DK2516104T3 - Loddepastasammensætning, loddepasta og loddeflusmiddel - Google Patents
Loddepastasammensætning, loddepasta og loddeflusmiddel Download PDFInfo
- Publication number
- DK2516104T3 DK2516104T3 DK10799017.8T DK10799017T DK2516104T3 DK 2516104 T3 DK2516104 T3 DK 2516104T3 DK 10799017 T DK10799017 T DK 10799017T DK 2516104 T3 DK2516104 T3 DK 2516104T3
- Authority
- DK
- Denmark
- Prior art keywords
- solder
- present
- amount
- solder paste
- soldering flux
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Claims (9)
1. Loddeflusmiddel der omfatter, baseret på den totale mængde af loddeflus-midlet, fra 10 til 60 vægt-% af en harpiks, fra 1 til 10 vægt-% af et thixotropt middel, fra 0,5 til 30 vægt-% af en aktivator, fra 10 til 60 vægt-% af et opløsningsmiddel såvel som fra 0,2 til 10 vægt-% af en langkædet thiol og/eller et organisk chelateringsmiddel, hvor den langkædede thiol er valgt blandt hexan-ethiol, octanethiol, decanethiol, dodecanethiol og/eller octadecanethiol og/eller blandinger deraf, og hvor det organiske chelateringsmiddel er valgt blandt 1,10-o-naphthisodiazin, 2,9-dimethyl-4,7-diphenyl-1,10-phenanthrolin, 4,7-dimethyl-1,10-o-naphthisodiazin, 4,7-diphenyl-1,10-o-naphthisodiazin og/eller blandinger deraf.
2. Loddeflusmidlet ifølge krav 1, hvor den langkædede thiol og/eller det organiske chelateringsmiddel er til stede i en mængde på 0,2 til 10 vægt-%, der er baseret på den totale mængde af loddeflusmidlet.
3. Loddeflusmiddel ifølge krav 1 eller 2, hvor harpiksen er valgt fra colofonium-harpikser, syremodificerede colofoniumharpikser, hydrogenerede colofonium-harpikser, disproportionerede colofoniumharpikser og/eller polymeriserede colo-fonium-harpikser og/eller blandinger deraf.
4. Loddeflusmiddel ifølge et hvilket som helst af kravene 1 til 3, hvor harpiksen er til stede i en mængde på 10 til 60 vægt-%, der er baseret på den totale mængde af loddeflusmidlet.
5. Loddeflusmiddel ifølge et hvilket som helst af kravene 1 til 4, hvor det thixo-trope middel er valgt blandt polyamider, hydrogenerede colofoniumolier og/eller amidmodificerede hydrogenerede colofoniumolier og/eller blandinger deraf.
6. Loddepastasammensætning i form af et kit, der indeholder loddeflusmidlet ifølge et hvilket som helst af kravene 1 til 5 og mindst ét legeringsloddepulver.
7. Loddepastasammensætningen ifølge krav 6, hvor kittet omfatter mindst to beholdere.
8. Loddepastasammensætningen ifølge krav 6 eller 7, hvor volumenforholdet mellem loddeflusmidlet og legeringslodspulveret er fra 0,8 : 1 til 1,2 : 1.
