EP0553371A1 - Masse à mouler à base de résine époxyde utilisée pour l'encapsulation des composants électroniques - Google Patents

Masse à mouler à base de résine époxyde utilisée pour l'encapsulation des composants électroniques Download PDF

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Publication number
EP0553371A1
EP0553371A1 EP92101362A EP92101362A EP0553371A1 EP 0553371 A1 EP0553371 A1 EP 0553371A1 EP 92101362 A EP92101362 A EP 92101362A EP 92101362 A EP92101362 A EP 92101362A EP 0553371 A1 EP0553371 A1 EP 0553371A1
Authority
EP
European Patent Office
Prior art keywords
epoxy resin
molding material
sealing
containing organopolysiloxane
resin molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP92101362A
Other languages
German (de)
English (en)
Other versions
EP0553371B1 (fr
Inventor
Shinsuke Hagiwara
Hiroyuki Kuriya
Shigeki Ichimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US07/826,512 priority Critical patent/US5319005A/en
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to EP92101362A priority patent/EP0553371B1/fr
Priority to DE1992627299 priority patent/DE69227299T2/de
Publication of EP0553371A1 publication Critical patent/EP0553371A1/fr
Application granted granted Critical
Publication of EP0553371B1 publication Critical patent/EP0553371B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the main chains of the organopolysiloxanes described above are not particularly limited, but it is preferable that these organopolysiloxanes are not visually miscible in the resins (components (A) and (B)).
  • liquid organopolysiloxanes obtained by introducing vinyl groups or ⁇ SiH groups to the molecule ends or in the molecules of homopolymers or copolymers of siloxanes, such as dimethylsiloxane, methylphenylsiloxane and diphenylsiloxane.
  • the molecular weights thereof are not particularly limited so far as their volatile losses are less than the value described above.
  • the preferred volume ratio of the total of the organopolysiloxanes used as raw materials to the dispersion medium is from 1:2 to 1:10. If the volume ratio is more than 1:2, the organopolysiloxanes may become difficult to disperse in a state of particulates, and if it is less than 1:10, the increase in the amount of the dispersion medium will be unfavorable in the cost of production.
  • the epoxy resin molding material for sealing of electronic components of the present invention further contains an inorganic filler as a component (D).
  • Typical examples of the inorganic filler are crushed or spherical (beaded) powder of fused silica, crystalline silica, alumina, zircon, calcium silicate, calcium carbonate, silicon carbide, silicon nitride, beryllia, zirconia; single crystal fiber of potassium titanate, silicon carbide, silicon nitride, alumina; and glass fiber.
  • These inorganic fillers may be used individually or in combination of two or more of them.
  • the epoxy resin molding material of the present invention is excellent in soldering resistance, thermal shock resistance and moldability, and, as well, is advantageous in the preparation thereof. That is, according to the present invention, soft rubberty solid particulates having a particle size of not more than 100 ⁇ m can be blended in molding materials with a low cost. Generally, preparation of rubberty matters having particle size of not more than 100 ⁇ m from bulky rubberty matters by pulverization is difficult, and it requires high cost. Also, other known methods of preparing particulates of organopolysiloxanes by means of emulsion polymerization or suspension polymerization requires removal of dispersion mediums and removal of surfactants.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
EP92101362A 1992-01-27 1992-01-28 Masse à mouler à base de résine époxyde utilisée pour l'encapsulation des composants électroniques Expired - Lifetime EP0553371B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US07/826,512 US5319005A (en) 1992-01-27 1992-01-27 Epoxy resin molding material for sealing of electronic component
EP92101362A EP0553371B1 (fr) 1992-01-27 1992-01-28 Masse à mouler à base de résine époxyde utilisée pour l'encapsulation des composants électroniques
DE1992627299 DE69227299T2 (de) 1992-01-28 1992-01-28 Epoxydharzformmasse zur Verkapselung von elektronischen Bauelementen

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/826,512 US5319005A (en) 1992-01-27 1992-01-27 Epoxy resin molding material for sealing of electronic component
EP92101362A EP0553371B1 (fr) 1992-01-27 1992-01-28 Masse à mouler à base de résine époxyde utilisée pour l'encapsulation des composants électroniques

Publications (2)

Publication Number Publication Date
EP0553371A1 true EP0553371A1 (fr) 1993-08-04
EP0553371B1 EP0553371B1 (fr) 1998-10-14

Family

ID=26130785

Family Applications (1)

Application Number Title Priority Date Filing Date
EP92101362A Expired - Lifetime EP0553371B1 (fr) 1992-01-27 1992-01-28 Masse à mouler à base de résine époxyde utilisée pour l'encapsulation des composants électroniques

Country Status (2)

Country Link
US (1) US5319005A (fr)
EP (1) EP0553371B1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995008584A1 (fr) * 1993-09-24 1995-03-30 Shell Internationale Research Maatschappij B.V. Composition de resine epoxy
EP0676448A1 (fr) * 1994-04-08 1995-10-11 Kabushiki Kaisha Toshiba Composition de résine époxyde et massé à mouler la contenant
EP0707042A1 (fr) * 1994-10-07 1996-04-17 Hitachi Chemical Co., Ltd. Masse à mouler à base de résines époxydes pour sceller des éléments électroniqes et un dispositif semi-conducteur capsule utilisant celui-ci
EP0761722A1 (fr) * 1995-03-14 1997-03-12 Nagase-Ciba Ltd. Derive d'organopolysiloxane
EP0818511A2 (fr) * 1996-07-08 1998-01-14 Dow Corning Toray Silicone Co., Ltd. Compositions liquides durcissables, produits durcis et un composant électronique
EP1172408A1 (fr) * 2000-07-14 2002-01-16 Abb Research Ltd. Masses à couler modifiés par volume à partir de résines de matrices polymèriques

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100333452B1 (ko) 1994-12-26 2002-04-18 이사오 우치가사키 필름 형상의 유기 다이본딩재 및 이를 이용한 반도체 장치
US6717242B2 (en) * 1995-07-06 2004-04-06 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
TW310481B (fr) * 1995-07-06 1997-07-11 Hitachi Chemical Co Ltd
EP0780435A1 (fr) * 1995-12-21 1997-06-25 National Starch and Chemical Investment Holding Corporation Adhésive epog, flexible ayant une tendance de migration faible
US5904984A (en) * 1996-10-17 1999-05-18 Siemens Westinghouse Power Corporation Electrical insulation using liquid crystal thermoset epoxy resins
US6429238B1 (en) * 1999-06-10 2002-08-06 Shin-Etsu Chemical Co., Ltd. Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device
US6342303B1 (en) 2000-02-23 2002-01-29 Georgia-Pacific Resins, Inc. Epoxy-functional polysiloxane modified phenolic resin compositions and composites
DE10057111C1 (de) * 2000-11-16 2002-04-11 Bosch Gmbh Robert Wärmeleitfähige Vergußmasse
TWI345576B (en) * 2003-11-07 2011-07-21 Dow Corning Toray Silicone Curable silicone composition and cured product thereof
JP4931366B2 (ja) * 2005-04-27 2012-05-16 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
US20060270808A1 (en) * 2005-05-24 2006-11-30 Shin-Etsu Chemical Co., Ltd. Epoxy-silicone mixed resin composition, cured article thereof, and light-emitting semiconductor device
US20060293427A1 (en) * 2005-06-10 2006-12-28 Martens Marvin M Thermally conductive polyamide-based components used in light emitting diode reflector applications
JP5285846B2 (ja) * 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5547369B2 (ja) * 2007-09-28 2014-07-09 東レ・ダウコーニング株式会社 硬化性液状エポキシ樹脂組成物およびその硬化物
KR101640961B1 (ko) * 2009-03-11 2016-07-19 스미토모 베이클리트 컴퍼니 리미티드 반도체 봉지용 수지 조성물 및 반도체 장치
JP2013525593A (ja) 2010-05-05 2013-06-20 タイコ エレクトロニクス サービシズ ゲゼルシャフト ミット ベシュレンクテル ハフツンク 電子部品用ポッティング

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0266513A2 (fr) * 1986-10-07 1988-05-11 hanse chemie GmbH Résine réactive modifiée, procédé pour sa préparation et son utilisation
EP0360461A2 (fr) * 1988-09-07 1990-03-28 MITSUI TOATSU CHEMICALS, Inc. Composition de résines pour sceller des semi-conducteurs
EP0428871A2 (fr) * 1989-11-22 1991-05-29 Sumitomo Bakelite Company Limited Composition de résine époxyde pour le scellement de semi-conducteurs

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JPS62270617A (ja) * 1986-05-20 1987-11-25 Mitsui Toatsu Chem Inc 半導体封止用樹脂組成物
DE3738634C2 (de) * 1986-11-13 1996-11-14 Sunstar Engineering Inc Epoxyharzmasse mit darin dispergierten Siliconharzteilchen
JPS63241021A (ja) * 1987-03-27 1988-10-06 Hitachi Chem Co Ltd 電子部品封止用エポキシ樹脂成形材料
JPH01272619A (ja) * 1987-07-22 1989-10-31 Mitsubishi Gas Chem Co Inc エポキシ樹脂組成物
JPH01272624A (ja) * 1988-04-25 1989-10-31 Hitachi Chem Co Ltd 電子部品封止用エポキシ樹脂成形材料
JP2547245B2 (ja) * 1988-11-18 1996-10-23 宇部興産株式会社 エポキシ樹脂組成物
JP2675108B2 (ja) * 1988-12-08 1997-11-12 住友ベークライト株式会社 エポキシ樹脂組成物
JPH0662834B2 (ja) * 1989-01-20 1994-08-17 松下電工株式会社 エポキシ樹脂組成物
JPH02311520A (ja) * 1989-05-27 1990-12-27 Toshiba Chem Corp エポキシ樹脂組成物
JPH03197528A (ja) * 1989-12-26 1991-08-28 Hitachi Chem Co Ltd 電子部品封止用エポキシ樹脂成形材料
JP2890591B2 (ja) * 1990-01-19 1999-05-17 日立化成工業株式会社 電子部品封止用エポキシ樹脂成形材料

