coloring agents such as pigments and dyes, antifoaming agents, leveling agents, thickening agents, flame retardant and antioxidant; fillers such as silica, alumina, glass powder, ceramic powder, metal powder and modifier resins.
  • radical-polymerizable organic substances include but not limited to compounds that thermally polymerize, while those of the heat-sensitive polymerization initiator includes aliphatic onium salts disclosed in Japanese Patent Laid-Open Nos. 49613/1982 and 37004/1983 .
  • the filler to be used in the present invention is a reactive or non-reactive, inorganic or organic, powdery, fibrous or flaky material.
  • organic filler materials are polymeric compounds, thermoplastics, core-shell, aramid, kevlar, nylon, crosslinked polystyrene, crosslinked poly(methyl methacrylate), polystyrene or polypropylene, crosslinked polyethylene powder, crosslinked phenolic resin powder, crosslinked urea resin powder, crosslinked melamine resin powder, crosslinked polyester resin powder and crosslinked epoxy resin powder.
  • inorganic fillers are glass or silica beads, calcium carbonate, barium sulfate, talc, mica, glass or silica bubbles, zirconium silicate, iron oxides, glass fiber, asbestos, diatomaceous earth, dolomite, powdered metals, titanium oxides, pulp powder, kaoline, modified kaolin, hydrated kaolin metallic filers, ceramics and composites. Mixtures of organic and/or inorganic fillers can be used.
  • preferred fillers are micro crystalline silica, crystalline silica, amorphous silica, alkali alumino silicate, feldspar, woolastonite, alumina, aluminum hydroxide, glass powder, alumina trihydrate, surface treated alumina trihydrate, alumina silicate.
  • the most preferred filler materials are inorganic fillers, such as Imsil, Novasite, mica, amorphous silica, feldspar, and alumina trihydrate.
  • Mica as a filler is very attractive because it shows low tendency to settle out from the photocurable compositions. It has transparency to UV light, low tendency to refract or reflect incident light and it provides good dimensional stability and heat resistance.
  • the filler to be used for the resin composition for stereolithography according to the present invention must satisfy requirements that it hinders neither cationic nor radical polymerizations and the filled SL composition has a relatively low viscosity suitable for the stereolithography process.
  • These fillers may be used alone or as a mixture of two or more of them depending upon the desired performance.
  • the fillers used in the present invention may be neutral acidic or basic.
  • the filler particle size may vary depending on the application and the desired resin characteristics. It may vary between 50 nanometers and 50 micrometers.
  • the filler material can optionally be surfaced treated with various compounds-coupling agents.
  • compounds-coupling agents include methacryloxy propyl trimethoxy silane, beta-(3,4-epoxycyclohexyl)ethyl trimethoxy silane, gamma-glycidoxy propyl trimethoxy silane and methyl triethoxy silane.
  • the most preferred coupling agents are commercially available from Osi Chemicals Corp. and other chemical suppliers.
  • novel compositions can be prepared in a known manner by, for example, premixing individual components and then mixing these premixes, or by mixing all of the components using customary devices, such as stirred vessels, in the absence of light and, if desired, at slightly elevated temperature.
  • novel compositions can be polymerized by irradiation with actinic light, for example by means of electron beams, X-rays, UV or VIS light, preferably with radiation in the wavelength range of 280-650 nm.
  • actinic light for example by means of electron beams, X-rays, UV or VIS light, preferably with radiation in the wavelength range of 280-650 nm.
  • laser beams of HeCd, argon or nitrogen and also metal vapor and NdYAG lasers are particularly suitable.
  • This invention is extended throughout the various types of lasers existing or under development that are to be used for the stereolithography process, e.g. solid state, argon ion, helium cadmium lasers, etc.
  • the person skilled in the art is aware that it is necessary, for each chosen light source, to select the appropriate photoinitiator and, if appropriate, to carry out sensitization.
  • the depth of penetration of the radiation into the composition to be polymerized and also the operating rate, are directly proportional to the absorption coefficient and to the concentration of the photoinitiator.
  • those photoinitiators which give rise to the highest number of forming free radicals or cationic particles and which enable the greatest depth of penetration of the radiation into the compositions which are to be polymerized.
