DE69610919D1 - Methode und vorrichtung zur bestückung elektronischer bauteile - Google Patents
Methode und vorrichtung zur bestückung elektronischer bauteileInfo
- Publication number
- DE69610919D1 DE69610919D1 DE69610919T DE69610919T DE69610919D1 DE 69610919 D1 DE69610919 D1 DE 69610919D1 DE 69610919 T DE69610919 T DE 69610919T DE 69610919 T DE69610919 T DE 69610919T DE 69610919 D1 DE69610919 D1 DE 69610919D1
- Authority
- DE
- Germany
- Prior art keywords
- electronic components
- fitting electronic
- fitting
- components
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/351—Working by laser beam, e.g. welding, cutting or boring for trimming or tuning of electrical components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
- Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14612895A JP3552791B2 (ja) | 1995-06-13 | 1995-06-13 | 電子部品実装方法及び装置 |
PCT/JP1996/001529 WO1996042189A1 (fr) | 1995-06-13 | 1996-06-06 | Procede et dispositif de montage de pieces electroniques |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69610919D1 true DE69610919D1 (de) | 2000-12-14 |
DE69610919T2 DE69610919T2 (de) | 2001-03-15 |
Family
ID=15400786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69610919T Expired - Fee Related DE69610919T2 (de) | 1995-06-13 | 1996-06-06 | Methode und vorrichtung zur bestückung elektronischer bauteile |
Country Status (5)
Country | Link |
---|---|
US (1) | US6256876B1 (de) |
EP (1) | EP0835050B1 (de) |
JP (1) | JP3552791B2 (de) |
DE (1) | DE69610919T2 (de) |
WO (1) | WO1996042189A1 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6792674B2 (en) | 2000-04-28 | 2004-09-21 | Hitachi High-Tech Instruments Company, Ltd. | Apparatus for mounting electronic components |
WO2002007195A1 (fr) * | 2000-07-19 | 2002-01-24 | Ibiden Co., Ltd. | Dispositif chauffant ceramique pour la fabrication/verification de semi-conducteurs, son procede de fabrication, et son systeme de fabrication |
WO2002007196A1 (fr) * | 2000-07-19 | 2002-01-24 | Ibiden Co., Ltd. | Dispositif chauffant ceramique pour la fabrication/verification de semi-conducteurs |
US20040035846A1 (en) * | 2000-09-13 | 2004-02-26 | Yasuji Hiramatsu | Ceramic heater for semiconductor manufacturing and inspecting equipment |
EP1282350B1 (de) * | 2001-07-20 | 2006-04-26 | Hitachi High-Tech Instruments Co., Ltd. | Einrichtung zur Montage elektronischer Bauteile |
US6875950B2 (en) * | 2002-03-22 | 2005-04-05 | Gsi Lumonics Corporation | Automated laser trimming of resistors |
US6972391B2 (en) * | 2002-11-21 | 2005-12-06 | Hadco Santa Clara, Inc. | Laser trimming of annular passive components |
US7297896B2 (en) * | 2002-11-21 | 2007-11-20 | Hadco Santa Clara, Inc. | Laser trimming of resistors |
WO2004049401A2 (en) * | 2002-11-21 | 2004-06-10 | Sanmina-Sci Corporation | Laser trimming of resistors |
US7059195B1 (en) * | 2004-12-02 | 2006-06-13 | Honeywell International Inc. | Disposable and trimmable wireless pressure sensor for medical applications |
NL1029247C2 (nl) * | 2005-06-14 | 2006-12-18 | Assembleon Nv | Werkwijze voor het instellen van ten minste een optionele instelling van een verwerkingseigenschap van de componentplaatsingsinrichting alsmede een dergelijke componentplaatsingsinrichting en elektronische sleutel. |
JP4962635B1 (ja) * | 2011-03-15 | 2012-06-27 | オムロン株式会社 | 光半導体パッケージおよび光半導体モジュールならびにこれらの製造方法 |
CN102509600A (zh) * | 2011-10-31 | 2012-06-20 | 上海交通大学 | 直滑式导塑电位器激光修刻机及修刻方法 |
JP2013115229A (ja) * | 2011-11-29 | 2013-06-10 | Panasonic Corp | 部品実装方法及び部品実装システム |
US10206320B2 (en) * | 2014-09-30 | 2019-02-12 | Fuji Corporation | Component mounter |
EP3307046B1 (de) | 2015-06-03 | 2021-01-13 | FUJI Corporation | Komponentenmontagemaschine |
CN111465308B (zh) * | 2020-04-13 | 2021-04-06 | 温州职业技术学院 | 预制电路基板组装中心 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5950503A (ja) * | 1982-09-16 | 1984-03-23 | 松下電器産業株式会社 | 電気回路調整装置 |
JPS60175445A (ja) * | 1984-02-21 | 1985-09-09 | Matsushita Electric Ind Co Ltd | 電子回路の調整方法 |
US4573262A (en) * | 1984-05-11 | 1986-03-04 | Amp Incorporated | Apparatus for force fitting components into a workpiece |
US4998207A (en) * | 1988-02-01 | 1991-03-05 | Cooper Industries, Inc. | Method of manufacture of circuit boards |
JP2803221B2 (ja) * | 1989-09-19 | 1998-09-24 | 松下電器産業株式会社 | Ic実装装置及びその方法 |
US5003254A (en) * | 1989-11-02 | 1991-03-26 | Huntron, Inc. | Multi-axis universal circuit board test fixture |
US5209131A (en) * | 1989-11-03 | 1993-05-11 | Rank Taylor Hobson | Metrology |
US5166492A (en) * | 1991-03-27 | 1992-11-24 | Motorola, Inc. | Laser power correlation system |
TW222364B (de) * | 1992-05-28 | 1994-04-11 | Digital Equipment Corp | |
JP3114034B2 (ja) * | 1992-06-05 | 2000-12-04 | ヤマハ発動機株式会社 | 部品実装方法及び部品実装装置 |
US5443534A (en) * | 1992-07-21 | 1995-08-22 | Vlt Corporation | Providing electronic components for circuity assembly |
BE1009814A5 (nl) * | 1995-11-06 | 1997-08-05 | Framatome Connectors Belgium | Werkwijze en inrichting voor het aanbrengen van elektronische onderdelen in een plaat met gedrukte schakelingen. |
-
1995
- 1995-06-13 JP JP14612895A patent/JP3552791B2/ja not_active Expired - Fee Related
-
1996
- 1996-06-06 WO PCT/JP1996/001529 patent/WO1996042189A1/ja active IP Right Grant
- 1996-06-06 US US08/973,094 patent/US6256876B1/en not_active Expired - Fee Related
- 1996-06-06 EP EP96916322A patent/EP0835050B1/de not_active Expired - Lifetime
- 1996-06-06 DE DE69610919T patent/DE69610919T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH08340195A (ja) | 1996-12-24 |
EP0835050A1 (de) | 1998-04-08 |
US6256876B1 (en) | 2001-07-10 |
EP0835050A4 (de) | 1998-09-23 |
WO1996042189A1 (fr) | 1996-12-27 |
DE69610919T2 (de) | 2001-03-15 |
JP3552791B2 (ja) | 2004-08-11 |
EP0835050B1 (de) | 2000-11-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |