BR9806706A - Elemento de suporte para um chip semicondutor, para montagem em cartões de chip - Google Patents
Elemento de suporte para um chip semicondutor, para montagem em cartões de chipInfo
- Publication number
- BR9806706A BR9806706A BR9806706-0A BR9806706A BR9806706A BR 9806706 A BR9806706 A BR 9806706A BR 9806706 A BR9806706 A BR 9806706A BR 9806706 A BR9806706 A BR 9806706A
- Authority
- BR
- Brazil
- Prior art keywords
- chip
- support element
- semiconductor chip
- mounting
- cards
- Prior art date
Links
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Credit Cards Or The Like (AREA)
- Die Bonding (AREA)
Abstract
Patente de Invenção: <B>''ELEMENTO DE SUPORTE PARA UM CHIP SEMI-CONDUTOR, PARA MONTAGEM EM CARTõES DE CHIP''<D>. Elemento de suporte para um chip semicondutor (2), com pelo menos duas ligações (1), particularmente para montagem em cartões de chip (11), que apresenta uma massa de revestimento (5), que protege o chip semicondutor (2). As ligações (1) estão dispostas em uma das superfícies principais da massa de revestimento (5), ao longo de duas bordas opostas. Elas são de material condutor e têm uma espessura diminuída nas extremidades (1a) voltadas uma para a outra, sendo que a seção transversal apresenta em apenas um lado um escalão. O chip semicondutor (2) está disposto na região dessa seção de espessura (1a) diminuída sobre as ligações (1) e está unido mecanicamente com as mesmas.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19745648A DE19745648A1 (de) | 1997-10-15 | 1997-10-15 | Trägerelement für einen Halbleiterchip zum Einbau in Chipkarten |
PCT/DE1998/002768 WO1999019832A1 (de) | 1997-10-15 | 1998-09-17 | Trägerelement für einen halbleiterchip zum einbau in chipkarten |
Publications (1)
Publication Number | Publication Date |
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BR9806706A true BR9806706A (pt) | 2000-04-04 |
Family
ID=7845667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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BR9806706-0A BR9806706A (pt) | 1997-10-15 | 1998-09-17 | Elemento de suporte para um chip semicondutor, para montagem em cartões de chip |
Country Status (10)
Country | Link |
---|---|
US (1) | US6719205B1 (pt) |
EP (1) | EP0951692A1 (pt) |
JP (1) | JP3839063B2 (pt) |
KR (1) | KR20000069487A (pt) |
CN (1) | CN1122942C (pt) |
BR (1) | BR9806706A (pt) |
DE (1) | DE19745648A1 (pt) |
RU (1) | RU2216042C2 (pt) |
UA (1) | UA46136C2 (pt) |
WO (1) | WO1999019832A1 (pt) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19918852C1 (de) * | 1999-04-26 | 2000-09-28 | Giesecke & Devrient Gmbh | Chipkarte mit Flip-Chip und Verfahren zu ihrer Herstellung |
DE19940564C2 (de) | 1999-08-26 | 2002-03-21 | Infineon Technologies Ag | Chipkartenmodul und diesen umfassende Chipkarte, sowie Verfahren zur Herstellung des Chipkartenmoduls |
DE19955537B4 (de) * | 1999-11-18 | 2006-04-13 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung eines Trägerelementes für einen IC-Baustein |
DE60137117D1 (de) * | 2000-02-22 | 2009-02-05 | Toray Eng Co Ltd | Kontaktlose ic-karte und verfahren zu ihrer herstellung |
SG106050A1 (en) * | 2000-03-13 | 2004-09-30 | Megic Corp | Method of manufacture and identification of semiconductor chip marked for identification with internal marking indicia and protection thereof by non-black layer and device produced thereby |
US6606247B2 (en) | 2001-05-31 | 2003-08-12 | Alien Technology Corporation | Multi-feature-size electronic structures |
US7253735B2 (en) | 2003-03-24 | 2007-08-07 | Alien Technology Corporation | RFID tags and processes for producing RFID tags |
FR2857483B1 (fr) * | 2003-07-11 | 2005-10-07 | Oberthur Card Syst Sa | Carte a puce anti-intrusion |
FR2869706B1 (fr) * | 2004-04-29 | 2006-07-28 | Oberthur Card Syst Sa | Entite electronique securisee, telle qu'un passeport. |
CN101228539A (zh) * | 2004-06-30 | 2008-07-23 | Nxp股份有限公司 | 插入夹持器的芯片卡 |
US7733657B2 (en) * | 2004-07-29 | 2010-06-08 | Nxp B.V. | Module base unit with strain relief means |
KR101038493B1 (ko) * | 2004-11-12 | 2011-06-01 | 삼성테크윈 주식회사 | 극초단파용 라디오 주파수 인식태그 제조방법 |
