DE69412059D1 - Verfahren und Vorrichtung zur Linsenmontage - Google Patents

Verfahren und Vorrichtung zur Linsenmontage

Info

Publication number
DE69412059D1
DE69412059D1 DE69412059T DE69412059T DE69412059D1 DE 69412059 D1 DE69412059 D1 DE 69412059D1 DE 69412059 T DE69412059 T DE 69412059T DE 69412059 T DE69412059 T DE 69412059T DE 69412059 D1 DE69412059 D1 DE 69412059D1
Authority
DE
Germany
Prior art keywords
lens mounting
lens
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69412059T
Other languages
English (en)
Other versions
DE69412059T2 (de
Inventor
Mitsutoshi Kamakura
Hiroichi Murakami
Hiroyuki Ishii
Masayuki Nishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of DE69412059D1 publication Critical patent/DE69412059D1/de
Application granted granted Critical
Publication of DE69412059T2 publication Critical patent/DE69412059T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Lens Barrels (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69412059T 1994-01-07 1994-05-26 Verfahren und Vorrichtung zur Linsenmontage Expired - Fee Related DE69412059T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP01212194A JP3412224B2 (ja) 1994-01-07 1994-01-07 レンズ実装方法と装置

Publications (2)

Publication Number Publication Date
DE69412059D1 true DE69412059D1 (de) 1998-09-03
DE69412059T2 DE69412059T2 (de) 1998-12-03

Family

ID=11796721

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69412059T Expired - Fee Related DE69412059T2 (de) 1994-01-07 1994-05-26 Verfahren und Vorrichtung zur Linsenmontage

Country Status (7)

Country Link
US (1) US5578156A (de)
EP (1) EP0662723B1 (de)
JP (1) JP3412224B2 (de)
KR (1) KR0148703B1 (de)
CA (1) CA2124544C (de)
DE (1) DE69412059T2 (de)
TW (1) TW300285B (de)

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DE19545721C2 (de) * 1995-12-07 2003-02-20 Deutsche Telekom Ag Verfahren und Vorrichtung zum Herstellen und präzisen Positionieren von optischen Mikrokomponenten auf einer über einer optischen Einrichtung
US6031958A (en) * 1997-05-21 2000-02-29 Mcgaffigan; Thomas H. Optical light pipes with laser light appearance
US6352612B1 (en) * 1998-05-19 2002-03-05 Steag Hamatech, Inc. System for forming bonded storage disks with low power light assembly
US6525386B1 (en) 1998-03-10 2003-02-25 Masimo Corporation Non-protruding optoelectronic lens
US6399425B1 (en) 1998-09-02 2002-06-04 Micron Technology, Inc. Method of encapsulating semiconductor devices utilizing a dispensing apparatus with rotating orifices
DE19859357A1 (de) 1998-12-22 2000-06-29 Thomson Brandt Gmbh Aufzeichnungs-oder Wiedergabegerät mit einer Auf- und Abnahmevorrichtung für plattenförmige Aufzeichnungsträger
US6185816B1 (en) 1999-07-06 2001-02-13 Lucent Technologies Inc. Alignment method
DE19960055A1 (de) 1999-12-13 2001-06-21 Thomson Brandt Gmbh Photoelement für ein Gerät zum Lesen optischer Aufzeichnungsträger und Verfahren zu dessen Herstellung
DE10053543B4 (de) * 2000-10-27 2004-11-25 Mühlbauer Ag Vorrichtung zum Herstellen von optoelektronischen Bauelementen
KR100423929B1 (ko) * 2000-11-21 2004-03-26 화우테크놀러지 주식회사 평판디스플레이용 도광판 브이커팅기
US6485160B1 (en) 2001-06-25 2002-11-26 Gelcore Llc Led flashlight with lens
KR100561844B1 (ko) * 2003-10-07 2006-03-16 삼성전자주식회사 마이크로 렌즈 어레이 및 그 제조 방법
US20050174753A1 (en) * 2004-02-06 2005-08-11 Densen Cao Mining light
KR20060084256A (ko) * 2005-01-19 2006-07-24 삼성전자주식회사 액정 표시 장치용 발광 다이오드 소자의 렌즈 조성물,이를 포함하는 발광 다이오드 소자, 백라이트 유닛 및액정 표시 장치
KR100740982B1 (ko) * 2005-01-31 2007-07-19 카바스(주) 광모듈 조립체의 광축 조절장치
KR100665222B1 (ko) * 2005-07-26 2007-01-09 삼성전기주식회사 확산재료를 이용한 엘이디 패키지 및 그 제조 방법
US7772604B2 (en) 2006-01-05 2010-08-10 Illumitex Separate optical device for directing light from an LED
JP4954652B2 (ja) * 2006-09-19 2012-06-20 三和システムエンジニアリング株式会社 精密部品の組み付け装置
EP2070123A2 (de) 2006-10-02 2009-06-17 Illumitex, Inc. Led-system und -verfahren
CN100592130C (zh) * 2007-02-28 2010-02-24 鸿富锦精密工业（深圳）有限公司 相机模组的对位组装系统及对位组装方法
US7829358B2 (en) 2008-02-08 2010-11-09 Illumitex, Inc. System and method for emitter layer shaping
TW201034256A (en) 2008-12-11 2010-09-16 Illumitex Inc Systems and methods for packaging light-emitting diode devices
CN101858503B (zh) * 2009-04-10 2012-06-27 富士迈半导体精密工业（上海）有限公司 固态光源组装装置及其组装方法
US8585253B2 (en) 2009-08-20 2013-11-19 Illumitex, Inc. System and method for color mixing lens array
US8449128B2 (en) 2009-08-20 2013-05-28 Illumitex, Inc. System and method for a lens and phosphor layer
JP5566359B2 (ja) * 2011-09-29 2014-08-06 株式会社日立ハイテクインスツルメンツ 部品装着装置
CN103217765A (zh) * 2013-04-17 2013-07-24 江苏奥雷光电有限公司 一种光学器件的预固定装置及预固定方法
KR101634599B1 (ko) * 2014-02-11 2016-06-29 (주)제론 렌즈모듈 본딩장치
AT517259B1 (de) * 2015-06-09 2020-01-15 Zkw Group Gmbh Verfahren zur positionsgenauen Bestückung eines Schaltungsträgers
JP6528643B2 (ja) * 2015-10-27 2019-06-12 三菱電機株式会社 波長多重光通信モジュール
KR101939347B1 (ko) * 2017-02-28 2019-01-16 (주) 예스티 반도체 제조 장치
DE102018128863A1 (de) * 2018-11-16 2020-05-20 HELLA GmbH & Co. KGaA Verfahren zum Verkleben von zwei lagegenau zueinander angeordneten Bauteilen
KR102169271B1 (ko) * 2019-03-08 2020-10-23 한국광기술원 Led 구조체 전사 장치
CN111580235B (zh) * 2020-05-11 2022-02-25 深圳爱克莱特科技股份有限公司 一种透镜组装系统和透镜组装方法
EP4270069A4 (de) * 2020-12-22 2024-06-26 Sumitomo Electric Industries, Ltd. Verfahren zur schätzung der ausrichtung einer glasfaser und verfahren zur herstellung einer glasfaserkomponente

