DE69630224D1 - Verfahren und einrichtung zur bestückung elektronischer bauteile - Google Patents

Verfahren und einrichtung zur bestückung elektronischer bauteile

Info

Publication number
DE69630224D1
DE69630224D1 DE69630224T DE69630224T DE69630224D1 DE 69630224 D1 DE69630224 D1 DE 69630224D1 DE 69630224 T DE69630224 T DE 69630224T DE 69630224 T DE69630224 T DE 69630224T DE 69630224 D1 DE69630224 D1 DE 69630224D1
Authority
DE
Germany
Prior art keywords
electronic components
fitting electronic
fitting
components
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69630224T
Other languages
English (en)
Other versions
DE69630224T2 (de
Inventor
Koji Hirotani
Tomoyuki Nakano
Ryoji Inutsuka
Kunio Ohe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69630224D1 publication Critical patent/DE69630224D1/de
Publication of DE69630224T2 publication Critical patent/DE69630224T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • H05K13/041Incorporating a pick-up tool having multiple pick-up tools
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53174Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)
DE69630224T 1995-07-12 1996-07-11 Verfahren und einrichtung zur bestückung elektronischer bauteile Expired - Lifetime DE69630224T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP17580095 1995-07-12
JP17580095 1995-07-12
PCT/JP1996/001928 WO1997003547A1 (fr) 1995-07-12 1996-07-11 Procede et appareil pour monter des composants electroniques

Publications (2)

Publication Number Publication Date
DE69630224D1 true DE69630224D1 (de) 2003-11-06
DE69630224T2 DE69630224T2 (de) 2004-08-05

Family

ID=16002475

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69630224T Expired - Lifetime DE69630224T2 (de) 1995-07-12 1996-07-11 Verfahren und einrichtung zur bestückung elektronischer bauteile

Country Status (6)

Country Link
US (1) US6044169A (de)
EP (1) EP0838992B1 (de)
JP (1) JP3258026B2 (de)
CN (1) CN1099226C (de)
DE (1) DE69630224T2 (de)
WO (1) WO1997003547A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100332525B1 (ko) * 1997-08-29 2002-04-17 마츠시타 덴끼 산교 가부시키가이샤 부품 장착 방법 및 부품 장착 장치
US6801652B1 (en) * 1998-09-29 2004-10-05 Siemens Aktiengesellschaft Method for checking the presentation of components to an automatic onserting unit
DE19919916C2 (de) 1999-04-30 2001-07-05 Siemens Ag Verfahren zur zeitoptimierten Bestückung von Leiterplatten
DE19925217A1 (de) * 1999-06-01 2000-12-21 Siemens Ag Verfahren zum Bestücken von Substraten mit Bauelementen
EP1215954B1 (de) * 1999-09-02 2006-11-15 Matsushita Electric Industrial Co., Ltd. Verfahren und vorrichtung zur erkennung eines werkstückes sowie verfahren und vorrichtung zur bestückung
DE60035605T8 (de) * 1999-09-27 2008-06-05 Matsushita Electric Industrial Co., Ltd., Kadoma Bauteilbestuckungsverfahren und -einrichtung
JP3624145B2 (ja) * 2000-09-26 2005-03-02 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP2003060395A (ja) * 2001-08-10 2003-02-28 Matsushita Electric Ind Co Ltd 電子部品の実装方法および実装装置
US7395129B2 (en) * 2003-01-23 2008-07-01 Matsushita Electric Industrial Co., Ltd. Method for optimization of an order of component mounting, apparatus using the same, and mounter
JP4564235B2 (ja) * 2003-02-24 2010-10-20 パナソニック株式会社 部品実装装置及び部品実装方法
JP4421991B2 (ja) * 2004-10-04 2010-02-24 ヤマハ発動機株式会社 移載装置、表面実装機、誤差テーブルの作成方法、プログラムおよび記憶媒体
US7440813B2 (en) * 2006-04-20 2008-10-21 Valor Computerized Systems Ltd. System and methods for automatic generation of component data
US7447560B2 (en) 2006-04-20 2008-11-04 Valor Computerized Systems Ltd. System and methods for automatic generation of component data
US8050789B2 (en) * 2006-04-20 2011-11-01 Bini Elhanan System and methods for automatic generation of component data
CN101578931B (zh) * 2006-12-12 2014-03-19 先进装配系统有限责任两合公司 用于为衬底装配元件的自动装配机
JP5070832B2 (ja) * 2006-12-22 2012-11-14 株式会社ナカヨ通信機 センサー起動型電話システム
JP2009093436A (ja) * 2007-10-09 2009-04-30 Kyoraku Sangyo Kk 電子機器、主制御基板、周辺基板、認証方法および認証プログラム
ATE528792T1 (de) * 2007-12-24 2011-10-15 Ismeca Semiconductor Holding Verfahren und vorrichtung zur ausrichtung von komponenten
JP6942545B2 (ja) * 2017-07-12 2021-09-29 Juki株式会社 搭載動作の最適化装置、実装装置、搭載動作の最適化方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0797019B2 (ja) * 1986-06-12 1995-10-18 松下電器産業株式会社 部品認識用照明方法及びその装置
JPH02111100A (ja) * 1988-10-20 1990-04-24 Matsushita Electric Ind Co Ltd 部品装着装置
JPH07120974B2 (ja) * 1989-06-20 1995-12-20 松下電器産業株式会社 陸上移動無線データ通信の端末装置
US5212881A (en) * 1990-09-20 1993-05-25 Tokico Ltd. Electronic component mounting apparatus
JP2517178B2 (ja) * 1991-03-04 1996-07-24 松下電器産業株式会社 電子部品の実装方法
JP2534410B2 (ja) * 1991-05-23 1996-09-18 松下電器産業株式会社 部品装着装置
JPH05129796A (ja) * 1991-09-25 1993-05-25 Toshiba Corp 部品実装装置
DE69300850T2 (de) * 1992-07-01 1996-03-28 Yamaha Motor Co Ltd Verfahren zum Montieren von Komponenten und Vorrichtung dafür.
JP2600044B2 (ja) * 1992-08-07 1997-04-16 ヤマハ発動機株式会社 部品装着方法及び同装置
JP3086578B2 (ja) * 1993-12-27 2000-09-11 ヤマハ発動機株式会社 部品装着装置
JP3295529B2 (ja) * 1994-05-06 2002-06-24 松下電器産業株式会社 Ic部品実装方法及び装置

Also Published As

Publication number Publication date
CN1099226C (zh) 2003-01-15
CN1191063A (zh) 1998-08-19
EP0838992A1 (de) 1998-04-29
EP0838992A4 (de) 1999-11-17
JP3258026B2 (ja) 2002-02-18
DE69630224T2 (de) 2004-08-05
US6044169A (en) 2000-03-28
EP0838992B1 (de) 2003-10-01
WO1997003547A1 (fr) 1997-01-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)