US7688206B2 (en) | 2004-11-22 | 2010-03-30 | Alien Technology Corporation | Radio frequency identification (RFID) tag for an item having a conductive layer included or attached |
FR2888371B1 (fr) * | 2005-07-06 | 2007-10-05 | Oberthur Card Syst Sa | Support de donnees pliable a puce sans contact tel qu'un passeport |
KR101108361B1 (ko) * | 2006-09-26 | 2012-01-25 | 페이닉스 아마테크 테오란타 | 트랜스폰더 칩 및 대응되는 인레이 기판에 안테나를 연결하는 방법 |
US8608080B2 (en) | 2006-09-26 | 2013-12-17 | Feinics Amatech Teoranta | Inlays for security documents |
US7707706B2 (en) * | 2007-06-29 | 2010-05-04 | Ruhlamat Gmbh | Method and arrangement for producing a smart card |
DE102008016274A1 (de) | 2008-03-28 | 2009-10-01 | Smartrac Ip B.V. | Chipträger für ein Transpondermodul sowie Transpondermodul |
DE102010041917B4 (de) * | 2010-10-04 | 2014-01-23 | Smartrac Ip B.V. | Schaltungsanordnung und Verfahren zu deren Herstellung |
CN116235180A (zh) * | 2020-09-25 | 2023-06-06 | 兰克森控股公司 | 智能卡的预层合嵌体、形成智能卡的预层合嵌体的方法、以及智能卡 |
CN114823550B (zh) * | 2022-06-27 | 2022-11-11 | 北京升宇科技有限公司 | 一种适于批量生产的芯片封装结构及封装方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
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DE3019207A1 (de) * | 1980-05-20 | 1981-11-26 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer einen ic-chip |
DE3123198C2 (de) * | 1980-12-08 | 1993-10-07 | Gao Ges Automation Org | Trägerelemente für einen IC-Baustein |
DE3248385A1 (de) * | 1982-12-28 | 1984-06-28 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit integriertem schaltkreis |
JPH02303056A (ja) * | 1989-05-17 | 1990-12-17 | Mitsubishi Electric Corp | 半導体集積回路の製造方法 |
FR2659157B2 (fr) | 1989-05-26 | 1994-09-30 | Lemaire Gerard | Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede. |
JPH04148999A (ja) * | 1990-10-12 | 1992-05-21 | Dainippon Printing Co Ltd | Icカード |
US5172214A (en) * | 1991-02-06 | 1992-12-15 | Motorola, Inc. | Leadless semiconductor device and method for making the same |
KR930014916A (ko) * | 1991-12-24 | 1993-07-23 | 김광호 | 반도체 패키지 |
DE19527359A1 (de) * | 1995-07-26 | 1997-02-13 | Giesecke & Devrient Gmbh | Schaltungseinheit und Verfahren zur Herstellung einer Schaltungseinheit |
DE19532755C1 (de) * | 1995-09-05 | 1997-02-20 | Siemens Ag | Chipmodul, insbesondere für den Einbau in Chipkarten, und Verfahren zur Herstellung eines derartigen Chipmoduls |
FR2741191B1 (fr) * | 1995-11-14 | 1998-01-09 | Sgs Thomson Microelectronics | Procede de fabrication d'un micromodule, notamment pour cartes a puces |
DE29621837U1 (de) * | 1996-12-16 | 1997-02-27 | Siemens AG, 80333 München | Trägerelement für Halbleiterchips |
KR0179925B1 (ko) * | 1996-06-14 | 1999-03-20 | 문정환 | 리드프레임 및 그를 이용한 버텀 리드 반도체 패키지 |
US6049463A (en) * | 1997-07-25 | 2000-04-11 | Motorola, Inc. | Microelectronic assembly including an antenna element embedded within a polymeric card, and method for forming same |
-
1997
- 1997-10-15 DE DE19745648A patent/DE19745648A1/de not_active Withdrawn
-
1998
- 1998-09-17 UA UA99063283A patent/UA46136C2/uk unknown
- 1998-09-17 WO PCT/DE1998/002768 patent/WO1999019832A1/de not_active Application Discontinuation
- 1998-09-17 JP JP52075299A patent/JP3839063B2/ja not_active Expired - Fee Related
- 1998-09-17 BR BR9806706-0A patent/BR9806706A/pt not_active IP Right Cessation
- 1998-09-17 EP EP98956777A patent/EP0951692A1/de not_active Withdrawn
- 1998-09-17 RU RU99115169/09A patent/RU2216042C2/ru not_active IP Right Cessation
- 1998-09-17 KR KR1019997005344A patent/KR20000069487A/ko not_active Application Discontinuation
- 1998-09-17 CN CN98802532A patent/CN1122942C/zh not_active Expired - Fee Related
-
1999
- 1999-06-15 US US09/333,322 patent/US6719205B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
UA46136C2 (uk) | 2002-05-15 |
RU2216042C2 (ru) | 2003-11-10 |
CN1122942C (zh) | 2003-10-01 |
KR20000069487A (ko) | 2000-11-25 |
US6719205B1 (en) | 2004-04-13 |
DE19745648A1 (de) | 1998-11-26 |
WO1999019832A1 (de) | 1999-04-22 |
JP2001507842A (ja) | 2001-06-12 |
EP0951692A1 (de) | 1999-10-27 |
CN1247616A (zh) | 2000-03-15 |
JP3839063B2 (ja) | 2006-11-01 |
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B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
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