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0266513A2 (fr) * 1986-10-07 1988-05-11 hanse chemie GmbH Résine réactive modifiée, procédé pour sa préparation et son utilisation
EP0360461A2 (fr) * 1988-09-07 1990-03-28 MITSUI TOATSU CHEMICALS, Inc. Composition de résines pour sceller des semi-conducteurs
EP0428871A2 (fr) * 1989-11-22 1991-05-29 Sumitomo Bakelite Company Limited Composition de résine époxyde pour le scellement de semi-conducteurs

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
IEEE TRANSACTIONS ON COMPONENTS ,HYBRIDS AND MANUFACTURING TECHNOLOGY vol. 7, no. 3, September 1984, pages 249 - 256; OTSUKA ET AL: 'A New Silicone Gel Sealing Mechanism For High Reliability Encapsulation' *
PATENT ABSTRACTS OF JAPAN vol. 14, no. 377 (C-748)(4320) 15 August 1990 & JP-A-2 138 332 ( UBE IND. LTD ) 28 May 1990 *
PATENT ABSTRACTS OF JAPAN vol. 14, no. 412 (C-755)(4355) 6 September 110 & JP-A-2 155 914 ( SUMITOMO BAKELITE CO. LTD ) 15 June 1990 *
WORLD PATENTS INDEX LATEST Derwent Publications Ltd., London, GB; AN 88-326860 & JP-A-63 241 021 (HITACHI CHEMICAL LTD) 6 October 1988 *
WORLD PATENTS INDEX LATEST Derwent Publications Ltd., London, GB; AN 90-271584(36) & JP-A-2 191 659 (MATSUSHITA ELEC. WORKS) 27 July 1990 *

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995008584A1 (fr) * 1993-09-24 1995-03-30 Shell Internationale Research Maatschappij B.V. Composition de resine epoxy
US5597876A (en) * 1993-09-24 1997-01-28 Shell Oil Company Epoxy resin composition containing novolac with adjacent hydroxyl groups
CN1051326C (zh) * 1993-09-24 2000-04-12 国际壳牌研究有限公司 环氧树脂组合物
EP0676448A1 (fr) * 1994-04-08 1995-10-11 Kabushiki Kaisha Toshiba Composition de résine époxyde et massé à mouler la contenant
CN1066764C (zh) * 1994-04-08 2001-06-06 株式会社东芝 环氧树脂组合物及用其制成的树脂模塑件
EP0707042A1 (fr) * 1994-10-07 1996-04-17 Hitachi Chemical Co., Ltd. Masse à mouler à base de résines époxydes pour sceller des éléments électroniqes et un dispositif semi-conducteur capsule utilisant celui-ci
US5739217A (en) * 1994-10-07 1998-04-14 Hitachi Chemical Company, Ltd. Epoxy resin molding for sealing electronic parts containing organic polymer-grafted silicone
US5962139A (en) * 1994-10-07 1999-10-05 Hitachi Chemical Co., Ltd. Semiconductor sealant of epoxy resin and organic polymer-grafted silicone polymer
EP0761722A4 (fr) * 1995-03-14 1999-03-17 Nagase Ciba Ltd Derive d'organopolysiloxane
EP0761722A1 (fr) * 1995-03-14 1997-03-12 Nagase-Ciba Ltd. Derive d'organopolysiloxane
EP0818511A3 (fr) * 1996-07-08 1998-04-22 Dow Corning Toray Silicone Co., Ltd. Compositions liquides durcissables, produits durcis et un composant électronique
EP0818511A2 (fr) * 1996-07-08 1998-01-14 Dow Corning Toray Silicone Co., Ltd. Compositions liquides durcissables, produits durcis et un composant électronique
EP1172408A1 (fr) * 2000-07-14 2002-01-16 Abb Research Ltd. Masses à couler modifiés par volume à partir de résines de matrices polymèriques
WO2002006398A1 (fr) * 2000-07-14 2002-01-24 Abb Research Ltd Masse de remplissage a modification de volume a base de resine a matrice polymere
JP2004504436A (ja) * 2000-07-14 2004-02-12 アーベーベー・リサーチ・リミテッド ポリマーマトリックス樹脂をベースとする体積改質注型用材料
US7268181B2 (en) 2000-07-14 2007-09-11 Abb Research Ltd Volume-modified casting compounds based on polymeric matrix resins
KR100872758B1 (ko) * 2000-07-14 2008-12-08 에이비비 리써치 리미티드 중합체 매트릭스 수지 기재의 부피 변형된 주물 화합물

Also Published As

Publication number Publication date
US5319005A (en) 1994-06-07
EP0553371B1 (fr) 1998-10-14

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