SG10201804792XA - Method and apparatus for aligning and inspecting electronic components - Google Patents
Method and apparatus for aligning and inspecting electronic componentsInfo
- Publication number
- SG10201804792XA SG10201804792XA SG10201804792XA SG10201804792XA SG10201804792XA SG 10201804792X A SG10201804792X A SG 10201804792XA SG 10201804792X A SG10201804792X A SG 10201804792XA SG 10201804792X A SG10201804792X A SG 10201804792XA SG 10201804792X A SG10201804792X A SG 10201804792XA
- Authority
- SG
- Singapore
- Prior art keywords
- electronic components
- inspection devices
- inspecting
- aligning
- electronic component
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
- G01N21/9503—Wafer edge inspection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/04—Batch operation; multisample devices
- G01N2201/0415—Carrusel, sequential
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Biochemistry (AREA)
- Analytical Chemistry (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Quality & Reliability (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
METHOD AND APPARATUS FOR ALIGNING AND INSPECTING ELECTRONIC COMPONENTS 5 A method for automated alignment of electronic components with respect to one or more inspection devices for inspecting the electronic components, each electronic component having a plurality of side surfaces. The method comprises: positioning each electronic component relative to an imaging device; determining, by the imaging device, an angular offset and a linear offset between each side surface of 10 the electronic component and the one or more inspection devices; positioning each electronic component relative to the inspection devices; effecting alignment between each side surface and the one or more inspection devices in accordance with the respective angular and linear offsets; and inspecting each side surface after effecting alignment between the side surface and the inspection devices. 15 (Figure 6)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/623,458 US10338006B2 (en) | 2017-06-15 | 2017-06-15 | Method and apparatus for aligning and inspecting electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201804792XA true SG10201804792XA (en) | 2019-01-30 |
Family
ID=64656522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201804792XA SG10201804792XA (en) | 2017-06-15 | 2018-06-05 | Method and apparatus for aligning and inspecting electronic components |
Country Status (5)
Country | Link |
---|---|
US (1) | US10338006B2 (en) |
CN (1) | CN109119360B (en) |
MY (1) | MY184397A (en) |
SG (1) | SG10201804792XA (en) |
TW (1) | TWI730231B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7126285B1 (en) * | 2021-09-17 | 2022-08-26 | 上野精機株式会社 | electronic component processing equipment |
CN116500063B (en) * | 2023-06-27 | 2023-08-29 | 深圳市德斯戈智能科技有限公司 | Wafer defect detection device capable of automatically aligning and system thereof |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008024457A (en) * | 2006-07-22 | 2008-02-07 | Tekkusu Iijii:Kk | Carrying device |
US9465383B2 (en) * | 2013-06-27 | 2016-10-11 | Asm Technology Singapore Pte Ltd | Apparatus and method of using an imaging device for adjustment of at least one handling device for handling semiconductor components |
TWI553763B (en) * | 2014-01-23 | 2016-10-11 | 先進科技新加坡有限公司 | A test handler that picks up electronic devices for testing and an orientation-changing apparatus for use in a test handler |
JP5783652B2 (en) * | 2014-06-04 | 2015-09-24 | 上野精機株式会社 | Attitude correction device and electrical component inspection device |
US9510460B2 (en) * | 2014-09-17 | 2016-11-29 | Asm Technology Singapore Pte Ltd | Method for aligning electronic components |
KR102662003B1 (en) * | 2015-07-30 | 2024-04-29 | 램 리써치 코포레이션 | Vision-based wafer notch position measurement |
US10115620B2 (en) * | 2015-08-31 | 2018-10-30 | Asm Technology Singapore Pte Ltd | Apparatus and method for adjustment of a handling device for handling electronic components |
DE102015220746A1 (en) * | 2015-10-23 | 2017-04-27 | Ersa Gmbh | Method and device for placing electronic components |
US10473714B2 (en) * | 2017-03-06 | 2019-11-12 | Asm Technology Singapore Pte Ltd | Method and apparatus for aligning electronic components |
-
2017
- 2017-06-15 US US15/623,458 patent/US10338006B2/en active Active
-
2018
- 2018-05-25 TW TW107117836A patent/TWI730231B/en active
- 2018-05-28 MY MYPI2018000830A patent/MY184397A/en unknown
- 2018-06-05 SG SG10201804792XA patent/SG10201804792XA/en unknown
- 2018-06-11 CN CN201810594988.7A patent/CN109119360B/en active Active
Also Published As
Publication number | Publication date |
---|---|
MY184397A (en) | 2021-04-01 |
TW201906061A (en) | 2019-02-01 |
TWI730231B (en) | 2021-06-11 |
US10338006B2 (en) | 2019-07-02 |
US20180364180A1 (en) | 2018-12-20 |
CN109119360A (en) | 2019-01-01 |
CN109119360B (en) | 2022-02-25 |
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