EP0679727A2 - Verfahren zur Herstellung einer Kupfer-Nickel-Silizium-Legierung und deren Verwendung - Google Patents

Verfahren zur Herstellung einer Kupfer-Nickel-Silizium-Legierung und deren Verwendung Download PDF

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Publication number
EP0679727A2
EP0679727A2 EP95105326A EP95105326A EP0679727A2 EP 0679727 A2 EP0679727 A2 EP 0679727A2 EP 95105326 A EP95105326 A EP 95105326A EP 95105326 A EP95105326 A EP 95105326A EP 0679727 A2 EP0679727 A2 EP 0679727A2
Authority
EP
European Patent Office
Prior art keywords
alloy
composition
nickel
yield strength
process steps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP95105326A
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German (de)
English (en)
French (fr)
Other versions
EP0679727A3 (cg-RX-API-DMAC7.html
Inventor
Norbert Dipl. Ing. Gaag
Peter Dr. Ing. Ruchel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Diehl Verwaltungs Stiftung
Original Assignee
Diehl GmbH and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Diehl GmbH and Co filed Critical Diehl GmbH and Co
Publication of EP0679727A2 publication Critical patent/EP0679727A2/de
Publication of EP0679727A3 publication Critical patent/EP0679727A3/xx
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4998—Combined manufacture including applying or shaping of fluent material
    • Y10T29/49988—Metal casting
    • Y10T29/49991—Combined with rolling

Definitions

  • the invention relates to a method for producing a copper-nickel-silicon alloy with a composition Cu (balance), Ni 1.5 - 5.5%, Si 0.2 - 1.0%, Fe 0 - 0, 5%, Mg 0-0.1% (all figures in percent by weight). Alloys of this type have been known for a long time and are used with or without further additives, in particular as a conductor material in electrical engineering, in particular as a conductor material for electronic components.
  • DE-AS 1 278 110 for example, describes a copper-nickel-silicon alloy consisting of 2% Ni and 0.5% Si, the rest being copper, in which, however, the deformability is assessed as very poor while having good strength .
  • This publication also describes copper-nickel-silicon alloys (CuNiSi), in which the addition of small amounts of chromium is essential. These alloys have good cold formability, whereas the question of conductivity plays no role in the application described there.
  • the invention turns to another technical field. It should be used where there is good electrical conductivity, good cold formability during the process and very high Yield strength arrives, with the peculiarity that the yield strength of the alloy increases when cooling from high temperatures.
  • a preferred field of application of the invention is therefore in metal housings capable of pressure glazing, in particular those in which a hermetic seal of the pressure glazing in the housing is important.
  • the object of the invention is therefore to provide a method with which a copper alloy can be produced which increases its yield strength during cooling and which, in addition to a very high yield strength, has good conductivity (electrical and thermal) and cold formability.
  • the cooling rate in process step e) should be at most 100 ° C./min, preferably lower but not higher.
  • the alloys produced by the process according to the invention reach yield strengths of 400 to 450 N / mm2.
  • the conductivity reaches values up to a maximum of about 36% IACS.
  • a further improvement in the abovementioned properties of the alloy is achieved by additional aging of the alloy after it has cooled.
  • This aging takes place in a development of the invention at 300 to 600 ° C for a period of 8 to 1 hour.
  • the yield strength values rise up to 550 N / mm2, the conductivity reaches values up to 50% IACS.
  • Proportional to the electrical conductivity the thermal conductivity increases from around 150 W / m ° k to values of 200 W / m ° k.
  • the deep-drawing ability of the alloy is improved in that an intermediate soft annealing step is switched on at 400 ° C. to 750 ° C. for 8 hours to 1 minute after the cold rolling.
  • Tables 1 and 2 show the alloys examined with their composition and the resulting properties.
  • Table 1 Alloys Leg.No. Cu Ni Si Mg Fe 1873 98.26 1.01 0.64 1874 97.61 1.70 0.65 1875 96.92 2.42 0.65 1876 96.20 3.15 0.65 1877 95.48 3.85 0.66 1878 94.70 4.57 0.70 1879 93.98 5.30 0.66 1880 98.98 0.56 0.37 1881 98.15 1.36 0.38 1882 97.51 2.09 0.36 1883 96.82 2.50 0.67 1884 97.57 1.86 0.52 1885 98.76 0.96 0.27 1886 95.60 3.50 0.95 1887 94.28 4.60 1.16 1898 96.61 2.99 0.39 1899 95.10 4.50 0.41 1900 96.84 2.27 0.86 1901 94.96 4.08 0.89 1902 94.12 4.96 0.90 1903 93.24 5.83 0.86 1904 97.17 2.38 0.47 1905
  • Fig. 2 shows that, with the exception of alloys with a silicon content of 0.4% (or below), the conductivity in the preferred ranges of the nickel content also takes very good values.
  • Fig. 3 shows the cold formability and the change in the yield strength with a constant silicon content of 0.7% depending on the changing nickel content. It can be seen that the cold deformability is approximately inversely proportional to the change in the yield strength.
  • the two outer curves enclose the area "A” that can be used by the alloys described, which is between 0.2 and 1.0% in a region of silicon and between 1.5 and about 5.5% for nickel. lies.
  • the particularly preferred range "B”, in which high yield strength combined with high conductivity and good cold formability is between 0.4 and 0.9% Si and 2.3 and 4.5% Ni. It can also be seen from the figure that the Ni / Si ratio can vary within wide limits between 1.6 and 11.2%, preferably between 2.5 and 11.2%.
  • Fig. 5 shows the dependence of the yield strength and the, shown on the alloy No. 1876, with a composition Cu (rest), Ni 3.15%, Si 0.65% Conductivity from aging temperature, the last step in the manufacturing process. It can be seen from the figure that beginning with aging at a temperature of 350 ° C, the yield strength increases from about 510 to about 570 N / mm2 at a temperature of 500 ° C and then drops steeply. In terms of conductivity, the increase in the same temperature range is much steeper to 50% IACS with a drop at higher temperatures.
  • Fig. 6 shows the influence of additions of magnesium and iron to the proposed alloy. It can be seen that the additives are only very weak and only effective up to small additions.
  • step g) By inserting a step g) between steps c) and d), namely soft annealing at 400 to 750 ° C. for 8 hours to 1 minute, a subsequent deep drawing according to step h) is promoted.
  • step i) thermoforming according to a) or b the alloy is also forged [process step hh) instead of h)] possible.
  • the solution annealing process step has proven to be advantageous, but not mandatory, for sample production. This process step is common in the production of copper-nickel-silicon alloys, but in the sense of the invention it may also be unnecessary.
  • step e after the fairly rapid cooling to 350 ° C., a slow cooling to room temperature is advantageous. This can be done by cooling in air or in a cooling section.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
EP95105326A 1994-04-29 1995-04-08 Verfahren zur Herstellung einer Kupfer-Nickel-Silizium-Legierung und deren Verwendung Withdrawn EP0679727A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4415067 1994-04-29
DE4415067A DE4415067C2 (de) 1994-04-29 1994-04-29 Verfahren zur Herstellung einer Kupfer-Nickel-Silizium-Legierung und deren Verwendung

Publications (2)

Publication Number Publication Date
EP0679727A2 true EP0679727A2 (de) 1995-11-02
EP0679727A3 EP0679727A3 (cg-RX-API-DMAC7.html) 1995-11-29

Family

ID=6516822

Family Applications (1)

Application Number Title Priority Date Filing Date
EP95105326A Withdrawn EP0679727A2 (de) 1994-04-29 1995-04-08 Verfahren zur Herstellung einer Kupfer-Nickel-Silizium-Legierung und deren Verwendung

Country Status (7)

Country Link
US (1) US5675883A (cg-RX-API-DMAC7.html)
EP (1) EP0679727A2 (cg-RX-API-DMAC7.html)
JP (1) JPH083703A (cg-RX-API-DMAC7.html)
KR (1) KR950032669A (cg-RX-API-DMAC7.html)
CA (1) CA2144003A1 (cg-RX-API-DMAC7.html)
DE (1) DE4415067C2 (cg-RX-API-DMAC7.html)
IL (1) IL113528A0 (cg-RX-API-DMAC7.html)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6251199B1 (en) 1999-05-04 2001-06-26 Olin Corporation Copper alloy having improved resistance to cracking due to localized stress
JP2001148205A (ja) * 1999-11-19 2001-05-29 Hitachi Cable Ltd 超極細銅合金線材及びその製造方法
JP3520034B2 (ja) * 2000-07-25 2004-04-19 古河電気工業株式会社 電子電気機器部品用銅合金材
US7090732B2 (en) * 2000-12-15 2006-08-15 The Furukawa Electric, Co., Ltd. High-mechanical strength copper alloy
JP4494258B2 (ja) * 2005-03-11 2010-06-30 三菱電機株式会社 銅合金およびその製造方法
DE102005063324B4 (de) * 2005-05-13 2008-02-28 Federal-Mogul Wiesbaden Gmbh & Co. Kg Gleitlagerverbundwerkstoff, Verwendung und Herstellungsverfahren
JP5961335B2 (ja) * 2010-04-05 2016-08-02 Ｄｏｗａメタルテック株式会社 銅合金板材および電気・電子部品
EP3786982B1 (en) * 2019-08-26 2023-06-07 Nexans Cunisi alloy cable sheathing
JP2025101360A (ja) * 2023-12-25 2025-07-07 古河電気工業株式会社 銅合金板材、絞り加工用銅合金板材および絞り加工品

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1278110C2 (de) * 1960-03-09 1973-09-20 Ver Deutsche Metallwerke Ag Verwendung einer aushaertbaren kupferlegierung zur herstellung von halbzeug mit erhoehtem formaenderungsvermoegen
DE2918106C2 (de) * 1979-05-04 1983-02-24 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Verschweißen und Kontaktieren eines Golddrahtes an einer Aluminiumoberfläche
DE2919404C2 (de) * 1979-05-14 1986-04-03 Siemens AG, 1000 Berlin und 8000 München Gehäuse für Halbleiterbauelement
JPS5727051A (en) * 1980-07-25 1982-02-13 Nippon Telegr & Teleph Corp <Ntt> Copper nickel tin alloy for integrated circuit conductor and its manufacture
JPS5959866A (ja) * 1982-09-29 1984-04-05 Hitachi Metals Ltd 高融点金属鋳造用プリハ−ドン金型材料
KR840001426B1 (ko) * 1982-10-20 1984-09-26 이영세 전기전자 부품용 동합금 및 동합금판의 제조방법
DE3417273C2 (de) * 1984-05-10 1995-07-20 Poong San Metal Corp Kupfer-Nickel-Legierung für elektrisch leitendes Material für integrierte Schaltkreise
US4656003A (en) * 1984-10-20 1987-04-07 Kabushiki Kaisha Kobe Seiko Sho Copper alloy and production of the same
JPS61143564A (ja) * 1984-12-13 1986-07-01 Nippon Mining Co Ltd 高力高導電性銅基合金の製造方法
JPS62120450A (ja) * 1985-11-19 1987-06-01 Nakasato Kk 電気・電子機器用電気機械的接続ばね材料の製造法
JPS63130752A (ja) * 1986-11-20 1988-06-02 Nippon Mining Co Ltd 高力高導電銅合金の製造方法
JP2871801B2 (ja) * 1990-04-13 1999-03-17 古河電気工業株式会社 析出硬化型銅合金の溶体化処理方法
DE4115998C2 (de) * 1991-05-16 1999-02-25 Diehl Stiftung & Co Verfahren zur Herstellung von Kupferlegierungen
JP2529489B2 (ja) * 1991-07-09 1996-08-28 三菱電機株式会社 銅−ニッケル基合金

Also Published As

Publication number Publication date
US5675883A (en) 1997-10-14
DE4415067C2 (de) 1996-02-22
IL113528A0 (en) 1995-07-31
CA2144003A1 (en) 1995-10-30
EP0679727A3 (cg-RX-API-DMAC7.html) 1995-11-29
KR950032669A (ko) 1995-12-22
DE4415067A1 (de) 1995-11-02
JPH083703A (ja) 1996-01-09

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