DE69806966D1 - Erdungsklammer für leiterplatten - Google Patents

Erdungsklammer für leiterplatten

Info

Publication number
DE69806966D1
DE69806966D1 DE69806966T DE69806966T DE69806966D1 DE 69806966 D1 DE69806966 D1 DE 69806966D1 DE 69806966 T DE69806966 T DE 69806966T DE 69806966 T DE69806966 T DE 69806966T DE 69806966 D1 DE69806966 D1 DE 69806966D1
Authority
DE
Germany
Prior art keywords
pcb
earthing clamp
earthing
clamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69806966T
Other languages
English (en)
Other versions
DE69806966T2 (de
Inventor
A Moran
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm Inc
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of DE69806966D1 publication Critical patent/DE69806966D1/de
Application granted granted Critical
Publication of DE69806966T2 publication Critical patent/DE69806966T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/12Resilient or clamping means for holding component to structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2457Contacts for co-operating by abutting resilient; resiliently-mounted consisting of at least two resilient arms contacting the same counterpart
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/52Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/368Assembling printed circuits with other printed circuits parallel to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps
    • H05K3/4015Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1417Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142Spacers not being card guides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/0015Gaskets or seals
    • H05K9/0016Gaskets or seals having a spring contact
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0215Grounding of printed circuits by connection to external grounding means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0302Properties and characteristics in general
    • H05K2201/0311Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/1031Surface mounted metallic connector elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954Other details of electrical connections
    • H05K2201/10962Component not directly connected to the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/209Auto-mechanical connection between a component and a PCB or between two PCBs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
DE69806966T 1997-12-03 1998-11-30 Erdungsklammer für leiterplatten Expired - Lifetime DE69806966T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/984,443 US5984697A (en) 1997-12-03 1997-12-03 Ground clip apparatus for circuit boards
PCT/US1998/025419 WO1999029151A1 (en) 1997-12-03 1998-11-30 Ground clip apparatus for circuit boards

Publications (2)

Publication Number Publication Date
DE69806966D1 true DE69806966D1 (de) 2002-09-05
DE69806966T2 DE69806966T2 (de) 2003-04-24

Family

ID=25530555

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69806966T Expired - Lifetime DE69806966T2 (de) 1997-12-03 1998-11-30 Erdungsklammer für leiterplatten

Country Status (11)

Country Link
US (1) US5984697A (de)
EP (1) EP1038421B1 (de)
JP (1) JP4294861B2 (de)
KR (1) KR100513986B1 (de)
AU (1) AU737519B2 (de)
CA (1) CA2313017C (de)
DE (1) DE69806966T2 (de)
ES (1) ES2181311T3 (de)
HK (1) HK1032175A1 (de)
IL (1) IL136387A0 (de)
WO (1) WO1999029151A1 (de)

