DE69935333T2 - Verbessertes verfahren zur herstellung leitender spuren und so hergestellte gedruckte leiterplatten - Google Patents
Verbessertes verfahren zur herstellung leitender spuren und so hergestellte gedruckte leiterplatten Download PDFInfo
- Publication number
- DE69935333T2 DE69935333T2 DE69935333T DE69935333T DE69935333T2 DE 69935333 T2 DE69935333 T2 DE 69935333T2 DE 69935333 T DE69935333 T DE 69935333T DE 69935333 T DE69935333 T DE 69935333T DE 69935333 T2 DE69935333 T2 DE 69935333T2
- Authority
- DE
- Germany
- Prior art keywords
- conductive metal
- copper foil
- layer
- copper
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims abstract description 82
- SPJOZZSIXXJYBT-UHFFFAOYSA-N Fenson Chemical compound C1=CC(Cl)=CC=C1OS(=O)(=O)C1=CC=CC=C1 SPJOZZSIXXJYBT-UHFFFAOYSA-N 0.000 title 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 145
- 229910052751 metal Inorganic materials 0.000 claims abstract description 100
- 239000002184 metal Substances 0.000 claims abstract description 100
- 239000011889 copper foil Substances 0.000 claims abstract description 84
- 229910052802 copper Inorganic materials 0.000 claims abstract description 61
- 239000010949 copper Substances 0.000 claims abstract description 61
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 29
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 59
- 229910052759 nickel Inorganic materials 0.000 claims description 29
- 238000005530 etching Methods 0.000 claims description 20
- 230000003750 conditioning effect Effects 0.000 claims description 18
- 238000011282 treatment Methods 0.000 claims description 18
- 238000000151 deposition Methods 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 12
- 230000008021 deposition Effects 0.000 claims description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 5
- 239000011324 bead Substances 0.000 claims description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 2
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 claims description 2
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 claims description 2
- 238000007788 roughening Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 31
- 239000011888 foil Substances 0.000 description 13
- 238000007747 plating Methods 0.000 description 13
- 239000000243 solution Substances 0.000 description 11
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 239000003973 paint Substances 0.000 description 9
- 150000002739 metals Chemical class 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 229910052804 chromium Inorganic materials 0.000 description 6
- 239000011651 chromium Substances 0.000 description 6
- 238000011536 re-plating Methods 0.000 description 6
- 239000002131 composite material Substances 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 238000013459 approach Methods 0.000 description 4
- 238000004070 electrodeposition Methods 0.000 description 4
- 238000003486 chemical etching Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000010411 cooking Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000004922 lacquer Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000001143 conditioned effect Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- -1 sulfur peroxide Chemical class 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10477—Inverted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US113043 | 1971-02-19 | ||
| US09/113,043 US6117300A (en) | 1996-05-01 | 1998-07-09 | Method for forming conductive traces and printed circuits made thereby |
| PCT/US1999/015546 WO2000003568A1 (en) | 1998-07-09 | 1999-07-09 | Improved method for forming conductive traces and printed circuits made thereby |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69935333D1 DE69935333D1 (de) | 2007-04-12 |
| DE69935333T2 true DE69935333T2 (de) | 2007-10-11 |
Family
ID=22347304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69935333T Expired - Lifetime DE69935333T2 (de) | 1998-07-09 | 1999-07-09 | Verbessertes verfahren zur herstellung leitender spuren und so hergestellte gedruckte leiterplatten |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US6117300A (enExample) |
| EP (1) | EP1099361B1 (enExample) |
| JP (1) | JP4959052B2 (enExample) |
| KR (1) | KR100599139B1 (enExample) |
| CN (1) | CN100344212C (enExample) |
| AT (1) | ATE355726T1 (enExample) |
| CA (1) | CA2336918C (enExample) |
| DE (1) | DE69935333T2 (enExample) |
| TW (1) | TW480902B (enExample) |
| WO (1) | WO2000003568A1 (enExample) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6884944B1 (en) | 1998-01-14 | 2005-04-26 | Mitsui Mining & Smelting Co., Ltd. | Multi-layer printed wiring boards having blind vias |
| WO2000007197A2 (en) * | 1998-07-31 | 2000-02-10 | Oak-Mitsui Inc. | Composition and method for manufacturing integral resistors in printed circuit boards |
| JP3690962B2 (ja) * | 2000-04-26 | 2005-08-31 | 三井金属鉱業株式会社 | キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法並びに銅張積層板 |
| US6426290B1 (en) * | 2000-08-18 | 2002-07-30 | Advanced Micro Devices, Inc. | Electroplating both sides of a workpiece |
| US6447929B1 (en) * | 2000-08-29 | 2002-09-10 | Gould Electronics Inc. | Thin copper on usable carrier and method of forming same |
| KR100899588B1 (ko) * | 2000-10-26 | 2009-05-27 | 오우크-미츠이, 인크 . | 인쇄 회로 기판 제조에서 옥사이드 공정을 대체하고 미세라인을 제조하기 위해 구리 포일을 금속 처리하는 인쇄회로 기판 제조 방법 |
| US6763575B2 (en) * | 2001-06-11 | 2004-07-20 | Oak-Mitsui Inc. | Printed circuit boards having integrated inductor cores |
| JP2003051673A (ja) * | 2001-08-06 | 2003-02-21 | Mitsui Mining & Smelting Co Ltd | プリント配線板用銅箔及びそのプリント配線板用銅箔を用いた銅張積層板 |
| US6610417B2 (en) | 2001-10-04 | 2003-08-26 | Oak-Mitsui, Inc. | Nickel coated copper as electrodes for embedded passive devices |
| US6770976B2 (en) | 2002-02-13 | 2004-08-03 | Nikko Materials Usa, Inc. | Process for manufacturing copper foil on a metal carrier substrate |
| US7261920B2 (en) * | 2002-04-24 | 2007-08-28 | Sipix Imaging, Inc. | Process for forming a patterned thin film structure on a substrate |
| US7972472B2 (en) * | 2002-04-24 | 2011-07-05 | Sipix Imaging, Inc. | Process for forming a patterned thin film structure for in-mold decoration |
| TWI268813B (en) * | 2002-04-24 | 2006-12-21 | Sipix Imaging Inc | Process for forming a patterned thin film conductive structure on a substrate |
| US7156945B2 (en) * | 2002-04-24 | 2007-01-02 | Sipix Imaging, Inc. | Process for forming a patterned thin film structure for in-mold decoration |
| US8002948B2 (en) * | 2002-04-24 | 2011-08-23 | Sipix Imaging, Inc. | Process for forming a patterned thin film structure on a substrate |
| US7767126B2 (en) * | 2005-08-22 | 2010-08-03 | Sipix Imaging, Inc. | Embossing assembly and methods of preparation |
| KR101232137B1 (ko) | 2005-11-21 | 2013-02-12 | 엘지디스플레이 주식회사 | 인쇄판, 인쇄판의 제조방법 및 그를 이용한 액정표시소자제조방법 |
| EP2312022A4 (en) * | 2008-07-22 | 2012-11-14 | Furukawa Electric Co Ltd | SURFACE-TREATED COPPER AND COPPER-COATED LAMINATE |
| WO2011159929A1 (en) * | 2010-06-17 | 2011-12-22 | Ddi Global Corp. | Systems and methods for reducing overhang on electroplated surfaces of printed circuit boards |
| KR102038137B1 (ko) * | 2012-12-21 | 2019-10-30 | 주식회사 넥스플렉스 | 다층 연성금속박 적층체 및 이의 제조방법 |
| US9707738B1 (en) | 2016-01-14 | 2017-07-18 | Chang Chun Petrochemical Co., Ltd. | Copper foil and methods of use |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE503299A (enExample) * | 1949-10-29 | |||
| US3469982A (en) * | 1968-09-11 | 1969-09-30 | Jack Richard Celeste | Process for making photoresists |
| US3857681A (en) * | 1971-08-03 | 1974-12-31 | Yates Industries | Copper foil treatment and products produced therefrom |
| US3998601A (en) * | 1973-12-03 | 1976-12-21 | Yates Industries, Inc. | Thin foil |
| US3984598A (en) * | 1974-02-08 | 1976-10-05 | Universal Oil Products Company | Metal-clad laminates |
| US3981691A (en) * | 1974-07-01 | 1976-09-21 | Minnesota Mining And Manufacturing Company | Metal-clad dielectric sheeting having an improved bond between the metal and dielectric layers |
| JPS5856758B2 (ja) * | 1975-12-17 | 1983-12-16 | ミツイアナコンダドウハク カブシキガイシヤ | ドウハクヒヨウメンシヨリホウホウ |
| US4088544A (en) * | 1976-04-19 | 1978-05-09 | Hutkin Irving J | Composite and method for making thin copper foil |
| US4049431A (en) * | 1976-09-30 | 1977-09-20 | The United States Of America As Represented By The United States Energy Research And Development Administration | High strength ferritic alloy |
| US4082620A (en) * | 1977-04-29 | 1978-04-04 | Bell Telephone Laboratories, Incorporated | Process for chromating metallic surfaces |
| US4357395A (en) * | 1980-08-22 | 1982-11-02 | General Electric Company | Transfer lamination of vapor deposited foils, method and product |
| US4808967A (en) * | 1985-05-29 | 1989-02-28 | Ohmega Electronics | Circuit board material |
| US4863808A (en) * | 1985-09-13 | 1989-09-05 | Gould Inc. | Copper-chromium-polyimide composite |
| DE3576900D1 (de) * | 1985-12-30 | 1990-05-03 | Ibm Deutschland | Verfahren zum herstellen von gedruckten schaltungen. |
| JPS62173748A (ja) * | 1986-01-27 | 1987-07-30 | Hitachi Cable Ltd | 半導体用リ−ドフレ−ムの製造方法 |
| JPS648694A (en) * | 1987-06-30 | 1989-01-12 | Hitachi Chemical Co Ltd | Manufacture of insulating substrate with thin nickel layer |
| JP2550081B2 (ja) * | 1987-07-08 | 1996-10-30 | 株式会社日立製作所 | 回路形成法 |
| JPH01124286A (ja) * | 1987-11-09 | 1989-05-17 | Hitachi Chem Co Ltd | プリント配線板の製造法 |
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| US5017271A (en) * | 1990-08-24 | 1991-05-21 | Gould Inc. | Method for printed circuit board pattern making using selectively etchable metal layers |
| TW230290B (enExample) * | 1991-11-15 | 1994-09-11 | Nikko Guruder Foreer Kk | |
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| US5685970A (en) * | 1992-07-01 | 1997-11-11 | Gould Electronics Inc. | Method and apparatus for sequentially metalized polymeric films and products made thereby |
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| AU2993997A (en) * | 1996-05-01 | 1997-11-19 | Allied-Signal Inc. | New method of forming fine circuit lines |
-
1998
- 1998-07-09 US US09/113,043 patent/US6117300A/en not_active Expired - Lifetime
-
1999
- 1999-07-09 DE DE69935333T patent/DE69935333T2/de not_active Expired - Lifetime
- 1999-07-09 KR KR1020017000254A patent/KR100599139B1/ko not_active Expired - Fee Related
- 1999-07-09 CN CNB998083623A patent/CN100344212C/zh not_active Expired - Lifetime
- 1999-07-09 WO PCT/US1999/015546 patent/WO2000003568A1/en not_active Ceased
- 1999-07-09 JP JP2000559716A patent/JP4959052B2/ja not_active Expired - Fee Related
- 1999-07-09 AT AT99930884T patent/ATE355726T1/de active
- 1999-07-09 TW TW088111684A patent/TW480902B/zh not_active IP Right Cessation
- 1999-07-09 EP EP99930884A patent/EP1099361B1/en not_active Expired - Lifetime
- 1999-07-09 CA CA002336918A patent/CA2336918C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR100599139B1 (ko) | 2006-07-12 |
| CN1308836A (zh) | 2001-08-15 |
| ATE355726T1 (de) | 2006-03-15 |
| KR20010079509A (ko) | 2001-08-22 |
| CA2336918A1 (en) | 2000-01-20 |
| WO2000003568A1 (en) | 2000-01-20 |
| JP4959052B2 (ja) | 2012-06-20 |
| EP1099361B1 (en) | 2007-02-28 |
| WO2000003568A9 (en) | 2000-06-08 |
| CA2336918C (en) | 2008-02-26 |
| DE69935333D1 (de) | 2007-04-12 |
| US6117300A (en) | 2000-09-12 |
| EP1099361A1 (en) | 2001-05-16 |
| CN100344212C (zh) | 2007-10-17 |
| JP2002520195A (ja) | 2002-07-09 |
| TW480902B (en) | 2002-03-21 |
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| 8364 | No opposition during term of opposition |