JPS648694A - Manufacture of insulating substrate with thin nickel layer - Google Patents

Manufacture of insulating substrate with thin nickel layer

Info

Publication number
JPS648694A
JPS648694A JP16371987A JP16371987A JPS648694A JP S648694 A JPS648694 A JP S648694A JP 16371987 A JP16371987 A JP 16371987A JP 16371987 A JP16371987 A JP 16371987A JP S648694 A JPS648694 A JP S648694A
Authority
JP
Japan
Prior art keywords
nickel layer
thin
support
layer
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16371987A
Other languages
Japanese (ja)
Inventor
Kazuyasu Minagawa
Akishi Nakaso
Toshiro Okamura
Akinari Kida
Yoshiaki Tsubomatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP16371987A priority Critical patent/JPS648694A/en
Publication of JPS648694A publication Critical patent/JPS648694A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

PURPOSE:To manufacture an insulating plate with a metal layer without pinhole even if it is thin by forming a thin nickel layer on the uneven face of a metal foil support having the uneven face, laminating the thin layer with an insulating organic material to be integrated, and then selectively removing the support by etching. CONSTITUTION:A nickel layer formed by electroless nickel plating or the like on a metal foil support, such as a copper foil or the like having an uneven face is formed in a uniform thickness along the rough shape of the copper foil surface. Thus, after the copper foil formed with the nickel layer and resin are laminated, a thin nickel layer is transferred simultaneously with the uneven shape of the support to a substrate surface on which only the copper is removed by etching. The electroless plating provides less irregularity in the thickness of plating film according to the place, and scarcely generates a pinhole. Accordingly, the laminated plate with extrathin metal foil smaller than 5mum in thickness can be manufactured.
JP16371987A 1987-06-30 1987-06-30 Manufacture of insulating substrate with thin nickel layer Pending JPS648694A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16371987A JPS648694A (en) 1987-06-30 1987-06-30 Manufacture of insulating substrate with thin nickel layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16371987A JPS648694A (en) 1987-06-30 1987-06-30 Manufacture of insulating substrate with thin nickel layer

Publications (1)

Publication Number Publication Date
JPS648694A true JPS648694A (en) 1989-01-12

Family

ID=15779351

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16371987A Pending JPS648694A (en) 1987-06-30 1987-06-30 Manufacture of insulating substrate with thin nickel layer

Country Status (1)

Country Link
JP (1) JPS648694A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997041713A1 (en) * 1996-05-01 1997-11-06 Alliedsignal Inc. New method of forming fine circuit lines
WO2000003568A1 (en) * 1998-07-09 2000-01-20 Oak-Mitsui, Inc. Improved method for forming conductive traces and printed circuits made thereby

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997041713A1 (en) * 1996-05-01 1997-11-06 Alliedsignal Inc. New method of forming fine circuit lines
US6117300A (en) * 1996-05-01 2000-09-12 Honeywell International Inc. Method for forming conductive traces and printed circuits made thereby
WO2000003568A1 (en) * 1998-07-09 2000-01-20 Oak-Mitsui, Inc. Improved method for forming conductive traces and printed circuits made thereby

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