9. Loddepasta som er en blanding af alle bestanddele af loddepastasammensætningen ifølge et hvilket som helst af kravene 7 til 8.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910215134.4A CN102107340B (zh) | 2009-12-24 | 2009-12-24 | 一种焊膏组合物、焊膏及一种助焊剂 |
PCT/EP2010/070329 WO2011076770A2 (en) | 2009-12-24 | 2010-12-21 | A solder paste composition, a solder paste and a soldering flux |
Publications (1)
Publication Number | Publication Date |
---|---|
DK2516104T3 true DK2516104T3 (da) | 2019-04-08 |
Family
ID=43836664
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK10799017.8T DK2516104T3 (da) | 2009-12-24 | 2010-12-21 | Loddepastasammensætning, loddepasta og loddeflusmiddel |
Country Status (9)
Country | Link |
---|---|
US (1) | US9511453B2 (da) |
EP (1) | EP2516104B1 (da) |
JP (1) | JP5717147B2 (da) |
CN (2) | CN102107340B (da) |
DK (1) | DK2516104T3 (da) |
ES (1) | ES2712549T3 (da) |
HU (1) | HUE042953T2 (da) |
PL (1) | PL2516104T3 (da) |
WO (1) | WO2011076770A2 (da) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3766631A3 (en) * | 2011-08-02 | 2021-03-24 | Alpha Assembly Solutions Inc. | Solder compositions |
JP5218686B2 (ja) * | 2011-08-08 | 2013-06-26 | Jsr株式会社 | フラックス組成物、電気的接続構造の形成方法、電気的接続構造および半導体装置 |
JP5766668B2 (ja) * | 2012-08-16 | 2015-08-19 | 株式会社タムラ製作所 | はんだ組成物およびそれを用いたプリント配線基板 |
JP6088204B2 (ja) * | 2012-10-29 | 2017-03-01 | 株式会社タムラ製作所 | はんだ組成物 |
KR102156373B1 (ko) * | 2013-05-10 | 2020-09-16 | 엘지이노텍 주식회사 | 솔더 페이스트 |
CN104646862A (zh) * | 2013-11-26 | 2015-05-27 | 刘现梅 | 一种含有松油醇副产松油烯衍生物的助焊剂 |
CN104476018B (zh) * | 2014-11-17 | 2016-06-01 | 如皋市大昌电子有限公司 | 一种贴片二极管焊接专用焊锡膏 |
WO2017086335A1 (ja) * | 2015-11-17 | 2017-05-26 | 積水化学工業株式会社 | はんだ接合材料、接続構造体及び接続構造体の製造方法 |
CN107731434B (zh) * | 2017-09-25 | 2019-07-19 | 江苏时恒电子科技有限公司 | 一种热敏电阻铜电极多功能防护膜层及其制备方法 |
JP6824208B2 (ja) * | 2018-02-26 | 2021-02-03 | 株式会社タムラ製作所 | フラックス及びソルダペースト |
CN111660037B (zh) * | 2019-03-05 | 2022-04-15 | 潮州三环(集团)股份有限公司 | 助焊剂及包含该助焊剂的锡膏 |
CN110369818B (zh) * | 2019-08-05 | 2022-03-04 | 大连爱碧克空调配件有限公司 | 铝合金支架焊接方法 |
JP6764123B1 (ja) * | 2019-10-04 | 2020-09-30 | 千住金属工業株式会社 | ソルダペースト |
CN111777944A (zh) * | 2020-07-01 | 2020-10-16 | 云南锡业锡材有限公司 | 一种芯片封装用焊锡球表面处理剂及其制备方法 |
JP6928295B1 (ja) * | 2020-10-02 | 2021-09-01 | 千住金属工業株式会社 | フラックス及びソルダペースト |
JP6928296B1 (ja) * | 2020-10-02 | 2021-09-01 | 千住金属工業株式会社 | ソルダペースト |
CN115870660A (zh) * | 2021-09-29 | 2023-03-31 | 比亚迪股份有限公司 | 活性金属焊膏组合物、焊膏及焊接陶瓷与金属的方法 |
JP7037103B1 (ja) * | 2021-10-06 | 2022-03-16 | 千住金属工業株式会社 | フラックス及びソルダペースト |
JP7208579B1 (ja) * | 2022-07-22 | 2023-01-19 | 千住金属工業株式会社 | フラックス及びソルダペースト |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
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US4169167A (en) * | 1978-06-26 | 1979-09-25 | Lord Corporation | Low gloss finishes by gradient intensity cure |
JPH106074A (ja) * | 1996-06-20 | 1998-01-13 | Harima Chem Inc | ソルダペースト組成物 |
JPH10109188A (ja) * | 1996-10-01 | 1998-04-28 | Showa Denko Kk | はんだペースト |
JP3791403B2 (ja) * | 2000-12-04 | 2006-06-28 | 富士電機ホールディングス株式会社 | 鉛フリーハンダ対応無洗浄用フラックスおよびこれを含有するハンダ組成物 |
FR2845024B1 (fr) * | 2002-10-01 | 2005-06-10 | Ind Des Poudres Spheriques | Preformes de soudure comportant un revetement de surface et procede de production de telles preformes. |
JP2004291019A (ja) * | 2003-03-26 | 2004-10-21 | Nof Corp | はんだ付け用フラックス組成物、はんだペースト及びはんだ付け方法 |
JP3814594B2 (ja) * | 2003-08-08 | 2006-08-30 | 株式会社東芝 | ハンダ、及びハンダペースト |
JP4103784B2 (ja) * | 2003-11-21 | 2008-06-18 | 日油株式会社 | はんだ付け用フラックス組成物、はんだペーストおよびはんだ付け方法 |
JP2005152999A (ja) * | 2003-11-28 | 2005-06-16 | Tamura Kaken Co Ltd | ソルダーペースト組成物 |
CN100482043C (zh) * | 2004-04-16 | 2009-04-22 | P.凯金属股份有限公司 | 焊接方法 |
JP2006009125A (ja) * | 2004-06-29 | 2006-01-12 | Kumamoto Technology & Industry Foundation | 表面修飾金属微粒子および該金属微粒子を含有するペースト |
US20060147683A1 (en) * | 2004-12-30 | 2006-07-06 | Harima Chemicals, Inc. | Flux for soldering and circuit board |
US20060272747A1 (en) * | 2005-06-03 | 2006-12-07 | Renyi Wang | Fluxing compositions |
CN100349688C (zh) * | 2005-07-16 | 2007-11-21 | 李昕 | 用于配制焊锡膏的焊剂组合物 |
ATE554126T1 (de) * | 2006-01-26 | 2012-05-15 | Showa Denko Kk | Härtbare zusammensetzung, die eine thiolverbindung enthält |
CN100571962C (zh) * | 2006-06-13 | 2009-12-23 | 深圳市合明科技有限公司 | 一种smt无铅锡膏用焊膏 |
WO2008004287A1 (fr) * | 2006-07-05 | 2008-01-10 | Ablestik (Japan) Co., Ltd. | Adhésif conducteur |
JP2008111004A (ja) * | 2006-10-06 | 2008-05-15 | Sumitomo Bakelite Co Ltd | 液状封止樹脂組成物および半導体装置 |
CN100425385C (zh) * | 2006-10-27 | 2008-10-15 | 烟台德邦科技有限公司 | 一种无铅焊锡膏及其制备方法 |
US7651021B2 (en) * | 2007-12-28 | 2010-01-26 | Intel Corporation | Microball attachment using self-assembly for substrate bumping |
JP2010221260A (ja) * | 2009-03-24 | 2010-10-07 | Mitsubishi Materials Corp | はんだ粉末及び該粉末を用いたはんだペースト |
-
2009
- 2009-12-24 CN CN200910215134.4A patent/CN102107340B/zh active Active
-
2010
- 2010-12-21 WO PCT/EP2010/070329 patent/WO2011076770A2/en active Application Filing
- 2010-12-21 CN CN201080059039.0A patent/CN102666001B/zh active Active
- 2010-12-21 ES ES10799017T patent/ES2712549T3/es active Active
- 2010-12-21 JP JP2012545285A patent/JP5717147B2/ja active Active
- 2010-12-21 DK DK10799017.8T patent/DK2516104T3/da active
- 2010-12-21 EP EP10799017.8A patent/EP2516104B1/en active Active
- 2010-12-21 HU HUE10799017A patent/HUE042953T2/hu unknown
- 2010-12-21 PL PL10799017T patent/PL2516104T3/pl unknown
-
2012
- 2012-06-22 US US13/530,751 patent/US9511453B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2011076770A2 (en) | 2011-06-30 |
EP2516104A2 (en) | 2012-10-31 |
US20130042946A1 (en) | 2013-02-21 |
US9511453B2 (en) | 2016-12-06 |
CN102666001B (zh) | 2016-09-14 |
JP5717147B2 (ja) | 2015-05-13 |
CN102107340B (zh) | 2015-10-21 |
PL2516104T3 (pl) | 2019-08-30 |
ES2712549T3 (es) | 2019-05-13 |
WO2011076770A3 (en) | 2011-09-09 |
EP2516104B1 (en) | 2019-01-30 |
JP2013515611A (ja) | 2013-05-09 |
CN102107340A (zh) | 2011-06-29 |
CN102666001A (zh) | 2012-09-12 |
HUE042953T2 (hu) | 2019-07-29 |
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