DE69635203D1 - Beschichtungen und Verfahren, insbesondere für Leiterplatten - Google Patents

Beschichtungen und Verfahren, insbesondere für Leiterplatten

Info

Publication number
DE69635203D1
DE69635203D1 DE69635203T DE69635203T DE69635203D1 DE 69635203 D1 DE69635203 D1 DE 69635203D1 DE 69635203 T DE69635203 T DE 69635203T DE 69635203 T DE69635203 T DE 69635203T DE 69635203 D1 DE69635203 D1 DE 69635203D1
Authority
DE
Germany
Prior art keywords
coatings
methods
printed circuit
circuit boards
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69635203T
Other languages
English (en)
Other versions
DE69635203T2 (de
Inventor
Samuel Victor Bristol
Eugene Horace Hanaway
Thomas Richard Mueller
Mary Jane Barnaby
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delphi Technologies Inc
Original Assignee
Delphi Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi Technologies Inc filed Critical Delphi Technologies Inc
Publication of DE69635203D1 publication Critical patent/DE69635203D1/de
Application granted granted Critical
Publication of DE69635203T2 publication Critical patent/DE69635203T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • C23F11/145—Amides; N-substituted amides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Paints Or Removers (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
DE1996635203 1995-07-11 1996-06-12 Beschichtungen und Verfahren, insbesondere für Leiterplatten Expired - Fee Related DE69635203T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US50054395A 1995-07-11 1995-07-11
US500543 1995-07-11

Publications (2)

Publication Number Publication Date
DE69635203D1 true DE69635203D1 (de) 2006-02-02
DE69635203T2 DE69635203T2 (de) 2006-06-29

Family

ID=23989884

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1996635203 Expired - Fee Related DE69635203T2 (de) 1995-07-11 1996-06-12 Beschichtungen und Verfahren, insbesondere für Leiterplatten

Country Status (4)

Country Link
US (1) US6066197A (de)
EP (1) EP0753989B1 (de)
JP (1) JP2918496B2 (de)
DE (1) DE69635203T2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6555170B2 (en) * 1998-01-30 2003-04-29 Duratech Industries, Inc. Pre-plate treating system
US6506448B1 (en) * 1999-06-01 2003-01-14 Fry's Metals, Inc. Method of protective coating BGA solder alloy spheres
US6464899B1 (en) 1999-06-11 2002-10-15 Henkel Loctite Corporation Putty composition containing a vapor phase corrosion inhibitor
EP1211011B1 (de) * 1999-10-20 2011-04-06 Senju Metal Industry Co., Ltd. Herstellungsverfahren eines mit lot beschichteten materials ; entsprechendes lotbeschischtetes material
WO2001095499A1 (en) * 2000-06-02 2001-12-13 Thomson Licensing S.A. Apparatus and method for reducing electromigration
JP2003338682A (ja) * 2002-01-11 2003-11-28 Nec Infrontia Corp はんだ付け方法及びはんだ接合体
US6752015B2 (en) * 2002-09-24 2004-06-22 Visteon Global Technologies, Inc. Fluid flow device having reduced fluid ingress
US20070157457A1 (en) * 2004-09-10 2007-07-12 Lance Fried Assembly Method and Machinery for Waterproof Testing of Electronic Devices
JP2006351568A (ja) * 2005-06-13 2006-12-28 Sumitomo Metal Electronics Devices Inc 発光素子搭載パッケージの製造方法
KR100639919B1 (ko) * 2005-10-10 2006-11-01 한국전자통신연구원 섬유강화 플라스틱 기판의 표면 처리 방법
US7955520B2 (en) * 2007-11-27 2011-06-07 Cabot Microelectronics Corporation Copper-passivating CMP compositions and methods
GB2485419B (en) * 2010-11-15 2015-02-25 Semblant Ltd Method for reducing creep corrosion
CN113597123A (zh) 2015-06-04 2021-11-02 科迪华公司 用于在金属表面上产生抗蚀刻图案的方法及其组合物组
KR102508824B1 (ko) 2015-08-13 2023-03-09 카티바, 인크. 금속 표면 상에 에치 레지스트 패턴을 형성하는 방법
US9744640B2 (en) * 2015-10-16 2017-08-29 Applied Materials, Inc. Corrosion resistant retaining rings
US10398034B2 (en) 2016-12-12 2019-08-27 Kateeva, Inc. Methods of etching conductive features, and related devices and systems
DE102019201035A1 (de) * 2019-01-28 2020-07-30 Robert Bosch Gmbh Verfahren zur Behandlung metallischer Einlegeteile

