SG11201903701SA - Method for manufacturing electronic apparatus, adhesive film for manufacturing electronic apparatus, and electronic component testing apparatus - Google Patents

Method for manufacturing electronic apparatus, adhesive film for manufacturing electronic apparatus, and electronic component testing apparatus

Info

Publication number
SG11201903701SA
SG11201903701SA SG11201903701SA SG11201903701SA SG11201903701SA SG 11201903701S A SG11201903701S A SG 11201903701SA SG 11201903701S A SG11201903701S A SG 11201903701SA SG 11201903701S A SG11201903701S A SG 11201903701SA SG 11201903701S A SG11201903701S A SG 11201903701SA
Authority
SG
Singapore
Prior art keywords
electronic component
adhesive film
electronic
testing apparatus
manufacturing electronic
Prior art date
Application number
SG11201903701SA
Inventor
Eiji Hayashishita
Original Assignee
Mitsui Chemicals Tohcello Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Tohcello Inc filed Critical Mitsui Chemicals Tohcello Inc
Publication of SG11201903701SA publication Critical patent/SG11201903701SA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Laminated Bodies (AREA)
  • Dicing (AREA)

Abstract

A method for manufacturing electronic apparatus includes: a step (A) of preparing a structure (100) provided with an adhesive film (50) and one or two or more electronic components (70) affixed to 5 an adhesive surface of the adhesive film (50); a step (B) of disposing the structure (100) in the electronic component testing apparatus (200) such that the electronic component (70) is positioned over an electronic component installation region (85) of a sample stand (80) of the electronic component testing apparatus (200) with the adhesive 10 film (50) interposed between the electronic component (70) and the electronic component installation region (85), the electronic component testing apparatus (200) being provided with the sample stand (80) including the electronic component installation region (85) and a probe card (90) that is provided at a position facing the 15 sample stand (80) and includes a probe terminal (95); a step (C) of evaluating the properties of the electronic component (70) in a state of being affixed to the adhesive film (50) with the probe terminal (95) being in contact with a terminal (75) of the electronic component (70); and a step (D) of picking up the electronic component (70) from 20 the adhesive film (50) after the step (C). In addition, the sample stand (80) is provided with a first vacuum suction unit (210) in a region (89) on an outer peripheral side which is different from the electronic component installation region (85), the first vacuum suction unit (210) vacuum-sucking the adhesive film (50), and at least 25 in the step (C), the first vacuum suction unit (210) vacuum-sucks a region (58) of the adhesive film (50) to which no electronic 47 component (70) is affixed.
SG11201903701SA 2016-10-27 2017-10-24 Method for manufacturing electronic apparatus, adhesive film for manufacturing electronic apparatus, and electronic component testing apparatus SG11201903701SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016210626 2016-10-27
PCT/JP2017/038366 WO2018079552A1 (en) 2016-10-27 2017-10-24 Electronic device production method, adhesive film for electronic device production, and electronic component testing device

Publications (1)

Publication Number Publication Date
SG11201903701SA true SG11201903701SA (en) 2019-05-30

Family

ID=62024133

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201903701SA SG11201903701SA (en) 2016-10-27 2017-10-24 Method for manufacturing electronic apparatus, adhesive film for manufacturing electronic apparatus, and electronic component testing apparatus

Country Status (8)

Country Link
US (2) US11047900B2 (en)
EP (1) EP3533852A4 (en)
JP (1) JP6726296B2 (en)
KR (1) KR102243345B1 (en)
CN (1) CN109891253A (en)
SG (1) SG11201903701SA (en)
TW (1) TWI745464B (en)
WO (1) WO2018079552A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6204639B1 (en) * 2016-03-30 2017-09-27 三井化学東セロ株式会社 Manufacturing method of semiconductor device
JPWO2022172990A1 (en) * 2021-02-10 2022-08-18

Family Cites Families (23)

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JPS5697884A (en) * 1980-01-07 1981-08-06 Mitsubishi Electric Corp Testing method for damp resistance of electronic parts
JPS6313339A (en) * 1986-07-04 1988-01-20 Hitachi Ltd Foreign material existence inspecting device
JPH02235355A (en) * 1989-03-08 1990-09-18 Nec Kansai Ltd Semiconductor manufacturing equipment and manufacture thereof
JPH10163281A (en) 1996-10-04 1998-06-19 Hitachi Ltd Semiconductor element and its manufacture
JP2000180469A (en) 1998-12-18 2000-06-30 Fujitsu Ltd Contactor for semiconductor device, tester using contactor for semiconductor device, testing method using contactor for semiconductor device and method for cleaning contactor for semiconductor device
US6445202B1 (en) 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
US6541989B1 (en) 2000-09-29 2003-04-01 Motorola, Inc. Testing device for semiconductor components and a method of using the device
JP4137471B2 (en) 2002-03-04 2008-08-20 東京エレクトロン株式会社 Dicing method, integrated circuit chip inspection method, and substrate holding apparatus
JP2003303919A (en) * 2002-04-10 2003-10-24 Hitachi Ltd Semiconductor device and its manufacturing method
WO2004000966A1 (en) 2002-06-24 2003-12-31 3M Innovative Properties Company Heat curable adhesive composition, article, semiconductor apparatus and method
US20050224978A1 (en) 2002-06-24 2005-10-13 Kohichiro Kawate Heat curable adhesive composition, article, semiconductor apparatus and method
SG116533A1 (en) * 2003-03-26 2005-11-28 Toshiba Kk Semiconductor manufacturing apparatus and method of manufacturing semiconductor device.
TWI402325B (en) 2005-05-12 2013-07-21 Nitto Denko Corp Adhesive sheet for dicing and dicing method using the same
JP5054949B2 (en) 2006-09-06 2012-10-24 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor device
KR101336430B1 (en) * 2009-07-08 2013-12-04 후루카와 덴키 고교 가부시키가이샤 Wafer-pasting adhesive sheet and wafer processing method using the same
CN102472790B (en) 2009-08-02 2015-01-28 Qmc株式会社 Pickup apparatus and LED chip classification apparatus including same
JP2012241063A (en) 2011-05-17 2012-12-10 Nitto Denko Corp Adhesive sheet for producing semiconductor device
JP6159163B2 (en) 2013-06-21 2017-07-05 日東電工株式会社 Adhesive sheet
JP2016210626A (en) 2013-10-18 2016-12-15 旭硝子株式会社 Method for producing vacuum multi-layered glass
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Also Published As

Publication number Publication date
US20210172993A1 (en) 2021-06-10
EP3533852A1 (en) 2019-09-04
EP3533852A4 (en) 2020-06-17
CN109891253A (en) 2019-06-14
US11047900B2 (en) 2021-06-29
US20190285687A1 (en) 2019-09-19
JPWO2018079552A1 (en) 2019-10-03
KR20190059935A (en) 2019-05-31
WO2018079552A1 (en) 2018-05-03
TW201816984A (en) 2018-05-01
KR102243345B1 (en) 2021-04-21
TWI745464B (en) 2021-11-11
US11747388B2 (en) 2023-09-05
JP6726296B2 (en) 2020-07-22

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