DE69831101D1 - Montagemethode für Halbleiterbauteile auf einer Leiterplatte - Google Patents

Montagemethode für Halbleiterbauteile auf einer Leiterplatte

Info

Publication number
DE69831101D1
DE69831101D1 DE69831101T DE69831101T DE69831101D1 DE 69831101 D1 DE69831101 D1 DE 69831101D1 DE 69831101 T DE69831101 T DE 69831101T DE 69831101 T DE69831101 T DE 69831101T DE 69831101 D1 DE69831101 D1 DE 69831101D1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
semiconductor devices
mounting method
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69831101T
Other languages
English (en)
Other versions
DE69831101T2 (de
Inventor
Yoshihiko Yagi
Hiroyuki Otani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69831101D1 publication Critical patent/DE69831101D1/de
Publication of DE69831101T2 publication Critical patent/DE69831101T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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    • H05K2201/10954—Other details of electrical connections
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
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Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Die Bonding (AREA)
DE69831101T 1997-10-02 1998-09-30 Montagemethode für Halbleiterbauteile auf einer Leiterplatte Expired - Fee Related DE69831101T2 (de)

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AT410882B (de) * 2000-08-17 2003-08-25 Datacon Semiconductor Equip Verfahren und einrichtung zum befestigen von elektronischen schaltungen
JP2002261262A (ja) * 2001-03-01 2002-09-13 Mitsubishi Heavy Ind Ltd イメージセンサ及びその製造方法
DE10110999A1 (de) * 2001-03-07 2002-10-02 Infineon Technologies Ag Anordnung mit elektronischem Bauteil und einer Leiterplatte
US7656678B2 (en) * 2001-10-26 2010-02-02 Entorian Technologies, Lp Stacked module systems
WO2004010499A1 (ja) * 2002-07-19 2004-01-29 Matsushita Electric Industrial Co., Ltd. モジュール部品
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TW398045B (en) 2000-07-11
WO1999018766A1 (en) 1999-04-15
EP1020104A1 (de) 2000-07-19
CN1271509A (zh) 2000-10-25
DE69831100D1 (de) 2005-09-08
DE69831101T2 (de) 2006-06-08
KR100395444B1 (ko) 2003-08-21
EP1175138A3 (de) 2002-03-13
US6651320B1 (en) 2003-11-25
EP1194030B1 (de) 2005-08-03
EP1020104B1 (de) 2002-11-27
EP1175138B1 (de) 2005-08-03
DE69831100T2 (de) 2006-06-08
EP1175138A2 (de) 2002-01-23
DE69809787T2 (de) 2003-09-18
DE69809787D1 (de) 2003-01-09
KR20010024320A (ko) 2001-03-26
CN1138460C (zh) 2004-02-11
EP1194030A1 (de) 2002-04-03

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