DE69614857D1 - Prepreg für gedruckte leiterplatten, harzlack, harzzusammensetzung und laminat für gedruckte leiterplatten - Google Patents

Prepreg für gedruckte leiterplatten, harzlack, harzzusammensetzung und laminat für gedruckte leiterplatten

Info

Publication number
DE69614857D1
DE69614857D1 DE69614857T DE69614857T DE69614857D1 DE 69614857 D1 DE69614857 D1 DE 69614857D1 DE 69614857 T DE69614857 T DE 69614857T DE 69614857 T DE69614857 T DE 69614857T DE 69614857 D1 DE69614857 D1 DE 69614857D1
Authority
DE
Germany
Prior art keywords
printed circuits
resin
prepreg
laminate
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69614857T
Other languages
English (en)
Other versions
DE69614857T2 (de
Inventor
Nozomu Takano
Shigeo Sase
Tomio Fukuda
Michitoshi Arata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of DE69614857D1 publication Critical patent/DE69614857D1/de
Publication of DE69614857T2 publication Critical patent/DE69614857T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/24—Coatings containing organic materials
    • C03C25/40—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
    • C08J5/08—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/248—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using pre-treated fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/50—Improvements relating to the production of bulk chemicals
    • Y02P20/582—Recycling of unreacted starting or intermediate materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber
    • Y10T428/2933—Coated or with bond, impregnation or core
    • Y10T428/2962—Silane, silicone or siloxane in coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2993—Silicic or refractory material containing [e.g., tungsten oxide, glass, cement, etc.]
    • Y10T428/2995—Silane, siloxane or silicone coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31609—Particulate metal or metal compound-containing
    • Y10T428/31612—As silicone, silane or siloxane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
DE1996614857 1995-06-27 1996-06-20 Prepreg für gedruckte leiterplatten, harzlack, harzzusammensetzung und laminat für gedruckte leiterplatten Expired - Lifetime DE69614857T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP16067495 1995-06-27
JP25587295 1995-10-03
JP25587195 1995-10-03
JP25587395 1995-10-03
PCT/JP1996/001708 WO1997001595A1 (fr) 1995-06-27 1996-06-20 Preimpregne pour cartes a circuits imprimes, vernis de resine, composition de resine et plaque feuilletee pour cartes a circuits imprimes produite avec ces substances

Publications (2)

Publication Number Publication Date
DE69614857D1 true DE69614857D1 (de) 2001-10-04
DE69614857T2 DE69614857T2 (de) 2002-04-11

Family

ID=27473690

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1996614857 Expired - Lifetime DE69614857T2 (de) 1995-06-27 1996-06-20 Prepreg für gedruckte leiterplatten, harzlack, harzzusammensetzung und laminat für gedruckte leiterplatten

Country Status (8)

Country Link
US (3) US6696155B1 (de)
EP (1) EP0837090B1 (de)
KR (1) KR100272785B1 (de)
CN (5) CN1234791C (de)
DE (1) DE69614857T2 (de)
MY (1) MY115821A (de)
TW (6) TW482788B (de)
WO (1) WO1997001595A1 (de)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4572423B2 (ja) * 1998-03-17 2010-11-04 日立化成工業株式会社 銅張積層板の製造方法及びこれを用いたプリント配線板、多層プリント配線板
US6524717B1 (en) * 1999-02-19 2003-02-25 Hitachi Chemical Co., Ltd. Prepreg, metal-clad laminate, and printed circuit board obtained from these
JP4872160B2 (ja) * 2000-03-21 2012-02-08 日立化成工業株式会社 誘電特性に優れる樹脂組成物並びにこれを用いて作製されるワニス、ワニスの製造方法、プリプレグ及び金属張積層板
TWI279420B (en) * 2000-03-21 2007-04-21 Hitachi Chemical Co Ltd Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepreg made with these, and metal-clad laminate
JP2001284753A (ja) * 2000-03-28 2001-10-12 Hitachi Chem Co Ltd 印刷配線板用プリプレグおよび積層板
CN1325565C (zh) 2000-03-31 2007-07-11 日立化成工业株式会社 热固性树脂组合物及使用其的物品
DE10037723A1 (de) * 2000-08-02 2002-02-14 Pfleiderer Ag Verfahren zur Herstellung eines Verbundwerkstoffes
US6706409B2 (en) * 2000-10-13 2004-03-16 Hitachi Chemical Co., Ltd. Incombustible resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board and multi-layer printed wiring board
JP2002201365A (ja) * 2001-01-05 2002-07-19 Hitachi Chem Co Ltd 樹脂組成物及びそれを含む被膜形成材料
JP4821059B2 (ja) * 2001-06-29 2011-11-24 日立化成工業株式会社 樹脂組成物ならびにそれを用いた難燃性の積層板および印刷配線板
ES2285634T3 (es) 2002-03-12 2007-11-16 Hamamatsu Photonics K. K. Metodo para dividir un siustrato.
AU2003236317A1 (en) 2002-03-29 2003-10-13 Du Pont-Toray Company, Ltd. Composite comprising heat-resistant fiber and siloxane polymer
EP1550678B1 (de) 2002-09-30 2008-03-26 Hitachi Chemical Co., Ltd. Harzzusammensetzung für leiterplatte und lack, prepreg und metallplattiertes laminat unter verwendung davon
CA2566302C (en) * 2004-05-17 2010-12-14 Ppg Industries Ohio, Inc. Sizing compositions for glass fibers and sized fiber glass products
US7947332B2 (en) * 2004-06-23 2011-05-24 Hitachi Chemical Company, Ltd. Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board
US7250381B2 (en) * 2004-11-12 2007-07-31 Johns Manville Fibrous nonwoven mats containing polyethermid fibers
EP1871824B1 (de) * 2005-03-24 2017-03-01 Bridgestone Corporation Verbindung eines durch silica verstärkten gummimaterials mit einer emission leicht flüchtiger organischer substanzen
JP2006313834A (ja) * 2005-05-09 2006-11-16 Nitto Denko Corp 配線回路基板の製造方法
EP2087403B1 (de) * 2006-11-01 2012-02-01 Koninklijke Philips Electronics N.V. Imprintmethode zur Herstellung einer Reliefschicht und deren Nutzung als Ätzmaske
US7915368B2 (en) * 2007-05-23 2011-03-29 Bridgestone Corporation Method for making alkoxy-modified silsesquioxanes
US8501895B2 (en) * 2007-05-23 2013-08-06 Bridgestone Corporation Method for making alkoxy-modified silsesquioxanes and amino alkoxy-modified silsesquioxanes
JP2009043914A (ja) * 2007-08-08 2009-02-26 Ishida Yukio 配線板の製造法および配線板
JP2008111188A (ja) * 2007-09-25 2008-05-15 Hitachi Chem Co Ltd プリント配線板用の銅箔
JP4924326B2 (ja) * 2007-09-25 2012-04-25 日立化成工業株式会社 プリント配線板用の銅箔
US8962746B2 (en) * 2007-12-27 2015-02-24 Bridgestone Corporation Methods of making blocked-mercapto alkoxy-modified silsesquioxane compounds
US8794282B2 (en) * 2007-12-31 2014-08-05 Bridgestone Corporation Amino alkoxy-modified silsesquioxane adhesives for improved metal adhesion and metal adhesion retention to cured rubber
US8097674B2 (en) * 2007-12-31 2012-01-17 Bridgestone Corporation Amino alkoxy-modified silsesquioxanes in silica-filled rubber with low volatile organic chemical evolution
EP2303896B1 (de) 2009-02-24 2013-11-06 International Business Machines Corporation Silankopplungsmittel für bestückte leiterplatten
US8642691B2 (en) 2009-12-28 2014-02-04 Bridgestone Corporation Amino alkoxy-modified silsesquioxane adhesives for improved metal adhesion and metal adhesion retention to cured rubber
US20110214909A1 (en) * 2010-03-05 2011-09-08 International Business Machines Corporation Hydrophobic Silane Coating for Preventing Conductive Anodic Filament (CAF) Growth in Printed Circuit Boards
CN102181127B (zh) * 2011-03-30 2012-12-05 同济大学 电路板回收粉料改性玻璃纤维增强环氧树脂复合材料的制备方法
TWI418545B (zh) * 2011-06-22 2013-12-11 Taiwan Union Technology Corp 三聚氰胺衍生物及其製法
WO2013146931A1 (ja) * 2012-03-30 2013-10-03 日立化成株式会社 多層配線板
CN105593016B (zh) * 2013-04-18 2018-04-10 一都公司 阻燃阻火层压膜
JP6297864B2 (ja) * 2014-03-11 2018-03-20 信越化学工業株式会社 金属張複合積層基板及び半導体装置
CN105778505B (zh) 2014-12-25 2019-04-30 广东生益科技股份有限公司 一种有机硅树脂组合物以及使用它的白色预浸料和白色层压板
US11401440B2 (en) 2014-12-31 2022-08-02 Bridgestone Corporation Amino alkoxy-modified silsesquioxane adhesives for adhering steel alloy to rubber
US10212812B2 (en) 2016-01-15 2019-02-19 International Business Machines Corporation Composite materials including filled hollow glass filaments
JP6793517B2 (ja) * 2016-10-17 2020-12-02 株式会社ダイセル シート状プリプレグ

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2649396A (en) * 1949-03-17 1953-08-18 Ralph K Witt Method of producing a bonded structure
US2683097A (en) * 1951-04-17 1954-07-06 Owens Corning Fiberglass Corp Coating glass fibers with unsaturated polysiloxanolate and article produced thereby
US3617613A (en) * 1968-10-17 1971-11-02 Spaulding Fibre Co Punchable printed circuit board base
US3825618A (en) * 1968-11-29 1974-07-23 Stauffer Chemical Co Curable organopolysiloxanes
US3579853A (en) * 1968-12-05 1971-05-25 Joseph J Martino Circuit board drier
US3607767A (en) * 1969-10-10 1971-09-21 Union Carbide Corp Azeothropic composition of 1,1,2-trifluoroethane,methylene chloride,and cyclopentane
US3876459A (en) * 1973-06-29 1975-04-08 Dow Corning Treatment of fibres
GB1543157A (en) * 1975-05-17 1979-03-28 Dow Corning Ltd Treatment of fibres
US4151157A (en) * 1977-06-28 1979-04-24 Union Carbide Corporation Polymer composite articles containing polysulfide silicon coupling agents
JPS5763708A (en) * 1980-10-06 1982-04-17 Toray Silicone Co Silicone rubber coated electric conductor
JPS5898367A (ja) * 1981-12-07 1983-06-11 Tokyo Denshi Kagaku Kabushiki シリコ−ン系被膜形成用組成物及びその製造方法
JPS61159427A (ja) * 1984-12-29 1986-07-19 Toshiba Silicone Co Ltd 表面処理用ポリオルガノシロキサン組成物
US4724167A (en) * 1986-05-30 1988-02-09 General Electric Company Treated silica fillers and process for making the same
JPS63183958A (ja) * 1986-09-04 1988-07-29 Toray Silicone Co Ltd 熱硬化性樹脂組成物
USRE36396E (en) * 1987-02-17 1999-11-16 Rogers Corporation Electrical substrate material comprising amorphous fused silica powder
DE3710240A1 (de) * 1987-03-27 1988-10-06 Siemens Ag Optische glasfaser mit einer primaerbeschichtung aus acrylsaeureestergruppenhaltigen organopolysiloxanen
JPH01141925A (ja) * 1987-11-30 1989-06-02 Honshu Paper Co Ltd パラ配向アラミド繊維シートを基材とする改良複合材料
JPH01204953A (ja) * 1988-02-12 1989-08-17 Chisso Corp 半導体封止用樹脂組成物
JP2751241B2 (ja) 1988-09-22 1998-05-18 日東紡績株式会社 プリント基板用ガラスクロスの製造方法
JPH0395232A (ja) * 1989-09-08 1991-04-19 Honshu Paper Co Ltd パラ配向アラミド繊維状物質を基材とする改良複合材料及びその製造法
DE4004946A1 (de) * 1990-02-16 1991-08-22 Wacker Chemie Gmbh Feinteilige organopolysiloxanemulsionen
JPH03287628A (ja) * 1990-04-03 1991-12-18 Nitto Boseki Co Ltd ガラス繊維強化樹脂積層板
US5182173A (en) * 1990-05-07 1993-01-26 Rogers Corporation Coated particles and method for making same
JP3047924B2 (ja) 1990-12-11 2000-06-05 旭シュエーベル株式会社 プリント配線基板
US5063260A (en) * 1991-05-01 1991-11-05 Dow Corning Corporation Compositions and their use for treating fibers
JP3287628B2 (ja) 1993-02-03 2002-06-04 日本碍子株式会社 無効電力補償装置
US5674625A (en) * 1993-11-10 1997-10-07 Central Glass Company, Limited Multilayered water-repellent film and method of forming same on glass substrate
JP3373277B2 (ja) * 1993-12-28 2003-02-04 住友ゴム工業株式会社 塗装ゴルフボール
JP3359410B2 (ja) * 1994-03-04 2002-12-24 三菱電機株式会社 成形用エポキシ樹脂組成物ならびにそれを用いた高電圧機器用モールド製品およびその製法
DE4444780A1 (de) * 1994-12-15 1996-06-20 Wacker Chemie Gmbh Zusammensetzung für die Beschichtung von Formteilen oder elastomeren Materialien
ES2157008T3 (es) * 1995-09-19 2001-08-01 Inst Neue Mat Gemein Gmbh Peliculas delgadas de sio2, procedimiento para su obtencion y utilizacion de las mismas.
JP2000508684A (ja) * 1996-04-04 2000-07-11 ナノフェイズ テクノロジーズ コーポレイション シロキサン星形グラフトポリマー、それによりコーティングされたセラミック粉末、及びコーティングされたセラミック粉末を調製する方法
US6001921A (en) * 1997-09-11 1999-12-14 Nec Corporation Flame retardant resin composition
US6472067B1 (en) * 2001-09-27 2002-10-29 Hc Chem Research And Service Corp. Non-flammable polymer composite panels

Also Published As

Publication number Publication date
CN1100816C (zh) 2003-02-05
US20030180536A1 (en) 2003-09-25
DE69614857T2 (de) 2002-04-11
CN1112395C (zh) 2003-06-25
EP0837090B1 (de) 2001-08-29
US6696155B1 (en) 2004-02-24
TW482788B (en) 2002-04-11
TW482786B (en) 2002-04-11
EP0837090A4 (de) 1999-03-17
CN1427034A (zh) 2003-07-02
TW482787B (en) 2002-04-11
CN1427053A (zh) 2003-07-02
CN1312309A (zh) 2001-09-12
CN1234791C (zh) 2006-01-04
CN1189843A (zh) 1998-08-05
CN1225508C (zh) 2005-11-02
KR100272785B1 (ko) 2000-11-15
KR19990028470A (ko) 1999-04-15
CN1225502C (zh) 2005-11-02
TW482785B (en) 2002-04-11
MY115821A (en) 2003-09-30
TW436496B (en) 2001-05-28
WO1997001595A1 (fr) 1997-01-16
EP0837090A1 (de) 1998-04-22
US20010053447A1 (en) 2001-12-20
CN1427039A (zh) 2003-07-02
US6692792B2 (en) 2004-02-17
TW482789B (en) 2002-04-11
US6572968B2 (en) 2003-06-03

Similar Documents

Publication Publication Date Title
DE69614857D1 (de) Prepreg für gedruckte leiterplatten, harzlack, harzzusammensetzung und laminat für gedruckte leiterplatten
DE69317862D1 (de) Harzzusammensetzung für Laminate
DE69735799D1 (de) Zwischenschichtklebefilm für mehrschichtige gedruckte Leiterplatte und mehrschichtige gedruckte Leiterplatte unter Verwendung desselben
DE69511187T2 (de) Harzzusammensetzung, laminat und verbundfolie
SG42994A1 (en) Resin impregnated laminate for wiring board applications
DE69510328D1 (de) Harzzusammensetzung und deren Verwendung für die Herstellung von mehrschichtigen Leiterplatten
EP1699279B8 (de) Mehrlagen Schaltungsplatte und Verfahren zur Herstellung
EP0678918A3 (de) Mehrlagenleiterplatte.
DE69421658T2 (de) Auslegungsmethode für mehrlagige gedruckte Schaltung
EP0789056A3 (de) Wärmehärtbare Harzmischung, gehärtetes Produkt, mit Metall bedeckter Schichtstoff und Leiterplatte
DE69331511D1 (de) Zweiseitig gedruckte Leiterplatte, mehrschichtige Leiterplatte und Verfahren zur Herstellung
DE69633690D1 (de) Harzfüllstoff und mehrschichtige Leiterplatte
DE69617195T2 (de) Polymere ethylenische klebstoffarzzusammensetzung und aus der zusammensetzung hergestelltes laminat
DE69631573D1 (de) Prepreg, Verfahren zur Herstellung und gedrucktes Leiterplattensubstrat und dessen Verwendung
HK1070327A1 (en) Biaxially oriented polyamide resin film
AU4316700A (en) Sheet for printed wiring board, method of forming via, resin sheet having filledvia, printed wiring board and method of manufacturing the same
AU2001244548A1 (en) Photosensitive resin composition, photosensitive element comprising the same, method for producing resist pattern, and method for producing printed wiring board
DE69924440D1 (de) Prepreg, mehrschichtige gedruckte Schaltungsplatte und Verfahren zu seiner Herstellung
DE69406390D1 (de) Laminat und mehrschichtige leiterplatte
DE69635203D1 (de) Beschichtungen und Verfahren, insbesondere für Leiterplatten
DE69610771D1 (de) Epoxidharzzusammensetzung für gedrückte leiterplatten und damit hergestellte schichtstoffplatten
AU2003271131A1 (en) Photosensitive resin composition, and, photosensitive element, method for forming resist pattern and printed wiring board using the composition
EP1637554A4 (de) Harzzusammensetzung für leiterplatte, prepreg und damit erhaltenes laminat
DE69705646T2 (de) 4-Methyl-1-Penten-Harzzusammensetzung und Laminate, die diese Zusammensetzung enthalten
DE69825012D1 (de) Basismaterial für Laminate, Verfahren zu deren Herstellung, Prepreg und Laminat

Legal Events

Date Code Title Description
8364 No opposition during term of opposition