DE69503096T2 - Einrichtung zum Montieren von elektrischen Teilen auf einer Leiterplatte - Google Patents

Einrichtung zum Montieren von elektrischen Teilen auf einer Leiterplatte

Info

Publication number
DE69503096T2
DE69503096T2 DE69503096T DE69503096T DE69503096T2 DE 69503096 T2 DE69503096 T2 DE 69503096T2 DE 69503096 T DE69503096 T DE 69503096T DE 69503096 T DE69503096 T DE 69503096T DE 69503096 T2 DE69503096 T2 DE 69503096T2
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
electrical parts
mounting electrical
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69503096T
Other languages
English (en)
Other versions
DE69503096D1 (de
Inventor
William J Avery
John S Suy
David M Tichane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tandem Computers Inc
Original Assignee
Tandem Computers Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tandem Computers Inc filed Critical Tandem Computers Inc
Application granted granted Critical
Publication of DE69503096D1 publication Critical patent/DE69503096D1/de
Publication of DE69503096T2 publication Critical patent/DE69503096T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53265—Means to assemble electrical device with work-holder for assembly

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Combinations Of Printed Boards (AREA)
DE69503096T 1994-05-17 1995-05-15 Einrichtung zum Montieren von elektrischen Teilen auf einer Leiterplatte Expired - Fee Related DE69503096T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/245,497 US5504988A (en) 1994-05-17 1994-05-17 Apparatus for mounting surface mount devices to a circuit board

Publications (2)

Publication Number Publication Date
DE69503096D1 DE69503096D1 (de) 1998-07-30
DE69503096T2 true DE69503096T2 (de) 1998-12-17

Family

ID=22926909

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69503096T Expired - Fee Related DE69503096T2 (de) 1994-05-17 1995-05-15 Einrichtung zum Montieren von elektrischen Teilen auf einer Leiterplatte

Country Status (5)

Country Link
US (1) US5504988A (de)
EP (1) EP0685990B1 (de)
JP (1) JPH0856100A (de)
CA (1) CA2149497A1 (de)
DE (1) DE69503096T2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5959840A (en) * 1994-05-17 1999-09-28 Tandem Computers Incorporated Apparatus for cooling multiple printed circuit board mounted electrical components
US5761795A (en) * 1994-10-05 1998-06-09 Enplas Corporation Pressing apparatus for connecting terminals of flexible circuit board
JP3339230B2 (ja) * 1995-01-17 2002-10-28 松下電器産業株式会社 プリント基板の支持装置および方法および実装装置
US5802707A (en) * 1996-03-28 1998-09-08 Intel Corporation Controlled bondline thickness attachment mechanism
KR100231152B1 (ko) * 1996-11-26 1999-11-15 윤종용 인쇄회로기판 상에 집적회로를 실장하기 위한실장방법
US6251219B1 (en) 1998-09-17 2001-06-26 Intermedics Inc. Method and apparatus for use in assembling electronic devices
US6505665B1 (en) 1998-09-17 2003-01-14 Intermedics, Inc. Method and apparatus for use in assembling electronic devices
DE10117797C2 (de) 2001-04-10 2003-04-17 Bosch Gmbh Robert Montagevorrichtung und Verfahren zum Aufbau eines elektronischen Bauteils
CN1209002C (zh) * 2001-10-12 2005-06-29 矽峰光电科技股份有限公司 影像感测器的对位装置
AP3901A (en) * 2011-07-20 2016-11-17 Visa Int Service Ass Expansion device placement apparatus

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3874768A (en) * 1974-03-11 1975-04-01 John M Cutchaw Integrated circuit connector
US4468074A (en) * 1978-05-22 1984-08-28 Rogers Corporation Solderless connection technique and apparatus
US4528747A (en) * 1982-12-02 1985-07-16 At&T Technologies, Inc. Method and apparatus for mounting multilead components on a circuit board
US4893403A (en) * 1988-04-15 1990-01-16 Hewlett-Packard Company Chip alignment method
JPH0638353B2 (ja) * 1988-07-18 1994-05-18 ヒロセ電機株式会社 電子部品用ソケット
US4933808A (en) * 1989-05-11 1990-06-12 Westinghouse Electric Corp. Solderless printed wiring board module and multi-module assembly
US5142444A (en) * 1989-08-31 1992-08-25 Hewlett-Packard Company Demountable tape-automated bonding system
US5006962A (en) * 1989-12-28 1991-04-09 Intel Corporation Apparatus for surface mounting an integrated circuit package
US5088930A (en) * 1990-11-20 1992-02-18 Advanced Interconnections Corporation Integrated circuit socket with reed-shaped leads
JP3013480B2 (ja) * 1991-03-12 2000-02-28 安藤電気株式会社 Ｉｃソケットのｉｃコンタクト機構
US5175410A (en) * 1991-06-28 1992-12-29 Digital Equipment Corporation IC package hold-down fixture
US5332463A (en) * 1992-01-15 1994-07-26 Cray Research, Inc. Self-aligned sealing fixture for use in assembly of microelectronic packages

Also Published As

Publication number Publication date
CA2149497A1 (en) 1995-11-18
EP0685990A2 (de) 1995-12-06
JPH0856100A (ja) 1996-02-27
US5504988A (en) 1996-04-09
DE69503096D1 (de) 1998-07-30
EP0685990A3 (de) 1995-12-27
EP0685990B1 (de) 1998-06-24

Similar Documents

Publication Publication Date Title
DE69831100D1 (de) Montagemethode für Halbleiterbauteile auf einer Leiterplatte
DE69020696D1 (de) Verfahren zum Montieren eines elektrischen Bauteils auf einer Leiterplatte.
DE69918489D1 (de) Erdungsklemme und dessen Montagestruktur auf einer Leiterplatte
DE69403044D1 (de) Verbesserung in einer Flussmittelvorrichtung zum Flusstragen auf einer Leiterplatte
DE69732174D1 (de) Zweiteilige elektromagnetische Abschirmvorrichtung zur Befestigung auf einer Leiterplatte
DE69204439D1 (de) Elektrischer Steckverbinder zum Aufnehmen einer Leiterplatte.
DE69433467D1 (de) Pressmaschine zur elektrischen Prüfung einer Leiterplatte
DE59700705D1 (de) Verfahren zum verlöten von elektronischen bauelementen auf einer leiterplatte
DE69410575D1 (de) Elektrische Verbinderanordnung zum Montieren auf gedruckte Leiterplatten
DE69105927D1 (de) Elektrische Verbinderanordung zum Montieren auf gedruckter Leiterplatte.
DE69825079D1 (de) Einrichtung zur durchführung eines magnetkreises auf einer leiterplatte
DE69401459T2 (de) Vorrichtung zum Montieren von elektronischen Bauelementen auf Platten
DE69503096D1 (de) Einrichtung zum Montieren von elektrischen Teilen auf einer Leiterplatte
DE69420144D1 (de) Elektrisches Stiftfeld auf einer Leiterplatte
DE69430707D1 (de) Elektrischer Verbinder zur Oberflächenmontage auf eine Leiterplatte
DE69400413T2 (de) Versorgungseinrichtung von Leiterplatten
DE59300799D1 (de) Leiterkarte für eine Leistungshalbleiter aufweisende Leistungselektronikschaltung.
DE69122047T2 (de) Elektrisches Gerät zum Anschliessen an eine Printplatte
DE69603600D1 (de) Kontaktanordnung zum lösbaren befestigen eines elektrischen bauteiles,insbesondere eines integrierten schaltkreises auf einer leiterplatte
DE69727722D1 (de) Vorrichtung zum Montieren eines elektrischen Verbinders auf eine Leiterplatte
KR950029030U (ko) 인쇄회로기판의 위치 고정장치
KR960009582U (ko) 인쇄회로기판 동분 제거장치
DE69904424T2 (de) Aufbau und Verfahren zum Montieren einer elektronischen Einheit auf eine gedruckte Schaltungsplatte
DE29718477U1 (de) Vorrichtung zum Abstützen von Leiterplatten in einer Bearbeitungsposition
KR950022289U (ko) 인쇄 회로 기판의 착탈 고정 장치

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee