KR970028761A - 액정 디스플레이 및 그 제조방법 - Google Patents

액정 디스플레이 및 그 제조방법 Download PDF

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Publication number
KR970028761A
KR970028761A KR1019960059070A KR19960059070A KR970028761A KR 970028761 A KR970028761 A KR 970028761A KR 1019960059070 A KR1019960059070 A KR 1019960059070A KR 19960059070 A KR19960059070 A KR 19960059070A KR 970028761 A KR970028761 A KR 970028761A
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South Korea
Prior art keywords
connection terminal
liquid crystal
glass substrate
output
conductive pattern
Prior art date
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KR1019960059070A
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English (en)
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KR100242874B1 (ko
Inventor
기요시 니까와
유지 스기야마
히로키 다케시타
데쓰로 오치
시즈오 니시하라
히로아키 이치가와
사토후미 고이케
야스노리 사토
후또시 나까니시
마사끼 이또오
Original Assignee
가네꼬 히사시
닛뽕덴끼 가부시끼가이샤
나카누마 쇼
안도덴끼 가부시끼가이샤
이데이 노부유키
소니 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 가네꼬 히사시, 닛뽕덴끼 가부시끼가이샤, 나카누마 쇼, 안도덴끼 가부시끼가이샤, 이데이 노부유키, 소니 가부시기가이샤 filed Critical 가네꼬 히사시
Publication of KR970028761A publication Critical patent/KR970028761A/ko
Application granted granted Critical
Publication of KR100242874B1 publication Critical patent/KR100242874B1/ko

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

본 발명에 따르면 칩 온 글래스(CHIP ON GLASS: COG)형 액정디스플레이(LCD) 및 그 제조방법이 개시 된다. 반도체 소자는 유리기판 또는 액정 패널상에 칩 온 글래스 구성에 의해 실장된다. 반도체 소자는 상기 유리기판상에 형성되는 출력 도전 패턴에 접속된 출력 접속단자를 갖는다. 또한, 상기 반도체 소자는 가요성 인쇄회로(FLEXIBLE PRINTED CIRCUIT : FPC)에 포함된 금속 배선에 접속된 입력 접속단자를 갖는다. 이는 통상적으로 유리기판상에 형성되는 입력 도전 패턴에 의존함이 없이 입력신호가 반도체 소자로 공급되도록 한다.

Description

액정 디스플레이 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명을 구현하는 칩 온 글래스형 액정 디스플레이를 나타낸 단면도.

Claims (6)

  1. 액정 패널을 구성하는 유리기판; 상기 유리 기판상에 형성된 출력 도전 패턴; 상기 유리기판상에 제공되고 상기 출력 도전 패턴에 접속된 출력 접속단자; 상기 유리기판상에 제공된 입력 접속단자; 및 금속 배선을 통하여 상기 유리기판상에 제공된 가요성 인쇄회로를 포함하며, 상기 금속 배선이 상기 가요성 인쇄회로로부터 돌출하는 일 단부에 의해 상기 입력 접속단자에 접속되는 것을 특징으로 하는 칩 온 글래스형 액정 디스플레이.
  2. 제1항에 있어서, 상기 입력 접속단자 및 상기 출력 접속단자는 서로 높이가 다른 것을 특징으로 하는 칩 온 글래스형 액정 디스플레이.
  3. 제1항에 있어서, 상기 입력 접속단자 및 상기 출력 접속단자 각각은 그 높이가 실질적으로 동일한 것을 특징으로 하는 칩 온 글래스형 액정 디스플레이.
  4. 제3항에 있어서, 상기 각 출력 접속단자에 각각 부가되어지는 제2접속단자를 더 포함하는 것을 특징으로 하는 칩 온 글래스형 액정 디스플레이.
  5. (a)액정 패널을 구성하는 유기기판상에, 금속 배선이 반도체 소자의 입력접속단자에 노출되는 가요성 인쇄회로의 단부를 접착제로 접속하여 상기 단부를 상기 입력 접속단자에 고정시키는 단계; 및 (b) 상기 유리기판상에 형성된 출력 도전 패턴을 상기 반도체 소자의 출력 접속단자에 접속하고, 상기 출력 도전 패턴을 상기 출력 접속단자에 접착제로 고정시키는 단계를 포함하는 것을 특징으로 하는 액정 디스플레이 제조방법.
  6. 제5항에 있어서 상기 단계 및 (b)가 동시에 수행되는 것을 특징으로 하는 액정 디스플레이 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960059070A 1995-11-29 1996-11-28 액정 디스플레이 및 그 제조방법 KR100242874B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP???? 1988-12-27
JP95-287316 1995-11-06
JP95-302649 1995-11-21
JP?7-331160 1995-11-27
JP95-311312 1995-11-29
JP7311312A JP2798027B2 (ja) 1995-11-29 1995-11-29 液晶表示装置およびその製造方法

Publications (2)

Publication Number Publication Date
KR970028761A true KR970028761A (ko) 1997-06-24
KR100242874B1 KR100242874B1 (ko) 2000-02-01

Family

ID=18015626

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960059070A KR100242874B1 (ko) 1995-11-29 1996-11-28 액정 디스플레이 및 그 제조방법

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Country Link
US (1) US5726726A (ko)
JP (1) JP2798027B2 (ko)
KR (1) KR100242874B1 (ko)

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KR100266213B1 (ko) * 1997-08-09 2000-09-15 구본준; 론 위라하디락사 패드마진을줄인cog형액정패널
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JP2004317924A (ja) * 2003-04-18 2004-11-11 Advanced Display Inc 表示装置および表示装置の製造方法
JP3693056B2 (ja) 2003-04-21 2005-09-07 セイコーエプソン株式会社 半導体装置及びその製造方法、電子装置及びその製造方法並びに電子機器
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JP2014095797A (ja) * 2012-11-09 2014-05-22 Japan Display Inc 表示装置および表示装置の製造方法
CN107437046B (zh) 2016-05-25 2020-12-01 讯芯电子科技（中山）有限公司 指纹传感器封装结构及其制作方法
TWI749442B (zh) 2020-01-06 2021-12-11 力晶積成電子製造股份有限公司 半導體封裝

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Also Published As

Publication number Publication date
JP2798027B2 (ja) 1998-09-17
US5726726A (en) 1998-03-10
JPH09152621A (ja) 1997-06-10
KR100242874B1 (ko) 2000-02-01

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