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TW472963U (en) * 1999-06-10 2002-01-11 Thomas & Amp Betts Internation Ground terminal
TW445020U (en) * 1999-06-22 2001-07-01 Hon Hai Prec Ind Co Ltd Grounding device
EP1121005A1 (de) * 2000-01-25 2001-08-01 TELEFONAKTIEBOLAGET LM ERICSSON (publ) Metallträger für Bauteil
US6821133B1 (en) * 2000-11-01 2004-11-23 Illinois Tool Works Inc. Printed circuit board mounting clip and system
TW536122U (en) * 2002-09-27 2003-06-01 Emi Stop Corp Corner elastic sheet
US6846986B1 (en) * 2003-11-07 2005-01-25 Intel Corporation Optical module ground strip
US7486240B2 (en) * 2004-10-12 2009-02-03 Qualcomm Incorporated Devices and methods for retaining an antenna
US7077692B2 (en) * 2004-10-12 2006-07-18 Qualcomm Incorporated Devices and methods for mounting circuit elements
WO2009044401A2 (en) 2007-10-02 2009-04-09 Yossi Gross External drug pump
US7967795B1 (en) 2010-01-19 2011-06-28 Lamodel Ltd. Cartridge interface assembly with driving plunger
US9656019B2 (en) 2007-10-02 2017-05-23 Medimop Medical Projects Ltd. Apparatuses for securing components of a drug delivery system during transport and methods of using same
US10420880B2 (en) 2007-10-02 2019-09-24 West Pharma. Services IL, Ltd. Key for securing components of a drug delivery system during assembly and/or transport and methods of using same
US9345836B2 (en) 2007-10-02 2016-05-24 Medimop Medical Projects Ltd. Disengagement resistant telescoping assembly and unidirectional method of assembly for such
US8064220B2 (en) * 2008-02-21 2011-11-22 Dell Products L.P. System and method for electrical communication through a non-conductive information handling system chassis surface
US9393369B2 (en) 2008-09-15 2016-07-19 Medimop Medical Projects Ltd. Stabilized pen injector
CN101997178B (zh) * 2009-08-26 2014-03-05 深圳富泰宏精密工业有限公司 弹片结构
US10071198B2 (en) 2012-11-02 2018-09-11 West Pharma. Servicees IL, Ltd. Adhesive structure for medical device
US8157769B2 (en) 2009-09-15 2012-04-17 Medimop Medical Projects Ltd. Cartridge insertion assembly for drug delivery system
US10071196B2 (en) 2012-05-15 2018-09-11 West Pharma. Services IL, Ltd. Method for selectively powering a battery-operated drug-delivery device and device therefor
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US8348898B2 (en) 2010-01-19 2013-01-08 Medimop Medical Projects Ltd. Automatic needle for drug pump
EP2569031B1 (de) 2010-05-10 2017-10-11 Medimop Medical Projects Ltd. Genauer injektor für geringe volumen
KR101811902B1 (ko) 2010-07-02 2018-01-25 톰슨 라이센싱 전자 디바이스에서 접지를 위한 시스템
US8875932B1 (en) * 2011-01-31 2014-11-04 J. Daniel Hankey Front load refuse container and lift pocket assembly
USD702834S1 (en) 2011-03-22 2014-04-15 Medimop Medical Projects Ltd. Cartridge for use in injection device
CN102740665A (zh) * 2011-04-08 2012-10-17 鸿富锦精密工业(深圳)有限公司 防电磁干扰弹片及采用该防电磁干扰弹片的电子装置
US9072827B2 (en) 2012-03-26 2015-07-07 Medimop Medical Projects Ltd. Fail safe point protector for needle safety flap
US9421323B2 (en) 2013-01-03 2016-08-23 Medimop Medical Projects Ltd. Door and doorstop for portable one use drug delivery apparatus
USD700941S1 (en) * 2013-01-04 2014-03-11 Warrior Sports, Inc. Lacrosse head
TW201431480A (zh) * 2013-01-22 2014-08-01 Askey Computer Corp 具電磁干擾防護的電子裝置
US9011164B2 (en) 2013-04-30 2015-04-21 Medimop Medical Projects Ltd. Clip contact for easy installation of printed circuit board PCB
EP3496523A1 (de) 2013-09-23 2019-06-12 Coriant Operations, Inc. Federclip zur fixierung eines kühlkörpers auf einem sfp/xfp-käfig
EP2874233B1 (de) * 2013-11-14 2017-01-25 Joinset Co., Ltd Oberflächenmontierbare elektrische Anschlussklemme und elektronische Moduleinheit und Leiterplatte damit
USD774273S1 (en) 2013-12-13 2016-12-20 General Mills, Inc. Shaped tortilla
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US10576207B2 (en) 2015-10-09 2020-03-03 West Pharma. Services IL, Ltd. Angled syringe patch injector
US9987432B2 (en) 2015-09-22 2018-06-05 West Pharma. Services IL, Ltd. Rotation resistant friction adapter for plunger driver of drug delivery device
CN113648488B (zh) 2015-10-09 2024-03-29 西医药服务以色列分公司 至预填充的流体储存器的弯曲流体路径附加装置
CN113041432B (zh) 2016-01-21 2023-04-07 西医药服务以色列有限公司 包括视觉指示物的药剂输送装置
CN111544704B (zh) 2016-01-21 2022-06-03 西医药服务以色列有限公司 自动注射器中的力牵制
WO2017127215A1 (en) 2016-01-21 2017-07-27 Medimop Medical Projects Ltd. Needle insertion and retraction mechanism
US11389597B2 (en) 2016-03-16 2022-07-19 West Pharma. Services IL, Ltd. Staged telescopic screw assembly having different visual indicators
EP3463526A1 (de) 2016-06-02 2019-04-10 West Pharma. Services Il, Ltd. Nadelrückzug mit drei positionen
US11338090B2 (en) 2016-08-01 2022-05-24 West Pharma. Services IL, Ltd. Anti-rotation cartridge pin
EP3978047B1 (de) 2016-08-01 2023-08-23 West Pharma Services IL, Ltd Feder zur verhinderung von teilweisem türverschluss
US9787032B1 (en) * 2016-10-14 2017-10-10 Apple Inc. Connector ground springs
CN110869072B (zh) 2017-05-30 2021-12-10 西部制药服务有限公司(以色列) 用于穿戴式注射器的模块化驱动机构
CN114470420A (zh) 2017-12-22 2022-05-13 西氏医药包装(以色列)有限公司 适用于不同尺寸的药筒的注射器
JP7089676B2 (ja) * 2019-01-31 2022-06-23 住友電装株式会社 ジョイントコネクタ
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US5460543A (en) * 1994-09-12 1995-10-24 Itt Corporation Boardlock assembly

Also Published As

Publication number Publication date
US5984697A (en) 1999-11-16
KR100513986B1 (ko) 2005-09-13
IL136387A0 (en) 2001-06-14
HK1032175A1 (en) 2001-07-06
DE69806966T2 (de) 2003-04-24
KR20010032755A (ko) 2001-04-25
EP1038421B1 (de) 2002-07-31
JP2001525620A (ja) 2001-12-11
CA2313017A1 (en) 1999-06-10
WO1999029151A1 (en) 1999-06-10
AU737519B2 (en) 2001-08-23
ES2181311T3 (es) 2003-02-16
EP1038421A1 (de) 2000-09-27
JP4294861B2 (ja) 2009-07-15
CA2313017C (en) 2006-12-19
AU1614399A (en) 1999-06-16

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Legal Events

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