EP0993024B1 - Electrostatic chuck - Google Patents

Electrostatic chuck

Info

Publication number
EP0993024B1
EP0993024B1 EP99307620.7A EP99307620A EP0993024B1 EP 0993024 B1 EP0993024 B1 EP 0993024B1 EP 99307620 A EP99307620 A EP 99307620A EP 0993024 B1 EP0993024 B1 EP 0993024B1
Authority
EP
European Patent Office
Prior art keywords
substrate
embossed portions
zone
electrode
electrostatic chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP99307620.7A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0993024A2 (en
EP0993024A3 (en
Inventor
Shinji Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of EP0993024A2 publication Critical patent/EP0993024A2/en
Publication of EP0993024A3 publication Critical patent/EP0993024A3/en
Application granted granted Critical
Publication of EP0993024B1 publication Critical patent/EP0993024B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means

Definitions

  • the present invention relates to an electrostatic chuck, and particularly to an electrostatic chuck favorably usable for holding a wafer in a semiconductor-producing apparatus.
  • electrostatic chucks are used for attracting and holding semiconductor wafers in finely working, e.g., transferring, exposing, film-forming by CVD, washing, etching, and ding the semiconductor wafers.
  • a discoid positive electrode 2 and a discoid negative electrode 3 are buried in a substrate 1 made of a ceramic material or the like as shown in Figs. 1 and 2 , and an object 7 to be treated, such as a semiconductor wafer, is attracted onto a main plane 1A of the substrate 1 through an electric field generated by applying a given voltage between the electrodes from a DC power source 6.
  • Fig. 2 is a plane view of the electrostatic chuck of Fig. 1 as viewed from an upper side. In Fig. 2 , the object 7 is omitted for facilitating the explanation.
  • the electrostatic chuck with such a construction has a relatively large electrode gap 8 between the positive and negative electrodes 2 and 3, the electric field generated there is not enough with the result that attracting force for the object 7 to be treated is not sufficient near the gap 8 between the electrodes. For this reason, the object 7 does not fully contact the main plane 1A of the substrate 1 at the gap between the electrodes, so that heat is not fully conducted to the object 7 from the substrate and consequently the entire object 7 cannot be uniformly heated.
  • EP-A-831 526 discloses an electrostatic chuck having an winer electrode and a ring electrode, a seris g raised portions being formed at the upper surface of the chuck.
  • Fig. 3 is a plane view of an electrostatic chuck which is outside the scope of the present invention.
  • Fig. 3 gives an outward appearance of the electrostatic chuck as viewed from the upper side as in Fig. 2 .
  • an object to be treated is omitted, too.
  • an inner electrode 12 and an outer electrode 13 are concentrically arranged in a substrate 11, and positive and negative potentials are to be applied to the inner and outer electrode, respectively, or vice versa, so that an electric field, i.e., an attracting force, can be uniformly formed as viewed in a circumferential direction.
  • a plurality of embossed portions 14 are formed on a main plane 11A of a substrate, a projecting portion 15 is formed of the same material as that of said plurality of the embossed portions on an entire outer peripheral portion on the main plane 11A of the substrate 11, a sum of a total area of upper surfaces 14B of the embossed portions 14 in a zone 18 of the substrate in which the outer electrode 13 is located and an area of an upper surface 15A of said projecting portion 15 in a zone of the substrate in which the outer electrode is located (this zone being a zone of the substrate outwardly defined by a dotted line DL 2) is in a range from 0.7 to 1.3 of a total area of upper surfaces 14A of the embossed portions 14 in a zone of the substrate in which the inner electrode 12 is located (this zone being a zone 17 of the substrate internally defined by a dotted line DL 1), and an object to be treated is to be supported by said plurality of said embossed portions and the projecting portion. Therefore, the attracting force is exerte
  • a positively charged amount of the object to be treated is equal to a negatively charged amount thereof, so that they are offset with each other to prevent the object from being charged. Therefore, electric breakdown due to discharging between the object and a member near it can be prevented. Furthermore, since the object is in an intermediate potential for the applied positive and negative potentials, the attracting force between the object and one of the electrodes is equal to that between the object and the other.
  • the wording "the total area of upper surfaces of the embossed portions in a zone of the substrate in which the inner electrode is located" means the total area of the upper surfaces 14A of the embossed portions which exist inside the zone 17 in which the inner electrode 12 is located, in other words, this total area is a value obtained by subtracting the total area of the upper surfaces 14c of the embossed portions (See black parts of the upper surfaces of the embossed portions crossing the dotted line DL1) from the total area of the upper faces 14A of the embossed portions 14 overlapping with the zone 17.
  • the wording "the total area of upper surfaces of the embossed portions in a zone of the substrate in which the outer electrode is located” means the total area of the upper surfaces 14B of the embossed portions 14 which overlap the zone 18 in which the inner electrode 12 is located.
  • the term "upper surface of the embossed portion” used herein means a contact surface of the embossed portion between an object to be treated in the state that the object is placed on the electrostatic chuck. Since the object is generally a planar object such as a wafer, it is preferable that the upper surfaces of a plurality of the embossed portions and that of the projecting portion are substantially flat and in flush with one another. It is preferable that the embossed portion has a pillar shape, for example, a pillar shape with a polygonal section, a pillar shape with a round section or a pillar shape with an elliptical section.
  • an area of an upper surface of said projecting portion in a zone of the substrate in which the outer electrode is located means the area of the upper surface 15A of the projecting portion which overlaps with the zone 18 in which the outer electrode 13 is located, in other words, it means the area of the upper surface part 15B (See a network pattern surface portion) of the projecting portion outside the zone 18 in which the outer electrode is positioned from the area of the upper surface 15A of the projecting portion 15.
  • the sum between the total area of upper surfaces of the embossed portions in a zone of the main plane of the substrate in which the outer electrode is located and the area of the upper surface of the projecting portion in the zone of the substrate in which the outer electrode is located is in a range of 0.7 to 1.3.
  • the above means the following inequalities.
  • V I is a potential applied to the inner electrode
  • V W is a potential generated in the object placed on the electrostatic chuck for treatment
  • V O is a potential applied to the outer electrode.
  • An electrostatic chuck which is outside the scape of the present invention has a plane view as shown in Fig. 3(a) .
  • the area of the zone 17 of the substrate in which the inner electrode 12 is located is substantially in a range of 0.7 to 1.3 that of the zone 18 of the substrate in which the outer electrode 13 is located.
  • the density of the embossed portions on the main plane 11A of the substrate 11 in the zone 17 in which the inner electrode 12 is located is larger than that of the embossed portions on the main plane 11A of the substrate 11 in the zone 18 in which the outer electrode 13 is located.
  • the heal conductivity in the inner side can be made larger. For this reason, when a high frequency voltage is applied between the inner electrode 12 and the outer electrode 13, the outer side of the object can be prevented from being heated to a high temperature with the heat of plasma.
  • a negative potential is applied to the inner electrode 12, whereas a positive potential is applied to the outer electrode 13.
  • the inner electrode 12 and the outer electrode 13 only have to be concentrically formed so as to attain the objective of the present invention. Therefore, it may be that a positive potential is applied to the inner electrode 12, whereas a negative potential is applied to the outer electrode 13. If the negative and positive potentials are applied to the inner and outer electrodes 12, 13, respectively, the density of lines of the electric force can be increased, to more firmly attract the object to the substrate, although the reason has not been clarified.
  • the size of a gap between the electrodes is not particularly limited so long as the inner electrode 12 can be electrically insulated from the outer electrode. However, the electrodes are so arranged that the width D of the gap may be generally 2 to 10 mm.
  • the configuration of the embossed portions 14 is not particularly limited so long as the total areas of the upper surfaces 14 A and 14B satisfy the above-mentioned requirement. Any shape such as a cylindrical shape as well as a rectangular-section shape such as a parallelopiped shape may be employed so long as the upper faces of the embossed portions are flat.
  • each of the embossed portions 14 and the projection 15 is not particularly limited in size, and may be formed in an arbitrary depending up a use of the electrostatic chuck. If cylindrical embossed portions and an annular projecting portion are employed as shown in Fig. 3 , it is preferable that the diameter "r" of the embossed portion is 1 to 8 mm, and the thickness "d" of the annular projecting portion is 1 to 8 mm. The height of each of the embossed portions and the annular portion is preferably 5 to 50 ⁇ m.
  • the rate of the embossed portions 14 is 2 to 4/cm 2 in the concentric area 17 in which the inner electrode is located and 1 to 2/cm 2 in the concentric area 18 in which the outer electrode is located.
  • each of the total area of the upper surfaces 14A of the embossed portions 14 in the zone 17 of the substrate in which the inner electrode is located and the sum of the total area of upper surfaces 14B of the embossed portions in the zone of the substrate in which the outer electrode is located and the area of the upper surface 15A of said projecting portion 15 in the zone of the substrate in which the outer electrode is located is set at 20 to 200 cm 2 for the plane having the diameter of 200 mm so that the object to be treated can be firmly supported.
  • embossed portions 14 and the projecting portion 15 need to be formed of the same material.
  • the material is not particularly limited to any material, so long as the object can be uniformly supported.
  • AIN or Al 2 O 3 may be used as such a material.
  • the embossed portions 14 and the projecting portion 15 is formed on the main plane 11A of the substrate by blast working or CVD.
  • a known ceramic material usable in the electrostatic chucks such as AIN or Al 2 O 3 may be used.
  • a known metallic electrode material such as Mo or W may be used.
  • the substrate 11 may be produced by a known method, for example, by forming a molded body of a ceramic material particles in a given shape, placing the inner electrode 12 and the outer electrode 13 on the molded body, charging the ceramic particles on it, molding the particles, and firing the resulting assembly, thereby realizing a state in which the inner electrode 12 and the outer electrode 13 are buried in the fired body.
  • Fig. 4 shows a plane view showing an electrostatic chuck according to the present invention.
  • a zone 27 in which an inner electrode 22 is located i.e., the area of the inner electrode 22 is larger than a zone 28 where an outer electrode 23 is located, i.e., the area of the outer electrode 23, whereas the density of the embossed portions 24 on the zone 27 on the main plane 11A of the substrate 11 where the inner electrode 22 is located is equal to that of the embossed portions 24 on the main plane 11A of the substrate where the outer electrode 23 is located.
  • the contacting density between the electrostatic chuck and the object to be treated is uniform over the inner and outer portions, heat can be conducted from the electrostatic chuck to the object, so that the object can be uniformly heated.
  • the objective of the present invention can be realized so long as the requirements according to the present invention, such as that imposed upon the total area of the upper surfaces 24A of the embossed portions 24 in the zone where the inner electrode is located, are satisfied.
  • a negative potential and a positive potential are applied to the inner and outer electrodes 22 and 23, respectively.
  • this is not particularly restrictive, so long as these electrodes are concentrically arranged. That is, a positive potential and a negative potential may be applied to the inner and outer electrodes 22 and 23, respectively.
  • each of the embossed portions 24 and the projecting portion 25 the same size and the same shape as in Fig. 3 may be employed, and the embossed portions and the projecting portion may be formed, on a main plane 21A of a substrate 21, of the same material in the same manner as in Fig. 3 .
  • Fig. 5 shows a case where an inner electrode terminal 39 for an inner electrode is formed in an outer electrode 33 in an electrostatic chuck as shown in Fig. 3 .
  • This electrostatic chuck is outside the scope of the invention.
  • a voltage applying part such as a wire needs not be arranged near the center of the substrate, so that a positional limitation in attaching the device can be diminished. For example, this is effective, since the number of parts interrupting light is decreased in heating the electrostatic chuck with a lamp.
  • the objective of the present invention can be realized in a case where the outer electrode 33 is interrupted and discontinued in its circumferential direction by the provision of the inner electrode terminal 39, so long as the requirements according to the present invention are satisfied.
  • the other matters may be effected in the same manner as in Fig. 3 , including the materials usable for the embossed portions 34, etc. and their producing processes.
  • a back side gas may be introduced into a space between the embossed portions 14, the object to be treated, and the projecting portion 15 through a line (not shown) arranged at a rear surface of the electrostatic chuck.
  • a back side gas known He gas, Ar gas or the like may be used.
  • the back side gas is introduced into a central portion of the above space.
  • the back side gas is introduced, and simultaneously the object begins to be heated to actuate a film-forming process. Therefore, as the area of the substrate constituting the electrostatic chuck becomes relatively large, it need take a relatively long time for the back side gas to reach an edge portion of the space defined by the embossed portions, the projecting portion and the object to be treated. Owing to this, the temperature of the object to be treated may be non-uniform depending upon this non-uniformity of the back side gas immediately after the film-forming process is started, which causes variations in various film characteristics.
  • the total area of the upper surfaces of a plurality of the embossed portions in the zone where each of the inner and outer electrodes is located can be increased or decreased by varying the density of the embossed portions in the zone where the electrode is located or by varying the diameter of the embossed portions.
  • a molded body was formed by molding AIN ceramic powder to be used as a substrate 11 in a given shape, metallic electrodes made of Mo were placed on the molded body, the above ceramic powder was applied onto the resulting molded body and molded again to form a final molded body in which the metallic electrodes were buried, and then this molded body was sintered in a nitrogen atmosphere to produce a substrate in a diameter of 200 mm in which an inner electrode 12 and an outer electrode 13 were buried.
  • embossed portions 14 each having a diameter of 3 mm and a height of 20 were formed of AIN on the above substrate 11 at a ratio of 3 embossed portions /cm 2 in the zone 17 of the main plane 11A of the substrate 11 where the inner electrode 12 is located and at a ratio of 1/cm 3 in the zone 17 where the outer electrode 12 is locate.
  • a projecting portion 15 made of AIN was formed at an outer edge portion with a width of 2 mm.
  • Example 2 the same back side gas as in Example was charged in a space between the Si wafer and the substrate through a line not shown, the Si wafer was heated to 350°C as in Example by heating the substrate 1. Examination of the temperature distribution of the surface of the Si wafer in the same manner as in Example 1 revealed that the variation was ⁇ 10°C for the above 350°C.
  • the electrostatic chuck according to the present invention can uniformly attract the object to be treated, even if the gap between the electrodes is set at a relatively wide distance, and has extremely small variations in the temperature distribution at the surface of the object on heating it so that the object can be uniformly heated.
  • the electrostatic chuck according to the present invention can extremely uniformly attract the object to be treated and therefore can uniformly heat the object with small variations in the temperature distribution of the surface of the object.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Manipulator (AREA)
EP99307620.7A 1998-09-29 1999-09-28 Electrostatic chuck Expired - Lifetime EP0993024B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP27450698 1998-09-29
JP27450698A JP3983387B2 (ja) 1998-09-29 1998-09-29 静電チャック

Publications (3)

Publication Number Publication Date
EP0993024A2 EP0993024A2 (en) 2000-04-12
EP0993024A3 EP0993024A3 (en) 2002-07-17
EP0993024B1 true EP0993024B1 (en) 2013-08-07

Family

ID=17542655

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99307620.7A Expired - Lifetime EP0993024B1 (en) 1998-09-29 1999-09-28 Electrostatic chuck

Country Status (5)

Country Link
US (1) US6370004B1 (ja)
EP (1) EP0993024B1 (ja)
JP (1) JP3983387B2 (ja)
KR (1) KR100369871B1 (ja)
TW (1) TW577861B (ja)

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JP3983387B2 (ja) 2007-09-26
US20020027762A1 (en) 2002-03-07
KR20000023474A (ko) 2000-04-25
EP0993024A2 (en) 2000-04-12
EP0993024A3 (en) 2002-07-17
US6370004B1 (en) 2002-04-09
JP2000106392A (ja) 2000-04-11
KR100369871B1 (ko) 2003-01-29
TW577861B (en) 2004-03-01

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