DE69809787D1 - Montagemethode für halbleiterbauteil auf einer leiterplatte - Google Patents

Montagemethode für halbleiterbauteil auf einer leiterplatte

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Publication number
DE69809787D1
DE69809787D1 DE69809787T DE69809787T DE69809787D1 DE 69809787 D1 DE69809787 D1 DE 69809787D1 DE 69809787 T DE69809787 T DE 69809787T DE 69809787 T DE69809787 T DE 69809787T DE 69809787 D1 DE69809787 D1 DE 69809787D1
Authority
DE
Germany
Prior art keywords
pcb
assembly method
semiconductor components
semiconductor
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69809787T
Other languages
English (en)
Other versions
DE69809787T2 (de
Inventor
Yoshihiko Yagi
Hiroyuki Otani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69809787D1 publication Critical patent/DE69809787D1/de
Application granted granted Critical
Publication of DE69809787T2 publication Critical patent/DE69809787T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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    • H05K2201/10954—Other details of electrical connections
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
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    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Die Bonding (AREA)
DE69809787T 1997-10-02 1998-09-30 Montagemethode für halbleiterbauteil auf einer leiterplatte Expired - Lifetime DE69809787T2 (de)

Applications Claiming Priority (2)

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JP26966597 1997-10-02
PCT/JP1998/004401 WO1999018766A1 (en) 1997-10-02 1998-09-30 Method for mounting semiconductor element to circuit board, and semiconductor device

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DE69809787D1 true DE69809787D1 (de) 2003-01-09
DE69809787T2 DE69809787T2 (de) 2003-09-18

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DE69831101T Expired - Fee Related DE69831101T2 (de) 1997-10-02 1998-09-30 Montagemethode für Halbleiterbauteile auf einer Leiterplatte
DE69809787T Expired - Lifetime DE69809787T2 (de) 1997-10-02 1998-09-30 Montagemethode für halbleiterbauteil auf einer leiterplatte

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EP (3) EP1020104B1 (de)
KR (1) KR100395444B1 (de)
CN (1) CN1138460C (de)
DE (3) DE69831100T2 (de)
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AT410882B (de) * 2000-08-17 2003-08-25 Datacon Semiconductor Equip Verfahren und einrichtung zum befestigen von elektronischen schaltungen
JP2002261262A (ja) * 2001-03-01 2002-09-13 Mitsubishi Heavy Ind Ltd イメージセンサ及びその製造方法
DE10110999A1 (de) * 2001-03-07 2002-10-02 Infineon Technologies Ag Anordnung mit elektronischem Bauteil und einer Leiterplatte
US7656678B2 (en) * 2001-10-26 2010-02-02 Entorian Technologies, Lp Stacked module systems
WO2004010499A1 (ja) 2002-07-19 2004-01-29 Matsushita Electric Industrial Co., Ltd. モジュール部品
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DE69831101D1 (de) 2005-09-08
WO1999018766A1 (en) 1999-04-15
KR100395444B1 (ko) 2003-08-21
EP1020104A1 (de) 2000-07-19
DE69831100D1 (de) 2005-09-08
DE69831101T2 (de) 2006-06-08
EP1175138A2 (de) 2002-01-23
CN1138460C (zh) 2004-02-11
EP1020104B1 (de) 2002-11-27
DE69831100T2 (de) 2006-06-08
CN1271509A (zh) 2000-10-25
DE69809787T2 (de) 2003-09-18
EP1194030A1 (de) 2002-04-03
EP1175138A3 (de) 2002-03-13
TW398045B (en) 2000-07-11
EP1194030B1 (de) 2005-08-03
EP1175138B1 (de) 2005-08-03
US6651320B1 (en) 2003-11-25

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