EP0951692A1 - Element support pour une puce de semi-conducteur a inserer dans une carte a puce - Google Patents

Element support pour une puce de semi-conducteur a inserer dans une carte a puce

Info

Publication number
EP0951692A1
EP0951692A1 EP98956777A EP98956777A EP0951692A1 EP 0951692 A1 EP0951692 A1 EP 0951692A1 EP 98956777 A EP98956777 A EP 98956777A EP 98956777 A EP98956777 A EP 98956777A EP 0951692 A1 EP0951692 A1 EP 0951692A1
Authority
EP
European Patent Office
Prior art keywords
connections
carrier element
element according
semiconductor chip
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP98956777A
Other languages
German (de)
English (en)
Inventor
Frank PÜSCHNER
Jürgen Fischer
Josef Heitzer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP0951692A1 publication Critical patent/EP0951692A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
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Definitions

  • the invention relates to a carrier element for a semiconductor chip with at least two connections, in particular for installation in chip cards, the element having a wrapping compound that surrounds and protects the semiconductor chip, the connections are made of conductive material and have a reduced thickness at the mutually facing ends , the cross section having only one step.
  • the semiconductor chip is arranged in the region of this section of reduced thickness on the connections and is mechanically connected to them.
  • Such a support element is known from JP 08-116016 A from Patent Abstracts of Japan.
  • this known carrier element is not suitable for installing m chip cards, since it is provided on both sides with encapsulation compound and the connections are not accessible in a suitable manner.
  • No. 5,134,773 discloses a carrier element with contact surfaces made of conductive material in the form of a so-called leed frame, in which the semiconductor chip is glued to a centrally arranged chip island and is electrically connected to peripherally arranged contact surfaces by means of bonding wires.
  • the semiconductor chip is surrounded by a sheathing compound protecting it and the bond wires, which also holds the contact areas in position. Since the contact surfaces must be freely accessible from the side facing away from the chip, the wrapping aces are only present on one side.
  • the contact surfaces on the side facing away from the chip have undercuts in the area of the slots which are electrically insulating from one another. fertilize, which are filled in by the encapsulation and create a kind of riveted connection.
  • the carrier element described in US Pat. No. 5,134,773 is designed for so-called contact-type chip cards, that is to say it has contact surfaces lying on a surface of the chip card and accessible from outside for a reading device, but it is readily possible and also known to provide only two connections. which can be electrically connected to a coil arranged on the card or on a card layer.
  • connections in Zan. and design to provide such that they are equally suitable for both a connection to a coil or antenna and a reader.
  • a typical structure for a chip card for contactless use is composed as follows:
  • the coil support film has a thickness of approximately 200 ⁇ m
  • the two core films each have a thickness of approximately 100 ⁇ m
  • two printing films on each side have a thickness of approximately 150 ⁇ m
  • two scratch-proof films a thickness of about 50 ⁇ m each. Together, this results in a thickness of approximately 800 ⁇ m in accordance with ISO standard 7816. This results in a necessary support element phone of less than 400 ⁇ m as well as a possible expansion in the card level.
  • the object of the invention is to provide a support element that has a low height and an improved bruising behavior and is easy to produce.
  • connections which are part of a holder frame, a so-called lead frame, during the assembly of the semiconductor chip and the encapsulation of the chip and the connecting lines, have a section of reduced thickness such that the cross section has only one step on one side.
  • the section of reduced thickness is produced in accordance with the invention by embossing. A reduction in the thickness to 50 is necessary. In most cases, the nominal connection is sufficient.
  • a main surface of the connections is flat, while the opposite surface has a step.
  • the semiconductor chip is arranged in the region of this section. It can be arranged on the side of the step or on the opposite side.
  • the chip is expediently mounted with its active side oriented away from the connections if it is arranged on the step side of the connections. If it is located on the side opposite the step side, it is from
  • Chipmsel has not only the advantage ge ⁇ ringerer thickness of the carrier element but also a ⁇ en BES sere anchoring of Umhullungsmasse ⁇ en with terminals, since the Umhullungsmasse can enclose the Cnip from both sides and a good connection from the chip to the terminals is .
  • the chip capsule By eliminating the chip capsule, there are no longer any notch effects, so that better breaking strength properties result.
  • connection surfaces Due to the desired low height of the support element, one of the connection surfaces will be exposed and will be available for contacting.
  • a chip card especially a laminated one
  • connections can protrude beyond the dimensions of the enveloping mass and form contact tabs for antenna connections there.
  • This is advantageous for an assembly in which the antenna coil is applied to a carrier film.
  • the carrier film advantageously has a recess or recess in which the enveloping mass comes to lie, while the connections or, in this case, the contact tabs come to rest on the coil carrier film on the coil connections.
  • connection only in the area of the enveloping mass, which has the advantage that a carrier element of this type can also be retrofitted into an already laminated card which, however, has a cutout.
  • the ends of the antenna coil are expediently located in this recess in order to be able to be connected in a simple manner to the support element connections, for example by gluing or soldering or also by resilient connecting parts.
  • a support element that only has such contact surfaces instead of contact tabs projecting beyond the edge can also be applied directly to a coil support film.
  • the corresponding core film of the card laminate should have a recess.
  • the contact tabs can advantageously have a widened end in order to be able to be better connected to connections of wound coils.
  • connection lugs are bent again at right angles, preferably in the other direction, an even better anchoring results. This also creates additional contact surfaces that can be used for an alternative installation.
  • FIG. 1-6 different cross-sectional embodiments of a support element according to the invention
  • Figure 7 em carrier element with contact tabs for mounting on a coil carrier film
  • Figure 8 em carrier element with contact surfaces for mounting on a coil carrier film or directly in a chip card.
  • FIG. 1 shows a support element according to the invention in cross-section, as indicated in FIG. 7.
  • Two connections 1 are arranged along opposite edges of the carrier element. They serve on the one hand as an Au surface for a semiconductor chip 2 and on the other hand for contacting it from outside of the carrier element. For this purpose, they are connected to the semiconductor chip 2 via bonding wires 4.
  • the semiconductor 2 is mechanically connected to the connections 1 with an adhesive 3.
  • the semiconductor chip 2 and the bonding wires 4 are encapsulated or encapsulated with a coating compound 5.
  • the wrapping mass 5 advantageously has a light color which does not show through the layers of a chip card, as is the case with black masses which are usually available on the market.
  • connections 1 are advantageously arranged in the area of diagonal corners of the carrier element in order to serve a uniform and balanced base for the semiconductor chip 2 during the installation.
  • the connections 1 are included for the purpose of the installation a frame holding it, a so-called leadframe, is connected and is punched out of the chip after assembly and overmolding or casting.
  • only two connections 1 are provided, since these carrier elements are particularly suitable for contactless chip cards.
  • Umhullungsmasse 5 can envelop the ge ⁇ entire chip 2 and thus a better adhesion of the at ⁇ connections 1 cause the carrier element, since they are retained to a large extent by the adhesive joint 3, not only because of the adhesion forces between the encapsulation compound 5 and the connections 1.
  • connections 1 An even better anchoring of the connections 1 is achieved if they are angled, as shown in FIG. 2.
  • a first section 1c of the connections 1 is bent at an approximately right angle to the chip 2 hm.
  • a second gate l ⁇ can also be bent in the right direction m in the other direction. This creates a further contact surface that is accessible from the outside, so that such a support element is also suitable for so-called combination cards, since it can be connected to a coil from one side and can be contacted from the other side by a reading device.
  • more than two connections are required for this. It was enough, however, to turn only two.
  • the main aspect of the carrier element according to the invention can be seen in a section 1 a of the connections 1, which has a smaller thickness compared to the nominal thickness, but a step in cross section is only on one side of the connections 1.
  • the overall height of the carrier element can be reduced by approximately half the connection thickness if the semiconductor chip 2 is placed in the region of these sections with a smaller thickness 1 a. Since these sections 1 a can be kept small, the mechanical properties of the connections 1 are not impaired.
  • the semiconductor chip 2 is arranged on the side of the cross-sectional step of the connections 1, the active side of the semiconductor chip 2, that is to say the side that the Integrated circuits, oriented away from the connections 1.
  • FIGS. 3 and 4 show variants in which the semiconductor chip 2 is arranged on the side of the connections 1 opposite the cross-sectional step , the active side being oriented toward the connections 1 hm.
  • the bonding wires 4 are led erfmdungsgeseller manner to the sections of lesser thickness la, so that it must be provided by the loop height of the bonding wires, no additional height of the Tra ⁇ gerelements.
  • a further saving in height can be achieved if the chip back side is not provided with encapsulation compound 5, as shown in FIG. 4. This is possible because the active side of the semiconductor chip 2 is oriented towards the connections 1 nm.
  • FIGS. 5 and 6 show further assembly variants in which the semiconductor chip 2 m is connected to the connections 1 using the so-called flip-chip technology.
  • the connection pads of the chip 2 are connected directly to the connection sections with a smaller thickness la.
  • the lowest height has the carrier element according to FIG. 6, in which the semiconductor chip 2 m flip-chip technology is mounted in the region of the gates of reduced thickness 1 a and the back of the chip remains uncovered by encapsulation compound 5.
  • FIG. 7 shows a possible installation variant of a carrier element according to the invention, a carrier film 7 for an antenna coil 8.
  • the carrier element has connections 1 with contact tabs, that is to say connections 1, which protrude beyond the edge of the encapsulation compound 5.
  • the contact lugs have widened ends 1b in order to enable better contacting with the coil connections 10.
  • the encapsulation mass 5 m, a recess 9 of the carrier film 7 is inserted, the contact lugs 1 coming into contact with the coil connections 10 m.
  • This mounting variant enables a particularly planar installation of a support element in a laminated card.
  • FIG. 8 shows a variant in which the connections 1 are designed as contact surfaces (which cannot be seen in the figure since they lie on the underside of the carrier element).
  • the sections protruding beyond the edge of the encapsulation compound 5 have been removed, for example already during the punching out of the lead frame.
  • the support element is placed on the coil support film 7 and contacted with the coil connections 10.
  • the upper core film of the chip card lammate must have a cutout.
  • This embodiment of the carrier element can, however, also be retrofitted to an already laminated or cast card 11 which has a recess 12 for this purpose.
  • the coil connections 10 can be seen, which, due to this preferred position, allow simple contacting with the support element connections 1.
  • Chip card 11 enables a so-called combination card to be produced in a simple manner, which on the one hand has contact surfaces for contacting a reading device, which lie on a surface of the chip card 11 and on the other hand contains a coil 8.
  • a carrier element according to FIG. 2 is particularly suitable for this.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Credit Cards Or The Like (AREA)
  • Die Bonding (AREA)

