DE69935571D1 - Flexible Platte - Google Patents

Flexible Platte

Info

Publication number
DE69935571D1
DE69935571D1 DE69935571T DE69935571T DE69935571D1 DE 69935571 D1 DE69935571 D1 DE 69935571D1 DE 69935571 T DE69935571 T DE 69935571T DE 69935571 T DE69935571 T DE 69935571T DE 69935571 D1 DE69935571 D1 DE 69935571D1
Authority
DE
Germany
Prior art keywords
flexible plate
flexible
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69935571T
Other languages
English (en)
Other versions
DE69935571T2 (de
Inventor
Satoshi Takahashi
Hidetsugu Namiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemical and Information Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical and Information Device Corp filed Critical Sony Chemical and Information Device Corp
Application granted granted Critical
Publication of DE69935571D1 publication Critical patent/DE69935571D1/de
Publication of DE69935571T2 publication Critical patent/DE69935571T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
DE69935571T 1998-12-21 1999-12-20 Flexible Platte Expired - Lifetime DE69935571T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP36353698 1998-12-21
JP36353698A JP3405242B2 (ja) 1998-12-21 1998-12-21 フレキシブル基板

Publications (2)

Publication Number Publication Date
DE69935571D1 true DE69935571D1 (de) 2007-05-03
DE69935571T2 DE69935571T2 (de) 2007-12-06

Family

ID=18479562

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69935571T Expired - Lifetime DE69935571T2 (de) 1998-12-21 1999-12-20 Flexible Platte

Country Status (5)

Country Link
US (1) US6346298B1 (de)
EP (1) EP1014766B1 (de)
JP (1) JP3405242B2 (de)
CN (1) CN1159151C (de)
DE (1) DE69935571T2 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003059979A (ja) * 2001-08-20 2003-02-28 Mitsui Mining & Smelting Co Ltd 電子部品実装用積層フィルム及び電子部品実装用フィルムキャリアテープ
JP3534405B1 (ja) 2002-11-28 2004-06-07 鐘淵化学工業株式会社 耐熱性フレキシブル積層板の製造方法およびこれにより製造される耐熱性フレキシブル積層板
AU2003289243A1 (en) * 2003-01-09 2004-08-10 Kaneka Corporation Bonding sheet and one-side metal-clad laminate
JP2005186274A (ja) * 2003-12-24 2005-07-14 Kaneka Corp フレキシブル積層板およびその製造方法
US20070169886A1 (en) * 2004-03-04 2007-07-26 Toray Industries, Inc. Heat-resistant resin laminated film, multilayer film with metal layer including same and semiconductor device
JP2005259790A (ja) * 2004-03-09 2005-09-22 Nippon Steel Chem Co Ltd フレキシブルプリント配線用基板とその製造方法
US7717163B2 (en) * 2004-03-31 2010-05-18 Daikin Industries, Ltd. Heat exchanger
KR100668948B1 (ko) * 2004-09-21 2007-01-12 주식회사 엘지화학 금속 적층판 및 그의 제조방법
JP2006206756A (ja) 2005-01-28 2006-08-10 Sony Chem Corp ポリイミド化合物及びフレキシブル配線板
CA2603382A1 (en) * 2005-03-12 2006-09-21 3M Innovative Properties Company Illumination devices and methods for making the same
JP2007152653A (ja) * 2005-12-02 2007-06-21 Amt Kenkyusho:Kk インクジェットヘッド用金属箔−芳香族ポリマー積層体
TWI297342B (en) * 2006-01-17 2008-06-01 Ind Tech Res Inst Thermoplastic polyimide composition and double-sided flexible copper clad laminate using the same
JP2009528933A (ja) * 2006-03-06 2009-08-13 エルジー・ケム・リミテッド 金属積層板およびその製造方法
US20070298260A1 (en) * 2006-06-22 2007-12-27 Kuppusamy Kanakarajan Multi-layer laminate substrates useful in electronic type applications
JPWO2008004496A1 (ja) * 2006-07-06 2009-12-03 東レ株式会社 熱可塑性ポリイミド、これを用いた積層ポリイミドフィルムならびに金属箔積層ポリイミドフィルム
US8525402B2 (en) 2006-09-11 2013-09-03 3M Innovative Properties Company Illumination devices and methods for making the same
US8581393B2 (en) * 2006-09-21 2013-11-12 3M Innovative Properties Company Thermally conductive LED assembly
JP2008182222A (ja) * 2006-12-28 2008-08-07 Mitsui Mining & Smelting Co Ltd 可撓性プリント配線基板および半導体装置
US20080295327A1 (en) * 2007-06-01 2008-12-04 3M Innovative Properties Company Flexible circuit
CN103589356B (zh) * 2007-08-03 2016-01-20 株式会社钟化 多层聚酰亚胺膜、层叠板以及覆金属层叠板
CN101516159B (zh) * 2008-02-18 2011-03-23 富葵精密组件(深圳)有限公司 补强板及包括该补强板的补强软性电路板
TWI385198B (zh) * 2008-08-11 2013-02-11 Ind Tech Res Inst 雙面金屬箔層積層板及其製法
CN101670697B (zh) * 2008-09-12 2012-06-27 财团法人工业技术研究院 双面金属箔层积层板及其制法
TWI405667B (zh) * 2010-12-15 2013-08-21 Ind Tech Res Inst 聚醯亞胺薄膜層合物及包含其之金屬積層板
TWI490115B (zh) 2014-03-07 2015-07-01 Azotek Co Ltd 金屬基板及其製作方法
KR101932326B1 (ko) * 2016-12-20 2018-12-24 주식회사 두산 인쇄회로기판 및 이의 제조방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4998897A (de) 1973-01-13 1974-09-18
JPS5714622A (en) 1980-06-30 1982-01-25 Toray Ind Inc Production of polyamideimide resin
JPS60157286A (ja) 1984-01-27 1985-08-17 株式会社日立製作所 フレキシブルプリント基板の製造方法
JPS60243120A (ja) 1984-05-18 1985-12-03 Hitachi Ltd フレキシブルプリント基板の製造方法
JPS63199239A (ja) 1987-02-13 1988-08-17 New Japan Chem Co Ltd 新規な溶剤可溶性ポリイミド及びその製造方法
JPS63239998A (ja) 1987-03-27 1988-10-05 新日鐵化学株式会社 配線材料の製造方法
US4937133A (en) * 1988-03-28 1990-06-26 Nippon Steel Chemical Co., Ltd. Flexible base materials for printed circuits
JPH01245586A (ja) 1988-03-28 1989-09-29 Nippon Steel Chem Co Ltd フレキシブルプリント基板
JP2738453B2 (ja) 1989-10-03 1998-04-08 新日鐵化学株式会社 銅張積層板の製造方法
JPH0513902A (ja) * 1990-09-04 1993-01-22 Chisso Corp フレキシブルプリント基板及びその製造法
JPH05139027A (ja) 1991-11-18 1993-06-08 Oji Paper Co Ltd 感熱記録体
JP2746555B2 (ja) 1995-11-13 1998-05-06 新日鐵化学株式会社 フレキシブルプリント基板
JPH09148695A (ja) * 1995-11-24 1997-06-06 Mitsui Toatsu Chem Inc フレキシブルプリント回路基板及びその製造方法
KR100465047B1 (ko) * 1996-08-19 2005-01-13 신닛테츠가가쿠 가부시키가이샤 Ｈｄｄ 서스펜션용 적층체 및 그의 제조 방법

Also Published As

Publication number Publication date
EP1014766B1 (de) 2007-03-21
JP2000188445A (ja) 2000-07-04
CN1269285A (zh) 2000-10-11
DE69935571T2 (de) 2007-12-06
EP1014766A3 (de) 2003-02-05
CN1159151C (zh) 2004-07-28
EP1014766A2 (de) 2000-06-28
JP3405242B2 (ja) 2003-05-12
US6346298B1 (en) 2002-02-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition