ES2181311T3 - Dispositivo de fijacion a presion de masa para placa de circuito. - Google Patents

Dispositivo de fijacion a presion de masa para placa de circuito.

Info

Publication number
ES2181311T3
ES2181311T3 ES98960574T ES98960574T ES2181311T3 ES 2181311 T3 ES2181311 T3 ES 2181311T3 ES 98960574 T ES98960574 T ES 98960574T ES 98960574 T ES98960574 T ES 98960574T ES 2181311 T3 ES2181311 T3 ES 2181311T3
Authority
ES
Spain
Prior art keywords
circuit board
pressure fixing
fixing device
spring
ground
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES98960574T
Other languages
English (en)
Inventor
Sean A Moran
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm Inc
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Application granted granted Critical
Publication of ES2181311T3 publication Critical patent/ES2181311T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2457—Contacts for co-operating by abutting resilient; resiliently-mounted consisting of at least two resilient arms contacting the same counterpart
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • H05K9/0016—Gaskets or seals having a spring contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10962—Component not directly connected to the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/209—Auto-mechanical connection between a component and a PCB or between two PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

Dispositivo de fijación a presión de masa para conectar una toma de masa de una placa de circuito a otra placa de circuito, que comprende: un elemento separador de material conductor para su montaje en una primera placa de circuito y un elemento de fijación a presión de resorte de material conductor para su montaje en una segunda placa de circuito situada frente al elemento separador, presentando el elemento de fijación a presión de resorte una base para su conexión con la segunda placa de circuito y un par de brazos de resorte que sobresalen de la base para su unión elástica con el elemento separador cuando las dos placas de circuito se conectan entre sí, proporcionando conjuntamente el elemento separador y el elemento de fijación a presión de resorte una conexión a masa entre las dos placas y limitando el elemento separador la deflexión de la segunda placa de circuito.
ES98960574T 1997-12-03 1998-11-30 Dispositivo de fijacion a presion de masa para placa de circuito. Expired - Lifetime ES2181311T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/984,443 US5984697A (en) 1997-12-03 1997-12-03 Ground clip apparatus for circuit boards

Publications (1)

Publication Number Publication Date
ES2181311T3 true ES2181311T3 (es) 2003-02-16

Family

ID=25530555

Family Applications (1)

Application Number Title Priority Date Filing Date
ES98960574T Expired - Lifetime ES2181311T3 (es) 1997-12-03 1998-11-30 Dispositivo de fijacion a presion de masa para placa de circuito.

Country Status (11)

Country Link
US (1) US5984697A (es)
EP (1) EP1038421B1 (es)
JP (1) JP4294861B2 (es)
KR (1) KR100513986B1 (es)
AU (1) AU737519B2 (es)
CA (1) CA2313017C (es)
DE (1) DE69806966T2 (es)
ES (1) ES2181311T3 (es)
HK (1) HK1032175A1 (es)
IL (1) IL136387A0 (es)
WO (1) WO1999029151A1 (es)

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TW445020U (en) * 1999-06-22 2001-07-01 Hon Hai Prec Ind Co Ltd Grounding device
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US6821133B1 (en) * 2000-11-01 2004-11-23 Illinois Tool Works Inc. Printed circuit board mounting clip and system
TW536122U (en) * 2002-09-27 2003-06-01 Emi Stop Corp Corner elastic sheet
US6846986B1 (en) * 2003-11-07 2005-01-25 Intel Corporation Optical module ground strip
US7077692B2 (en) * 2004-10-12 2006-07-18 Qualcomm Incorporated Devices and methods for mounting circuit elements
US7486240B2 (en) * 2004-10-12 2009-02-03 Qualcomm Incorporated Devices and methods for retaining an antenna
EP2195052B1 (en) 2007-10-02 2019-09-04 Medimop Medical Projects Ltd. External drug pump
US9345836B2 (en) 2007-10-02 2016-05-24 Medimop Medical Projects Ltd. Disengagement resistant telescoping assembly and unidirectional method of assembly for such
US9656019B2 (en) 2007-10-02 2017-05-23 Medimop Medical Projects Ltd. Apparatuses for securing components of a drug delivery system during transport and methods of using same
US7967795B1 (en) 2010-01-19 2011-06-28 Lamodel Ltd. Cartridge interface assembly with driving plunger
US10420880B2 (en) 2007-10-02 2019-09-24 West Pharma. Services IL, Ltd. Key for securing components of a drug delivery system during assembly and/or transport and methods of using same
US8064220B2 (en) * 2008-02-21 2011-11-22 Dell Products L.P. System and method for electrical communication through a non-conductive information handling system chassis surface
US9393369B2 (en) 2008-09-15 2016-07-19 Medimop Medical Projects Ltd. Stabilized pen injector
CN101997178B (zh) * 2009-08-26 2014-03-05 深圳富泰宏精密工业有限公司 弹片结构
US10071198B2 (en) 2012-11-02 2018-09-11 West Pharma. Servicees IL, Ltd. Adhesive structure for medical device
US10071196B2 (en) 2012-05-15 2018-09-11 West Pharma. Services IL, Ltd. Method for selectively powering a battery-operated drug-delivery device and device therefor
US8157769B2 (en) 2009-09-15 2012-04-17 Medimop Medical Projects Ltd. Cartridge insertion assembly for drug delivery system
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US8348898B2 (en) 2010-01-19 2013-01-08 Medimop Medical Projects Ltd. Automatic needle for drug pump
WO2011141907A1 (en) 2010-05-10 2011-11-17 Medimop Medical Projects Ltd. Low volume accurate injector
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CN107683158B (zh) 2015-06-04 2021-05-14 麦迪麦珀医疗工程有限公司 用于药物释放装置的筒插入
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US10576207B2 (en) 2015-10-09 2020-03-03 West Pharma. Services IL, Ltd. Angled syringe patch injector
CN108472438B (zh) 2015-10-09 2022-01-28 西医药服务以色列分公司 至预填充的流体储存器的弯曲流体路径附加装置
CN109219456B (zh) 2016-01-21 2020-05-15 西医药服务以色列有限公司 自动注射器中的力牵制
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CN113041432B (zh) 2016-01-21 2023-04-07 西医药服务以色列有限公司 包括视觉指示物的药剂输送装置
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Also Published As

Publication number Publication date
AU737519B2 (en) 2001-08-23
JP4294861B2 (ja) 2009-07-15
EP1038421A1 (en) 2000-09-27
KR100513986B1 (ko) 2005-09-13
AU1614399A (en) 1999-06-16
CA2313017A1 (en) 1999-06-10
EP1038421B1 (en) 2002-07-31
JP2001525620A (ja) 2001-12-11
WO1999029151A1 (en) 1999-06-10
KR20010032755A (ko) 2001-04-25
US5984697A (en) 1999-11-16
HK1032175A1 (en) 2001-07-06
DE69806966D1 (de) 2002-09-05
IL136387A0 (en) 2001-06-14
CA2313017C (en) 2006-12-19
DE69806966T2 (de) 2003-04-24

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