Abstract

Elément support pour une puce de semi-conducteur (2) comprenant au moins deux connexions (1), destiné notamment à être inséré dans une carte à puce (11) présentant une matière d'enrobage (5) protégeant la puce de semi-conducteur (2). Les connexions (1) sont disposées sur l'une des surfaces principales de la matière d'enrobage (5), uniquement le long de deux bords opposés. Elles sont réalisées en un matériau conducteur et présentent, à leurs extrémités tournées l'une vers l'autre (1a), une épaisseur réduite, la section n'étant étagée que d'un seul côté. La puce de semi-conducteur (2) est disposée sur les connexions (1), dans la zone de cette section d'épaisseur (1a) réduite, et reliée mécaniquement à celles-ci.
EP98956777A 1997-10-15 1998-09-17 Element support pour une puce de semi-conducteur a inserer dans une carte a puce Withdrawn EP0951692A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19745648A DE19745648A1 (de) 1997-10-15 1997-10-15 Trägerelement für einen Halbleiterchip zum Einbau in Chipkarten
DE19745648 1997-10-15
PCT/DE1998/002768 WO1999019832A1 (fr) 1997-10-15 1998-09-17 Element support pour une puce de semi-conducteur a inserer dans une carte a puce

Publications (1)

Publication Number Publication Date
EP0951692A1 true EP0951692A1 (fr) 1999-10-27

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EP98956777A Withdrawn EP0951692A1 (fr) 1997-10-15 1998-09-17 Element support pour une puce de semi-conducteur a inserer dans une carte a puce

Country Status (10)

Country Link
US (1) US6719205B1 (fr)
EP (1) EP0951692A1 (fr)
JP (1) JP3839063B2 (fr)
KR (1) KR20000069487A (fr)
CN (1) CN1122942C (fr)
BR (1) BR9806706A (fr)
DE (1) DE19745648A1 (fr)
RU (1) RU2216042C2 (fr)
UA (1) UA46136C2 (fr)
WO (1) WO1999019832A1 (fr)

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Also Published As

Publication number Publication date
US6719205B1 (en) 2004-04-13
DE19745648A1 (de) 1998-11-26
UA46136C2 (uk) 2002-05-15
KR20000069487A (ko) 2000-11-25
BR9806706A (pt) 2000-04-04
CN1122942C (zh) 2003-10-01
CN1247616A (zh) 2000-03-15
RU2216042C2 (ru) 2003-11-10
JP3839063B2 (ja) 2006-11-01
WO1999019832A1 (fr) 1999-04-22
JP2001507842A (ja) 2001-06-12

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