KR910017603A - 리드 프레임 - Google Patents

리드 프레임 Download PDF

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Publication number
KR910017603A
KR910017603A KR1019910003723A KR910003723A KR910017603A KR 910017603 A KR910017603 A KR 910017603A KR 1019910003723 A KR1019910003723 A KR 1019910003723A KR 910003723 A KR910003723 A KR 910003723A KR 910017603 A KR910017603 A KR 910017603A
Authority
KR
South Korea
Prior art keywords
lead frame
substrate portions
frame
frame according
electronic circuit
Prior art date
Application number
KR1019910003723A
Other languages
English (en)
Other versions
KR100208301B1 (ko
Inventor
히사오 고
Original Assignee
나까하라 쯔네오
스미또모 덴끼 고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 나까하라 쯔네오, 스미또모 덴끼 고교 가부시끼가이샤 filed Critical 나까하라 쯔네오
Publication of KR910017603A publication Critical patent/KR910017603A/ko
Application granted granted Critical
Publication of KR100208301B1 publication Critical patent/KR100208301B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G02B6/4253—Sealed packages by embedding housing components in an adhesive or a polymer material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4255—Moulded or casted packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49544—Deformation absorbing parts in the lead frame plane, e.g. meanderline shape
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Light Receiving Elements (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

내용 없음

Description

리드 프레임
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 3도는 본 발명에 따른 리드 플레임의 제 1실시예 도시도.

Claims (4)

  1. 프레임부, 전자회로 부품이 장착될 다수의 기판부 및, 다수의 기판부를 상기 프레임부에 지지하기 위한 적어도 하나의 지지부를 구비하고, 상기 지지부는 각각의 기판부에 연결되는 다수의 독립된 단부를 구비하며, 상기 단부중 적어도 두 군데는 하나로 결합되어 상기 프레임부에 연결되는 것을 특징으로 하는 리드 프레임.
  2. 제 1항에 있어서, 응력 완화부가 상기 지지부에 배치되는 것을 특징으로 하는 리드 프레임.
  3. 제 1항에 있어서, 적어도 하나의 응력 완화부가 상기 프레임부에 배치되는 것을 특징으로 하는 리드 프레임.
  4. 제 1항에 있어서, 상기 리드 프레임은 광작동 소자와 이에 연결되는 전자회로 부품을 고정시키는 다수의 광커넥터를 구비하는 멀티-코어식 광모듈 제작용 구성 부품으로 사용되는 것을 특징으로 하는 리드 프레임.
    ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
KR1019910003723A 1990-03-16 1991-03-08 리드 프레임 KR100208301B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2-66179 1990-03-16
JP6617990 1990-03-16

Publications (2)

Publication Number Publication Date
KR910017603A true KR910017603A (ko) 1991-11-05
KR100208301B1 KR100208301B1 (ko) 1999-07-15

Family

ID=13308363

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910003723A KR100208301B1 (ko) 1990-03-16 1991-03-08 리드 프레임

Country Status (6)

Country Link
US (1) US5304818A (ko)
EP (1) EP0452634B1 (ko)
KR (1) KR100208301B1 (ko)
AU (1) AU639764B2 (ko)
CA (1) CA2037006A1 (ko)
DE (1) DE69125884T2 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0653394A (ja) * 1992-07-28 1994-02-25 Shinko Electric Ind Co Ltd 多層リードフレーム用プレーン支持体
US5854094A (en) * 1992-07-28 1998-12-29 Shinko Electric Industries Co., Ltd. Process for manufacturing metal plane support for multi-layer lead frames
US5416871A (en) * 1993-04-09 1995-05-16 Sumitomo Electric Industries, Ltd. Molded optical connector module
SE9403575L (sv) 1994-10-19 1996-04-20 Ericsson Telefon Ab L M Benram för kapslad optokomponent
JP4161399B2 (ja) * 1998-03-12 2008-10-08 沖電気工業株式会社 半導体装置用樹脂基板及び半導体装置
EP1154239B1 (de) * 2000-05-13 2009-09-30 Peter Apel Drehwinkelsensor
DE10128756A1 (de) * 2001-06-13 2002-12-19 Bosch Gmbh Robert Verpackung für ein elektronisches Bauelement
US6996897B2 (en) * 2002-07-31 2006-02-14 Freescale Semiconductor, Inc. Method of making a mount for electronic devices
US7012324B2 (en) 2003-09-12 2006-03-14 Freescale Semiconductor, Inc. Lead frame with flag support structure

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4149072A (en) * 1977-08-05 1979-04-10 Minnesota Mining And Manufacturing Company System for flat ribbon optical fiber data communications link
US4136357A (en) * 1977-10-03 1979-01-23 National Semiconductor Corporation Integrated circuit package with optical input coupler
US4188708A (en) * 1977-10-03 1980-02-19 National Semiconductor Corporation Integrated circuit package with optical input coupler
JPS584952A (ja) * 1981-07-01 1983-01-12 Toshiba Corp 半導体装置
EP0092330B1 (en) * 1982-04-19 1990-01-10 The Secretary of State for Defence in Her Britannic Majesty's Government of the United Kingdom of Great Britain and Infra red photo detector systems
GB2126795B (en) * 1982-09-09 1986-12-03 Plessey Co Plc Optical device
JPS59119774A (ja) * 1982-12-25 1984-07-11 Toshiba Corp 光結合半導体装置
JPS59205775A (ja) * 1983-05-10 1984-11-21 Sumitomo Electric Ind Ltd 光モジユ−ル
JPS6017411A (ja) * 1983-07-11 1985-01-29 Sumitomo Electric Ind Ltd 光モジユ−ル
IT1169922B (it) * 1983-11-04 1987-06-03 Telettra Lab Telefon Sistema e dispositivi per la connessione di fotorivelatori e di fibra ottica
FR2562271B1 (fr) * 1984-03-29 1986-07-18 Telecommunications Sa Connecteur d'une fibre optique et d'un photo-element, recepteur ou emetteur, et procede de positionnement de ceux-ci
US4730198A (en) * 1984-11-26 1988-03-08 American Telephone And Telegraph Company, At&T Bell Laboratories Aligning arrays of optoelectronic devices to arrays of optical fibers
US4803361A (en) * 1986-05-26 1989-02-07 Hitachi, Ltd. Photoelectric device with optical fiber and laser emitting chip
JPS6315454A (ja) * 1986-07-08 1988-01-22 Fujitsu Ltd 半導体装置用リ−ドフレ−ム
US4827118A (en) * 1986-07-10 1989-05-02 Minolta Camera Kabushiki Kaisha Light-sensitive device having color filter and manufacturing method thereof
JPS62169334A (ja) * 1986-12-24 1987-07-25 Hitachi Ltd 半導体装置の組立方法
DE3777785D1 (de) * 1986-12-26 1992-04-30 Idec Izumi Corp Traegerband fuer elektronische bauteile und herstellungsverfahren.
US4820013A (en) * 1987-01-06 1989-04-11 Alps Electric Co., Ltd. LED array head
JPH0719898B2 (ja) * 1987-01-30 1995-03-06 日本電気株式会社 光電気集積回路
GB8714396D0 (en) * 1987-06-19 1987-07-22 Amp Holland Fiber optic connector
JPH073907B2 (ja) * 1987-07-03 1995-01-18 株式会社日立製作所 デュアルインラインパッケ−ジ形半導体レ−ザモジュ−ル
JPH0828455B2 (ja) * 1988-02-24 1996-03-21 富士通株式会社 リードフレーム及びそれを用いた電子部品の製造方法
GB8816603D0 (en) * 1988-07-13 1988-08-17 Bt & D Technologies Ltd Optical components
JP2778054B2 (ja) * 1988-10-27 1998-07-23 日本電気株式会社 樹脂封止型フォトインタラプタ
US5011256A (en) * 1988-10-28 1991-04-30 E. I. Du Pont De Nemours And Company Package for an opto-electronic component
US4961107A (en) * 1989-04-03 1990-10-02 Motorola Inc. Electrically isolated heatsink for single-in-line package

Also Published As

Publication number Publication date
EP0452634B1 (en) 1997-05-02
AU639764B2 (en) 1993-08-05
KR100208301B1 (ko) 1999-07-15
AU7356591A (en) 1991-09-19
DE69125884D1 (de) 1997-06-05
US5304818A (en) 1994-04-19
EP0452634A1 (en) 1991-10-23
CA2037006A1 (en) 1991-09-17
DE69125884T2 (de) 1997-08-14

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Payment date: 20090410

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