DK2516104T3 - Loddepastasammensætning, loddepasta og loddeflusmiddel - Google Patents

Loddepastasammensætning, loddepasta og loddeflusmiddel Download PDF

Info

Publication number
DK2516104T3
DK2516104T3 DK10799017.8T DK10799017T DK2516104T3 DK 2516104 T3 DK2516104 T3 DK 2516104T3 DK 10799017 T DK10799017 T DK 10799017T DK 2516104 T3 DK2516104 T3 DK 2516104T3
Authority
DK
Denmark
Prior art keywords
solder
present
amount
solder paste
soldering flux
Prior art date
Application number
DK10799017.8T
Other languages
English (en)
Inventor
Huiying Yang
Daoqiang Lu
Original Assignee
Henkel Ag & Co Kgaa
Henkel IP & Holding GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Ag & Co Kgaa, Henkel IP & Holding GmbH filed Critical Henkel Ag & Co Kgaa
Application granted granted Critical
Publication of DK2516104T3 publication Critical patent/DK2516104T3/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Claims (9)

1. Loddeflusmiddel der omfatter, baseret på den totale mængde af loddeflus-midlet, fra 10 til 60 vægt-% af en harpiks, fra 1 til 10 vægt-% af et thixotropt middel, fra 0,5 til 30 vægt-% af en aktivator, fra 10 til 60 vægt-% af et opløsningsmiddel såvel som fra 0,2 til 10 vægt-% af en langkædet thiol og/eller et organisk chelateringsmiddel, hvor den langkædede thiol er valgt blandt hexan-ethiol, octanethiol, decanethiol, dodecanethiol og/eller octadecanethiol og/eller blandinger deraf, og hvor det organiske chelateringsmiddel er valgt blandt 1,10-o-naphthisodiazin, 2,9-dimethyl-4,7-diphenyl-1,10-phenanthrolin, 4,7-dimethyl-1,10-o-naphthisodiazin, 4,7-diphenyl-1,10-o-naphthisodiazin og/eller blandinger deraf.
2. Loddeflusmidlet ifølge krav 1, hvor den langkædede thiol og/eller det organiske chelateringsmiddel er til stede i en mængde på 0,2 til 10 vægt-%, der er baseret på den totale mængde af loddeflusmidlet.
3. Loddeflusmiddel ifølge krav 1 eller 2, hvor harpiksen er valgt fra colofonium-harpikser, syremodificerede colofoniumharpikser, hydrogenerede colofonium-harpikser, disproportionerede colofoniumharpikser og/eller polymeriserede colo-fonium-harpikser og/eller blandinger deraf.
4. Loddeflusmiddel ifølge et hvilket som helst af kravene 1 til 3, hvor harpiksen er til stede i en mængde på 10 til 60 vægt-%, der er baseret på den totale mængde af loddeflusmidlet.
5. Loddeflusmiddel ifølge et hvilket som helst af kravene 1 til 4, hvor det thixo-trope middel er valgt blandt polyamider, hydrogenerede colofoniumolier og/eller amidmodificerede hydrogenerede colofoniumolier og/eller blandinger deraf.
6. Loddepastasammensætning i form af et kit, der indeholder loddeflusmidlet ifølge et hvilket som helst af kravene 1 til 5 og mindst ét legeringsloddepulver.
7. Loddepastasammensætningen ifølge krav 6, hvor kittet omfatter mindst to beholdere.
8. Loddepastasammensætningen ifølge krav 6 eller 7, hvor volumenforholdet mellem loddeflusmidlet og legeringslodspulveret er fra 0,8 : 1 til 1,2 : 1.
9. Loddepasta som er en blanding af alle bestanddele af loddepastasammensætningen ifølge et hvilket som helst af kravene 7 til 8.
DK10799017.8T 2009-12-24 2010-12-21 Loddepastasammensætning, loddepasta og loddeflusmiddel DK2516104T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200910215134.4A CN102107340B (zh) 2009-12-24 2009-12-24 一种焊膏组合物、焊膏及一种助焊剂
PCT/EP2010/070329 WO2011076770A2 (en) 2009-12-24 2010-12-21 A solder paste composition, a solder paste and a soldering flux

Publications (1)

Publication Number Publication Date
DK2516104T3 true DK2516104T3 (da) 2019-04-08

Family

ID=43836664

Family Applications (1)

Application Number Title Priority Date Filing Date
DK10799017.8T DK2516104T3 (da) 2009-12-24 2010-12-21 Loddepastasammensætning, loddepasta og loddeflusmiddel

Country Status (9)

Country Link
US (1) US9511453B2 (da)
EP (1) EP2516104B1 (da)
JP (1) JP5717147B2 (da)
CN (2) CN102107340B (da)
DK (1) DK2516104T3 (da)
ES (1) ES2712549T3 (da)
HU (1) HUE042953T2 (da)
PL (1) PL2516104T3 (da)
WO (1) WO2011076770A2 (da)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3766631A3 (en) * 2011-08-02 2021-03-24 Alpha Assembly Solutions Inc. Solder compositions
JP5218686B2 (ja) * 2011-08-08 2013-06-26 Ｊｓｒ株式会社 フラックス組成物、電気的接続構造の形成方法、電気的接続構造および半導体装置
JP5766668B2 (ja) * 2012-08-16 2015-08-19 株式会社タムラ製作所 はんだ組成物およびそれを用いたプリント配線基板
JP6088204B2 (ja) * 2012-10-29 2017-03-01 株式会社タムラ製作所 はんだ組成物
KR102156373B1 (ko) * 2013-05-10 2020-09-16 엘지이노텍 주식회사 솔더 페이스트
CN104646862A (zh) * 2013-11-26 2015-05-27 刘现梅 一种含有松油醇副产松油烯衍生物的助焊剂
CN104476018B (zh) * 2014-11-17 2016-06-01 如皋市大昌电子有限公司 一种贴片二极管焊接专用焊锡膏
WO2017086335A1 (ja) * 2015-11-17 2017-05-26 積水化学工業株式会社 はんだ接合材料、接続構造体及び接続構造体の製造方法
CN107731434B (zh) * 2017-09-25 2019-07-19 江苏时恒电子科技有限公司 一种热敏电阻铜电极多功能防护膜层及其制备方法
JP6824208B2 (ja) * 2018-02-26 2021-02-03 株式会社タムラ製作所 フラックス及びソルダペースト
CN111660037B (zh) * 2019-03-05 2022-04-15 潮州三环（集团）股份有限公司 助焊剂及包含该助焊剂的锡膏
CN110369818B (zh) * 2019-08-05 2022-03-04 大连爱碧克空调配件有限公司 铝合金支架焊接方法
JP6764123B1 (ja) * 2019-10-04 2020-09-30 千住金属工業株式会社 ソルダペースト
CN111777944A (zh) * 2020-07-01 2020-10-16 云南锡业锡材有限公司 一种芯片封装用焊锡球表面处理剂及其制备方法
JP6928295B1 (ja) * 2020-10-02 2021-09-01 千住金属工業株式会社 フラックス及びソルダペースト
JP6928296B1 (ja) * 2020-10-02 2021-09-01 千住金属工業株式会社 ソルダペースト
CN115870660A (zh) * 2021-09-29 2023-03-31 比亚迪股份有限公司 活性金属焊膏组合物、焊膏及焊接陶瓷与金属的方法
JP7037103B1 (ja) * 2021-10-06 2022-03-16 千住金属工業株式会社 フラックス及びソルダペースト
JP7208579B1 (ja) * 2022-07-22 2023-01-19 千住金属工業株式会社 フラックス及びソルダペースト

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4169167A (en) * 1978-06-26 1979-09-25 Lord Corporation Low gloss finishes by gradient intensity cure
JPH106074A (ja) * 1996-06-20 1998-01-13 Harima Chem Inc ソルダペースト組成物
JPH10109188A (ja) * 1996-10-01 1998-04-28 Showa Denko Kk はんだペースト
JP3791403B2 (ja) * 2000-12-04 2006-06-28 富士電機ホールディングス株式会社 鉛フリーハンダ対応無洗浄用フラックスおよびこれを含有するハンダ組成物
FR2845024B1 (fr) * 2002-10-01 2005-06-10 Ind Des Poudres Spheriques Preformes de soudure comportant un revetement de surface et procede de production de telles preformes.
JP2004291019A (ja) * 2003-03-26 2004-10-21 Nof Corp はんだ付け用フラックス組成物、はんだペースト及びはんだ付け方法
JP3814594B2 (ja) * 2003-08-08 2006-08-30 株式会社東芝 ハンダ、及びハンダペースト
JP4103784B2 (ja) * 2003-11-21 2008-06-18 日油株式会社 はんだ付け用フラックス組成物、はんだペーストおよびはんだ付け方法
JP2005152999A (ja) * 2003-11-28 2005-06-16 Tamura Kaken Co Ltd ソルダーペースト組成物
CN100482043C (zh) * 2004-04-16 2009-04-22 P.凯金属股份有限公司 焊接方法
JP2006009125A (ja) * 2004-06-29 2006-01-12 Kumamoto Technology & Industry Foundation 表面修飾金属微粒子および該金属微粒子を含有するペースト
US20060147683A1 (en) * 2004-12-30 2006-07-06 Harima Chemicals, Inc. Flux for soldering and circuit board
US20060272747A1 (en) * 2005-06-03 2006-12-07 Renyi Wang Fluxing compositions
CN100349688C (zh) * 2005-07-16 2007-11-21 李昕 用于配制焊锡膏的焊剂组合物
ATE554126T1 (de) * 2006-01-26 2012-05-15 Showa Denko Kk Härtbare zusammensetzung, die eine thiolverbindung enthält
CN100571962C (zh) * 2006-06-13 2009-12-23 深圳市合明科技有限公司 一种smt无铅锡膏用焊膏
WO2008004287A1 (fr) * 2006-07-05 2008-01-10 Ablestik (Japan) Co., Ltd. Adhésif conducteur
JP2008111004A (ja) * 2006-10-06 2008-05-15 Sumitomo Bakelite Co Ltd 液状封止樹脂組成物および半導体装置
CN100425385C (zh) * 2006-10-27 2008-10-15 烟台德邦科技有限公司 一种无铅焊锡膏及其制备方法
US7651021B2 (en) * 2007-12-28 2010-01-26 Intel Corporation Microball attachment using self-assembly for substrate bumping
JP2010221260A (ja) * 2009-03-24 2010-10-07 Mitsubishi Materials Corp はんだ粉末及び該粉末を用いたはんだペースト

Also Published As

Publication number Publication date
WO2011076770A2 (en) 2011-06-30
EP2516104A2 (en) 2012-10-31
US20130042946A1 (en) 2013-02-21
US9511453B2 (en) 2016-12-06
CN102666001B (zh) 2016-09-14
JP5717147B2 (ja) 2015-05-13
CN102107340B (zh) 2015-10-21
PL2516104T3 (pl) 2019-08-30
ES2712549T3 (es) 2019-05-13
WO2011076770A3 (en) 2011-09-09
EP2516104B1 (en) 2019-01-30
JP2013515611A (ja) 2013-05-09
CN102107340A (zh) 2011-06-29
CN102666001A (zh) 2012-09-12
HUE042953T2 (hu) 2019-07-29

Similar Documents

Publication Publication Date Title
DK2516104T3 (da) Loddepastasammensætning, loddepasta og loddeflusmiddel
EP2072178B1 (en) Paste composition for aluminum brazing
JP6310894B2 (ja) はんだ組成物および電子基板の製造方法
KR101436714B1 (ko) 납프리 솔더 페이스트
EP0024484B1 (en) Vehicle for metal-joining paste, said paste and brazing or soldering process using said paste
EP1697430A2 (de) Flussmittel
JP2013515611A5 (da)
JP2010221260A (ja) はんだ粉末及び該粉末を用いたはんだペースト
EP3603879B1 (en) Flux composition and solder paste composition
TWI824999B (zh) 焊料膏用助焊劑及焊料膏
WO2018135426A1 (ja) フラックス及びはんだ組成物
JP6392574B2 (ja) フラックス組成物、はんだ組成物、および電子基板の製造方法
JP5481753B2 (ja) フラックス組成物及びはんだペースト組成物
TWI552825B (zh) 焊膏組合物、焊膏及助焊劑
JP6638845B1 (ja) はんだペースト
DE3915515A1 (de) Pastoeses gemisch zum verbinden oder beschichten von metallischen werkstoffen, insbesondere aluminium und aluminiumlegierungen sowie herstellungsverfahren dazu
JP2019150870A (ja) フラックス及びはんだペースト
JP6383587B2 (ja) フラックス組成物、はんだ組成物、および電子基板の製造方法
TWI782447B (zh) 助焊劑及焊膏
JPH03216292A (ja) クリームはんだ
JP2004058104A (ja) はんだ付け用フラックス及びはんだペースト
JP2003117689A (ja) はんだペースト
JPS63115692A (ja) クリ−ムはんだ