DE69927532D1 - Halbleiteranordnung aus vergossenem Kunststoff - Google Patents

Halbleiteranordnung aus vergossenem Kunststoff

Info

Publication number
DE69927532D1
DE69927532D1 DE69927532T DE69927532T DE69927532D1 DE 69927532 D1 DE69927532 D1 DE 69927532D1 DE 69927532 T DE69927532 T DE 69927532T DE 69927532 T DE69927532 T DE 69927532T DE 69927532 D1 DE69927532 D1 DE 69927532D1
Authority
DE
Germany
Prior art keywords
molded plastic
semiconductor assembly
semiconductor
assembly
molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69927532T
Other languages
English (en)
Other versions
DE69927532T2 (de
Inventor
Minamio Masanori
Takemura Kunikazi
Yamada Yuichiro
Ito Fumito
Matsuo Takahiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP04604099A external-priority patent/JP3535760B2/ja
Priority claimed from JP11095185A external-priority patent/JP3007632B1/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69927532D1 publication Critical patent/DE69927532D1/de
Application granted granted Critical
Publication of DE69927532T2 publication Critical patent/DE69927532T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
DE69927532T 1999-02-24 1999-11-04 Halbleiteranordnung aus vergossenem Kunststoff Expired - Lifetime DE69927532T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP4604099 1999-02-24
JP04604099A JP3535760B2 (ja) 1999-02-24 1999-02-24 樹脂封止型半導体装置，その製造方法及びリードフレーム
JP11095185A JP3007632B1 (ja) 1999-04-01 1999-04-01 樹脂封止型半導体装置およびその製造方法
JP9518599 1999-04-01

Publications (2)

Publication Number Publication Date
DE69927532D1 true DE69927532D1 (de) 2006-02-09
DE69927532T2 DE69927532T2 (de) 2006-03-16

Family

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Family Applications (3)

Application Number Title Priority Date Filing Date
DE69917880T Expired - Lifetime DE69917880T2 (de) 1999-02-24 1999-11-04 Halbleiteranordnung aus vergossenem Kunststoff, Verfahren zu ihrer Herstellung, und Leiterrahmen
DE69932268T Expired - Lifetime DE69932268T2 (de) 1999-02-24 1999-11-04 Halbleiteranordnung aus vergossenem Kunststoff und Verfahren zu Ihrer Herstellung
DE69927532T Expired - Lifetime DE69927532T2 (de) 1999-02-24 1999-11-04 Halbleiteranordnung aus vergossenem Kunststoff

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Application Number Title Priority Date Filing Date
DE69917880T Expired - Lifetime DE69917880T2 (de) 1999-02-24 1999-11-04 Halbleiteranordnung aus vergossenem Kunststoff, Verfahren zu ihrer Herstellung, und Leiterrahmen
DE69932268T Expired - Lifetime DE69932268T2 (de) 1999-02-24 1999-11-04 Halbleiteranordnung aus vergossenem Kunststoff und Verfahren zu Ihrer Herstellung

Country Status (4)

Country Link
US (2) US6208020B1 (de)
EP (3) EP1335428B1 (de)
DE (3) DE69917880T2 (de)
TW (1) TW428295B (de)

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EP1335428B1 (de) 2006-07-05
DE69932268D1 (de) 2006-08-17
DE69927532T2 (de) 2006-03-16
EP1335427A3 (de) 2003-10-08
EP1032037A3 (de) 2001-04-25
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DE69917880T2 (de) 2004-10-07
EP1032037B1 (de) 2004-06-09
EP1335427B1 (de) 2005-09-28
US6338984B2 (en) 2002-01-15
EP1335427A2 (de) 2003-08-13
EP1032037A2 (de) 2000-08-30
DE69932268T2 (de) 2006-11-09
TW428295B (en) 2001-04-01
US6208020B1 (en) 2001-03-27
US20010007780A1 (en) 2001-07-12
EP1335428A3 (de) 2003-10-08

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