DE69700993T2 - Verfahren und vorrichtung zur befestigung von bauelementen - Google Patents

Verfahren und vorrichtung zur befestigung von bauelementen

Info

Publication number
DE69700993T2
DE69700993T2 DE69700993T DE69700993T DE69700993T2 DE 69700993 T2 DE69700993 T2 DE 69700993T2 DE 69700993 T DE69700993 T DE 69700993T DE 69700993 T DE69700993 T DE 69700993T DE 69700993 T2 DE69700993 T2 DE 69700993T2
Authority
DE
Germany
Prior art keywords
fixing components
fixing
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69700993T
Other languages
English (en)
Other versions
DE69700993D1 (de
Inventor
Yuzo Nishimori
Makito Seno
Makoto Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69700993D1 publication Critical patent/DE69700993D1/de
Application granted granted Critical
Publication of DE69700993T2 publication Critical patent/DE69700993T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
DE69700993T 1996-03-11 1997-03-10 Verfahren und vorrichtung zur befestigung von bauelementen Expired - Fee Related DE69700993T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP05269596A JP3549327B2 (ja) 1996-03-11 1996-03-11 部品装着方法及び部品装着機
PCT/JP1997/000783 WO1997034462A1 (en) 1996-03-11 1997-03-10 Method and apparatus for mounting components

Publications (2)

Publication Number Publication Date
DE69700993D1 DE69700993D1 (de) 2000-01-27
DE69700993T2 true DE69700993T2 (de) 2000-06-29

Family

ID=12922032

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69700993T Expired - Fee Related DE69700993T2 (de) 1996-03-11 1997-03-10 Verfahren und vorrichtung zur befestigung von bauelementen

Country Status (7)

Country Link
US (1) US5979045A (de)
EP (1) EP0887001B1 (de)
JP (1) JP3549327B2 (de)
KR (1) KR100447470B1 (de)
CN (1) CN1094720C (de)
DE (1) DE69700993T2 (de)
WO (1) WO1997034462A1 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09283986A (ja) * 1996-04-18 1997-10-31 Matsushita Electric Ind Co Ltd 部品供給方法及びその装置
JP3579538B2 (ja) * 1996-05-22 2004-10-20 松下電器産業株式会社 部品供給装置及びこれを用いた部品供給方法
JP3369071B2 (ja) * 1997-02-21 2003-01-20 松下電器産業株式会社 電子部品供給方法およびその装置
JP3739218B2 (ja) 1998-04-02 2006-01-25 松下電器産業株式会社 部品装着方法及び装置
JP4126762B2 (ja) * 1998-07-30 2008-07-30 松下電器産業株式会社 電子部品の実装方法
US6629007B1 (en) * 1998-12-25 2003-09-30 Matsushita Electric Industrial Co., Ltd. Apparatus and method for notifying lack of component in advance, component mounting apparatus, and article of manufacture comprising computer usable medium
DE19925217A1 (de) * 1999-06-01 2000-12-21 Siemens Ag Verfahren zum Bestücken von Substraten mit Bauelementen
JP3719051B2 (ja) * 1999-07-02 2005-11-24 松下電器産業株式会社 電子部品の実装装置および実装方法
KR100328345B1 (ko) * 1999-09-01 2002-03-12 정문술 표면실장장치 및 그 실장방법
FR2810496A1 (fr) * 2000-06-16 2001-12-21 Vincent Huret Dispositif de pose de composants electroniques
EP1350419B1 (de) * 2000-08-04 2013-02-20 Panasonic Corporation Verfahren zur optimierung der bestückungsfolge, vorichtung dafür und bestücker
KR100348401B1 (ko) * 2000-10-27 2002-08-10 미래산업 주식회사 표면실장장치에서 피더스테이지의 위치조정장치
JP4592194B2 (ja) * 2001-02-08 2010-12-01 富士機械製造株式会社 電子部品装着機
US20020133940A1 (en) * 2001-03-26 2002-09-26 Fuji Machine Mfg. Co., Ltd Electric-component supplying method and device, and electric-component mounting method and system
US6662966B2 (en) 2001-06-28 2003-12-16 Smtc Corporation Surface mount manufacturing storage system
US6925709B1 (en) * 2002-12-04 2005-08-09 Exatron, Inc. Method and apparatus for assembling electronics
JP2006049336A (ja) * 2004-07-30 2006-02-16 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置
JP2010073924A (ja) * 2008-09-19 2010-04-02 Panasonic Corp 部品実装装置
KR101594083B1 (ko) * 2009-08-04 2016-02-16 한화테크윈 주식회사 전자 부품 제조 장치
JP5203480B2 (ja) * 2011-03-07 2013-06-05 ヤマハ発動機株式会社 部品実装システム
WO2016035145A1 (ja) * 2014-09-02 2016-03-10 富士機械製造株式会社 部品実装システム及び部品実装方法
EP3484258B1 (de) * 2016-07-08 2020-12-02 Fuji Corporation Komponentenmontagesystem und verwaltungsvorrichtung
CN107263091A (zh) * 2017-09-11 2017-10-20 苏州市全力自动化科技有限公司 机器人pcb板异型元器件装配线及其生产工艺
JP6932785B2 (ja) * 2017-09-19 2021-09-08 株式会社Ｆｕｊｉ 部品実装システム
CN109807625B (zh) * 2019-03-21 2023-10-20 江苏杰士德精密工业有限公司 手机铃铛键线圈自动组装装置及其操作方法
CN114554827B (zh) * 2019-03-29 2023-09-29 松下知识产权经营株式会社 部件搭载装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1320005C (en) * 1988-06-16 1993-07-06 Kotaro Harigane Electronic component mounting apparatus
JPH07100265B2 (ja) * 1989-04-27 1995-11-01 松下電器産業株式会社 部品装着装置
JPH07105637B2 (ja) * 1990-05-31 1995-11-13 三洋電機株式会社 部品装着装置
JPH04177799A (ja) * 1990-11-09 1992-06-24 Olympus Optical Co Ltd 電子部品自動実装機におけるテーピング部品の送り機構ユニットの自動供給装置
JP2841856B2 (ja) * 1990-11-29 1998-12-24 松下電器産業株式会社 電子部品実装装置
JP2636087B2 (ja) * 1991-03-28 1997-07-30 松下電器産業株式会社 部品供給方法
JPH07336088A (ja) * 1994-06-08 1995-12-22 Olympus Optical Co Ltd 電子部品自動段取装置
JPH09130084A (ja) * 1995-11-06 1997-05-16 Matsushita Electric Ind Co Ltd 部品実装装置および部品実装設備
US5743001A (en) * 1996-08-16 1998-04-28 Amistar Corporation Surface mount placement system with single step, multiple place carriage

Also Published As

Publication number Publication date
CN1212822A (zh) 1999-03-31
DE69700993D1 (de) 2000-01-27
KR100447470B1 (ko) 2004-10-14
CN1094720C (zh) 2002-11-20
KR19990028982A (ko) 1999-04-15
WO1997034462A1 (en) 1997-09-18
JPH09246779A (ja) 1997-09-19
EP0887001B1 (de) 1999-12-22
EP0887001A1 (de) 1998-12-30
JP3549327B2 (ja) 2004-08-04
US5979045A (en) 1999-11-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee