ATE528792T1 - Verfahren und vorrichtung zur ausrichtung von komponenten - Google Patents
Verfahren und vorrichtung zur ausrichtung von komponentenInfo
- Publication number
- ATE528792T1 ATE528792T1 AT07150412T AT07150412T ATE528792T1 AT E528792 T1 ATE528792 T1 AT E528792T1 AT 07150412 T AT07150412 T AT 07150412T AT 07150412 T AT07150412 T AT 07150412T AT E528792 T1 ATE528792 T1 AT E528792T1
- Authority
- AT
- Austria
- Prior art keywords
- component
- pick
- aligning device
- aligning
- nozzle
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 238000005259 measurement Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Attitude Control For Articles On Conveyors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP07150412A EP2075829B1 (de) | 2007-12-24 | 2007-12-24 | Verfahren und Vorrichtung zur Ausrichtung von Komponenten |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE528792T1 true ATE528792T1 (de) | 2011-10-15 |
Family
ID=39332222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT07150412T ATE528792T1 (de) | 2007-12-24 | 2007-12-24 | Verfahren und vorrichtung zur ausrichtung von komponenten |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US8550766B2 (de) |
| EP (1) | EP2075829B1 (de) |
| KR (1) | KR101448076B1 (de) |
| CN (1) | CN101919039B (de) |
| AT (1) | ATE528792T1 (de) |
| MX (1) | MX2010006994A (de) |
| MY (1) | MY147294A (de) |
| TW (1) | TWI483340B (de) |
| WO (1) | WO2009080652A1 (de) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2471712A (en) * | 2009-07-10 | 2011-01-12 | De Beers Centenary AG | Gemstone alignment system |
| JP5299380B2 (ja) * | 2010-08-17 | 2013-09-25 | パナソニック株式会社 | 部品実装装置および部品検出方法 |
| JP5299379B2 (ja) * | 2010-08-17 | 2013-09-25 | パナソニック株式会社 | 部品実装装置および部品検出方法 |
| DE102011013369A1 (de) * | 2010-12-30 | 2012-07-05 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen einer Mehrzahl von Halbleiterbauelementen |
| EP2658958B1 (de) * | 2011-03-18 | 2017-05-03 | Siemens Healthcare Diagnostics Inc. | Verfahren und systeme zur kalibrierung einer positionsausrichtung zwischen einem probenbehälter und einer düsenspitze |
| US9044812B2 (en) | 2011-08-03 | 2015-06-02 | General Electric Company | Jig and method for modifying casing in turbine system |
| EP2801109A1 (de) | 2011-12-07 | 2014-11-12 | ISMECA Semiconductor Holding SA | Anordnung zur komponentenhandhabung |
| US8919528B2 (en) * | 2012-07-13 | 2014-12-30 | Hewlett-Packard Industrial Printing Ltd. | Nozzled device to align a substrate on a surface |
| TW201432080A (zh) * | 2013-02-01 | 2014-08-16 | Chiuan Yan Technology Co Ltd | 負壓無塵型對位機構 |
| KR101479667B1 (ko) * | 2014-04-21 | 2015-01-07 | 주식회사 디앤씨 | 압력 조절 장치 및 이를 이용한 피처리물 이송 방법 |
| KR101687191B1 (ko) * | 2015-08-17 | 2016-12-19 | 비케이전자 주식회사 | 전자부품 실장장치 |
| DE102017008869B3 (de) | 2017-09-21 | 2018-10-25 | Mühlbauer Gmbh & Co. Kg | Bauteilzentrierung |
| MY192110A (en) * | 2018-07-26 | 2022-07-28 | Mi Equipment M Sdn Bhd | Method for automatic alignment of an electronic component during die sorting process |
| WO2020203948A1 (ja) * | 2019-04-04 | 2020-10-08 | アキム株式会社 | 部品搬送処理装置 |
| JP7291577B2 (ja) * | 2019-08-28 | 2023-06-15 | 芝浦メカトロニクス株式会社 | 移送装置および実装装置 |
| DE102019125127A1 (de) * | 2019-09-18 | 2021-03-18 | Mühlbauer Gmbh & Co. Kg | Bauteilhandhabung, Bauteilinspektion |
| DE102019125134B4 (de) | 2019-09-18 | 2025-12-18 | Mühlbauer Gmbh & Co. Kg | Vorrichtung und Verfahren zur Bauteilhandhabung |
| CN114787978A (zh) * | 2019-12-26 | 2022-07-22 | 佐藤控股株式会社 | Ic芯片搭载装置、ic芯片搭载方法 |
| TWI741748B (zh) * | 2020-08-20 | 2021-10-01 | 鴻勁精密股份有限公司 | 接合機構及其應用之作業設備 |
| WO2022046566A1 (en) * | 2020-08-27 | 2022-03-03 | Mrsi Systems Llc | Self-aligning tip |
| CN114203612B (zh) * | 2020-09-17 | 2025-10-24 | 深圳市索恩达电子有限公司 | 一种快速调节真空吸嘴机构 |
| DE102021111953A1 (de) | 2021-05-07 | 2022-11-10 | Mühlbauer Gmbh & Co. Kg | Optische Bauteilinspektion |
| CN113877845A (zh) * | 2021-10-28 | 2022-01-04 | 浙江庆鑫科技有限公司 | 一种压力补偿装置及方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0697718B2 (ja) | 1989-11-18 | 1994-11-30 | 太陽誘電株式会社 | チップ状電子部品マウント方法及び装置 |
| US5133926A (en) * | 1991-04-18 | 1992-07-28 | Westinghouse Electric Corp. | Extended burnup top nozzle for a nuclear fuel assembly |
| JP3258026B2 (ja) * | 1995-07-12 | 2002-02-18 | 松下電器産業株式会社 | 電子部品実装方法及び装置 |
| JP3935632B2 (ja) | 1998-10-27 | 2007-06-27 | 松下電器産業株式会社 | 電子部品の実装方法 |
| JP3719182B2 (ja) | 2001-09-28 | 2005-11-24 | 松下電器産業株式会社 | 電子部品実装装置および電子部品実装方法 |
| JP3861710B2 (ja) | 2002-02-15 | 2006-12-20 | 松下電器産業株式会社 | 電子部品供給装置および電子部品実装装置 |
| US7306695B2 (en) | 2003-04-10 | 2007-12-11 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for picking up semiconductor chip |
| US7222654B2 (en) * | 2004-04-30 | 2007-05-29 | The Procter & Gamble Company | Apparatus for producing elastomeric nonwoven laminates |
| JP4516354B2 (ja) | 2004-05-17 | 2010-08-04 | パナソニック株式会社 | 部品供給方法 |
| US7207430B2 (en) * | 2004-10-25 | 2007-04-24 | Ui Holding Company | Vacuum gripper for handling small components |
-
2007
- 2007-12-24 EP EP07150412A patent/EP2075829B1/de not_active Not-in-force
- 2007-12-24 AT AT07150412T patent/ATE528792T1/de active
-
2008
- 2008-12-17 KR KR1020107016432A patent/KR101448076B1/ko not_active Expired - Fee Related
- 2008-12-17 WO PCT/EP2008/067752 patent/WO2009080652A1/en not_active Ceased
- 2008-12-17 CN CN2008801225452A patent/CN101919039B/zh not_active Expired - Fee Related
- 2008-12-17 MX MX2010006994A patent/MX2010006994A/es active IP Right Grant
- 2008-12-17 MY MYPI2010002996A patent/MY147294A/en unknown
- 2008-12-22 TW TW097150025A patent/TWI483340B/zh active
-
2010
- 2010-06-21 US US12/819,300 patent/US8550766B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20100254788A1 (en) | 2010-10-07 |
| TW200935551A (en) | 2009-08-16 |
| CN101919039B (zh) | 2012-12-05 |
| MY147294A (en) | 2012-11-30 |
| KR20100110835A (ko) | 2010-10-13 |
| US8550766B2 (en) | 2013-10-08 |
| EP2075829A1 (de) | 2009-07-01 |
| EP2075829B1 (de) | 2011-10-12 |
| TWI483340B (zh) | 2015-05-01 |
| MX2010006994A (es) | 2010-08-25 |
| KR101448076B1 (ko) | 2014-10-07 |
| CN101919039A (zh) | 2010-12-15 |
| HK1148387A1 (en) | 2011-09-02 |
| WO2009080652A1 (en) | 2009-07-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| UEP | Publication of translation of european patent specification |
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