MY192110A - Method for automatic alignment of an electronic component during die sorting process - Google Patents

Method for automatic alignment of an electronic component during die sorting process

Info

Publication number
MY192110A
MY192110A MYUI2018702607A MYUI2018702607A MY192110A MY 192110 A MY192110 A MY 192110A MY UI2018702607 A MYUI2018702607 A MY UI2018702607A MY UI2018702607 A MYUI2018702607 A MY UI2018702607A MY 192110 A MY192110 A MY 192110A
Authority
MY
Malaysia
Prior art keywords
electronic component
axis movement
sorting process
automatic alignment
during die
Prior art date
Application number
MYUI2018702607A
Inventor
Kye Seang Tan
Ban Chuan Teh
Kok Seng Chan
Original Assignee
Mi Equipment M Sdn Bhd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mi Equipment M Sdn Bhd filed Critical Mi Equipment M Sdn Bhd
Priority to MYUI2018702607A priority Critical patent/MY192110A/en
Priority to PH12019000247A priority patent/PH12019000247A1/en
Priority to KR1020190089471A priority patent/KR102365182B1/en
Priority to TW108126285A priority patent/TWI685912B/en
Publication of MY192110A publication Critical patent/MY192110A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

A method for automatic alignment of an electronic component (201) during die sorting process (1), comprising the steps of: determining first position of said electronic component (201)(101); adjusting said ejector module (207) and said wafer holding means (205) in X-axis movement and Y-axis movement (103); picking and flipping said electronic component (201) using said flipper head (209) at an angle of 90 degrees (105); determining orientation of said electronic component (201) (107); flipping said electronic component (201) at an angle of 90 degrees (109); adjusting said flipper module (211) in X-axis movement and Y-axis movement (111); adjusting said pick-up head (215) in Z-axis movement (113); and said flipper module (211) is operated based on air chamber conversion method to allow 360 degrees rotation from said flipper module (211) (115).
MYUI2018702607A 2018-07-26 2018-07-26 Method for automatic alignment of an electronic component during die sorting process MY192110A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
MYUI2018702607A MY192110A (en) 2018-07-26 2018-07-26 Method for automatic alignment of an electronic component during die sorting process
PH12019000247A PH12019000247A1 (en) 2018-07-26 2019-07-22 Method for automatic alignment of an electronic component duting die sorting process
KR1020190089471A KR102365182B1 (en) 2018-07-26 2019-07-24 Method for automatic alignment of an electronic component during die sorting process
TW108126285A TWI685912B (en) 2018-07-26 2019-07-25 Method for automatic alignment of an electronic component during die sorting process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYUI2018702607A MY192110A (en) 2018-07-26 2018-07-26 Method for automatic alignment of an electronic component during die sorting process

Publications (1)

Publication Number Publication Date
MY192110A true MY192110A (en) 2022-07-28

Family

ID=69515138

Family Applications (1)

Application Number Title Priority Date Filing Date
MYUI2018702607A MY192110A (en) 2018-07-26 2018-07-26 Method for automatic alignment of an electronic component during die sorting process

Country Status (4)

Country Link
KR (1) KR102365182B1 (en)
MY (1) MY192110A (en)
PH (1) PH12019000247A1 (en)
TW (1) TWI685912B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102503855B1 (en) 2020-06-10 2023-02-23 아이디씨코리아 주식회사 Micro chips module arranged matrix and Method thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW477021B (en) * 2000-10-26 2002-02-21 Chein Hui Chuan Method of precisely accessing and placing chip to align the substrate during flip chip bonding process
JP5059518B2 (en) * 2007-08-10 2012-10-24 Ｊｕｋｉ株式会社 Electronic component mounting method and apparatus
EP2075829B1 (en) * 2007-12-24 2011-10-12 ISMECA Semiconductor Holding SA A method and device for aligning components
US20110182701A1 (en) * 2010-01-28 2011-07-28 Ui Holding Co. Method and apparatus for transferring die from a wafer
TWM463904U (en) * 2013-06-14 2013-10-21 Mpi Corp Rotary die sorting apparatus
KR101593801B1 (en) * 2014-05-29 2016-02-12 세메스 주식회사 Apparatus for ejecting dies
KR20170006343A (en) * 2015-07-07 2017-01-18 주식회사 프로텍 Apparatus and Method for Bonding Flip Chip
DE102015013494B3 (en) * 2015-10-16 2017-04-06 Mühlbauer Gmbh & Co. Kg Component handling device and method for removing components from a structured component supply and for depositing at a receiving device
US10056278B2 (en) * 2016-08-22 2018-08-21 Asm Technology Singapore Pte Ltd Apparatus and method for transferring electronic devices

Also Published As

Publication number Publication date
TW202008498A (en) 2020-02-16
PH12019000247A1 (en) 2020-06-22
KR20200012761A (en) 2020-02-05
TWI685912B (en) 2020-02-21
KR102365182B1 (en) 2022-02-17

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