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US3834966A (en) * 1972-12-26 1974-09-10 Mech El Inc Ind Adhesive bonding system
GB2035595B (en) * 1978-11-29 1982-12-01 Plessey Co Ltd Optical positioning apparatus
DD150264A5 (de) * 1979-05-11 1981-08-19 Cordaro Walter Kontaktraster fuer graphische reproduktionsverfahren
JPS5729067A (en) * 1980-07-30 1982-02-16 Fuji Xerox Co Ltd Heat fixing device for electrophotographic copier
US4501637A (en) * 1981-06-12 1985-02-26 Motorola, Inc. LED having self-aligned lens
DE3147025A1 (de) * 1981-11-27 1983-06-01 Akzo Gmbh, 5600 Wuppertal Einbettmasse auf basis schnellreagierender polyurethan-giessharze
JPS60413A (ja) * 1983-06-16 1985-01-05 Sumitomo Electric Ind Ltd レンズ装荷方法
US4647331A (en) * 1983-07-29 1987-03-03 Motorola, Inc. Method for assembling an electro-optical device
NL8303251A (nl) * 1983-09-22 1985-04-16 Philips Nv Werkwijze voor het optisch verbinden van een lichtgeleider aan een elektrooptische inrichting.
JPH0634410B2 (ja) * 1984-02-02 1994-05-02 住友電気工業株式会社 半導体発光素子
US4772123A (en) * 1986-11-24 1988-09-20 American Telephone And Telegraph Company, At&T Bell Laboratories Alignment of optical components
JPH0629577A (ja) * 1992-07-10 1994-02-04 Sumitomo Electric Ind Ltd 半導体発光素子の製造方法

Also Published As

Publication number Publication date
KR950024617A (ko) 1995-08-21
TW300285B (de) 1997-03-11
CA2124544C (en) 1998-12-22
US5578156A (en) 1996-11-26
EP0662723B1 (de) 1998-07-29
JP3412224B2 (ja) 2003-06-03
DE69412059T2 (de) 1998-12-03
CA2124544A1 (en) 1995-07-08
EP0662723A1 (de) 1995-07-12
JPH07199007A (ja) 1995-08-04
KR0148703B1 (ko) 1998-08-01

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Legal Events

Date Code Title Description
8328 Change in the person/name/address of the agent

Free format text: WESER & KOLLEGEN, 81245 MUENCHEN

8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee