DE69530651D1 - Herstellungsverfahren von keramischen elektronischen Komponenten und Vorrichtung zur Herstellung - Google Patents

Herstellungsverfahren von keramischen elektronischen Komponenten und Vorrichtung zur Herstellung

Info

Publication number
DE69530651D1
DE69530651D1 DE69530651T DE69530651T DE69530651D1 DE 69530651 D1 DE69530651 D1 DE 69530651D1 DE 69530651 T DE69530651 T DE 69530651T DE 69530651 T DE69530651 T DE 69530651T DE 69530651 D1 DE69530651 D1 DE 69530651D1
Authority
DE
Germany
Prior art keywords
manufacturing
electronic components
ceramic electronic
manufacturing process
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69530651T
Other languages
English (en)
Other versions
DE69530651T2 (de
Inventor
Ryo Kobayashi
Hiroshi Yagi
Takaya Ishigaki
Shigehiko Shirai
Eizou Tsunoda
Kaoru Kawasaki
Ryuji Hosogaya
Yasunori Chiba
Yoshimi Yodokawa
Minoru Kanzaki
Masatoshi Ito
Takachi Abe
Yasushi Izumibe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP26788394A external-priority patent/JP3358763B2/ja
Priority claimed from JP6267882A external-priority patent/JPH08130150A/ja
Priority claimed from JP26913994A external-priority patent/JP3358764B2/ja
Priority claimed from JP26913894A external-priority patent/JP3672107B2/ja
Priority claimed from JP30663994A external-priority patent/JP3358765B2/ja
Priority claimed from JP8297195A external-priority patent/JP3599201B2/ja
Priority claimed from JP24629595A external-priority patent/JP3687757B2/ja
Priority claimed from JP7246294A external-priority patent/JPH0992587A/ja
Application filed by TDK Corp filed Critical TDK Corp
Publication of DE69530651D1 publication Critical patent/DE69530651D1/de
Publication of DE69530651T2 publication Critical patent/DE69530651T2/de
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01G4/308—Stacked capacitors made by transfer techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S101/00—Printing
    • Y10S101/46—Printing operation controlled by code indicia on printing plate or substate
DE69530651T 1994-10-31 1995-10-27 Herstellungsverfahren von keramischen elektronischen Komponenten und Vorrichtung zur Herstellung Expired - Lifetime DE69530651T2 (de)

Applications Claiming Priority (16)

Application Number Priority Date Filing Date Title
JP26788394 1994-10-31
JP6267882A JPH08130150A (ja) 1994-10-31 1994-10-31 セラミック塗料及びセラミック電子部品の製造方法
JP26788294 1994-10-31
JP26788394A JP3358763B2 (ja) 1994-10-31 1994-10-31 積層セラミック電子部品の製造方法
JP26913894A JP3672107B2 (ja) 1994-11-01 1994-11-01 塗布装置
JP26913994A JP3358764B2 (ja) 1994-11-01 1994-11-01 セラミック塗料塗布用可撓性支持体及びセラミック電子部品の製造方法
JP26913894 1994-11-01
JP26913994 1994-11-01
JP30663994A JP3358765B2 (ja) 1994-12-09 1994-12-09 積層セラミック電子部品製造装置
JP30663994 1994-12-09
JP8297195 1995-04-07
JP8297195A JP3599201B2 (ja) 1995-04-07 1995-04-07 セラミック塗料塗布装置
JP24629595 1995-09-25
JP24629495 1995-09-25
JP24629595A JP3687757B2 (ja) 1995-09-25 1995-09-25 セラミック電子部品の製造方法及び製造装置
JP7246294A JPH0992587A (ja) 1995-09-25 1995-09-25 セラミック電子部品製造装置

Publications (2)

Publication Number Publication Date
DE69530651D1 true DE69530651D1 (de) 2003-06-12
DE69530651T2 DE69530651T2 (de) 2004-03-25

Family

ID=27572743

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69530651T Expired - Lifetime DE69530651T2 (de) 1994-10-31 1995-10-27 Herstellungsverfahren von keramischen elektronischen Komponenten und Vorrichtung zur Herstellung

Country Status (7)

Country Link
US (2) US5716481A (de)
EP (1) EP0709866B1 (de)
KR (1) KR100261756B1 (de)
CN (1) CN1095175C (de)
DE (1) DE69530651T2 (de)
HU (1) HU222941B1 (de)
MY (1) MY119247A (de)

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US5716481A (en) * 1994-10-31 1998-02-10 Tdk Corporation Manufacturing method and manufacturing apparatus for ceramic electronic components
US5922168A (en) * 1995-09-28 1999-07-13 Pacific Trinetics Corporation Apparatus for making laminated electrical and electronic devices
US6191933B1 (en) 1998-01-07 2001-02-20 Tdk Corporation Ceramic capacitor
TW428184B (en) * 1998-02-19 2001-04-01 Teijin Ltd Method and apparatus for producing laminated type electronic component
US6380619B2 (en) 1998-03-31 2002-04-30 Tdk Corporation Chip-type electronic component having external electrodes that are spaced at predetermined distances from side surfaces of a ceramic substrate
US5935358A (en) * 1998-04-17 1999-08-10 New Create Corporation Method of producing a laminate ceramic capacitor
JP2001114569A (ja) * 1999-10-20 2001-04-24 Murata Mfg Co Ltd セラミックスラリー組成物、セラミックグリーンシート及び積層セラミック電子部品の製造方法
WO2002041665A1 (en) * 2000-11-16 2002-05-23 The Penn State Research Foundation Cofired multilayered piezoelectric ceramic materials with base metal electrodes
US20030111158A1 (en) * 2001-12-14 2003-06-19 Murata Manufacturing Co., Ltd. Method for manufacturing multilayer ceramic electronic element
US20030124030A1 (en) * 2001-12-27 2003-07-03 Neopoxy Corporation System and method for delivering reactive fluids to remote application sites
JP2004087561A (ja) * 2002-08-23 2004-03-18 Fuji Mach Mfg Co Ltd 多層基板製造工程集約機
JP4789400B2 (ja) * 2003-02-24 2011-10-12 株式会社村田製作所 セラミック電子部品の製造方法及びグラビア印刷方法
WO2004088687A1 (ja) * 2003-03-31 2004-10-14 Tdk Corporation 積層セラミック電子部品の製造方法
US20070007700A1 (en) * 2003-09-30 2007-01-11 Tdk Corporation Method for Preparing Dielelectric Paste for Multi-Layer Ceramic Electronic Component
JP4487542B2 (ja) * 2003-11-27 2010-06-23 Ｔｄｋ株式会社 積層セラミック電子部品用の導電体ペーストおよび積層セラミック電子部品用の積層体ユニットの製造方法
JP4662298B2 (ja) * 2003-12-15 2011-03-30 Ｔｄｋ株式会社 積層セラミック電子部品のスペーサ層用の誘電体ペースト
JP4487595B2 (ja) * 2004-02-27 2010-06-23 Ｔｄｋ株式会社 積層セラミック電子部品用の積層体ユニットの製造方法
JP4487596B2 (ja) * 2004-02-27 2010-06-23 Ｔｄｋ株式会社 積層セラミック電子部品用の積層体ユニットの製造方法
JP4412013B2 (ja) * 2004-03-16 2010-02-10 Ｔｄｋ株式会社 積層セラミック電子部品用の誘電体ペーストおよび積層セラミック電子部品用の積層体ユニットの製造方法
EP1834779A1 (de) * 2006-03-14 2007-09-19 Kba-Giori S.A. Inspektionsvorrichtung für eine beidseitige Bogendruckmaschine
JP4479687B2 (ja) * 2006-03-29 2010-06-09 Ｔｄｋ株式会社 積層電子部品の製造方法
RU2481670C2 (ru) * 2007-12-11 2013-05-10 Конинклейке Филипс Электроникс Н.В. Устройство бокового свечения с гибридным верхним отражателем
WO2009104619A1 (ja) * 2008-02-19 2009-08-27 株式会社村田製作所 積層型セラミック電子部品の製造方法
US20090296080A1 (en) * 2008-06-03 2009-12-03 Samsung Electro-Mechanics Co., Ltd. Method and apparatus for measuring deformation of laminated body
CN101303324A (zh) * 2008-07-03 2008-11-12 宗小林 一种快速检测试条电极的制备方法
TWI520852B (zh) * 2011-04-01 2016-02-11 Ｌｇ化學股份有限公司 印刷設備及印刷方法
CN105631893A (zh) * 2016-03-09 2016-06-01 中国矿业大学 一种通过拍照检测电容安装正确与否的方法及装置
CN106206008B (zh) * 2016-06-28 2018-11-02 深圳市宇阳科技发展有限公司 快速检测电极移位的印刷网版、mlcc及其检测方法
DE102018102749B4 (de) * 2018-02-07 2019-12-05 db-matik AG Siebdruckvorrichtung für eine Rolle-zu-Rolle Anlage
EP3833164A1 (de) * 2019-12-05 2021-06-09 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Kompensation der fehlausrichtung eines komponententrägermerkmals durch modifizierung des zieldesigns hinsichtlich eines korrelierten komponententrägermerkmals
CN111341563B (zh) * 2020-05-19 2020-10-16 深圳市诚捷智能装备股份有限公司 电容器涂液装置及电容器制备方法

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Also Published As

Publication number Publication date
CN1129843A (zh) 1996-08-28
US5716481A (en) 1998-02-10
EP0709866A3 (de) 1997-09-10
KR960014065A (ko) 1996-05-22
HUT76211A (en) 1997-07-28
HU222941B1 (hu) 2003-12-29
CN1095175C (zh) 2002-11-27
HU9503096D0 (en) 1995-12-28
EP0709866A2 (de) 1996-05-01
KR100261756B1 (ko) 2000-07-15
DE69530651T2 (de) 2004-03-25
US5935365A (en) 1999-08-10
MY119247A (en) 2005-04-30
EP0709866B1 (de) 2003-05-07

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