  • the invention additionally relates to a method of producing a cured product, in which compositions as described above are treated with actinic radiation.
  • the novel compositions as adhesives, as coating compositions, as photoresists, for example as solder resists, or for rapid prototyping, but especially for stereolithography.
  • the novel mixtures are employed as coating compositions, the resulting coatings on wood, paper, metal, ceramic or other surfaces are clear and hard.
  • the coating thickness may vary greatly and can for instance be from 0.01 mm to 1 mm.
  • Using the novel mixtures it is possible to produce relief images for printed circuits or printing plates directly by irradiation of the mixtures, for example by means of a computer-controlled laser beam of appropriate wavelength or employing a photomask and an appropriate light source.
  • One specific embodiment of the abovementioned method is a process for the stereolithographic production of a three-dimensional shaped article, in which the article is built up from a novel composition with the aid of a repeating, alternating sequence of steps (a) and (b); in step (a), a layer of the composition, one boundary of which is the surface of the composition, is cured with the aid of appropriate radiation within a surface region which corresponds to the desired cross-sectional area of the three-dimensional article to be formed, at the height of this layer, and in step (b) the freshly cured layer is covered with a new layer of the liquid, radiation-curable composition, this sequence of steps (a) and (b) being repeated until an article having the desired shape is formed.
  • the radiation source used is preferably a laser beam, which with particular preference is computer-controlled.
  • liquid in this application is to be equated with “liquid at room temperature” in the absence of any statement to the contrary, room temperature being understood as being, in general, a temperature between 5° and 45°C, preferably between 15° and 30°C.
  • Base Resin SL 5210 available from Ciba Specialty Chemicals Corporation, Los Angeles, California is a mixture of a multifunctional epoxy resin, vinyl ether-based resin and a mixture of polyacrylate components.
  • Cationic reactive modifier is Heloxy 84, a triglycidylether of glycerol having chain extension segments comprising 8 isopropoxy linkages.
  • Heloxy 84 is a commercial product of Shell Corp., Houston, TX.
  • the polyaryletherpolyol reactive modifier, PEPO is a copolymer or homopolymer of Bisphenol A with epichlorohydrin. It is a commercial product under the tradename Paphen PKHM- 85X of Phenoxy Specialties Corp., NC. It is believed to be a mixture of a solid polyether-polyol Paphen with a liquid commercial polyol based on information provided by the manufacturer.
  • the formulations indicated in the examples are prepared by mixing the components, with a stirrer at between 20 and 80°C depending on the viscosity of the various components until a homogeneous composition is obtained. Most compositions are mixed at a room temperature of 25 to 30°C.
  • the physical data relating to the formulations are obtained as follows:
  • the mechanical properties of the formulations are determined on three-dimensional specimens produced with the aid of an He/Cd laser.
  • the window panes (for measuring photospeed), dogbone and Izod impact specimens were built in a 3D Systems SL 250/30 sterelithography machine using a helium cadium laser emitting at 325 nm.
  • To measure the elongation at break four dogbones 12 centimeters long were built.
  • the impact resistance bars had a thickness of 0.15 inches (0.38 centimetres) and were notched in an automatic notcher machine.
  • the dogbone and Izod impact bars were postcured with ultraviolet energy for 90 minutes in a conventional UV postcuring apparatus.
  • the photosensitivity of the formulations is determined on so-called window panes.
  • window panes single-layer test specimens are produced using different laser energies, and the layer thicknesses obtained are measured.
  • the plotting of the resulting layer thickness on a graph against the logarithm of the irradiation energy used gives a "working curve".
  • the slope of this curve is termed Dp (given in mm or mils).
  • Ec The energy value at which the curve passes through the x-axis is termed Ec (and is the energy at which gelling of the material still just takes place; cf. P. Jacobs, Rapid Prototyping and Manufacturing, Soc. of Manufacturing Engineers, 1992, p. 270 ff. ).
  • Liquid composition 1 comprises 100% the Base Resin.
  • Liquid compositions 2 and 3 are prepared by mixing 17% of Heloxy 84 or Paphen 85X, respectively, with 83% Base Resin, and stirring the mixture at 45°C for 3 hours. Afterwards, all three liquid compositions were evaluated in a stereolithography machine SL 250/30 using a helium cadmium laser. The experimental data is shown in Table 1. TABLE 1. Resin No. Dp, mils ( ⁇ m) Ec (mJ/cm 2 ) Elongation at Break, % Izod Impact Resistance ft.lb/in (J/m) 1. Base Resin 5.43 (138) 7.80 1.20 0.35(18.7) 2. RCM 6.14 (156) 6.53 8.5 0.65 (34.7) 3. PEPO 5.88 (149) 5.56 18 0.84 (44.8)
  • Resin No.2 comprising the cationic reactive modifier shows over seven times improvement in elongation at break compared to the selected Base Resin No.1. Furthermore, the Izod impact resistance has been improved by 85% relative to the Base Resin. Similarly, Resin No. 3 comprising PEPO shows 15 times improvement in elongation at break relative to the Base Resin, and 140% improvement in Izod impact resistance.
  • the increase in elongation and impact resistance by using the aforementioned reactive modifiers does not come at the expense of a reduced photospeed, which is the usual result of the addition of conventional flexibilizers. On the contrary, the photospeed increased, as well. Table 1 shows that the Dp values of Resins No.

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Claims (19)

  1. Flüssige, strahlungshärtbare Zusammensetzung zur Herstellung von dreidimensionalen Formkörpern, die Folgendes umfasst, in Gew.-%, bezogen auf das Gewicht der Zusammensetzung:
    a) 20 bis 90 Gew.-% durch aktinische Strahlung härtbare und kationisch polymerisierbare organische Verbindungen;
    b) 0,05 bis 12 Gew.-% eines kationischen Initiators;
    c) 0,5 bis 60 Gew.-% eines kationischen reaktiven Modifikators, der durch die Formel
    Figure imgb0028
     dargestellt wird, oder wenigstens einer Polyetherpolyolkomponente mit einem Molekulargewicht von größer oder gleich 4000; oder Gemischen davon;
    d) 0 bis 10 Gew.-% eines radikalischen Photoinitiators;
    e) 0 bis 40 Gew.-% einer radikalisch härtbaren Komponente, die wenigstens ein Mono- oder Poly(meth)acrylat enthält;
    f) 0 bis 30 Gew.-% eines Polyols, das von der Polyetherpolyolkomponente verschieden ist; und
    g) 0 bis 10 Gew.-% übliche Additive.
  2. Zusammensetzung gemäß Anspruch 1, wobei die durch aktinische Strahlung härtbare und kationisch polymerisierbare organische Substanz 10 bis 80 Gew.-% wenigstens eines festen oder flüssigen cycloaliphatischen Polyepoxids mit wenigstens zwei Epoxygruppen und einem Epoxy-Äquivalentgewicht zwischen 70 und 350 g/Äq oder Gemische davon umfasst.
  3. Zusammensetzung gemäß Anspruch 1, wobei die durch aktinische Strahlung härtbare und kationisch polymerisierbare organische Substanz 3 bis 70 Gew.-% wenigstens eines festen oder flüssigen Polyglycidylethers eines aliphatischen, alicyclischen oder aromatischen Alkohols oder einer mehrbasigen Säure, Epoxykresolnovolak, Epoxyphenolnovolak, Spiroorthoesterverbindungen, Oxetanverbindungen, die wenigstens zwei kationisch reaktive Gruppen pro Molekül aufweisen, oder von Gemischen davon umfasst.
  4. Zusammensetzung gemäß Anspruch 1, wobei die durch aktinische Strahlung härtbare und kationisch polymerisierbare organische Substanz 0,5 bis 40 Gew.-% wenigstens eines festen oder flüssigen Vinylethers mit wenigstens zwei Vinylethergruppen oder wenigstens eines hydroxyfunktionalisierten Vinylethers umfasst.
  5. Zusammensetzung gemäß Anspruch 1, wobei die Zusammensetzung 3 bis 40 Gew.-% einer radikalisch härtbaren Komponente enthält, die wenigstens ein Mono- oder Poly(meth)acrylat enthält.
  6. Zusammensetzung gemäß Anspruch 1, wobei die Polyetherpolyolkomponente die folgende Formel hat:

            [-O-A-O-R1-]m,

    wobei m einen Wert annimmt, so dass das Molekulargewicht des Polyetherpolyols größer oder gleich 4000 ist, A ein para-, meta- oder orthosubstituierter aromatischer Diolrest ist, der ausgewählt ist aus Bisphenol A, Bisphenol F, p-, m-, o-Biphenyl, p-, m-, o-Hydrochinon, das mit aliphatischen oder aromatischen Substituenten substituiert ist, die (un)gesättigte C1-C5-Alkylgruppen, Ether- oder Estergruppen aufweisen; para-, meta- und orthosubstituierten aromatischen Strukturen der folgenden Struktur:
    Figure imgb0029
     wobei R2 wenigstens eine der Gruppen -O-, -SO2- -CO-, -COO-, -OCH2-, -CH2-, (CH3)2C< und ein aliphatisches oder aromatisches Kettenverlängerungssegment mit 1 bis 100 C1-C4-Repetiereinheiten aus gesättigten und/oder ungesättigten Alkyl-, Alkoxy-, Aryloxy-, Ethoxy-, Propoxy-, Isopropoxy, Oxytetramethylen-, aliphatischen oder aromatischen Ester-, Siloxan- und Carbonatverknüpfungen ist;
    R1 = CH2CH(OH)(CR3R4)n- ist,
    wobei n größer oder gleich 1 ist, R3 und R4 unabhängig voneinander -H, -CH3, -CH2CH3, gesättigte oder ungesättigte lineare oder verzweigte C1-C20-Alkylgruppen, ein aliphatisches oder alicyclisches oder aromatisches Segment, das aromatische Ether-, aliphatische Ether-, Ethoxy-, Propoxy-, Isopropoxy-, Oxytetramethylen-, aliphatische oder aromatische Ester-, Siloxan- oder Carbonatverknüpfungen enthält, sind;
    A ein linearer oder verzweigter aliphatischer oder substituierter alicyclischer Diol- oder unsubstituierter alicyclischer Diolrest ist, der gesättigte oder ungesättigte C1-C20-Alkylgruppen, Ether-, Ethoxy-, Propoxy-, Isopropoxy-, Oxytetramethylen-, Ester-, Sulfon-, Sulfoxid-, Siloxan- und Carbonatverknüpfungen trägt.
  7. Zusammensetzung gemäß Anspruch 8, wobei es sich bei A um ein aliphatisches oder substituiertes alicyclisches Diol oder unsubstituiertes alicyclisches Diol, Cyclohexandimethanol, hydriertes Bisphenol A und hydriertes Bisphenol F handelt.
  8. Zusammensetzung gemäß Anspruch 6, wobei A ein aromatischer Diolrest ist, der aus Bisphenol A, Bisphenol F, Hydrochinon, Bisphenol, aromatischen Diolen, die ein flexibles Segment zwischen den aromatischen Ringen tragen, ausgewählt ist und R1 = -CH2CH(OH)CH2- ist.
  9. Zusammensetzung gemäß Anspruch 8, wobei A ein aromatischer Diolrest ist, der aus Bisphenol A ausgewählt ist, R1 = -CH2CH(OH)CH2- ist und m größer als 15 ist.
  10. Zusammensetzung gemäß Anspruch 9, wobei die Zusammensetzung den reaktiven Polyetherpolyol-Modifikator in einem Anteil von 1 bis 45 Gew.-% umfasst.
  11. Zusammensetzung gemäß Anspruch 6, wobei der reaktive Modifikator in Form einer festen oder flüssigen Polyetherpolyolkomponente in wenigstens einem flüssigen oder festen Diol oder Polyol, das aromatische Ringe oder Polyesterverknüpfungen oder Polyetherverknüpfungen enthält oder das ein Derivat von aliphatischen, alicyclischen oder aromatischen mehrwertigen Alkoholen ist, gemischt, dispergiert, verdünnt oder gelöst wird.
  12. Zusammensetzung gemäß Anspruch 6, wobei A ein aliphatisches Polyol ist und die Polyetherpolyolkomponente ein festes oder flüssiges aliphatisches Polyetherpolyol ist.
  13. Zusammensetzung gemäß Anspruch 1, wobei die kationisch polymerisierbare organische Komponente ein Gemisch ist, das wenigstens eine Polyglycidylverbindung oder ein cycloaliphatisches Polyepoxid oder einen aromatischen Ring, Epoxykresolnovolak oder Epoxyphenolnovolak enthaltenden Polyglycidylverbindung mit durchschnittlich wenigstens zwei Epoxygruppen pro Molekül und wenigstens ein Harz auf Vinyletherbasis umfasst.
  14. Zusammensetzung gemäß Anspruch 1, wobei die Zusammensetzung weiterhin 0 bis 30 Gew.-% einer flüssigen oder festen Polyhydroxyverbindung umfasst.
  15. Zusammensetzung gemäß Anspruch 14, wobei die Polyhydroxyverbindung Folgendes umfasst: Substanzen, die aromatische Kohlenstoffringe in ihren Molekülen haben, oder phenolische Verbindungen, die wenigstens zwei Hydroxygruppen aufweisen, oder phenolische Verbindungen, die wenigstens zwei Hydroxygruppen, die mit Ethylenoxid, Propylenoxid oder mit Ethylenoxid und Propylenoxid umgesetzt sind, aufweisen, oder Hydroxyverbindungen, die wenigstens eine Hydroxygruppe und wenigstens eine Epoxidgruppe aufweisen.
  16. Zusammensetzung gemäß Anspruch 14, wobei die Polyhydroxyverbindung aliphatische, alicyclische oder substituierte alicyclische Gruppen enthält.
  17. Zusammensetzung gemäß Anspruch 14, wobei die Polyhydroxyverbindung ein Derivat von aliphatischen oder alicyclischen oder aromatischen mehrwertigen Alkoholen ist, das Polyester-, Polyether-, Polysiloxan- und/oder Polykohlenwasserstoff-Verknüpfungen trägt.
  18. Zusammensetzung gemäß Anspruch 1, wobei das wenigstens eine polyfunktionelle (Meth)acrylat im Durchschnitt zwischen 2 bis 7 Acrylatgruppen aufweist.
  19. Verfahren zur Herstellung von dreidimensionalen Formkörpern, umfassend:
    a) Behandeln einer strahlungshärtbaren Zusammensetzung gemäß den Ansprüchen 1 bis 18 mit aktinischer Strahlung unter Bildung einer wenigstens teilweise gehärteten Schicht auf der Oberfläche der Zusammensetzung innerhalb eines Oberflächenbereichs, der einer gewünschten Querschnittsfläche des zu bildenden dreidimensionalen Formteils entspricht;
    b) Bedecken der in Schritt (a) hergestellten wenigstens teilweise gehärteten Schicht mit einer neuen Schicht aus der strahlungshärtbaren Zusammensetzung; und
    c) Wiederholen der Schritte (a) und (b), bis ein Formteil mit der gewünschten Form entstanden ist; und gegebenenfalls
    d) Nachhärten des resultierenden Formteils.
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HK1032635A1 (en) 2001-07-27
CN1296577A (zh) 2001-05-23
US6136497A (en) 2000-10-24
EP1080392A1 (de) 2001-03-07
BR9909270A (pt) 2000-11-21
CN1191498C (zh) 2005-03-02
WO1999050711A1 (en) 1999-10-07
IL138301A0 (en) 2001-10-31
DE69938966D1 (de) 2008-08-07
TWI221850B (en) 2004-10-11
US20020177073A1 (en) 2002-11-28
CA2326128C (en) 2008-07-15
KR20010042325A (ko) 2001-05-25
ATE399335T1 (de) 2008-07-15
AU3518699A (en) 1999-10-18
CA2326128A1 (en) 1999-10-07
US6413697B1 (en) 2002-07-02
TR200002776T2 (tr) 2001-02-21
JP2002509982A (ja) 2002-04-02
JP4798845B2 (ja) 2011-10-19
KR100653732B1 (ko) 2006-12-05

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