JPS648694A - Manufacture of insulating substrate with thin nickel layer - Google Patents
Manufacture of insulating substrate with thin nickel layerInfo
- Publication number
- JPS648694A JPS648694A JP16371987A JP16371987A JPS648694A JP S648694 A JPS648694 A JP S648694A JP 16371987 A JP16371987 A JP 16371987A JP 16371987 A JP16371987 A JP 16371987A JP S648694 A JPS648694 A JP S648694A
- Authority
- JP
- Japan
- Prior art keywords
- nickel layer
- thin
- support
- layer
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
PURPOSE:To manufacture an insulating plate with a metal layer without pinhole even if it is thin by forming a thin nickel layer on the uneven face of a metal foil support having the uneven face, laminating the thin layer with an insulating organic material to be integrated, and then selectively removing the support by etching. CONSTITUTION:A nickel layer formed by electroless nickel plating or the like on a metal foil support, such as a copper foil or the like having an uneven face is formed in a uniform thickness along the rough shape of the copper foil surface. Thus, after the copper foil formed with the nickel layer and resin are laminated, a thin nickel layer is transferred simultaneously with the uneven shape of the support to a substrate surface on which only the copper is removed by etching. The electroless plating provides less irregularity in the thickness of plating film according to the place, and scarcely generates a pinhole. Accordingly, the laminated plate with extrathin metal foil smaller than 5mum in thickness can be manufactured.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16371987A JPS648694A (en) | 1987-06-30 | 1987-06-30 | Manufacture of insulating substrate with thin nickel layer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16371987A JPS648694A (en) | 1987-06-30 | 1987-06-30 | Manufacture of insulating substrate with thin nickel layer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS648694A true JPS648694A (en) | 1989-01-12 |
Family
ID=15779351
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16371987A Pending JPS648694A (en) | 1987-06-30 | 1987-06-30 | Manufacture of insulating substrate with thin nickel layer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS648694A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997041713A1 (en) * | 1996-05-01 | 1997-11-06 | Alliedsignal Inc. | New method of forming fine circuit lines |
WO2000003568A1 (en) * | 1998-07-09 | 2000-01-20 | Oak-Mitsui, Inc. | Improved method for forming conductive traces and printed circuits made thereby |
-
1987
- 1987-06-30 JP JP16371987A patent/JPS648694A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997041713A1 (en) * | 1996-05-01 | 1997-11-06 | Alliedsignal Inc. | New method of forming fine circuit lines |
US6117300A (en) * | 1996-05-01 | 2000-09-12 | Honeywell International Inc. | Method for forming conductive traces and printed circuits made thereby |
WO2000003568A1 (en) * | 1998-07-09 | 2000-01-20 | Oak-Mitsui, Inc. | Improved method for forming conductive traces and printed circuits made thereby |
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