KR920010613A - 3 디멘션 써킷 모듈 - Google Patents

3 디멘션 써킷 모듈 Download PDF

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KR920010613A
KR920010613A KR1019910020555A KR910020555A KR920010613A KR 920010613 A KR920010613 A KR 920010613A KR 1019910020555 A KR1019910020555 A KR 1019910020555A KR 910020555 A KR910020555 A KR 910020555A KR 920010613 A KR920010613 A KR 920010613A
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terminal
connection zone
circuit module
circuit
module
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KR1019910020555A
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KR100228838B1 (ko
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에이취. 밀러 웨인
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제프리 디. 그린
아메리칸 텔리폰 앤드 텔레그라프 캄파니
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/023—Stackable modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06527—Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06572—Auxiliary carrier between devices, the carrier having an electrical connection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06589—Thermal management, e.g. cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Combinations Of Printed Boards (AREA)
  • Dram (AREA)

Abstract

내용 없음.

Description

3 디멘션 써킷 모듈
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따라 형성된 써킷접속부를 갖는 일예의 써킷 모듈의 선도,
제2도는 제1도에 도시된 모듈이 그 위에 장착된 본 발명에 따라 형성된 모 보드의 선도.

Claims (9)

  1. 스택에 장착된 다수개의 써킷 모듈과, 스택내의 인접 써킷 모듈상에 제1 및 제2접속지대의 하나와 대향하여 접속시키기 위한 수단을 포함하는데, 상기 각각의 써킷 모듈은 그위에 적어도 한세트의 교체 형성된 터미널과 콘덕터를 구비하는 평면 써킷 보드 이며, 각각의 교체 형성된 터미널은 써킷 모듈 한 측부상의 제1접속지대와 써킷 모듈의 다른 축부상의 제2접속 지대를 구비하며, 교체 형성된 터미널의 제1접속지대는 다른 교체 형성된 터미널의 제2접속지대에 대향위치하며, 각각의 모듈상에 교체 형성된 터미널의 적어도 한 개는 모듈상에 장착된 제1활용 수단에 어느한개의 콘덕터에 의해 접속되는 것을 특징으로 하는 3디멘션 써킷구조체.
  2. 제1항에 있어서, 각각의 써킷 모듈은 그위에 적어도 한 개의 관통 터미널을 구비하며, 각각의 관통 터미널은 써킷 모듈의 한 측부상에 제1접속 지대와 써킷 모듈의 다른 측부상에 제2접속 지대를 구비하며, 관통 터미널의 제1접속지대는 동일한 터미널의 제2접속지대에 대향위치되고, 각각의 관통 터미널은 콘덕터에 의해 제2활용 수단에 접속되는 것을 특징으로 하는 써킷 구조체.
  3. 제1항 또는 제2항에 있어서, 적어도 한 개의 써킷 모듈은 관통 터미널 및/ 또는 교체 형성된 터미널의 적어도 한 개가 제2활용 수단에 접속시키기 위한 수단을 구비하는 것을 특징으로 하는 써킷 구조체.
  4. 제3항에 있어서, 제1활용 수단의 각각은 세미콘덕터 메모리를 포함하고, 제2활용 수단은 세미콘덕터 메모리를 읽고, 쓰고, 파워시키기 위한 수단을 포함하는 것을 특징으로 하는 써킷 구조체.
  5. 콘덕터와 그위에 적어도 한세트의 교체 형성된 터미널을 구비하는 평면 써킷보드를 포함하며, 각각의 교체형성된 터미널은 써킷모듈의 한 측부상에 제1접속지대와 써킷모듈의 다른측부상에 제2접속지대를 구비하며, 교체 형성된 터미널의 제1접속지대는 다른 교체 형성된 터미널의 제2접속지대에 대향위치되며 각각의 모듈상에 교체 형성된 터미널의 적어도 한 개는 어느한개의 콘덕터에 의해 모듈상에 장착된 제1활용 수단에 접속되며, 따라서 스택내에 상기 접속 수단으로 조립될 때 어느한개의 써킷 모듈상에 제1접속지대가 인접 써킷 모듈상에 제2접속지대에 대향도록 접속되는 것을 특징으로 하는 써킷모듈.
  6. 제5항에 있어서, 적어도 한 개의 관통 터미널도 포함하며, 각각의 관통터미널은 써킷 모듈의 한 축부상의 제1접속지대와 써킷모듈의 다른 축부상에 제2접속지대를 구비하며, 관통 터미널의 제1접속지대는 동일한 관통터미널의 제2접속지대에 대향위치되며, 각각의 관통 터미널은 어느하나의 콘덕터에 의해 제1활용 수단에 접속되는 것을 특징으로 하는 써킷 모듈.
  7. 제6항에 있어서, 제2활용 수단에 인접 관통 터미널 및/ 또는 교체 형성된 터미널의 적어도 어느 한 개를 접속시키기 위한 수단도 포함하는 것을 특징으로 하는 써킷 모듈.
  8. 제6항 또는 제7항에 있어서, 제1활용 수단은 세미콘덕터 메모리를 포함하는 것을 특징으로 하는 써킷모듈.
  9. 제7항에 있어서, 제2활용 수단은 세미콘덕터 메모리를 일고, 쓰고, 파워시키기 위한 수단을 포함하는 것을 특징으로 하는 써킷 모듈.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910020555A 1990-11-26 1991-11-19 3 디멘션 써킷 모듈 KR100228838B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US617,704 1990-11-26
US07/617,704 US5130894A (en) 1990-11-26 1990-11-26 Three-dimensional circuit modules

Publications (2)

Publication Number Publication Date
KR920010613A true KR920010613A (ko) 1992-06-26
KR100228838B1 KR100228838B1 (ko) 1999-11-01

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Country Link
US (1) US5130894A (ko)
JP (1) JPH0666405B2 (ko)
KR (1) KR100228838B1 (ko)
GB (1) GB2250138B (ko)
HK (1) HK102794A (ko)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5354695A (en) 1992-04-08 1994-10-11 Leedy Glenn J Membrane dielectric isolation IC fabrication
US5241454A (en) * 1992-01-22 1993-08-31 International Business Machines Corporation Mutlilayered flexible circuit package
US5985693A (en) * 1994-09-30 1999-11-16 Elm Technology Corporation High density three-dimensional IC interconnection
US6714625B1 (en) 1992-04-08 2004-03-30 Elm Technology Corporation Lithography device for semiconductor circuit pattern generation
EP0586888B1 (en) * 1992-08-05 2001-07-18 Fujitsu Limited Three-dimensional multichip module
US5854534A (en) 1992-08-05 1998-12-29 Fujitsu Limited Controlled impedence interposer substrate
US5544017A (en) * 1992-08-05 1996-08-06 Fujitsu Limited Multichip module substrate
US5561593A (en) * 1994-01-27 1996-10-01 Vicon Enterprises, Inc. Z-interface-board
US5583749A (en) * 1994-11-30 1996-12-10 Altera Corporation Baseboard and daughtercard apparatus for reconfigurable computing systems
US5966282A (en) * 1994-12-20 1999-10-12 A. C. Data Systems, Inc. Power surge protection assembly
US5969932A (en) * 1994-12-20 1999-10-19 A.C. Data Systems, Inc. Power surge protection assembly
US5754408A (en) * 1995-11-29 1998-05-19 Mitsubishi Semiconductor America, Inc. Stackable double-density integrated circuit assemblies
US5838060A (en) * 1995-12-12 1998-11-17 Comer; Alan E. Stacked assemblies of semiconductor packages containing programmable interconnect
US5841638A (en) * 1996-02-15 1998-11-24 L3 Communications Stacked memory for flight recorders
US5748452A (en) * 1996-07-23 1998-05-05 International Business Machines Corporation Multi-electronic device package
US6551857B2 (en) 1997-04-04 2003-04-22 Elm Technology Corporation Three dimensional structure integrated circuits
US5915167A (en) 1997-04-04 1999-06-22 Elm Technology Corporation Three dimensional structure memory
US5825631A (en) * 1997-04-16 1998-10-20 Starkey Laboratories Method for connecting two substrates in a thick film hybrid circuit
JP2870530B1 (ja) * 1997-10-30 1999-03-17 日本電気株式会社 スタックモジュール用インターポーザとスタックモジュール
JP2000031614A (ja) * 1997-11-04 2000-01-28 Seiko Epson Corp メモリモジュールおよびメモリモジュールの積層体ならびにメモリモジュールを具備するメモリカードおよびコンピュータ
US6278616B1 (en) * 1998-07-07 2001-08-21 Texas Instruments Incorporated Modifying memory device organization in high density packages
US6154373A (en) * 1999-03-24 2000-11-28 Lucent Technologies Inc. High density cross-connection system
JP2000277944A (ja) * 1999-03-24 2000-10-06 Ando Electric Co Ltd 増設用の基板および基板の増設方法
US6713854B1 (en) 2000-10-16 2004-03-30 Legacy Electronics, Inc Electronic circuit module with a carrier having a mounting pad array
US7102892B2 (en) * 2000-03-13 2006-09-05 Legacy Electronics, Inc. Modular integrated circuit chip carrier
US6963941B1 (en) * 2000-05-31 2005-11-08 Micron Technology, Inc. High speed bus topology for expandable systems
US7337522B2 (en) * 2000-10-16 2008-03-04 Legacy Electronics, Inc. Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
US6327168B1 (en) * 2000-10-19 2001-12-04 Motorola, Inc. Single-source or single-destination signal routing through identical electronics module
JP2002158420A (ja) * 2000-11-21 2002-05-31 Nec Yonezawa Ltd プリント基板の電源線および信号線の接続方法ならびに電気機器
EP1378152A4 (en) * 2001-03-14 2006-02-01 Legacy Electronics Inc METHOD AND DEVICE FOR PREPARING A PCB WITH A THREE-DIMENSIONAL ARRAY OF SEMICONDUCTOR CHIPS USED ON THE SURFACE
US6707684B1 (en) * 2001-04-02 2004-03-16 Advanced Micro Devices, Inc. Method and apparatus for direct connection between two integrated circuits via a connector
US6748994B2 (en) * 2001-04-11 2004-06-15 Avery Dennison Corporation Label applicator, method and label therefor
US6537852B2 (en) 2001-08-22 2003-03-25 International Business Machines Corporation Spacer - connector stud for stacked surface laminated multichip modules and methods of manufacture
US7046522B2 (en) * 2002-03-21 2006-05-16 Raymond Jit-Hung Sung Method for scalable architectures in stackable three-dimensional integrated circuits and electronics
WO2004015764A2 (en) 2002-08-08 2004-02-19 Leedy Glenn J Vertical system integration
US7180165B2 (en) 2003-09-05 2007-02-20 Sanmina, Sci Corporation Stackable electronic assembly
US7435097B2 (en) * 2005-01-12 2008-10-14 Legacy Electronics, Inc. Radial circuit board, system, and methods
JP2006216956A (ja) * 2005-02-02 2006-08-17 Samsung Electronics Co Ltd 配線構造を有するメモリモジュール
KR100702016B1 (ko) * 2005-02-02 2007-03-30 삼성전자주식회사 양면 실장 메모리 모듈의 인쇄 회로 기판 및 이를이용하는 양면 실장 메모리 모듈
JP4577688B2 (ja) * 2005-05-09 2010-11-10 エルピーダメモリ株式会社 半導体チップ選択方法、半導体チップ及び半導体集積回路装置
US20080272496A1 (en) * 2007-05-02 2008-11-06 Starkey Laboratories, Inc. Planar interconnect structure for hybrid circuits
KR100874926B1 (ko) * 2007-06-07 2008-12-19 삼성전자주식회사 스택 모듈, 이를 포함하는 카드 및 이를 포함하는 시스템
US9619000B2 (en) * 2013-05-17 2017-04-11 Nec Corporation Board, board apparatus and method for interconnection of boards
US11342698B2 (en) * 2019-12-23 2022-05-24 Celestica Technology Consultancy (Shanghai) Co. Ltd Layout method for backplane connector, backplane and electronic terminal

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4190901A (en) * 1977-12-01 1980-02-26 Honeywell Information Systems Inc. Printed circuit board apparatus which facilitates fabrication of units comprising a data processing system
US5019946A (en) * 1988-09-27 1991-05-28 General Electric Company High density interconnect with high volumetric efficiency

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GB2250138B (en) 1994-03-30
HK102794A (en) 1994-09-30
GB9124290D0 (en) 1992-01-08
JPH0513661A (ja) 1993-01-22
JPH0666405B2 (ja) 1994-08-24
KR100228838B1 (ko) 1999-11-01
US5130894A (en) 1992-07-14
GB2250138A (en) 1992-05-27

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