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2715084A (en) * 1952-02-07 1955-08-09 Nat Lead Co Modified rosin soldering flux
GB801510A (en) * 1954-01-11 1958-09-17 Sylvania Electric Prod Soldering machine and method
US2904459A (en) * 1956-03-22 1959-09-15 Tamura Works Ltd Non-corrosive soldering flux for electrical application
US2926108A (en) * 1957-08-30 1960-02-23 Gen Mills Inc Process for inhibiting corrosion of metals
US2898255A (en) * 1958-06-30 1959-08-04 Ibm Soldering flux composition
US3235414A (en) * 1962-01-11 1966-02-15 Continental Can Co Organic flux for soldering
US3305406A (en) * 1964-04-06 1967-02-21 Western Electric Co Method of fluxing an article to be soldered with noncorrosive fluxing compositions
US3264146A (en) * 1965-09-10 1966-08-02 Continental Can Co Organic flux compositions and method of using same
US3467556A (en) * 1966-09-28 1969-09-16 Chevron Res High temperature soldering oil
US3484209A (en) * 1966-12-08 1969-12-16 Burndy Corp Corrosion resistant electric contacts
US3837932A (en) * 1972-03-27 1974-09-24 Lake Chemical Co Fluxes for use in bonding plates of storage batteries to connecting straps
US3787227A (en) * 1972-06-29 1974-01-22 Grace W R & Co Rust preventative compositions
US4168996A (en) * 1977-05-16 1979-09-25 Western Electric Company, Inc. Soldering flux
US4360392A (en) * 1980-05-29 1982-11-23 International Standard Electric Corporation Solder flux composition
GB2080341B (en) * 1980-07-24 1985-01-09 Standard Telephones Cables Ltd Solder flux compositions
JPS5739177A (en) * 1980-08-20 1982-03-04 Ajinomoto Co Inc Water soluble rust-resisting agent
US4402747A (en) * 1981-05-15 1983-09-06 United States Steel Corporation Rust Inhibiting for steel
JPS6056434B2 (ja) * 1982-01-29 1985-12-10 株式会社大和化成研究所 防錆剤の製造法
JPS58130384A (ja) * 1983-01-17 1983-08-03 シャープ株式会社 電子機器
US4532887A (en) * 1983-05-02 1985-08-06 General Motors Corporation Life extension of catalyst predip baths
JPS6281264A (ja) * 1985-10-02 1987-04-14 Alps Electric Co Ltd 半田付装置
US4684544A (en) * 1986-02-19 1987-08-04 General Motors Corporation Solder fluxing method and apparatus
US4781788A (en) * 1986-12-29 1988-11-01 Delco Electronics Corporation Process for preparing printed circuit boards
US5145722A (en) * 1989-04-11 1992-09-08 Hughes Aircraft Company Method and composition for protecting and enhancing the solderability of metallic surfaces
US5004509A (en) * 1990-05-04 1991-04-02 Delco Electronics Corporation Low residue soldering flux
US5190208A (en) * 1990-05-15 1993-03-02 Hughes Aircraft Company Foaming flux for automatic soldering process
US5092943A (en) * 1990-09-17 1992-03-03 Motorola, Inc. Method of cleaning printed circuit boards using water
US5368899A (en) * 1992-02-28 1994-11-29 Delco Electronics Corp. Automatic vertical dip coater with simultaneous ultraviolet cure
US5297721A (en) * 1992-11-19 1994-03-29 Fry's Metals, Inc. No-clean soldering flux and method using the same
US5281281A (en) * 1993-02-05 1994-01-25 Litton Systems, Inc. No-clean, low-residue, volatile organic compound free soldering flux and method of use

Also Published As

Publication number Publication date
JPH0940890A (ja) 1997-02-10
EP0753989A1 (de) 1997-01-15
EP0753989B1 (de) 2005-09-21
US6066197A (en) 2000-05-23
JP2918496B2 (ja) 1999-07-12
DE69635203T2 (de) 2006-06-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee