EP1078451A1 - Composant electronique - Google Patents

Composant electronique

Info

Publication number
EP1078451A1
EP1078451A1 EP99920557A EP99920557A EP1078451A1 EP 1078451 A1 EP1078451 A1 EP 1078451A1 EP 99920557 A EP99920557 A EP 99920557A EP 99920557 A EP99920557 A EP 99920557A EP 1078451 A1 EP1078451 A1 EP 1078451A1
Authority
EP
European Patent Office
Prior art keywords
chip
base plate
frame
film
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99920557A
Other languages
German (de)
English (en)
Inventor
Alois Stelzl
Hans Krüger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of EP1078451A1 publication Critical patent/EP1078451A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1078—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a foil covering the non-active sides of the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material

Definitions

  • Electronic component in particular SAW component working with surface acoustic waves, and method for producing this component.
  • the present invention relates to an electronic component, in particular an SAW component working with surface acoustic waves, with a chip with a piezoelectric substrate, with electrically conductive structures arranged on the chip - interdigital transducers, connecting tracks and the like - with a base plate with external ones , with the electrically conductive structures of the chip contacted connection elements and with the hermetically sealed frame arranged on the base plate, within which the chip is arranged at a distance from the frame.
  • the invention further relates to a method for producing this component.
  • the present invention has set itself the task of creating a further miniaturized SAW component of the type mentioned and a less complex method for its production, while reducing the manufacturing costs.
  • the invention proposes in an electronic component of the type mentioned at the outset that the space between the chip and the base plate is covered with a film, e.g. Plastic film, tightly enclosed is that the space between the frame and film with the film or with potting compound, e.g. Epoxy resin is filled and that the chip together with potting compound and frame by a coating of galvanic material, e.g. a CuNi alloy, the edge area of which rests tightly on the base plate.
  • a film e.g. Plastic film
  • potting compound e.g. Epoxy resin
  • the relevant method for this suggests that the chip - except for the side surface facing the base plate - is encapsulated with a film which is pulled down at least to the base plate, that the space between the frame and the film is filled with sealing compound, that the film in its potting-free surface areas, e.g. is removed by means of plasma etching and that a coating of galvanic material is applied to the chip together with the potting compound.
  • Dispensing with the protective film contributes to a considerable reduction in costs and to a reduction in the dimensions of the components.
  • this 3 element due to its increased reliability, since when it is soldered onto the base plate, which is done using flip-chip technology, there is no risk that the solder balls or bumps, which are liquid in this state, can flow into free spaces or gaps as they do occur when the component is underfilled with potting compound, for example epoxy resin. This danger also does not exist when the component is soldered into the customer's circuit.
  • Figures 1 to 3 show a partially sectioned and schematic representation of the manufacture of a component according to the invention.
  • a support plate in particular ceramic plate, which can be separated into base plates 3, is provided, which, lined up on the support plate, carries self-contained frames 4, so-called solder frames, within which chips are spaced apart from the frames 2 are soldered in flip-chip technology with their electrically conductive structures to corresponding conductor tracks of the base plate.
  • the chips 2 soldered in this way except for the side surface facing the base plate 3 — are encapsulated with a plastic film 5 or metal or composite film that is pulled down at least to the base plate 3.
  • the film 5 is preferably guided in the space between the solder frame 4 and the chip 2 over the entire surface of the base plate 3 and solder frame 4. Possible, if advantageous in terms of production technology, the film 5 can also completely envelop the solder frame 4 and rest with its ends on the base plate 3.
  • the space between the solder frame 4 and the film 5 is, if necessary, with 4
  • Figures 1 to 3 show the individual manufacturing steps using only one OFB component.
  • the production provides base plates (panels) of relatively large area with a multiplicity of chips which are arranged in rows and are each surrounded by frames, in particular solder frames.

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Wire Bonding (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

L'invention concerne un composant à ondes superficielles ainsi que son procédé de fabrication, ledit composant comprenant une puce (2) présentant un substrat piézoélectrique, des structures électroniquement conductrices agencées sur la puce (convertisseurs IDT, pistes de connexion et analogues), des éléments de connexion externes en contact avec les structures électriquement conductrices de la puce, et un cadre étanche (4), agencé hermétiquement sur la plaque de base, à l'intérieur duquel la puce est logée, à distance de ce cadre. L'invention est caractérisée en ce que l'espace entre la puce (2) et la plaque de base (3) est entouré de façon étanche par une feuille (5), l'espace entre le cadre (4) et la feuille (5) est rempli d'une masse de scellement (6), et la puce (2) ainsi que la masse de scellement (6) et le cadre (4) sont protégés par un revêtement (7) ou une coiffe de protection en une matière galvanique s'appliquant hermétiquement, par sa bordure (8), sur la plaque de base (3).
EP99920557A 1998-04-27 1999-03-25 Composant electronique Withdrawn EP1078451A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19818824A DE19818824B4 (de) 1998-04-27 1998-04-27 Elektronisches Bauelement und Verfahren zu dessen Herstellung
DE19818824 1998-04-27
PCT/DE1999/000895 WO1999056390A1 (fr) 1998-04-27 1999-03-25 Composant electronique

Publications (1)

Publication Number Publication Date
EP1078451A1 true EP1078451A1 (fr) 2001-02-28

Family

ID=7865960

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99920557A Withdrawn EP1078451A1 (fr) 1998-04-27 1999-03-25 Composant electronique

Country Status (8)

Country Link
US (1) US6519822B1 (fr)
EP (1) EP1078451A1 (fr)
JP (1) JP2002513234A (fr)
KR (1) KR20010042990A (fr)
CN (1) CN1127202C (fr)
CA (1) CA2330039A1 (fr)
DE (1) DE19818824B4 (fr)
WO (1) WO1999056390A1 (fr)

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JP3974346B2 (ja) * 2001-03-30 2007-09-12 富士通メディアデバイス株式会社 弾性表面波装置
US6930364B2 (en) * 2001-09-13 2005-08-16 Silicon Light Machines Corporation Microelectronic mechanical system and methods
DE10238523B4 (de) * 2002-08-22 2014-10-02 Epcos Ag Verkapseltes elektronisches Bauelement und Verfahren zur Herstellung
US6846423B1 (en) 2002-08-28 2005-01-25 Silicon Light Machines Corporation Wafer-level seal for non-silicon-based devices
US6877209B1 (en) 2002-08-28 2005-04-12 Silicon Light Machines, Inc. Method for sealing an active area of a surface acoustic wave device on a wafer
DE10329329B4 (de) * 2003-06-30 2005-08-18 Siemens Ag Hochfrequenz-Gehäuse und Verfahren zu seiner Herstellung
WO2005099088A1 (fr) * 2004-03-26 2005-10-20 Cypress Semiconductor Corp. Circuit integre comprenant un ou plusieurs dispositifs conducteurs formes sur un dispositif saw et/ou mems
DE102004020204A1 (de) 2004-04-22 2005-11-10 Epcos Ag Verkapseltes elektrisches Bauelement und Verfahren zur Herstellung
JP3998658B2 (ja) 2004-04-28 2007-10-31 富士通メディアデバイス株式会社 弾性波デバイスおよびパッケージ基板
US7608789B2 (en) * 2004-08-12 2009-10-27 Epcos Ag Component arrangement provided with a carrier substrate
DE102005008514B4 (de) * 2005-02-24 2019-05-16 Tdk Corporation Mikrofonmembran und Mikrofon mit der Mikrofonmembran
DE102005008512B4 (de) 2005-02-24 2016-06-23 Epcos Ag Elektrisches Modul mit einem MEMS-Mikrofon
DE102005008511B4 (de) * 2005-02-24 2019-09-12 Tdk Corporation MEMS-Mikrofon
DE102005053765B4 (de) * 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
DE102005053767B4 (de) * 2005-11-10 2014-10-30 Epcos Ag MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau
US20070251719A1 (en) * 2006-04-27 2007-11-01 Rick Sturdivant Selective, hermetically sealed microwave package apparatus and methods
DE102009053965B4 (de) * 2009-11-19 2016-06-02 Siemens Aktiengesellschaft Mit einer Vergussmasse vergossene Gradientenspule
DE102010022523B4 (de) 2010-06-02 2017-09-14 Siemens Healthcare Gmbh Gradientenspule mit in einer Vergussmasse vergossenen Spulenwicklungen
JP6116120B2 (ja) 2012-01-24 2017-04-19 太陽誘電株式会社 弾性波デバイス及び弾性波デバイスの製造方法
DE102013106353B4 (de) * 2013-06-18 2018-06-28 Tdk Corporation Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement
CN103928409B (zh) * 2014-03-17 2017-01-04 江苏省宜兴电子器件总厂 一种集成电路倒扣焊气密性封装结构
WO2020148381A1 (fr) * 2019-01-18 2020-07-23 Trinamix Gmbh Capteur optique et détecteur servant à une détection optique

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Also Published As

Publication number Publication date
KR20010042990A (ko) 2001-05-25
DE19818824B4 (de) 2008-07-31
CN1127202C (zh) 2003-11-05
JP2002513234A (ja) 2002-05-08
US6519822B1 (en) 2003-02-18
WO1999056390A1 (fr) 1999-11-04
DE19818824A1 (de) 1999-11-04
CN1298571A (zh) 2001-06-06
CA2330039A1 (fr) 1999-11-04

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