EP0228454B1 - Compositions and methods for printed circuit board and/or printed wiring board cleaning and soldermask testing - Google Patents

Compositions and methods for printed circuit board and/or printed wiring board cleaning and soldermask testing Download PDF

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Publication number
EP0228454B1
EP0228454B1 EP86904574A EP86904574A EP0228454B1 EP 0228454 B1 EP0228454 B1 EP 0228454B1 EP 86904574 A EP86904574 A EP 86904574A EP 86904574 A EP86904574 A EP 86904574A EP 0228454 B1 EP0228454 B1 EP 0228454B1
Authority
EP
European Patent Office
Prior art keywords
board
terpene
composition
water
compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Revoked
Application number
EP86904574A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0228454A4 (en
EP0228454A1 (en
Inventor
Michael Edward Hayes
Craig C. Hood
Donald E. Miller
Robert Sharpe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Petroferm Inc
Original Assignee
Petroferm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Application filed by Petroferm Inc filed Critical Petroferm Inc
Publication of EP0228454A1 publication Critical patent/EP0228454A1/en
Publication of EP0228454A4 publication Critical patent/EP0228454A4/en
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Publication of EP0228454B1 publication Critical patent/EP0228454B1/en
Anticipated expiration legal-status Critical
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
    • C23G5/024—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D9/00—Chemical paint or ink removers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/288—Removal of non-metallic coatings, e.g. for repairing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Definitions

  • the present invention relates to non-toxic, environmentally safe compositions for use in cleaning during the fabrication of printed circuit or printed wiring boards.
  • Terpene compounds are utilized with or without terpene emulsifying surfactants to achieve a variety of objectives, among which are the removal of solder flux, oils, waxes and greasy substances or adhesive tape residues.
  • soldering fluxes are first applied to the substrate board material to ensure firm, uniform bonding of the solder.
  • These soldering fluxes fall into two broad categories: rosin and non-rosin, or water soluble, fluxes.
  • the rosin fluxes which are generally non-corrosive and have a much longer history of use, are still widely used throughout the electronics industry.
  • the water soluble fluxes which are a more recent development, are being used increasingly in consumer products applications. Because they contain strong acids and/or amine hydrohalides and are thus corrosive, the water soluble soldering fluxes can cause circuit failure if residual traces of the material are not carefully removed. For that reason military specifications require the use of rosin fluxes.
  • Alkaline cleaning compounds known as the alkanol amines have been used for rosin flux removal as an alternative to the toxic chlorinated hydrocarbon solvents. These compounds chemically react with rosin flux to form a rosin soap through the process of saponification. Other organic substances such as surfactants or alcohol derivatives may be added to these alkaline cleaning compounds to facilitate the removal of such rosin soap.
  • these compounds like the water soluble soldering fluxes have a tendency to cause corrosion on the surfaces and interfaces of printed wiring boards if they are not completely and rapidly removed during the fabrication process.
  • Bakos et al . U.S. Patent No. 4,276,186
  • mixtures of N-methyl-2-pyrrolidone and a water miscible alkanolamine to remove solder flux and solder flux residue from integrated circuit modules. These mixtures were also said to be useful for removing various cured synthetic organic polymer compositions such as cured polyimide coating compositions from integrated circuit chip modules.
  • soldermask is a polymer or resin coating that is selectively applied to a printed circuit board to shield areas where solder is not required or desired. Where such masking is to be permanent, the soldermask must be "cured," a process by which monomeric reactants are made to polymerize. If curing of the soldermask is incomplete, solder will penetrate areas that are to be shielded, resulting in destruction of the board.
  • soldermask is based on acrylate chemistry and is photo-initiated and polymerized, and thus cured, using ultraviolet (U.V.) light.
  • U.V.-cured soldermask is advantageous in that its curing is rapid, but the thickness of such soldermask films must be uniform for successful curing.
  • the U.V. irradiation used cannot penetrate to the bottom of deep soldermask deposits, and attempts to increase the intensity or the duration of irradiation to cure thick sections can result in the embrittlement of the thinner mask film regions.
  • This invention provides cleaning methods and compositions for the removal of rosin solder fluxes and adhesive tape residues during the fabrication of printed circuit or wiring boards. As a result, the possibility of premature circuit failure that might occur in the absence of such cleaning is eliminated or greatly reduced.
  • the cleaning efficacy of the compositions of the invention is such that printed wiring boards thus treated meet stringent U.S. Department of Defense specifications.
  • compositions of the invention are characterized by low toxity, biodegradability and non-corrosiveness, unlike the chlorinated hydrocarbon solvents and alkaline cleaners that have heretofore been employed for printed wiring board and printed circuit board cleaning. As a result, the need for costly containment equipment is eliminated.
  • the present invention provides printed circuit/wiring board treatment compositions comprising terpene compounds such as limonene or dipentene.
  • terpene compounds such as limonene or dipentene.
  • These terpene compounds which have the ability to dissolve or complex with and remove rosin solder fluxes, oils, waxes and greasy substances or adhesive tape residues, could be used as such and removed, e.g ., with clean absorbent materials.
  • the terpene compounds of the invention are combined with terpene emulsifying surfactants to facilitate removal by water.
  • FIG. 1 a flow chart shows a representative printed circuit/wiring board fabrication process.
  • compositions of the present invention contain terpene compounds that have the capability to dissolve rosin soldering flux or adhesive tape residues that are commonly used in the fabrication of printed circuit or wiring boards.
  • Terpene compounds that are suitable for this purpose include but are not limited to pinene, both alpha and beta isomers, gamma terpinene, delta-3-carene, limonene and dipentene (the racemic mixture of the isomers of optically active limonene), with limonene and dipentene being preferred.
  • terpene compounds could be used alone and removed, after allowing them to complex with and dissolve rosin flux or adhesive tape residues, e.g ., by flushing with excess terpenes or by absorption into paper or cloth. Because they are almost completely insoluble in water, however, the terpenes cannot be directly flushed away by water.
  • the terpene compounds are combined with one or more terpene emulsifying surfactants. The addition of such surfactants facilitates removal of the terpenes from printed wiring boards by rinsing with water, whereby the terpenes are formed into oil-in-water emulsions.
  • Numerous surfactants capable of emulsifying the terpenes of the invention may be used, including but not limited to the linear alkyl benzene sulfonates, linear or branched chain alcoholic ethoxylates and ethoxysulfates, polysorbate esters, ethoxylated alkylphenols and alkyl and dialkyl succinate compounds.
  • An example of the latter class of compounds is sodium dioctyl sulfosuccinate.
  • the ethoxylated alkylphenols contain various alkyl side chains and various numbers of linked ethylene oxide units.
  • Useful compounds of this class contain from about 5 to about 20 ethylene oxide groups, with 7 or 8 being preferred.
  • the quantity of terpene emulsifying surfactants in the compositions of the present invention may range on a weight basis from 0 to about 40%, with the terpene compounds accounting for the balance of the compositions.
  • the composition comprises by weight about 6.5% poly (7) ethoxy nonylphenol, 2.1% poly (10) ethoxy nonylphenol, 1.4% sodium dioctyl sulfosuccinate and 90% limonene.
  • compositions of this invention are characterized by low toxicity and environmental biodegradibility, unlike the chlorinated hydrocarbon solvents that had been used prior to this invention for printed wiring board cleaning.
  • Limonene for example, is a natural product in various ethereal oils such as oils of lemon, orange, caraway, dill and bergamot which possesses a pleasant, lemon-like odor.
  • EC-1 has biological oxygen demand and chemical oxygen demand values of 295 and 1,425 milligrams per liter, respectively, at a dilution of 1,000:1, as determined by methods described in Standard Methods for the Examination of Water and Wastewater, 16th Edition, American Public Health Association.
  • compositions of the invention to various aspects of the printed circuit/wiring board fabrication process can best be understood by reference to a representative process flow chart, which is shown in Figure 1.
  • the assembly manufacturing process involves the placement of components such as integrated circuits, resistors, capacitors, diodes, etc. on the surface of the board or their insertion through pre-drilled holes.
  • the components are then secured by soldering by mechanical or automatic means. Interspersed with the soldering operations are cleaning procedures and inspections to ensure that tape and solder flux residues that could lead to premature circuit failure do not remain. Points in the fabrication process to which the compositions of the invention apply will be identified below.
  • the compositions of the invention may be applied to the boards by immersion in dip tanks or by hand or mechanical brushing. Alternatively, they may be applied by any of the commercially available printed wiring board cleaning equipment. Dishwasher size units may be employed, or much larger continuous belt cleaning machinery such as Total Systems Concept's Dual Process Cleaning System models 31-218, 31-418, 31-224 and 31-424 (Total Systems Concept, St. Louis, MO). Depending upon their design, these washers may apply the compositions of the invention by spraying with mechanical nozzles or by rolling contact with wetted roller surfaces.
  • the temperature at which the compositions may be applied can range from room, or ambient, temperature (about 20°C 70°F) to about 66°C (150°F).
  • the compositions containing terpene emulsifying surfactants may be used full strength or diluted with water to as low as about a 2 volume percent concentration. The compositions should contact the boards for about 1 to about 5 minutes.
  • the compositions of the invention are removed.
  • their removal can be carried out by flushing with a non-toxic, miscible solvent or by absorption into appropriate materials.
  • the boards may simply be flushed with water for a period of up to about 2 minutes. Deionized water is preferred.
  • the optimal rinsing time varies according to the kinds of surfactants and the concentrations of the terpene formulations used and can easily be determined by routine experimentation.
  • the cleaned boards are then dried, preferably with forced air. Drying is expedited if the air is warmed, preferably to above about 37,8°C (100°F).
  • the efficacy of rosin soldering flux removal from printed wiring boards is such that the boards meet stringent military specifications for low resistivity after cleaning.
  • the boards meet the Mil-P-28809A standard for low resistivity of solvent extracts by which contamination has been removed from a cleaned board according to Mil-P-55110C.
  • the resistivity of solvent extracts of cleaned boards is most easily determined with an Omega Meter. Omega Meter is the registered trademark of Kenco Industries, Inc., Atlanta, GA, for a microprocessor-controlled contamination test system that rapidly measures changes in resistivity due to contamintating ions.
  • tin-lead residues must first be removed from the unplated tabs. Removal of these residues is carried out through the use of etching chemicals that can damage other unprotected printed circuit/wiring board components. To protect vulnerable components from the etching chemicals, boards are wrapped on both sides with an adhesive plating tape which forms a shield or splash guard for all but the exposed tab area. The etching chemicals then remove the tin-lead residues on the tabs, a nickel plate is applied as a base for the gold, and gold plating of the tabs is finally carried out. The adhesive plating tape which was maintained in place through all of these etching and plating steps, is then removed.
  • Fig. 1 The use of adhesive tape is indicated in Fig. 1 at the point labeled "tape for gold plating.”
  • the tape is removed following the “nickel and gold plate” step, and it is at this point that the terpene compositions of the invention may most advantageously be used.
  • a silicone-based and/or rubber-based residue may remain on the board.
  • This residue may easily be removed by the compositions of the invention under the same conditions described above for solder flux removal.
  • the exact operational parameters will be determined by the nature of the tape residue and the tenacity with which it adheres to the board, but the conditions described above are generally effective.
  • treatment of the board with the terpene compounds of the invention is generally followed by water flushing and air drying.
  • the efficiency of removal of adhesive tape residues from printed circuit/wiring boards by the compositions of the invention is such that no residues are visible after cleaning.
  • a simple 5-10X stereomicroscope can facilitate visual inspection for tape residues following cleaning.
  • the cleaning composition designated EC-1, contained by weight 90% d-limonene, 6.5% poly (7) ethoxy nonylphenol, 2.1% poly (10) ethoxy nonylphenol and 1.4% sodium dioctyl sulfosuccinate. Concentrations of 25 to 100 volume percent of EC-1 diluted in water were used as indicated below.
  • the cleaning system was a Series 400, Model TRL-HSE Aqueous Cleaning System manufactured by The John Treiber Company, Huntington Beach, CA.
  • the cleaning system has a conveyor driven modular design in which the operations of loading, pre-wash rinsing, washing, air knife drying, first rinsing, air knife drying, final rinsing and high speed drying are carried out in succession.
  • Rinse water at ambient temperature and EC-1 for washing at 120°F were applied through spray nozzle manifolds as the boards traversed the system at a conveyor speed of 8 feet/minute.
  • air knife drying turbine propelled air shears fluids from the board surfaces.
  • two sets of dual air knives above and below the conveyor thoroughly dry the cleaned boards. The air in this module was heated to 49°C (120°F).

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Detergent Compositions (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
EP86904574A 1985-07-01 1986-06-27 Compositions and methods for printed circuit board and/or printed wiring board cleaning and soldermask testing Revoked EP0228454B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/750,198 US4640719A (en) 1985-07-01 1985-07-01 Method for printed circuit board and/or printed wiring board cleaning
US750198 1991-08-27

Publications (3)

Publication Number Publication Date
EP0228454A1 EP0228454A1 (en) 1987-07-15
EP0228454A4 EP0228454A4 (en) 1989-09-04
EP0228454B1 true EP0228454B1 (en) 1993-02-10

Family

ID=25016911

Family Applications (1)

Application Number Title Priority Date Filing Date
EP86904574A Revoked EP0228454B1 (en) 1985-07-01 1986-06-27 Compositions and methods for printed circuit board and/or printed wiring board cleaning and soldermask testing

Country Status (5)

Country Link
US (2) US4640719A (ja)
EP (1) EP0228454B1 (ja)
JP (1) JP2610854B2 (ja)
DE (1) DE3687747T2 (ja)
WO (1) WO1987000209A1 (ja)

Families Citing this family (92)

* Cited by examiner, † Cited by third party
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JPS63501908A (ja) 1988-07-28
WO1987000209A1 (en) 1987-01-15
DE3687747D1 (de) 1993-03-25
US4640719A (en) 1987-02-03
DE3687747T2 (de) 1993-08-19
US4640719B1 (ja) 1993-04-27
JP2610854B2 (ja) 1997-05-14
US4740247A (en) 1988-04-26
EP0228454A4 (en) 1989-09-04
EP0228454A1 (en) 1987-07-15

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