MX2010006994A - Un metodo y dispositivo para alinear componentes. - Google Patents

Un metodo y dispositivo para alinear componentes.

Info

Publication number
MX2010006994A
MX2010006994A MX2010006994A MX2010006994A MX2010006994A MX 2010006994 A MX2010006994 A MX 2010006994A MX 2010006994 A MX2010006994 A MX 2010006994A MX 2010006994 A MX2010006994 A MX 2010006994A MX 2010006994 A MX2010006994 A MX 2010006994A
Authority
MX
Mexico
Prior art keywords
component
pick
aligning device
aligning
nozzle
Prior art date
Application number
MX2010006994A
Other languages
English (en)
Inventor
Pascal Dromard
Sebastien Maier
Original Assignee
Ismeca Semiconductor Holding
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ismeca Semiconductor Holding filed Critical Ismeca Semiconductor Holding
Publication of MX2010006994A publication Critical patent/MX2010006994A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Attitude Control For Articles On Conveyors (AREA)

Abstract

Método y aparato para alinear un componente de tamaño pequeño con boquillas de recolección con vacío, dentro de torretas empleadas con componentes electrónicos o equipos de ensamblado. El método comprende las etapas de recoger el componente con una boquilla de recolección; medir una posición del componente respecto a un valor definido llevar el componente sostenido por la boquilla de recolección en contacto con un dispositivo para alinear, sostener el componente con el dispositivo para alinear y, mover el dispositivo para alinear, a fin de alinear el componente con base en la medición de posición.
MX2010006994A 2007-12-24 2008-12-17 Un metodo y dispositivo para alinear componentes. MX2010006994A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP07150412A EP2075829B1 (en) 2007-12-24 2007-12-24 A method and device for aligning components
PCT/EP2008/067752 WO2009080652A1 (en) 2007-12-24 2008-12-17 A method and device for aligning components

Publications (1)

Publication Number Publication Date
MX2010006994A true MX2010006994A (es) 2010-08-25

Family

ID=39332222

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2010006994A MX2010006994A (es) 2007-12-24 2008-12-17 Un metodo y dispositivo para alinear componentes.

Country Status (10)

Country Link
US (1) US8550766B2 (es)
EP (1) EP2075829B1 (es)
KR (1) KR101448076B1 (es)
CN (1) CN101919039B (es)
AT (1) ATE528792T1 (es)
HK (1) HK1148387A1 (es)
MX (1) MX2010006994A (es)
MY (1) MY147294A (es)
TW (1) TWI483340B (es)
WO (1) WO2009080652A1 (es)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2471712A (en) * 2009-07-10 2011-01-12 De Beers Centenary AG Gemstone alignment system
JP5299379B2 (ja) * 2010-08-17 2013-09-25 パナソニック株式会社 部品実装装置および部品検出方法
JP5299380B2 (ja) * 2010-08-17 2013-09-25 パナソニック株式会社 部品実装装置および部品検出方法
DE102011013369A1 (de) * 2010-12-30 2012-07-05 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen einer Mehrzahl von Halbleiterbauelementen
WO2012129105A1 (en) * 2011-03-18 2012-09-27 Siemens Healthcare Diagnostics Inc. Methods and systems for calibration of a positional orientation between a sample container and nozzle tip
US9044812B2 (en) 2011-08-03 2015-06-02 General Electric Company Jig and method for modifying casing in turbine system
EP2801109A1 (en) 2011-12-07 2014-11-12 ISMECA Semiconductor Holding SA A component handling assembly
US8919528B2 (en) * 2012-07-13 2014-12-30 Hewlett-Packard Industrial Printing Ltd. Nozzled device to align a substrate on a surface
TW201432080A (zh) * 2013-02-01 2014-08-16 Chiuan Yan Technology Co Ltd 負壓無塵型對位機構
KR101479667B1 (ko) * 2014-04-21 2015-01-07 주식회사 디앤씨 압력 조절 장치 및 이를 이용한 피처리물 이송 방법
KR101687191B1 (ko) * 2015-08-17 2016-12-19 비케이전자 주식회사 전자부품 실장장치
DE102017008869B3 (de) 2017-09-21 2018-10-25 Mühlbauer Gmbh & Co. Kg Bauteilzentrierung
MY192110A (en) * 2018-07-26 2022-07-28 Mi Equipment M Sdn Bhd Method for automatic alignment of an electronic component during die sorting process
CN113677608B (zh) * 2019-04-04 2024-01-12 亚企睦自动设备有限公司 部件搬运处理装置
JP7291577B2 (ja) * 2019-08-28 2023-06-15 芝浦メカトロニクス株式会社 移送装置および実装装置
DE102019125134A1 (de) 2019-09-18 2021-03-18 Mühlbauer Gmbh & Co. Kg Bauteilhandhabung, Bauteilinspektion
DE102019125127A1 (de) * 2019-09-18 2021-03-18 Mühlbauer Gmbh & Co. Kg Bauteilhandhabung, Bauteilinspektion
TWI741748B (zh) * 2020-08-20 2021-10-01 鴻勁精密股份有限公司 接合機構及其應用之作業設備
WO2022046566A1 (en) * 2020-08-27 2022-03-03 Mrsi Systems Llc Self-aligning tip
DE102021111953A1 (de) 2021-05-07 2022-11-10 Mühlbauer Gmbh & Co. Kg Optische Bauteilinspektion
CN113877845A (zh) * 2021-10-28 2022-01-04 浙江庆鑫科技有限公司 一种压力补偿装置及方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0697718B2 (ja) 1989-11-18 1994-11-30 太陽誘電株式会社 チップ状電子部品マウント方法及び装置
US5133926A (en) * 1991-04-18 1992-07-28 Westinghouse Electric Corp. Extended burnup top nozzle for a nuclear fuel assembly
JP3258026B2 (ja) 1995-07-12 2002-02-18 松下電器産業株式会社 電子部品実装方法及び装置
JP3935632B2 (ja) 1998-10-27 2007-06-27 松下電器産業株式会社 電子部品の実装方法
JP3719182B2 (ja) 2001-09-28 2005-11-24 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
JP3861710B2 (ja) 2002-02-15 2006-12-20 松下電器産業株式会社 電子部品供給装置および電子部品実装装置
US7306695B2 (en) 2003-04-10 2007-12-11 Matsushita Electric Industrial Co., Ltd. Apparatus and method for picking up semiconductor chip
US7222654B2 (en) * 2004-04-30 2007-05-29 The Procter & Gamble Company Apparatus for producing elastomeric nonwoven laminates
JP4516354B2 (ja) 2004-05-17 2010-08-04 パナソニック株式会社 部品供給方法
US7207430B2 (en) * 2004-10-25 2007-04-24 Ui Holding Company Vacuum gripper for handling small components

Also Published As

Publication number Publication date
CN101919039B (zh) 2012-12-05
US8550766B2 (en) 2013-10-08
KR20100110835A (ko) 2010-10-13
WO2009080652A1 (en) 2009-07-02
TWI483340B (zh) 2015-05-01
US20100254788A1 (en) 2010-10-07
EP2075829A1 (en) 2009-07-01
EP2075829B1 (en) 2011-10-12
TW200935551A (en) 2009-08-16
CN101919039A (zh) 2010-12-15
HK1148387A1 (en) 2011-09-02
ATE528792T1 (de) 2011-10-15
MY147294A (en) 2012-11-30
KR101448076B1 (ko) 2014-10-07

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